CN112776237A - Pouring type resin-based distributed optical fiber sensor packaging device - Google Patents
Pouring type resin-based distributed optical fiber sensor packaging device Download PDFInfo
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- CN112776237A CN112776237A CN202011589553.7A CN202011589553A CN112776237A CN 112776237 A CN112776237 A CN 112776237A CN 202011589553 A CN202011589553 A CN 202011589553A CN 112776237 A CN112776237 A CN 112776237A
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- Prior art keywords
- optical fiber
- distributed optical
- grooves
- casting mold
- temperature
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
- B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/22—Component parts, details or accessories; Auxiliary operations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/22—Component parts, details or accessories; Auxiliary operations
- B29C39/26—Moulds or cores
Abstract
The invention discloses a pouring type resin-based distributed optical fiber sensor packaging device, belongs to the technical field of distributed optical fiber sensors, and aims to solve the problem that the preparation of large-size products is difficult to realize by the existing pouring type molding process. It includes: the device comprises a casting mold, a vulcanizing platform, an operating bench, a heat insulation plate, a heating pipe and a temperature control box; the heat insulation plate is laid above the operation bench, the casting mold and the vulcanizing platform are laid on the heat insulation plate at intervals, grooves are formed in the lower portions of the casting mold and the vulcanizing platform, the heating pipes are laid in the grooves, and the heating ends of the heating pipes are connected with the temperature control box. The temperature control box is characterized by further comprising a temperature sensor, wherein the temperature sensor is arranged in a hole reserved in the side face of the casting mold, monitors the temperature of the mold in real time, and transmits the temperature acquired through real-time monitoring to the temperature control box. The invention is used for realizing the encapsulation of the distributed optical fiber or the quasi-distributed optical fiber grating string by various pouring type resins.
Description
Technical Field
The invention relates to a pouring type resin-based distributed optical fiber sensor packaging device, and belongs to the technical field of distributed optical fiber sensors.
Background
Compared with the traditional sensor, the optical fiber sensor has the advantages of light weight, small volume, high sensitivity, corrosion resistance, electromagnetic interference resistance, distributable or quasi-distributed measurement and the like, is widely concerned in various fields since the world, develops rapidly, and is applied to various fields of petrochemical industry, civil construction, aerospace and the like.
Common fiber sensors can be classified into point type fiber sensors and distributed fiber sensors. The distributed optical fiber sensor comprises a quasi-distributed type and a full-distributed type from a broad perspective. The sensors of the point type optical fiber sensing technology are discretely arranged at the local positions of the structure, so that the local strain, temperature and pressure of the structure can be accurately measured, but the multipoint sensors are complex in circuit and poor in system integration. The quasi-distributed optical fiber sensing technology is characterized in that a plurality of point type sensors are connected through an optical fiber multiplexing technology, and multipoint large-range measurement can be achieved. The distributed optical fiber sensing technology is a sensor which measures or monitors information which is distributed along the space of an optical fiber transmission path and changes along time by adopting the geometric one-dimensional characteristics of the optical fiber, and simultaneously obtains the parameter change condition of each measuring point along the whole length of the optical fiber axis, thereby remarkably embodying the advantages of optical fiber distribution and extension. Compared with point type sensing, distributed sensing is more suitable for large-scale application, and the system integration is better.
The bare optical fiber is small and easy to be brittle-broken, and the construction environment of various engineering structures is severe and extensive, so that the bare optical fiber is essential to be packaged. The packaging material of the optical fiber sensor not only can play a role in protecting the sensing element, but also different packaging materials can have a certain adjusting function on the sensitivity of the sensor. The existing distributed optical fiber packaging technology generally adopts sheath type packaging of mixing of high polymer materials and metals, and certain problems of stability, accuracy, structural deformation matching and durability exist in the health monitoring process of an actual engineering structure. The resin material has wide types, strong plasticity, good processing performance, wide application range, high surface smoothness, good product flexibility, corrosion resistance, high and low temperature resistance, ageing resistance and long service life, and the style, the color or the size can be designed according to requirements.
Therefore, the encapsulation of the distributed optical fiber by using the casting resin is a new approach for encapsulation of the distributed optical fiber sensor. However, the conventional casting molding process is limited by space in the packaging process, and is difficult to realize the preparation of large-size products.
