CN112802773A - Semiconductor system and semiconductor processing method - Google Patents
Semiconductor system and semiconductor processing method Download PDFInfo
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- CN112802773A CN112802773A CN201911106424.5A CN201911106424A CN112802773A CN 112802773 A CN112802773 A CN 112802773A CN 201911106424 A CN201911106424 A CN 201911106424A CN 112802773 A CN112802773 A CN 112802773A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32853—Hygiene
- H01J37/32862—In situ cleaning of vessels and/or internal parts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/332—Coating
- H01J2237/3321—CVD [Chemical Vapor Deposition]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/335—Cleaning
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Abstract
The invention relates to a semiconductor system and a semiconductor process method; the method comprises the following steps: the signal acquisition module is used for acquiring the condition of the semiconductor machine; the cleaning processing module is used for automatically cleaning a process chamber of the semiconductor machine when the semiconductor machine is in a condition that the semiconductor machine needs to be cleaned; and the automatic machine condition switching module is used for automatically switching the condition of the semiconductor machine to the machine testing condition after the cleaning treatment and when the machine condition switching condition is met. According to the semiconductor system, the process chamber of the semiconductor machine can be automatically cleaned when the semiconductor machine is in a condition needing cleaning, and the condition of the semiconductor machine is automatically switched to the condition of testing after the cleaning is finished, so that the whole process is completely automatic, the manpower and time are greatly reduced, the hidden danger of misoperation is avoided, the normal operation time of the machine is improved, and the productivity of the semiconductor machine is improved.
Description
Technical Field
The present invention relates to the field of integrated circuit technology, and more particularly, to the application of system automation functions in semiconductor integrated circuits at the machine side, and more particularly, to a semiconductor system and a semiconductor processing method.
Background
In the conventional semiconductor equipment, especially in the CVD (chemical vapor deposition) equipment for TEL (tokyo electron) to deposit Ti (titanium) or TiN (titanium nitride), the condition (chamber condition) of the process chamber is deteriorated with the increase of the number of wafers to be processed, so that the equipment maintenance and abnormal condition treatment are often required to ensure the yield of the product. However, in the prior art, the machine condition needs to be manually switched after equipment maintenance and abnormal condition processing, which takes a lot of manpower and time; meanwhile, there is a high risk of Misoperation (MO) (for example, no testing is performed after equipment maintenance or abnormal condition handling), and a large amount of products are scrapped once misoperation occurs, resulting in huge economic loss; in addition, the semiconductor equipment often cannot be returned to the manufacturing department for testing after the equipment maintenance or the abnormal processing is completed, which affects the normal operation time (uptime) of the semiconductor equipment and results in low productivity.
Disclosure of Invention
Accordingly, it is necessary to provide a semiconductor system and a semiconductor process method, which are directed to the problems of the prior art that a lot of labor and time are required, a high misoperation risk exists, and the processed equipment cannot be returned to the manufacturing part for testing in time, so that the productivity of the semiconductor machine is low.
In order to achieve the above object, in one aspect, the present invention provides a semiconductor system comprising: the signal acquisition module is used for acquiring the condition of the semiconductor machine; the cleaning processing module is used for automatically cleaning a process chamber of the semiconductor machine when the semiconductor machine is in a condition that the semiconductor machine needs to be cleaned; and the automatic machine condition switching module is used for automatically switching the condition of the semiconductor machine to the machine testing condition after the cleaning treatment and when the machine condition switching condition is met.
According to the semiconductor system, the process chamber of the semiconductor machine can be automatically cleaned when the semiconductor machine is in a condition needing cleaning, and the condition of the semiconductor machine is automatically switched to the condition of testing after the cleaning is finished, so that the whole process is completely automatic, the manpower and time are greatly reduced, the hidden danger of misoperation is avoided, the normal operation time of the machine is improved, and the productivity of the semiconductor machine is improved.
In one embodiment, the cleaning processing module cleans the process chamber when the semiconductor machine is in a post-equipment maintenance condition, a downtime condition or an abnormal condition of the process chamber; the machine condition switching condition comprises a condition that the cleaning processing is finished and the semiconductor machine is in an equipment maintenance state, a downtime state or a process chamber abnormal state before the cleaning processing.
