CN112804627A

CN112804627A - Electret self-excitation bone conduction microphone

Info

Publication number: CN112804627A
Application number: CN202110343921.8A
Authority: CN
Inventors: 田达亨; 王晶晶
Original assignee: Shandong Xingang Electronic Technology Co ltd
Current assignee: Shandong Xingang Electronic Technology Co ltd
Priority date: 2021-03-31
Filing date: 2021-03-31
Publication date: 2021-05-14

Abstract

The invention provides an electret self-excitation bone conduction microphone, which comprises a metal shell component and is characterized in that: the metal casing subassembly is connected with the PCB board, the metal casing bottom is connected with the vibrating diaphragm part, the vibrating diaphragm part includes vibrating diaphragm support piece, vibrating diaphragm support piece fixedly connected with vibrating diaphragm subassembly, vibrating diaphragm support piece includes gasket ring and copper ring, be connected with the vibrating diaphragm between gasket ring and the copper ring, vibrating diaphragm central part is equipped with the quality piece, the vibrating diaphragm subassembly upper end is connected with the back plate, the damping hole has been seted up on the back plate, back plate subassembly up end is connected with the support external member, the support external member up end is connected with the PCB board contact. The excitation form of the existing microphone is changed from the excitation form to the self-excitation form, so that the sound can be effectively converted, the influence on the sound receiving effect caused by the environmental noise and the environmental sound pressure change is reduced, the sound receiving tone quality is improved, and the requirements of more scenes and use environments are met.

Description

Electret self-excitation bone conduction microphone

Technical Field

The invention relates to the technical field of microphones, in particular to an electret self-excitation bone conduction microphone.

Background

A microphone is also known as a microphone, which is an energy conversion device that converts a sound signal into an electrical signal. Microphones come in many types, including moving coil, capacitive, and electret types.

The commonly used microphone is mainly an electret microphone, which mainly senses sound pressure change by virtue of an electret film and converts the sound pressure change into an electric signal to be transmitted to a chip.

Bone conduction is a sound conduction mode, can realize clear sound reduction and type clear sound in noisy environment, the bone conduction technique divide into bone conduction speaker technique and bone conduction microphone technique, bone conduction microphone technique is used for collecting sound, air conduction is that the sound wave passes through air conduction to microphone, and bone conduction speech is then through the bone transmission, can prevent effectively because of the ambient noise and the noise of breathing out that air propagation caused through the bone transmission to make the speech more clear accurate.

Disclosure of Invention

The invention aims to overcome the defects of the traditional technology and provides an electret bone conduction microphone which can realize self-excitation through the vibration of a diaphragm.

The aim of the invention is achieved by the following technical measures:

an electret self-excited bone conduction microphone comprising a metal housing assembly, characterized in that: the metal shell assembly comprises a metal shell bottom, a metal shell peripheral part and a top annular curled edge, the top annular curled edge is connected with a PCB assembly, the PCB assembly comprises a PCB plate, the metal shell bottom is connected with a vibrating diaphragm part, the vibrating diaphragm part comprises a vibrating diaphragm support part, the vibrating diaphragm support part is fixedly connected with a vibrating diaphragm assembly, the vibrating diaphragm support part comprises a gasket ring and a copper ring, the gasket ring is arranged on the upper end surface of the copper ring, a vibrating diaphragm is connected between the lower end surface of the gasket ring and the upper end surface of the copper ring, the middle part of the vibrating diaphragm is provided with a mass block, the upper end of the vibrating diaphragm assembly is connected with a back plate assembly, the back plate assembly comprises a back plate, the gasket ring and the vibrating diaphragm surround to form an upper sound cavity, the vibrating diaphragm, the copper ring and the metal shell bottom surround to form a lower sound cavity, the back plate is provided with a damping hole, the upper end face of the back plate assembly is connected with a supporting sleeve, and the upper end face of the supporting sleeve is in contact connection with the PCB.

As an improvement: the height of the gasket ring is the same as that of the copper ring, the space size of the upper sound cavity is in direct proportion to the height of the gasket ring, and the space size of the lower sound cavity is in direct proportion to the height of the copper ring.

As an improvement: the support external member includes insulating ring and conductive metal ring, be connected with the insulating ring between conductive metal ring and the metal casing circumference portion.