Disclosure of Invention
The invention aims to solve the problem that the preparation of large-size products is difficult to realize by the existing casting molding process, and provides a casting resin-based distributed optical fiber sensor packaging device.
The invention relates to a pouring type resin-based distributed optical fiber sensor packaging device, which comprises: the device comprises a casting mold, a vulcanizing platform, an operating bench, a heat insulation plate, a heating pipe and a temperature control box;
the heat insulation plate is laid above the operation bench, the casting mold and the vulcanizing platform are laid on the heat insulation plate at intervals, grooves are formed in the lower portions of the casting mold and the vulcanizing platform, the heating pipes are laid in the grooves, and the heating ends of the heating pipes are connected with the temperature control box.
Preferably, the grooves formed below the casting mold and the vulcanizing platform are U-shaped grooves which are arranged at equal intervals.
Preferably, a plurality of casting mold grooves are formed in the upper surface of the casting mold at equal intervals, special-shaped grooves are formed in the upper end portions of the casting mold grooves, and the special-shaped grooves are used for mounting the optical fiber clamping pieces; and the position of the casting mold groove is flush with that of the U-shaped groove.
Preferably, the vulcanizing platform is flush with the casting mold groove on the upper surface of the casting mold.
Preferably, the device also comprises a temperature sensor, wherein the temperature sensor is arranged in a hole reserved in the side surface of the casting mold, monitors the temperature of the mold in real time, and transmits the temperature acquired by real-time monitoring to the temperature control box.
Preferably, the optical fiber cable further comprises an optical fiber clamping sheet and a butterfly screw, the optical fiber clamping sheet is arranged on one side of the operating rack, and the optical fiber clamping sheet and the butterfly screw are matched to fix the optical fiber or the armored wire.
The pouring type resin-based distributed optical fiber sensor packaging device provided by the invention has the following advantages:
1. the distributed optical fiber sensor is prepared by adopting a segmented molding mode, so that the space limitation in the packaging process of the traditional packaging process is overcome, the segmented interface bonding condition is good, and the problem that the preparation of a large-size product is difficult to realize by the existing casting molding process is solved;
2. the whole process from preheating, pouring, curing, demoulding to vulcanizing of the casting resin is integrated in a complete device system, so that one-stop processing of resin matrix molding is realized;
3. the preparation method has wide applicability, is suitable for various resin materials, supports various pouring, forming and vulcanizing temperatures, and can realize the preparation of the fully-distributed optical fiber sensor and the quasi-distributed optical fiber sensor with various dimensions.
4. The proper resin type can be adopted according to the actual requirements of engineering, and the formula can be adjusted as required, so that the prepared distributed optical fiber sensor has the advantages of wide application range, high surface smoothness, good product flexibility, corrosion resistance, high and low temperature resistance, ageing resistance and long service life.
Drawings
FIG. 1 is a schematic structural diagram of a potting resin-based distributed optical fiber sensor packaging device according to the present invention;
FIG. 2 is a schematic view of the construction of a casting mold, heating tubes, temperature sensors and insulation panels;
FIG. 3 is a schematic structural view of a casting mold;
FIG. 4 is a schematic structural view of a vulcanization platform;
FIG. 5 is a schematic structural view of an operating bench, fiber holding pieces and thumb screws;
FIG. 6 is a schematic structural view of the fiber holding member, including fiber holding members 10a and 10b, with intermediate sections interfacing;
fig. 7 is a schematic view of the head-end structure of the distributed optical fiber sensor.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict.
The first embodiment is as follows: the present embodiment is described below with reference to fig. 1 to 5, and the resin-based distributed optical fiber sensor packaging apparatus according to the present embodiment includes: the device comprises a casting mould 1, a vulcanizing platform 2, an operating bench 9, a heat insulation plate 5, a heating pipe 3 and a temperature control box 6;
a heat insulation plate 5 is laid above the operating rack 9, a pouring mold 1 and a vulcanizing platform 2 are laid on the heat insulation plate 5 at intervals, grooves are formed in the lower portions of the pouring mold 1 and the vulcanizing platform 2, heating pipes 3 are laid in the grooves, and the heating ends of the heating pipes 3 are connected with a temperature control box 6.
In the embodiment, the casting mold 1 and the vulcanizing platform 2 are arranged at intervals without limiting the number of the combinations, and the long-size distributed optical fiber sensor is prepared by adopting the sectional molding and vulcanizing processes.
