CN112782939A - Two-dimensional code manufacturing method based on laser exposure - Google Patents
Two-dimensional code manufacturing method based on laser exposure Download PDFInfo
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- CN112782939A CN112782939A CN201911087742.1A CN201911087742A CN112782939A CN 112782939 A CN112782939 A CN 112782939A CN 201911087742 A CN201911087742 A CN 201911087742A CN 112782939 A CN112782939 A CN 112782939A
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- Prior art keywords
- sample
- dimensional code
- method based
- laser exposure
- processed
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
- G03F7/2053—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/3014—Imagewise removal using liquid means combined with ultrasonic means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
Abstract
The invention discloses a two-dimensional code manufacturing method based on laser exposure, belonging to the technical field of laser micromachining, and the manufacturing method comprises the following steps: expanding the beam by 5 times, and adding a power attenuation sheet into the optical path system; adjusting the focus of a light beam to focus on the surface of a workpiece to be processed, accurately positioning the workpiece through a CCD (charge coupled device), drawing a two-dimensional code through software, and adjusting processing parameters to perform exposure processing on a sample to be processed; immersing the exposed sample in a developing solution, carrying out ultrasonic-assisted oscillation, cleaning the sample in an ultrasonic cleaner filled with deionized water, and airing to obtain a developed sample; immersing the developed sample into a copper etching solution, carrying out ultrasonic-assisted oscillation for 60s, cleaning and naturally drying to obtain a two-dimensional code sample; the method has the advantages of high processing efficiency, high definition and high contrast of the two-dimensional code, is convenient for quickly and reliably identifying the two-dimensional code, and is not easy to age.
Description
Technical Field
The invention relates to the technical field of laser micromachining, in particular to a two-dimensional code manufacturing method based on laser exposure.
Background
In industry, enterprises often need to perform informatization management and anti-counterfeiting on corresponding products in the process of producing display panels, so that some informatization processing needs to be performed on the surfaces of the products, such as laser etching of two-dimensional codes, printing of two-dimensional codes by coloring agents, corrosion of two-dimensional codes by chemical solutions, and the like. However, the two-dimensional code manufactured on the surface of some display panels has the following disadvantages: the laser is used for directly etching the two-dimensional code, the function of the display panel is possibly influenced due to high laser energy density, and smoke dust is easily generated; printing the two-dimensional code by using a coloring agent, wherein the two-dimensional code can fade after a long time, so that the identification of the two-dimensional code is influenced; the two-dimensional code is corroded by chemical solution, so that the two-dimensional code is harmful to human bodies and can cause environmental pollution. Therefore, how to solve the above-mentioned defects becomes a problem to be solved by the present invention.
Disclosure of Invention
The invention aims to overcome the defects in the prior art, provides a two-dimensional code manufacturing method based on laser exposure, and has the characteristics of improvement of production efficiency, high definition and contrast of a two-dimensional code, convenience for quick and reliable identification and the like.
In order to achieve the purpose, the invention adopts the following technical scheme:
the invention discloses a two-dimensional code manufacturing method based on laser exposure, which comprises the following processing steps:
the method comprises the following steps: designing an optical path system according to the characteristics of a sample, expanding the light beam by 5 times, and adding a power attenuation sheet into the optical path system;
step two: adjusting the focus of a light beam to focus on the surface of a sample to be processed, accurately positioning the light beam through a CCD (charge coupled device), drawing a two-dimensional code through software, and adjusting processing parameters to perform exposure processing on the sample to be processed;
step three, immersing the exposed sample into a developing solution, carrying out ultrasonic-assisted oscillation for 30s, then putting the sample into an ultrasonic cleaner filled with deionized water for cleaning, and drying the sample by blowing with cold air or naturally drying at room temperature after cleaning to obtain a developed sample;
step four: and immersing the developed sample into a copper etching solution, carrying out ultrasonic-assisted oscillation for 60s, then putting the sample into an ultrasonic cleaner filled with deionized water for cleaning, and drying the sample by using cold air or naturally airing the sample at room temperature to obtain a two-dimensional code finished product.
And step two, the light source of the laser is ultraviolet light, and the pulse width is nanosecond.