As an improvement: the PCB is fixed in the metal shell component through a supporting sleeve and a top end annular curled edge, the supporting sleeve is connected with the lower end face of the PCB, and the top end annular curled edge is connected with the upper end face of the PCB.

As an improvement: an electret film is connected below the back electrode plate and is connected with the insulating backing ring.

As an improvement: the damping hole is communicated with the pressure stabilizing cavity and the upper sound cavity, and at least one damping hole is formed in the back plate.

As an improvement: the PCB is a copper-clad PCB, copper-clad circuits are printed on the upper end face and the lower end face of the PCB, and the copper-clad circuits are connected with electrical elements mounted on the PCB.

As an improvement: the PCB comprises a PCB and is characterized in that an electric circuit is printed on the upper end face of the PCB, an ASIC chip is connected to the lower end face of the PCB, the ASIC chip is fixedly connected in a voltage stabilizing cavity, and the ASIC chip is connected with an electric element through a printed copper-clad circuit.

As an improvement: a top pressure relief hole is formed in the PCB and connected with an external environment and a voltage stabilizing cavity.

As an improvement: and a bottom pressure relief hole is formed in the bottom of the metal shell and is communicated with the external environment and the lower sound cavity.

Due to the adoption of the technical scheme, compared with the prior art, the invention has the advantages that:

compared with the traditional bone conduction microphone, the traditional MEMS sound pressure sensor conversion mode is changed into the capacitive direct conversion mode, the excitation mode of the traditional bone conduction microphone is changed into the self-excitation mode from the excitation mode, the space size of the upper sound cavity and the lower sound cavity is changed through the vibration of the vibration assembly, the capacitance change on the back plate is further influenced, the sound pressure change is converted into an electric signal to be transmitted to the ASIC chip, the signal transmission and the signal conversion are more direct through the mode, and therefore the self-excitation bone conduction microphone can effectively convert the sound, the sound quality of the received sound is improved, and the requirements of more scenes and use environments are met.

The invention is further described with reference to the following figures and detailed description.

Drawings

Fig. 1 is a schematic structural view of an overall cross section of the present invention.

Fig. 2 is a schematic structural diagram of the metal housing assembly and the PCB assembly of the present invention.

Figure 3 is a schematic structural view of the support assembly and back plate assembly of the present invention.

Fig. 4 is a schematic structural diagram of a diaphragm member according to the present invention.

Fig. 5 is a schematic diagram of the structure of the novel chamber.

In the figure: 1-a metal housing component; 2-a PCB assembly; 3-a support kit; 4-a back plate assembly; 5-a diaphragm member; 6-a voltage stabilizing cavity; 7-upper sound cavity; 8-lower sound cavity; 11-top annular crimping; 12-metal housing perimeter; 13-metal housing bottom; 14-bottom relief hole; 21-a PCB board; 22-top pressure relief vent; 23-an ASIC chip; 24-copper-clad line; 31-an insulating ring; 32-a conductive metal ring; 41-back polar plate; 42-a damping orifice; 43-an electret film; 51-a diaphragm support; 52-a diaphragm assembly; 511-shim ring; 512-copper ring; 521-a diaphragm; 522-mass.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Example (b): as shown in fig. 1 to 5, an electret self-excited bone conduction microphone comprises a metal housing assembly 1, wherein the metal housing assembly 1 comprises a metal housing bottom 13, a metal housing peripheral portion 12 and a top annular curled edge 11, the top annular curled edge 11 is connected with a PCB 21, the metal housing bottom 13 is connected with a diaphragm part 5, the diaphragm part 5 comprises a diaphragm support member 51, the diaphragm support member 51 is fixedly connected with a diaphragm assembly 52, the diaphragm support member 51 comprises a spacer ring 511 and a copper ring 512, the spacer ring 511 is arranged on the copper ring 512, a diaphragm 521 is connected between the lower end face of the spacer ring 511 and the upper end face of the copper ring 512, a mass block 522 is arranged at the center portion of the diaphragm 521, a back plate assembly 4 is connected to the upper end of the diaphragm part 52, the back plate assembly 4 comprises a back plate 41, and the back plate 41, the spacer ring 511 and the diaphragm 521 form an upper sound cavity 7 in a surrounding manner, the vibrating diaphragm 521, the copper ring 512 and the bottom 13 of the metal shell surround to form a lower sound cavity 8, a voltage stabilizing cavity 6 is arranged between the back plate 41 and the PCB 21, a damping hole 42 is formed in the back plate 41, the upper end face of the back plate assembly 4 is connected with a supporting sleeve 3, and the upper end face of the supporting sleeve 3 is in contact connection with the PCB 21.