Further, as shown in fig. 2 to 4, the grooves formed below the casting mold 1 and the vulcanizing platform 2 are U-shaped grooves, and the U-shaped grooves are arranged at equal intervals.
Still further, as shown in fig. 3, a plurality of casting mold grooves 14 are arranged on the upper surface of the casting mold 1 at equal intervals, the upper end portions of the casting mold grooves 14 are provided with special-shaped grooves 15, and the special-shaped grooves 15 are used for installing optical fiber clamping pieces; and the casting mold groove 14 is flush with the U-shaped groove.
In this embodiment, the plurality of casting mold grooves 14 are preset on the upper surface of the casting mold 1, and the shape and the size are not limited, so that the casting mold can be used for casting and molding resin substrates with different cross-sectional forms and sizes.
Still further, the vulcanizing platform 2 is flush with the casting mold groove 14 on the upper surface of the casting mold 1.
In the embodiment, the resin-based distributed optical fiber sensor packaged by the casting mold 1 can be directly translated to the vulcanizing platform 2 for vulcanizing after being demolded. The heating pipes 3 arranged in the U-shaped grooves with the equal-distance and uniform distribution at the bottom can enable the vulcanizing platform 2 to reach the vulcanizing temperature of the used resin.
Still further, as shown in fig. 2, it further includes a temperature sensor 4, the temperature sensor 4 is disposed in a hole reserved on the side surface of the casting mold 1, monitors the temperature of the mold in real time, and transmits the temperature obtained by real-time monitoring to the temperature control box 6.
Still further, as shown in fig. 1 and 5, the optical fiber connector further includes an optical fiber clamping sheet 8 and a butterfly screw 7, the optical fiber clamping sheet 8 is disposed on one side of the operating platform 9, and the optical fiber clamping sheet 8 and the butterfly screw 7 are matched to fix an optical fiber or a wiring harness.
In this embodiment, the upper surface of the operating platform 9 is preset with internal threads for fixing the optical fiber or the armor wire by matching with the butterfly screw 7 and the optical fiber clamping piece 8, so as to ensure that the optical fiber is in a pre-tensioned state.
In the present invention, the casting mold 1 may be made of a material having a small thermal deformation, such as steel or aluminum alloy, and is suitable for molding various resin materials. The size of the casting mold 1 is not limited, and the length and the width of the mold can be adjusted according to actual preparation requirements. The size of the U-shaped groove arranged below can be adjusted according to the size of the die and the size of the heating pipe.
In the invention, the heat insulation plate 5 is selected to have heat insulation and heat resistance effects, so that the heat of the heating pipe is ensured to be conducted downwards as little as possible. For example, mica plate, glass fiber plate, vacuum insulation plate and other materials can be used.
In the invention, the temperature control box 6 has a temperature self-control function and is connected with the temperature sensor 4 to accurately control the temperature of the casting mold.
In the invention, when the fully-distributed optical fiber sensor is prepared, as shown in fig. 6, the optical fiber clamping piece comprises the optical fiber clamping pieces 10a and 10b with the middle sections connected, and the connection performance of the substrate with two segmented and poured sides can be improved by matching the optical fiber clamping pieces with the optical fiber clamping pieces.
In the invention, the structure of the head end and the tail end of the distributed optical fiber sensor is shown in fig. 7, and an optical fiber protection tube 11, an armor wire 12 and an end metal anchor head 13 are used for protecting the gauge length head end and the tail end of the fully distributed optical fiber sensor and the quasi-distributed optical fiber sensor.
In the invention, when the pouring type resin-based distributed optical fiber sensor packaging device provided by the invention is used for packaging an optical fiber, the heating pipe 3, the temperature sensor 4, the heat insulation plate 5 and the temperature control box 6 are arranged on the operation bench 9, the optical fiber is respectively clamped and fixed on the pouring mold 1 and the operation bench 9 through the optical fiber clamping piece 10 and the optical fiber clamping piece 8, and attention should be paid to keeping the optical fiber in a pre-tensioning state during clamping. The heating pipe 3 is controlled by the temperature control box 6 to preheat the casting mould 1 and the vulcanizing platform 2 so as to reach the mould use temperature meeting the resin casting requirement. After the mold preheating and the resin batching are finished, the casting is carried out along each mold, and after the resin meets the demolding requirement, the molded resin matrix with the optical fiber is moved to a vulcanizing platform 2 for vulcanizing. And after the sectional pouring, the molding and the vulcanization, placing the complete distributed optical fiber sensor at room temperature for corresponding time according to the post-vulcanization requirement of the used resin, and finally obtaining a finished product of the pouring type resin-based distributed optical fiber sensor.