In one embodiment, when the semiconductor machine is in a downtime condition or an abnormal condition of the semiconductor chamber, the automatic machine condition switching module is further used for automatically switching the condition of the semiconductor machine to an equipment maintenance condition while the cleaning processing module performs cleaning processing on the process chamber.
In one embodiment, the semiconductor system further comprises an authority control setting module for setting authority control for performing cleaning treatment on the process chamber.
In one embodiment, the semiconductor system further comprises a communication module for sending a test preparation instruction when the cleaning processing module performs cleaning processing on the process chamber, and sending a test instruction when the status of the semiconductor machine is switched to a test status.
In one embodiment, the communication module sends the machine testing preparation instruction and the machine testing instruction based on a short message platform, a mailbox or an instant communication tool.
The invention also provides a semiconductor process method, which comprises the following steps:
the method comprises the steps of collecting the condition of a semiconductor machine in real time, and automatically cleaning a process chamber of the semiconductor machine when the semiconductor machine is in a condition needing cleaning;
and after cleaning, automatically switching the state of the semiconductor machine to the state of the testing machine.
According to the semiconductor process method, the process chamber of the semiconductor machine can be automatically cleaned when the semiconductor machine is in a condition needing cleaning, and the condition of the semiconductor machine is automatically switched to the condition of testing the machine after the cleaning is finished, so that the whole process is completely automatic, the manpower and time are greatly reduced, the hidden danger of misoperation is avoided, the normal operation time of the machine is improved, and the productivity of the semiconductor machine is improved.
In one embodiment, the semiconductor machine is used for cleaning the process chamber when the semiconductor machine is in a state after equipment maintenance, a downtime state or an abnormal state of the process chamber; and after the cleaning treatment is finished, automatically switching to a machine testing state when the semiconductor machine is in a state after equipment maintenance, a downtime state or an abnormal state of the process chamber before the cleaning treatment.
In one embodiment, when the semiconductor machine is in a downtime condition or an abnormal condition of the semiconductor chamber, the condition of the semiconductor machine is automatically switched to an equipment maintenance condition while the process chamber is cleaned.
In one embodiment, the process chamber anomaly comprises an equipment failure, an anomaly in a particle count within a process chamber of a semiconductor tool, an anomaly in a film thickness on an inner wall of a process chamber of a semiconductor tool, or an anomaly in a resistance value.
In one embodiment, the cleaning treatment of the process chamber is carried out while sending a machine testing preparation instruction to a manufacturing department; the state of the semiconductor machine is switched to a machine testing state, and a machine testing instruction is sent to a manufacturing department; after the machine testing instruction is sent, the following steps are also included: and testing the semiconductor machine, and releasing the semiconductor machine after the testing is finished.
In one embodiment, the cleaning process includes cleaning, purging, and pre-depositing the process chamber of the semiconductor tool.
In one embodiment, the method further comprises the step of setting an authority card for the cleaning process before the cleaning process is performed on the process chamber.
In the semiconductor process method, the error operation of non-professional personnel can be avoided by setting the authority card control, so that the safety is improved.
Drawings
Fig. 1 is a block diagram of a semiconductor system according to an embodiment of the present invention.
Fig. 2 to 4 are flow charts of semiconductor processing methods in various embodiments provided by the present invention.
Detailed Description
To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are shown in the drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element and be integral therewith, or intervening elements may also be present. The terms "mounted," "one end," "the other end," and the like are used herein for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
In one embodiment, as shown in fig. 1, the present invention provides a semiconductor system comprising: the signal acquisition module 10, the signal acquisition module 10 is used for gathering the state of the semiconductor machine; a cleaning processing module 11, wherein the cleaning processing module 11 is used for automatically performing cleaning processing (macro) on a process chamber of a semiconductor machine when the semiconductor machine is in a condition that the semiconductor machine needs to be cleaned; an automatic machine condition switching module 12, wherein the automatic machine condition switching module 12 is used for automatically switching the condition of the semiconductor machine to the machine testing condition after the cleaning process and when the machine condition switching condition is met.
