CN112770479A - Flexible circuit board - Google Patents

Flexible circuit board Download PDF

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Publication number
CN112770479A
CN112770479A CN201911106838.8A CN201911106838A CN112770479A CN 112770479 A CN112770479 A CN 112770479A CN 201911106838 A CN201911106838 A CN 201911106838A CN 112770479 A CN112770479 A CN 112770479A
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CN
China
Prior art keywords
image capturing
mark
capturing area
identification feature
marks
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Granted
Application number
CN201911106838.8A
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Chinese (zh)
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CN112770479B (en
Inventor
郭博翔
陈美秀
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Chipbond Technology Corp
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Chipbond Technology Corp
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0266Marks, test patterns or identification means
    • H05K1/0269Marks, test patterns or identification means for visual or optical inspection

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

A flexible circuit board comprises a film substrate and a circuit layer, wherein a plurality of transmission holes are arranged on two sides of the film substrate, the circuit layer is provided with a plurality of parallel circuits, a first identification feature and a second identification feature, the length of each parallel circuit is not less than the distance between two transmission holes on the same side, the first identification feature and the second identification feature are respectively formed on at least one parallel circuit in a first image capturing area and a second image capturing area, and the first identification feature and the second identification feature have different shape features or position features so as to distinguish the first image capturing area from the second image capturing area.