Further, the number of bits of the two-dimensional code is 30 bits.
Furthermore, the ultrasonic frequency in the third step is 20KHz, the ultrasonic frequency in the fourth step is 50-150KHz, and the scanning speed is 200-900 mm/s.
Furthermore, the sample to be processed is a multi-layer material, the upper surface layer is a photoresist, the middle layer is copper, and the lower surface layer is PET.
Further, the area of the sample to be processed is 0.5 × 0.5-3 × 3mm2。
Further, the processing platform is fixed on the linear motor moving platform, the sample is placed on the processing platform, and the sample is fixed through the vacuum adsorption system.
Compared with the prior art, the invention has the beneficial effects that: the method (ultrasonic assistance) for manufacturing the two-dimensional code based on the laser exposure technology is adopted, so that the product quality stability and the production efficiency are improved; the CCD is accurately positioned, and the laser automatic exposure process is controlled by the computer, so that the permanence and reliability identification of the product identification are realized, and the information management requirements and the anti-counterfeiting technical requirements of the product are met.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the following embodiments of the present invention, and it should be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
A two-dimensional code manufacturing method based on laser exposure comprises the following processing steps:
the method comprises the following steps: designing an optical path system according to the characteristics of a sample, expanding the light beam by 5 times, and adding a power attenuation sheet into the optical path system;
step two: a nanometer ultraviolet laser is adopted to adjust the focus of a light beam, so that the focus is focused on the surface of a sample to be processed, the CCD is used for carrying out accurate positioning, a two-dimensional code is drawn through software, the number of bits of the two-dimensional code is 30, and the processing parameters are well adjusted to carry out exposure processing on the sample to be processed;
step three, immersing the exposed sample into a developing solution, carrying out ultrasonic-assisted oscillation for 30s, then putting the sample into an ultrasonic cleaner filled with deionized water for cleaning, and drying the sample by blowing with cold air or naturally drying at room temperature after cleaning to obtain a developed sample;
step four: and immersing the developed sample into a copper etching solution, carrying out ultrasonic-assisted oscillation for 60s, then putting the sample into an ultrasonic cleaner filled with deionized water for cleaning, and drying the sample by using cold air or naturally airing the sample at room temperature to obtain a two-dimensional code finished product.
Wherein, the laser in the second step is a nano ultraviolet laser, the light source is ultraviolet light, the pulse width is nanosecond, the ultrasonic frequency in the third step is 20KHz, the ultrasonic frequency in the fourth step is 50-150KHz, the scanning speed is 200-900mm/s, preferably, the ultrasonic frequency in the fourth step is 100KHz, and the scanning speed is 600 mm/s.
The sample to be processed is a multi-layer material, the upper surface layer is a photoresist, the middle layer is copper, the lower surface layer is PET, and the area of the sample to be processed is 0.5 multiplied by 0.5-3 multiplied by 3mm2。
The processing platform is fixed on the linear motor moving platform, the sample is placed on the processing platform, and the sample is fixed through the vacuum adsorption system.
The invention provides a two-dimensional code manufacturing method based on a laser exposure technology, which can not only avoid generating smoke dust in the processing process, but also improve the production efficiency by utilizing ultrasonic wave to assist the developing and copper etching processes after exposure.
By adopting the manufacturing method, the two-dimensional code with high definition and high contrast can be obtained, and the quick and reliable identification is facilitated.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (6)
1. A two-dimensional code manufacturing method based on laser exposure is characterized in that: the processing steps comprise:
the method comprises the following steps: designing an optical path system according to the characteristics of a sample, expanding the light beam by 5 times, and adding a power attenuation sheet into the optical path system;
step two: adjusting the focus of a light beam to focus on the surface of a sample to be processed, accurately positioning the light beam through a CCD (charge coupled device), drawing a two-dimensional code through software, and adjusting processing parameters to perform exposure processing on the sample to be processed;
step three, immersing the exposed sample into a developing solution, carrying out ultrasonic-assisted oscillation for 30s, then putting the sample into an ultrasonic cleaner filled with deionized water for cleaning, and drying the sample by blowing with cold air or naturally drying at room temperature after cleaning to obtain a developed sample;
step four: and immersing the developed sample into a copper etching solution, carrying out ultrasonic-assisted oscillation for 60s, then putting the sample into an ultrasonic cleaner filled with deionized water for cleaning, and drying the sample by using cold air or naturally airing the sample at room temperature to obtain a two-dimensional code finished product.