According to the semiconductor system, the process chamber of the semiconductor machine can be automatically cleaned when the semiconductor machine is in a condition needing cleaning, and the condition of the semiconductor machine is automatically switched to the condition of testing after the cleaning is finished, so that the whole process is completely automatic, the manpower and time are greatly reduced, the hidden danger of misoperation is avoided, the normal operation time of the machine is improved, and the productivity of the semiconductor machine is improved.
In an example, the signal acquisition module 10 may be any acquisition module capable of acquiring a status of a semiconductor machine, and a specific structure thereof is not limited herein.
In one example, the cleaning module 11 cleans the process chamber when the semiconductor machine is in a post-equipment maintenance (PM) condition, a downtime condition, or a process chamber exception condition.
In one example, the process chamber abnormality may include a device failure (Tool), a particle count abnormality in a process chamber of a semiconductor Tool, a film Thickness (THK) abnormality or a resistance value (Rs) abnormality on an inner wall of a process chamber of a semiconductor Tool, and the like. Specifically, taking the film thickness abnormality on the inner wall of the process chamber of the semiconductor machine as an example, the film thickness abnormality mainly refers to that the film thickness deposited on the inner wall of the process chamber of the semiconductor machine is gradually increased along with the increase of the working time of the process chamber, the performance of the process chamber is deteriorated, and the phenomena of abnormal particle count and abnormal film thickness are usually generated; in order to detect an abnormality in time, a threshold (target) is generally set, and when the film thickness on the inner wall of the process chamber reaches the threshold, it is determined that the semiconductor machine is abnormal. The film thickness on the inner wall of the process chamber of the semiconductor machine may be set to 10000nm (nanometers) in one example.
In one example, the detection device may be used to automatically detect the condition in the process chamber of the semiconductor tool in real time (e.g., the detection device may be used to detect the number of particles in the process chamber of the semiconductor tool and the thickness of the film on the inner wall of the process chamber in real time) to ensure that the process chamber abnormality can be detected in time.
In one example, the cleaning processing module 11 may include a control unit 111 and a cleaning processing unit 112, the control unit 111 may be electrically connected to the signal acquisition module 10, and the control unit 111 sends a cleaning control signal to the cleaning processing unit 112 when receiving that the condition of the semiconductor machine acquired by the signal acquisition module 10 is a condition requiring cleaning processing; the cleaning unit 112 receives the cleaning control signal and then performs a cleaning process on the process chamber of the semiconductor machine.
In one example, the cleaning process includes cleaning, purging, and pre-depositing the process chamber of the semiconductor tool. Specifically, at this time, the cleaning unit 112 may include a cleaning device, a purging device, and a pre-deposition device.
In one example, the cleaning processing module 11 may be part of a Material Management (MM) system, and an engineer may perform a Remote command (Remote command) to clean the process chamber based on an operating computer, a production Material and a tool piping system. The control unit 111 in the cleaning process module 11 may also be used to monitor the progress of the cleaning process in real time.
In one example, the machine condition switching condition includes a condition after cleaning processing is finished and a semiconductor machine is in equipment maintenance, downtime or abnormal condition of the process chamber before cleaning processing; that is, the automatic switching module 12 automatically switches the status of the semiconductor tool to a test status when the semiconductor is in a post-equipment maintenance condition, a downtime condition, or a process chamber abnormal condition before the cleaning process, for example, when the status of the semiconductor tool is equipment maintenance or downtime (PM/DWN), and includes "AT _ XXX" where "XXX" is the name of the type (cleaning, purging, or pre-deposition) that the process chamber is cleaned.
In one example, when the semiconductor machine is in a downtime condition or an abnormal condition of the process chamber, the automatic machine condition switching module 12 is further configured to automatically switch the condition of the semiconductor machine to an equipment maintenance condition while the cleaning processing module 11 is processing the process chamber; specifically, the control unit 111 sends a cleaning control signal to the cleaning processing unit 112 and simultaneously sends a control signal for automatically switching the machine condition to the automatic machine condition switching module 12, and the automatic machine condition switching module 12 automatically switches the condition of the semiconductor machine from a RUN-out (RUN) condition to an equipment maintenance condition.
