CN112775089A - Silicon chip washs effluent disposal system - Google Patents
Silicon chip washs effluent disposal system Download PDFInfo
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- CN112775089A CN112775089A CN202011608724.6A CN202011608724A CN112775089A CN 112775089 A CN112775089 A CN 112775089A CN 202011608724 A CN202011608724 A CN 202011608724A CN 112775089 A CN112775089 A CN 112775089A
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- tank
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
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- Cleaning By Liquid Or Steam (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses a silicon wafer cleaning wastewater treatment system which comprises an overflow tank group communicated with the downstream of a cleaning machine, wherein the overflow tank group comprises a plurality of rinsing tanks, a chemical washing tank and an ultrasonic tank, the downstream of each rinsing tank is communicated with a transfer tank, the downstream of each transfer tank is communicated with a pumping pipeline, a water supply pump is arranged on each pumping pipeline, the downstream of each pumping pipeline is respectively communicated with a first main pipeline communicated with a degumming machine and a second main pipeline communicated with a chip inserting machine, and the first main pipeline is connected with the second main pipeline in parallel. The system can fully recycle the waste water discharged by the cleaning machine, effectively avoid resource waste and reduce the waste water discharge pressure, and can supply water for the degumming machine, and the water temperature can meet the working requirement of the degumming machine.
Description
Technical Field
The invention relates to the technical field of silicon wafer cleaning equipment matching systems, in particular to a silicon wafer cleaning wastewater treatment system.
Background
The existing cleaning machine can generate a large amount of waste water in the silicon wafer cleaning process, the waste water is subjected to purification treatment after overflowing and filtering through a plurality of rinsing tanks and is finally discharged to the external environment, and due to the fact that the workload of the equipment is large, the discharged water amount is large, and the operation pressure of related waste water treatment equipment is large.
On the other hand, the water temperature required by the working operation of the components such as the chemical feeding tank, the spraying tank and the like of the degumming machine is high, and the water supplied to the degumming machine by the conventional system needs to be heated by a heating device, so that energy consumption is generated. The water in the rinsing tank of the cleaning machine can still keep higher water temperature under the influence of equipment, and the water in the rinsing tank is purified after being gradually overflowed and filtered by the upstream multistage rinsing tank, so that the water quality and the water temperature can completely meet the use requirements of the degumming machine.
Therefore, how to utilize the wastewater discharged by the cleaning machine, avoid resource waste, reduce the wastewater discharge pressure, and ensure that the water temperature supplied to the degumming machine can meet the working requirement of the degumming machine is an important technical problem to be solved by the technical personnel in the field at present.
Disclosure of Invention
The invention aims to provide a silicon wafer cleaning wastewater treatment system which can fully recycle wastewater discharged by a cleaning machine, effectively avoid resource waste and reduce the discharge pressure of the wastewater, can supply water for a degumming machine, and can meet the working requirement of the degumming machine by the water temperature.
In order to solve the technical problem, the invention provides a silicon wafer cleaning wastewater treatment system which comprises an overflow tank group communicated with the downstream of a cleaning machine, wherein the overflow tank group comprises a plurality of rinsing tanks, a chemical washing tank and an ultrasonic tank, the downstream of each rinsing tank is communicated with a transfer tank, the downstream of each transfer tank is communicated with a pumping pipeline, a water supply pump is arranged on each pumping pipeline, the downstream of each pumping pipeline is respectively communicated with a first main pipeline communicated with a degumming machine and a second main pipeline communicated with a chip inserting machine, and the first main pipeline is connected with the second main pipeline in parallel.
Preferably, the downstream of the transit tank is also communicated with a direct supply pipeline directly communicated with the degumming machine, and the direct supply pipeline is connected in parallel with the pumping pipeline.
Preferably, an electromagnetic valve is arranged on the direct supply pipeline.
Preferably, the transfer tanks correspond to the degumming machine one by one, the overflow tank groups correspond to the cleaning machine one by one, and each transfer tank is communicated with at least two overflow tank groups.
Preferably, 4 rinsing tanks in each overflow tank group are communicated with the transfer tank.
Compared with the background art, in the silicon wafer cleaning wastewater treatment system provided by the invention, in the working operation process, water subjected to overflow filtration in each rinsing tank is converged into the transfer tank to be stored in a centralized manner, and then the water which is relatively pure and still keeps relatively high temperature in the transfer tank is pumped to the degumming machine and the wafer inserting machine through the first main pipeline by the water supply pump, so that the working requirements of the chemical feeding tank, the spraying tank and related components of the wafer inserting machine of the degumming machine are met. Whole effluent disposal system operation is high-efficient, and only need utilize existing equipment to carry out simple pipeline transformation and can operate, and design cost and repacking cost are lower, can reduce the waste water treatment and the discharge pressure after the silicon chip washs by a wide margin, improve waste water utilization ratio to can provide for equipment such as degumming machine and insert machine and possess higher temperature and comparatively pure water, with the work demand that satisfies corresponding equipment, need not to supply the pure water in addition, reduced the whole running cost of equipment by a wide margin.