If the fully-distributed optical fiber sensor is prepared, the head end and the tail end of the fully-distributed optical fiber sensor are assembled and clamped in advance according to an optical fiber protection pipe 11, an armor wire 12 and a metal anchor head 13 shown in fig. 7 so as to ensure the head end and the tail end of the fully-distributed optical fiber sensor to be completely packaged, and the middle part of the fully-distributed optical fiber sensor can be sequentially molded by continuous casting in a segmented manner according to the method. If the quasi-distributed optical fiber sensor is prepared, the fiber bragg grating string is adopted for clamping, the fiber bragg grating section is arranged on the casting mold section, the non-sensing section is arranged on the vulcanizing platform section, and the fiber bragg grating protective tube 11, the armor wire 12 and the metal anchor head 13 are sleeved outside in advance to serve as protection according to the graph shown in figure 7. And clamping the optical fiber which is not cast with resin and is still bare again according to requirements, and performing secondary casting and vulcanization.
Although the invention herein has been described with reference to particular embodiments, it is to be understood that these embodiments are merely illustrative of the principles and applications of the present invention. It is therefore to be understood that numerous modifications may be made to the illustrative embodiments and that other arrangements may be devised without departing from the spirit and scope of the present invention as defined by the appended claims. It should be understood that features described in different dependent claims and herein may be combined in ways different from those described in the original claims. It is also to be understood that features described in connection with individual embodiments may be used in other described embodiments.
Claims (6)
1. A pouring type resin-based distributed optical fiber sensor packaging device is characterized by comprising: the device comprises a casting mold (1), a vulcanization platform (2), an operation bench (9), a heat insulation plate (5), a heating pipe (3) and a temperature control box (6);
heat insulation plates (5) are laid above the operating rack (9), casting molds (1) and vulcanizing platforms (2) are laid on the heat insulation plates (5) at intervals, grooves are formed in the lower portions of the casting molds (1) and the vulcanizing platforms (2), heating pipes (3) are laid in the grooves, and the heat supply ends of the heating pipes (3) are connected with a temperature control box (6).
2. A poured resin-based distributed optical fiber sensor packaging device according to claim 1, wherein the grooves disposed below the pouring mold (1) and the vulcanizing platform (2) are U-shaped grooves, and the U-shaped grooves are disposed at equal intervals.
3. A poured resin-based distributed optical fiber sensor packaging device according to claim 2, wherein a plurality of pouring mold grooves (14) are arranged on the upper surface of the pouring mold (1) at equal intervals, the upper end parts of the pouring mold grooves (14) are provided with special-shaped grooves (15), and the special-shaped grooves (15) are used for installing optical fiber clamping pieces; and the casting mold groove (14) is flush with the U-shaped groove.
4. A poured resin-based distributed optical fiber sensor package according to claim 3, wherein the vulcanization platform (2) is flush with the position of the casting mold groove (14) on the upper surface of the casting mold (1).
5. A poured resin-based distributed optical fiber sensor packaging device according to any one of claims 1-4, characterized in that it further comprises a temperature sensor (4), the temperature sensor (4) is disposed in a hole reserved on the side surface of the pouring mold (1), monitors the temperature of the mold in real time, and transmits the temperature obtained by real-time monitoring to the temperature control box (6).
6. A poured resin-based distributed optical fiber sensor packaging device according to claim 5, further comprising an optical fiber holding sheet (8) and a butterfly screw (7), wherein the optical fiber holding sheet (8) is disposed on one side of the operation bench (9), and the optical fiber holding sheet (8) and the butterfly screw (7) are matched to fix an optical fiber or a wiring harness.
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| CN202011589553.7A CN112776237B (en) | 2020-12-28 | 2020-12-28 | Pouring type resin-based distributed optical fiber sensor packaging device |
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| CN202011589553.7A CN112776237B (en) | 2020-12-28 | 2020-12-28 | Pouring type resin-based distributed optical fiber sensor packaging device |
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