In one example, please continue to refer to fig. 1, the semiconductor system further includes an authority card control setting module 13, the authority card control setting module 13 may be connected to the control unit 111 in the cleaning processing module 11, the authority card control setting module 13 is configured to set an authority card control for cleaning the process chamber, and the "authority card control" refers to an operation authority only possessed by an engineer in a designated department, an engineer in a designated level, or an engineer in a designated work number. The misoperation of non-professional personnel can be avoided by setting the authority card control, so that the safety is improved.
In an example, the semiconductor system of the present invention further includes a communication module 14, the communication module 14 is connected to the cleaning processing module 11 and the automatic machine condition switching module 12, and the communication module 14 is configured to send a machine testing preparation instruction when the cleaning processing module 11 performs a cleaning process on the process chamber, and send a machine testing instruction when the condition of the semiconductor machine is switched to a machine testing condition. Specifically, the communication module 14 sends the machine test preparation instruction and the machine test instruction to the manufacturing department.
In one example, the communication module 14 may send the machine test preparation instruction and the machine test instruction based on a short message platform, a mailbox or an instant messaging tool.
In another embodiment, as shown in fig. 2, the present invention further discloses a semiconductor processing method, comprising the steps of:
s11, acquiring the condition of a semiconductor machine in real time, and automatically cleaning the process chamber of the semiconductor machine when the semiconductor machine is in the condition that the semiconductor machine needs cleaning;
s12: and after cleaning, automatically switching the state of the semiconductor machine to the state of testing.
According to the semiconductor process method, the process chamber of the semiconductor machine can be automatically cleaned when the semiconductor machine is in a condition needing cleaning, and the condition of the semiconductor machine is automatically switched to the condition of testing the machine after the cleaning is finished, so that the whole process is completely automatic, the manpower and time are greatly reduced, the hidden danger of misoperation is avoided, the normal operation time of the machine is improved, and the productivity of the semiconductor machine is improved.
In one example, the condition of the semiconductor machine requiring cleaning treatment may include a post-equipment maintenance condition, a downtime condition, or a process chamber abnormal condition, etc. Namely, the semiconductor machine is processed when the semiconductor machine is in the state after equipment maintenance, the breakdown state or the abnormal state of the process chamber.
In one example, the process chamber anomaly may include a device failure, an abnormal number of particles in the process chamber of the semiconductor tool, an abnormal film thickness or resistance on an inner wall of the process chamber of the semiconductor tool, or the like. Specifically, taking the film thickness abnormality on the inner wall of the process chamber of the semiconductor machine as an example, the film thickness abnormality mainly refers to that the film thickness deposited on the inner wall of the process chamber of the semiconductor machine is gradually increased along with the increase of the working time of the process chamber, the performance of the process chamber is deteriorated, and the phenomena of abnormal particle count and abnormal film thickness are usually generated; in order to detect an abnormality in time, a threshold (target) is generally set, and when the film thickness on the inner wall of the process chamber reaches the threshold, it is determined that the semiconductor machine is abnormal. In one example, the thickness of the film on the inner wall of the process chamber of the semiconductor machine may be set to 10000 nm.
In one example, the detection device may be used to automatically detect the condition of the semiconductor tool in the process chamber in real time (e.g., the detection device may be used to detect the number of particles in the process chamber and the thickness of the film on the inner wall of the process chamber) to ensure that the abnormality of the semiconductor tool can be detected in time.
In one example, a process chamber of a semiconductor tool may be cleaned using a Material Management (MM) system; specifically, when the semiconductor machine is in a condition requiring cleaning, the production material and machine management system triggers the cleaning process, and the cleaning module 11 in the previous embodiment performs the cleaning process on the process chamber. The production materials and machine management system is a common system in the semiconductor field, and will not be described herein.
In particular, remote commands may be performed to clean the abnormal process chambers based on operating computers and production materials and tool management systems. The production material and machine management system monitors the progress of cleaning treatment in real time.