In another preferable scheme of the invention, a direct supply pipeline directly communicated with the degumming machine is further communicated with the downstream of the transit tank, and the direct supply pipeline is connected in parallel with the pumping pipeline. If the water pressure in the pipeline is sufficient and the water supply requirement of the sheet inserting machine is not large, the water can be directly supplied to the degumming machine through the direct supply pipeline, so that the water temperature loss and the water body loss which are supplied to the degumming machine through the pipeline are further reduced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic view of a silicon wafer cleaning wastewater treatment system according to an embodiment of the present invention.
The device comprises an overflow tank group 11, a rinsing tank 111, a chemical washing tank 112, an ultrasonic tank 113, a transit tank 12, a pumping pipeline 13, a water supply pump 131, a first main pipeline 141, a second main pipeline 142, a direct supply pipeline 15, an electromagnetic valve 151, a cleaning machine 21, a degumming machine 22 and a sheet inserting machine 23.
Detailed Description
The core of the invention is to provide a silicon wafer cleaning wastewater treatment system, which can fully recycle wastewater discharged by a cleaning machine, effectively avoid resource waste and reduce wastewater discharge pressure, and can supply water for a degumming machine, and the water temperature can meet the working requirement of the degumming machine.
In order that those skilled in the art will better understand the disclosure, the invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
Referring to fig. 1, fig. 1 is a schematic view illustrating a configuration of a silicon wafer cleaning wastewater treatment system according to an embodiment of the present invention.
In a specific embodiment, the silicon wafer cleaning wastewater treatment system provided by the invention comprises an overflow tank group 11 communicated with the downstream of a cleaning machine 21, wherein the overflow tank group 11 comprises a plurality of rinsing tanks 111, a chemical washing tank 112 and an ultrasonic tank 113, a transit tank 12 is communicated with the downstream of the rinsing tank 111, a pumping pipeline 13 is communicated with the downstream of the transit tank 12, a water supply pump 131 is arranged on the pumping pipeline 13, a first main pipeline 141 communicated with a degumming machine 22 and a second main pipeline 142 communicated with a chip inserter 23 are respectively communicated with the downstream of the pumping pipeline 13, and the first main pipeline 141 and the second main pipeline 142 are connected in parallel.
In the working and operating process, the water after overflow filtration in each rinsing tank 111 converges to the transfer tank 12 for centralized storage, and then the water which is relatively pure in the transfer tank 12 and still keeps high temperature is pumped to the degumming machine 22 and the sheet inserting machine 23 through the first main pipeline 141 by the water supply pump 131, so as to meet the working requirements of the chemical feeding tank and the spraying tank of the degumming machine 22 and the relevant components of the sheet inserting machine 23. Whole effluent disposal system operation is high-efficient, and only need utilize existing equipment to carry out simple pipeline transformation and can operate, and design cost and repacking cost are lower, can reduce the waste water treatment and the discharge pressure after the silicon chip washs by a wide margin, improve waste water utilization ratio to can provide for equipment such as degumming machine 22 and insert machine 23 and possess higher temperature and comparatively pure water, with the work demand that satisfies corresponding equipment, need not to supply the pure water in addition, reduced the whole running cost of equipment by a wide margin.
Further, a direct supply pipeline 15 directly communicated with the degumming machine 22 is communicated with the downstream of the transfer tank 12, and the direct supply pipeline 15 is connected with the pumping pipeline 13 in parallel. If the water pressure in the pipeline is sufficient and the water supply requirement of the sheet inserting machine 23 is not large, the water can be directly supplied to the degumming machine 22 through the direct supply pipeline 15, so that the water temperature loss and the water body loss which are supplied to the degumming machine 22 through the pipeline are further reduced.
It should be noted that, during actual assembly and application, temperature measuring devices may be respectively disposed on the direct supply pipeline 15 and the pumping pipeline 13, so as to know whether the water temperature delivered to the degumming machine 22 and the sheet inserting machine 23 through each pipeline is appropriate in real time; a temperature measuring device can be arranged in the transit tank 12 to monitor the water temperature in the transit tank 12 in real time, and whether the water in the transit tank 12 can be directly introduced into the pipeline is judged according to the water temperature, so that the normal operation of downstream equipment is not affected due to overhigh or overlow water temperature.