The height of the gasket ring 511 is the same as that of the copper ring 512, the space size of the upper sound cavity 7 is in direct proportion to the height of the gasket ring 511, and the space size of the lower sound cavity 8 is in direct proportion to the height of the copper ring 512. The sizes of the upper sound cavity 7 and the lower sound cavity 8 determine the amplitude of the diaphragm 521 and the mass block 522, so that the sound receiving range is determined, and the sound receiving precision is ensured.

The support sleeve 3 includes an insulating ring 31 and a conductive metal ring 32, and the insulating ring 31 is provided between the conductive metal ring 32 and the metal case peripheral portion 12. The insulating ring 31 and the conductive metal ring 32 support the PCB 21 and can effectively control the distance between the PCB 21 and the back plate 41.

The PCB 21 is fixed in the metal shell component 1 through a support sleeve 3 and a top end annular curled edge 11, the support sleeve 3 is connected with the lower end face of the PCB 21, and the top end annular curled edge 11 is connected with the upper end face of the PCB 21. The top annular bead 11 and the support sleeve 3 may effectively secure the PCB board 21.

The lower end face of the back plate 41 is connected with an electret film 43, and the electret film 43 is connected with the insulating ring 31. The electret film 43 and the back plate 41 are combined to form the back plate 41 where electric charges reside, and the electret film 43 can effectively separate the back plate 41 and the insulating ring 31, thereby effectively storing electric charges.

The damping hole 42 is communicated with the pressure stabilizing cavity 6 and the upper sound cavity 7, and at least one damping hole 42 is formed in the back plate 41. The damping hole 42 is communicated with the pressure stabilizing cavity 6 and the upper sound cavity 7 to ensure that the vibration amplitudes of the vibrating diaphragm 521 in the upper sound cavity 7 and the lower sound cavity 8 are the same, so that the air pressure of the upper sound cavity 7 is ensured to be the same as that of the lower sound cavity 8

A top pressure relief hole 22 is formed in the PCB 21, and the top pressure relief hole 22 is connected with the external environment and the pressure stabilizing cavity 6. The top end pressure relief hole 22 balances the external environment and the air pressure in the pressure stabilizing cavity 6, and the pressure stabilizing cavity 6 is connected with the upper sound cavity 7 through the damping hole 42, so that the pressure stabilizing cavity 6 is connected with the outside through the top end pressure relief hole 22 to stabilize the air pressure, and the air pressure stability of the pressure stabilizing cavity 6 and the upper sound cavity 7 can be guaranteed.

Bottom pressure relief holes 14 are formed in the bottom 13 of the metal shell, and the bottom pressure relief holes 14 are communicated with the external environment and the lower sound cavity 8. The bottom pressure relief hole 14 balances the air pressure of the lower sound cavity 8 and the air pressure outside, so that the air pressures of the upper sound cavity 7 and the lower sound cavity 8 are the same, and the vibration of the diaphragm 521 is ensured by keeping the air pressures of the upper sound cavity 7 and the lower sound cavity 8.

The PCB 21 is a copper-clad PCB 21, copper-clad circuits 24 are printed on the upper end face and the lower end face of the PCB 21, and the copper-clad circuits 24 are connected with electric elements mounted on the PCB 21. The PCB comprises a PCB 21 and is characterized in that an electric circuit is printed on the upper end face of the PCB 21, an ASIC chip 23 is connected to the lower end face of the PCB 21, the ASIC chip 23 is located in a voltage stabilizing cavity 6, and the ASIC chip 23 is connected with a loop through a copper-clad circuit 24 printed on the lower end face of the PCB 21.