In one example, the method further comprises the step of setting the authority card control of the cleaning treatment before the cleaning treatment is carried out on the process chamber; specifically, the authority card control can be set in the production material and machine management system, only engineers with corresponding authorities (such as engineers in designated departments, engineers in designated levels or engineers in designated work numbers) can execute remote commands, and misoperation of non-professionals can be avoided.
In one example, as shown in fig. 3, when a semiconductor machine is in a downtime condition or an abnormal condition of a semiconductor chamber, the condition of the semiconductor machine is automatically switched from a running condition to an equipment maintenance condition while the process chamber is cleaned. Of course, when the semiconductor machine is in the equipment maintenance state, the machine state of the semiconductor machine does not need to be switched, as shown in fig. 4.
In one example, the cleaning process includes cleaning (clean), purging (purge), or pre-deposition, etc. of the process chamber of the semiconductor tool. Specifically, the cleaning includes Auto dry cleaning (Auto dry cleaning). The cleaning process performed on the process chamber of the semiconductor machine can restore the environmental status of the process chamber to the environmental status required by the normal process, such as the number of particles in the process chamber is below the threshold value and the film thickness on the inner wall of the process chamber is below the threshold value.
In one example, a process chamber that is abnormal in a semiconductor tool is cleaned and a test preparation command is sent to a manufacturing department to inform the manufacturing department of preparing a test wafer (monitor wafer); specifically, a machine testing preparation instruction can be sent to a manufacturing department based on a short message platform, a mailbox or an instant communication tool, and the manufacturing department can be informed of preparing a machine testing wafer in the form of short messages or mails and the like; more specifically, the production materials and equipment Management system establishes a virtual ID (identity document) of the process chamber for cleaning, binds the virtual ID to an AMS (alarm Management system), and sends an email based on the AMS to inform the manufacturing part that the cleaning process is started to prepare the manufacturing part for testing the wafer. The manufacturing part is informed to prepare the test wafer while the cleaning treatment is carried out, so that the manufacturing part can prepare the test wafer in advance, the testing machine can be carried out at the first time after the cleaning treatment is finished, and the working efficiency is improved; the manufacturing part is informed of the preparation of the test wafer in the form of short message or mail, so that the whole process can be automated, the labor and the time are greatly saved, and the misoperation is avoided.
In one example, the semiconductor machine is in a post-equipment maintenance condition, a downtime condition, or a process chamber exception condition after the cleaning process and before the cleaning process; that is, the status of the semiconductor tool is automatically switched to a machine under test status when the semiconductor is in a post-equipment maintenance condition, a downtime condition, or a process chamber abnormal condition before the cleaning process, and the cleaning process is finished, for example, the status of the semiconductor tool is automatically switched to a machine under test status when the status of the semiconductor tool is equipment maintenance or downtime (PM/DWN) and includes "AT _ XXX", where "XXX" is the name of the type (cleaning, purging, or pre-deposition) that the process chamber is cleaned.
In one example, the condition of the semiconductor machine is switched to the machine testing condition, and simultaneously, the machine testing instruction is sent to a manufacturing department; after the machine testing instruction is sent, the following steps are also included: and testing the semiconductor machine, and releasing the semiconductor machine after the testing is finished.
In one example, a machine testing preparation instruction can be sent to a manufacturing department based on a short message platform, a mailbox or an instant messaging tool, namely the manufacturing department can be informed of the machine testing preparation instruction in the form of a short message or a mail; specifically, a production material and tool management system may be used to inform the manufacturing department that testing may be performed. Specifically, the testing machine is also called a warm-up machine, which is to process a wafer of the testing machine by using a process chamber before the production of processing the product wafer, so that the environment of the process chamber meets the environmental requirement for processing the product wafer.