And step two, the light source of the laser is ultraviolet light, and the pulse width is nanosecond.
2. The two-dimensional code manufacturing method based on laser exposure according to claim 1, characterized in that: the number of bits of the two-dimensional code is 30 bits.
3. The two-dimensional code manufacturing method based on laser exposure according to claim 1, characterized in that: the ultrasonic frequency in the third step is 20KHz, the ultrasonic frequency in the fourth step is 50-150KHz, and the scanning speed is 200-900 mm/s.
4. The two-dimensional code manufacturing method based on laser exposure according to claim 1, characterized in that: the sample to be processed is made of a multi-layer material, the upper surface layer is made of photoresistance, the middle layer is made of copper, and the lower surface layer is made of PET.
5. The two-dimensional code manufacturing method based on laser exposure according to claim 1, characterized in that: the area of the sample to be processed is 0.5 multiplied by 0.5 to 3 multiplied by 3mm2。
6. The two-dimensional code manufacturing method based on laser exposure according to claim 1, characterized in that: the processing platform is fixed on the linear motor moving platform, the sample is placed on the processing platform, and the sample is fixed through the vacuum adsorption system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911087742.1A CN112782939A (en) | 2019-11-08 | 2019-11-08 | Two-dimensional code manufacturing method based on laser exposure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911087742.1A CN112782939A (en) | 2019-11-08 | 2019-11-08 | Two-dimensional code manufacturing method based on laser exposure |
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| Publication Number | Publication Date |
|---|---|
| CN112782939A true CN112782939A (en) | 2021-05-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911087742.1A Pending CN112782939A (en) | 2019-11-08 | 2019-11-08 | Two-dimensional code manufacturing method based on laser exposure |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6558878B1 (en) * | 1999-07-08 | 2003-05-06 | Korea Electronics Technology Institute | Microlens manufacturing method |
| US20080213690A1 (en) * | 2005-05-30 | 2008-09-04 | Pioneer Corporation | Resist Material and Electron Beam Recording Resist Material |
| US20090013724A1 (en) * | 2006-02-22 | 2009-01-15 | Nippon Sheet Glass Company, Limited | Glass Processing Method Using Laser and Processing Device |
| CN108875968A (en) * | 2018-06-06 | 2018-11-23 | 中山新诺科技股份有限公司 | Generation method, product code printing method and the production method of product identification information |
| US20180340262A1 (en) * | 2015-08-31 | 2018-11-29 | Nippon Sheet Glass Company, Limited | Method for producing glass with fine structure |
| CN109848564A (en) * | 2018-12-28 | 2019-06-07 | 武汉华工激光工程有限责任公司 | A kind of laser processing of glass material surface frosting |
-
2019
- 2019-11-08 CN CN201911087742.1A patent/CN112782939A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6558878B1 (en) * | 1999-07-08 | 2003-05-06 | Korea Electronics Technology Institute | Microlens manufacturing method |
| US20080213690A1 (en) * | 2005-05-30 | 2008-09-04 | Pioneer Corporation | Resist Material and Electron Beam Recording Resist Material |
| US20090013724A1 (en) * | 2006-02-22 | 2009-01-15 | Nippon Sheet Glass Company, Limited | Glass Processing Method Using Laser and Processing Device |
| US20180340262A1 (en) * | 2015-08-31 | 2018-11-29 | Nippon Sheet Glass Company, Limited | Method for producing glass with fine structure |
| CN108875968A (en) * | 2018-06-06 | 2018-11-23 | 中山新诺科技股份有限公司 | Generation method, product code printing method and the production method of product identification information |
| CN109848564A (en) * | 2018-12-28 | 2019-06-07 | 武汉华工激光工程有限责任公司 | A kind of laser processing of glass material surface frosting |
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Application publication date: 20210511 |