The copper-clad circuit 24 printed on the PCB 21 is used to connect the electrical components and the ASIC chip 23, and the copper-clad circuit 24 on the lower end surface of the PCB 21 is connected to the conductive metal ring 32, so that the back plate 41 is connected to the circuit on the PCB 21 through the conductive metal ring 32, and the back plate 41 and the ASIC chip 23 can be connected in a loop.

It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. An electret self-excited bone conduction microphone comprising a metal housing component (1), characterized in that: the metal shell component (1) comprises a metal shell bottom (13), a metal shell peripheral part (12) and a top annular curled edge (11), the top annular curled edge (11) is connected with a PCB component (2), the PCB component (2) comprises a PCB (21), the metal shell bottom (13) is connected with a diaphragm component (5), the diaphragm component (5) comprises a diaphragm support piece (51), the diaphragm support piece (51) is fixedly connected with a diaphragm component (52), the diaphragm support piece (51) comprises a gasket ring (511) and a copper ring (512), the gasket ring (511) is arranged on the copper ring (512), a diaphragm (521) is connected between the lower end face of the gasket ring (511) and the upper end face of the copper ring (512), a mass block (522) is arranged at the center part of the diaphragm (521), the upper end of the diaphragm component (52) is connected with a back plate component (4), back polar plate subassembly (4) includes back polar plate (41), spacer ring (511) and vibrating diaphragm (521) encircle and constitute sound cavity (7) on, vibrating diaphragm (521), copper ring (512) and metal casing bottom (13) encircle and constitute down sound cavity (8), be equipped with between back polar plate (41) and PCB board (21) and stabilize voltage cavity (6), damping hole (42) have been seted up on back polar plate (41), back polar plate subassembly (4) up end is connected with supporting kit (3), supporting kit (3) up end and PCB board (21) contact are connected.

2. An electret self-energizing bone conduction microphone according to claim 1, wherein: the height of the gasket ring (511) is the same as that of the copper ring (512), the space size of the upper sound cavity (7) is in direct proportion to the height of the gasket ring (511), and the space size of the lower sound cavity (8) is in direct proportion to the height of the copper ring (512).

3. An electret self-energizing bone conduction microphone according to claim 1, wherein: the supporting sleeve member (3) comprises an insulating ring (31) and a conductive metal ring (32), and the insulating ring (31) is connected between the conductive metal ring (32) and the peripheral portion (12) of the metal shell.

4. An electret self-energizing bone conduction microphone according to claim 1, wherein: the PCB board (21) is fixed in the metal casing component (1) through a supporting sleeve component (3) and a top end annular curled edge (11), the supporting sleeve component (3) is connected with the lower end face of the PCB board (21), and the top end annular curled edge (11) is connected with the upper end face of the PCB board (21).

5. An electret self-energizing bone conduction microphone according to claim 1, wherein: an electret film (43) is connected below the back electrode plate (41), and the electret film (43) is connected with the insulating ring (31).

6. An electret self-energizing bone conduction microphone according to claim 1, wherein: the damping holes (42) are communicated with the pressure stabilizing cavity (6) and the upper sound cavity (7), and at least one damping hole (42) is formed in the back plate (41).

7. An electret self-energizing bone conduction microphone according to claim 1, wherein: the PCB board (21) is a copper-clad PCB board (21), copper-clad circuits (24) are printed on the upper end face and the lower end face of the PCB board (21), and the copper-clad circuits (24) are connected with electric elements mounted on the PCB board (21).

8. An electret self-energizing bone conduction microphone according to claim 1, wherein: the PCB comprises a PCB (21), wherein an electric circuit is printed on the upper end face of the PCB (21), an ASIC (application specific integrated circuit) chip (23) is connected to the lower end face of the PCB (21), the ASIC chip (23) is located in a voltage stabilizing cavity (6), and the ASIC chip (23) is connected with a loop through a copper-clad circuit (24) printed on the lower end face of the PCB (21).

9. An electret self-energizing bone conduction microphone according to claim 1, wherein: a top pressure relief hole (22) is formed in the PCB (21), and the top pressure relief hole (22) is connected with the outside and the pressure stabilizing cavity (6).

10. An electret self-energizing bone conduction microphone according to claim 1, wherein: and a bottom pressure relief hole (14) is formed in the bottom (13) of the metal shell, and the bottom pressure relief hole (14) is communicated with the external environment and the lower sound cavity (8).