More specifically, the direct supply line 15 is provided with a solenoid valve 151. In the operation process of the equipment, a worker can control the on-off of the direct supply pipeline 15 by switching on and off the electromagnetic valve 151, so that the water supply from the transfer tank 12 to the degumming machine 22 is ensured to be completed by selecting a proper pipeline under different water pressure states, and the stable operation of the degumming machine 22 is ensured.
On the other hand, the transfer tanks 12 correspond to the degumming machines 22 one by one, the overflow tank groups 11 correspond to the cleaning machines 21 one by one, and each transfer tank 12 is communicated with at least two overflow tank groups 11. The single transfer tank 12 is communicated and matched with the plurality of overflow tank groups 11, so that the water supply efficiency and the pipeline arrangement structure between each overflow tank group 11 and the transfer tank 12 can be further optimized, and the operation efficiency of the whole silicon wafer cleaning wastewater treatment system is further improved.
In addition, 4 rinsing tanks 111 are connected to the intermediate tank 12 in each overflow tank group 11. In practical applications, the number of the rinsing tanks 111 in the single overflow tank group 11 is 10 in total considering that the number of the rinsing tanks 111, the chemical washing tank 112 and the ultrasonic tank 113 arranged in each overflow tank group 11 is generally 4, so that the operation requirements of the equipment such as the degumming machine 22 and the sheet inserting machine 23 can be met.
It should be particularly noted that the number of the rinsing tanks 111 in the overflow tank group 11, which are communicated with the transfer tank 12, is only used as an example for a preferred scheme, and for overflow tank groups 11 of different specifications, because the overflow tank groups have different numbers of rinsing tanks 111, the number of the rinsing tanks 111 in which water meets requirements and can be communicated with the transfer tank 12 is also not determined, and in practical application, a worker can comprehensively consider and flexibly select according to specific working condition requirements and in combination with actual water quality in each rinsing tank 111, and in principle, it is preferable to ensure that the water meets the normal working requirements of the degumming machine 22 and the sheet inserting machine 23 and meets the actual operating requirements of the silicon wafer cleaning wastewater treatment system.
In summary, in the silicon wafer cleaning wastewater treatment system provided by the invention, in the working operation process, water subjected to overflow filtration in each rinsing tank is converged into the transfer tank to be stored in a centralized manner, and then the water which is relatively pure and still keeps relatively high temperature in the transfer tank is pumped to the degumming machine and the wafer inserting machine through the first main pipeline by the water supply pump, so that the working requirements of the chemical feeding tank, the spraying tank and related components of the wafer inserting machine of the degumming machine are met. Whole effluent disposal system operation is high-efficient, and only need utilize existing equipment to carry out simple pipeline transformation and can operate, and design cost and repacking cost are lower, can reduce the waste water treatment and the discharge pressure after the silicon chip washs by a wide margin, improve waste water utilization ratio to can provide for equipment such as degumming machine and insert machine and possess higher temperature and comparatively pure water, with the work demand that satisfies corresponding equipment, need not to supply the pure water in addition, reduced the whole running cost of equipment by a wide margin.
The silicon wafer cleaning wastewater treatment system provided by the invention is described in detail above. The principles and embodiments of the present invention are explained herein using specific examples, which are presented only to assist in understanding the method and its core concepts. It should be noted that, for those skilled in the art, it is possible to make various improvements and modifications to the present invention without departing from the principle of the present invention, and those improvements and modifications also fall within the scope of the claims of the present invention.
Claims (5)
1. The utility model provides a silicon chip washs effluent disposal system which characterized in that: the washing machine comprises an overflow tank group communicated with the downstream of a washing machine, wherein the overflow tank group comprises a plurality of rinsing tanks, a medicine washing tank and an ultrasonic tank, the downstream of each rinsing tank is communicated with a transfer tank, the downstream of each transfer tank is communicated with a pumping pipeline, a water supply pump is arranged on each pumping pipeline, the downstream of each pumping pipeline is respectively communicated with a first main pipeline communicated with a degumming machine and a second main pipeline communicated with a chip inserting machine, and the first main pipeline is connected with the second main pipeline in parallel.
2. The silicon wafer cleaning wastewater treatment system according to claim 1, characterized in that: the downstream of the transit tank is also communicated with a direct supply pipeline which is directly communicated with the degumming machine, and the direct supply pipeline is connected with the pumping pipeline in parallel.
3. The silicon wafer cleaning wastewater treatment system according to claim 2, characterized in that: the direct supply pipeline is provided with an electromagnetic valve.