The whole process of the semiconductor process method is fully automatic, so that the manpower and the time are greatly reduced, the normal operation time of a machine table is improved, and the capacity of the semiconductor machine table is improved; meanwhile, the misoperation risk can be reduced, and the method is safer and more reliable. Compared with the prior art, the semiconductor process method can save about 60% of manpower, can improve about 1% of the normal working time of the semiconductor machine, and can greatly reduce the hidden trouble caused by misoperation time.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (13)
1. A semiconductor system, comprising:
the signal acquisition module is used for acquiring the condition of the semiconductor machine;
the cleaning processing module is used for automatically cleaning a process chamber of the semiconductor machine when the semiconductor machine is in a condition that the semiconductor machine needs to be cleaned;
and the automatic machine condition switching module is used for automatically switching the condition of the semiconductor machine to the machine testing condition after cleaning and when the condition meets the machine condition switching condition.
2. The semiconductor system of claim 1, wherein the cleaning module cleans the process chamber when the semiconductor machine is in a post-equipment maintenance condition, a downtime condition, or an abnormal condition of the process chamber; the machine condition switching condition comprises a condition that the cleaning treatment is finished and the semiconductor machine is in an equipment maintenance state, a downtime state or an abnormal state of the process chamber before the cleaning treatment.
3. The semiconductor system of claim 2, wherein the automatic case switching module is further configured to automatically switch the status of the semiconductor tool to an equipment maintenance status while the cleaning module performs a cleaning process on the process chamber when the semiconductor tool is in a downtime condition or the semiconductor chamber is in an abnormal condition.
4. The semiconductor system of claim 1, further comprising an authority-based-control setting module for setting authority-based control for performing a cleaning process on the process chamber.
5. The semiconductor system of any one of claims 1 to 4, further comprising a communication module for sending a test preparation instruction when the cleaning processing module performs a cleaning process on the process chamber, and sending a test instruction when the status of the semiconductor machine switches to a test status.
6. The semiconductor system of claim 5, wherein the communication module sends the test preparation command and the test command based on a short message platform, a mailbox, or an instant messaging tool.
7. A semiconductor process method is characterized by comprising the following steps:
the method comprises the steps of collecting the condition of a semiconductor machine in real time, and automatically cleaning a process chamber of the semiconductor machine when the semiconductor machine is in a condition needing cleaning;
and after cleaning, automatically switching the state of the semiconductor machine to the state of testing.
8. The semiconductor processing method according to claim 7, wherein the semiconductor machine cleans the process chamber when the semiconductor machine is in a post-equipment maintenance condition, a downtime condition, or an abnormal condition of the process chamber; and after the cleaning treatment is finished, automatically switching to a machine testing state when the semiconductor machine is in a state after equipment maintenance, a downtime state or an abnormal state of the process chamber before the cleaning treatment.
9. The semiconductor processing method according to claim 8, wherein when the semiconductor tool is in a downtime condition or an abnormal condition of the semiconductor chamber, the condition of the semiconductor tool is automatically switched to an equipment maintenance condition while the process chamber is cleaned.
10. The semiconductor processing method of claim 8, wherein the process chamber anomaly comprises an equipment failure, an anomaly in a particle count within a process chamber of the semiconductor tool, an anomaly in a film thickness on an inner wall of a process chamber of the semiconductor tool, or an anomaly in a resistance value.
11. The semiconductor processing method of claim 7, wherein the process chamber is cleaned and a test preparation command is sent to a manufacturing department; the state of the semiconductor machine is switched to a machine testing state, and a machine testing instruction is sent to the manufacturing department; after the machine testing instruction is sent, the following steps are also included: and testing the semiconductor machine, and releasing the semiconductor machine after testing is finished.
12. The semiconductor processing method of claim 7, wherein the cleaning process comprises cleaning, purging, and pre-depositing the process chamber of the semiconductor tool.
13. The semiconductor processing method according to any one of claims 7 to 12, further comprising the step of setting an authority card for cleaning process before the cleaning process is performed on the process chamber.
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| CN113658888A (en) * | 2021-08-16 | 2021-11-16 | 长鑫存储技术有限公司 | Hybrid process control method, device, apparatus and medium |
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| CN113658888A (en) * | 2021-08-16 | 2021-11-16 | 长鑫存储技术有限公司 | Hybrid process control method, device, apparatus and medium |
| CN113658888B (en) * | 2021-08-16 | 2023-07-14 | 长鑫存储技术有限公司 | Hybrid process control method, apparatus, device and medium |
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