4. The silicon wafer cleaning wastewater treatment system according to claim 1, characterized in that: the transfer tanks correspond to the degumming machines one by one, the overflow tank groups correspond to the cleaning machines one by one, and each transfer tank is communicated with at least two overflow tank groups.
5. The silicon wafer cleaning wastewater treatment system according to claim 1, characterized in that: and 4 rinsing tanks in each overflow tank group are communicated with the transfer tank.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011608724.6A CN112775089A (en) | 2020-12-30 | 2020-12-30 | Silicon chip washs effluent disposal system |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011608724.6A CN112775089A (en) | 2020-12-30 | 2020-12-30 | Silicon chip washs effluent disposal system |
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| CN112775089A true CN112775089A (en) | 2021-05-11 |
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| CN202011608724.6A Pending CN112775089A (en) | 2020-12-30 | 2020-12-30 | Silicon chip washs effluent disposal system |
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Citations (9)
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|---|---|---|---|---|
| JPH08102457A (en) * | 1994-08-01 | 1996-04-16 | Tokyo Electron Ltd | Control method of cleaning treatment equipment |
| CN201219107Y (en) * | 2007-11-13 | 2009-04-08 | 常州天合光能有限公司 | Circulation tank of solar battery silicon slice cleaning machine |
| CN101947523A (en) * | 2010-10-21 | 2011-01-19 | 高佳太阳能股份有限公司 | Device for recycling silicon wafer cleaning wastewater |
| CN207086417U (en) * | 2017-03-16 | 2018-03-13 | 隆基绿能科技股份有限公司 | Silicon chip cleaning system |
| CN207204736U (en) * | 2017-08-25 | 2018-04-10 | 常州协鑫光伏科技有限公司 | Solar silicon wafers cleaning device |
| CN208712384U (en) * | 2018-07-06 | 2019-04-09 | 阜宁协鑫光伏科技有限公司 | The central heating system and silicon chip cleaning system of Wafer Cleaning |
| CN109877105A (en) * | 2019-04-04 | 2019-06-14 | 江苏美科硅能源有限公司 | Cleaning machine overflow reusing device for waste water |
| CN210286847U (en) * | 2019-06-26 | 2020-04-10 | 阜宁协鑫光伏科技有限公司 | Water system for inserting machine and silicon wafer cleaning system |
| CN210625149U (en) * | 2019-06-28 | 2020-05-26 | 扬州续笙新能源科技有限公司 | Abluent drying device of diamond wire-electrode cutting silicon chip |
-
2020
- 2020-12-30 CN CN202011608724.6A patent/CN112775089A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08102457A (en) * | 1994-08-01 | 1996-04-16 | Tokyo Electron Ltd | Control method of cleaning treatment equipment |
| CN201219107Y (en) * | 2007-11-13 | 2009-04-08 | 常州天合光能有限公司 | Circulation tank of solar battery silicon slice cleaning machine |
| CN101947523A (en) * | 2010-10-21 | 2011-01-19 | 高佳太阳能股份有限公司 | Device for recycling silicon wafer cleaning wastewater |
| CN207086417U (en) * | 2017-03-16 | 2018-03-13 | 隆基绿能科技股份有限公司 | Silicon chip cleaning system |
| CN207204736U (en) * | 2017-08-25 | 2018-04-10 | 常州协鑫光伏科技有限公司 | Solar silicon wafers cleaning device |
| CN208712384U (en) * | 2018-07-06 | 2019-04-09 | 阜宁协鑫光伏科技有限公司 | The central heating system and silicon chip cleaning system of Wafer Cleaning |
| CN109877105A (en) * | 2019-04-04 | 2019-06-14 | 江苏美科硅能源有限公司 | Cleaning machine overflow reusing device for waste water |
| CN210286847U (en) * | 2019-06-26 | 2020-04-10 | 阜宁协鑫光伏科技有限公司 | Water system for inserting machine and silicon wafer cleaning system |
| CN210625149U (en) * | 2019-06-28 | 2020-05-26 | 扬州续笙新能源科技有限公司 | Abluent drying device of diamond wire-electrode cutting silicon chip |
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Effective date of registration: 20210802 Address after: 614000 No. 8, Shizi street, Jinsu Town, Wutongqiao District, Leshan City, Sichuan Province Applicant after: Sichuan Yongxiang Photovoltaic Technology Co.,Ltd. Address before: 614800 No.100 Yongxiang Road, Zhugen Town, Wutongqiao District, Leshan City, Sichuan Province Applicant before: YONGXIANG Co.,Ltd. |
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Application publication date: 20210511 |
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