Description

Flexible circuit board
Technical Field
The present invention relates to a flexible printed circuit, and more particularly to a flexible printed circuit having different identification features.
Background
Automatic Optical Inspection (AOI) is a commonly used optical image inspection method, which can replace manpower to perform rapid and accurate inspection, and most AOI systems capture images of a target object with a CCD lens, and analyze whether the target object has defects such as foreign objects or abnormal patterns after image processing by vision software.
However, when the circuit on the flexible printed circuit is a repeating pattern (e.g., the flexible printed circuit has a large range of straight parallel circuits), there is no feature to be identified between the images captured from different areas of the repeating pattern, so the visual software cannot distinguish the repeating pattern of different areas, and it is difficult to determine in which area the defect is located.
Disclosure of Invention
The present invention is directed to a flexible printed circuit, which forms identification features with different shapes or positions in different image capturing areas to distinguish the different image capturing areas.
The invention relates to a flexible circuit board, which comprises a film substrate and a circuit layer, wherein the film substrate is provided with a surface and a plurality of transmission holes, the surface is defined with a detection area, the transmission holes are longitudinally arranged at two sides of the detection area, the detection area is provided with a first image capturing area and a second image capturing area, the line layer is formed on the surface, the line layer positioned in the detection area is provided with a plurality of parallel lines, a first identification feature and a second identification feature, the length of each parallel line is not less than the distance between the adjacent transmission holes at the same side, the first identification feature is located in the first image capturing area and formed on at least one parallel line, the second identification feature is located in the second image capturing area and formed on at least one parallel line, wherein the first identification feature and the second identification feature have different shape or position features.
In an embodiment of the present invention, the first identification feature is formed by at least one first mark recessed on one of the parallel lines in the first image capturing area, and the second identification feature is formed by at least one second mark recessed on one of the parallel lines in the second image capturing area.
In the flexible printed circuit, the first mark and the second mark are exposed from the surface.
In an embodiment of the invention, the first identification feature is formed by a plurality of first marks, the second identification feature is formed by a plurality of second marks, and a shape of at least one of the first marks is different from a shape of at least one of the second marks.
In an embodiment, the relative position of the first mark in the first image capturing area is the same as the relative position of the second mark in the second image capturing area.
In an embodiment, the relative position of the first mark in the first image capturing area is different from the relative position of the second mark in the second image capturing area.
In an embodiment of the invention, the first mark is concavely disposed on different parallel lines in the first image capturing area.
In an embodiment of the invention, the first mark is recessed in different positions of one of the parallel lines in the first image capturing area.
In an embodiment of the invention, the shape of the first mark is different.
In an embodiment of the invention, the first marks have the same shape.
In an embodiment, the first identification feature is formed by a plurality of first marks, the second identification feature is formed by a plurality of second marks, and a relative position of the first mark in the first image capturing area is different from a relative position of the second mark in the second image capturing area.
In an embodiment of the invention, the first mark and the second mark have the same shape.
In the flexible printed circuit board, not less than 7 of the transmission holes are respectively arranged on two sides of the film substrate.
In an embodiment, the coverage rate of the circuit layer on the surface of the film substrate is not less than 47.2%.
Because the lines in the detection area are parallel lines, the first identification feature and the second identification feature with different shapes or position features are respectively arranged in the first image capturing area and the second image capturing area, and by means of the first identification feature and the second identification feature, the AOI system can know that the images come from the first image capturing area and the second image capturing area respectively, and when the images are analyzed to find the defects, the AOI system can immediately know which image capturing area the defects are in.
Drawings
FIG. 1: according to an embodiment of the present invention, a top view of a flexible printed circuit is provided.
Fig. 2 to 5: according to an embodiment of the present invention, a top view of the flexible printed circuit is enlarged.
FIG. 6: according to another embodiment of the present invention, a top view of a flexible printed circuit is provided.
Fig. 7 and 8: according to an embodiment of the present invention, a top view of the flexible printed circuit is enlarged.
FIG. 9: according to an embodiment of the present invention, a top view of a flexible printed circuit is provided.
Fig. 10 and 11: according to an embodiment of the present invention, a top view of the flexible printed circuit is enlarged.
[ description of main element symbols ]
100: the flexible circuit board 110: thin film substrate
111: the transmission hole 112: surface of
113: detection area 113 a: a first image capturing area
113 b: the second image capturing area 113 c: third image capturing area
113 d: fourth image capturing area 120: line layer
121: the parallel lines 122: first mark
123: second mark 124: third mark
125: fourth mark D: distance between two adjacent plates
L: length of
Detailed Description
Referring to fig. 1, the present invention discloses a flexible printed circuit 100, which is a repeating unit of a tape substrate, the flexible printed circuit 100 includes a film substrate 110 and a circuit layer 120, the film substrate 110 has a plurality of transmission holes 111 and a surface 112, the transmission holes 111 are longitudinally arranged on two sides of the film substrate 110, the circuit layer 120 is formed on the surface 112, preferably, the film substrate 110 is a Polyimide (PI) film or a polyethylene terephthalate (PET) film, the circuit layer 120 is a copper foil substrate, and a plurality of circuits are formed after etching.
Referring to fig. 1, preferably, the two sides of the flexible printed circuit 100 are respectively arranged with not less than 7 transmission holes 111, and the coverage of the circuit layer 120 on the surface 112 of the film substrate 110 is not less than 47.2%, so that an Automatic Optical Inspection (AOI) system must respectively capture images of different areas of the flexible printed circuit 100 to obtain images for analysis and detection, however, when the parallel range of the circuits is not less than the distance D between the transmission holes 111 adjacent to the same side, the analysis software of the AOI system cannot distinguish a plurality of images captured from the parallel circuits.
For the above reasons, the present invention defines a detection region 113 on the surface 112 of the thin film substrate 110, the transmission holes 111 are longitudinally arranged at two sides of the detection area 113, the circuit layer 120 located in the detection area 113 has a plurality of parallel circuits 121, the parallel lines 121 may be straight lines or inclined straight lines, the length L of each parallel line 121 is not less than the distance D between the adjacent transmission holes 111 on the same side, preferably, the length L of each parallel line 121 is greater than the distance D, since the inspection area 113 exceeds the field of view of a single CCD camera, the inspection area 113 is divided into a first image capturing area 113a and a second image capturing area 113b, a single CCD camera is used to capture the images of the first image capture area 113a and the second image capture area 113b in sequence, or different CCD cameras are used to capture the images of the first image capture area 113a and the second image capture area 113 b.
Referring to fig. 1, in an embodiment, the detection area 111 is divided into the first image capturing area 113a and the second image capturing area 113b which are arranged in a longitudinal direction, so that a single CCD camera can be used to capture images of the first image capturing area 113a and the second image capturing area 113b, respectively.
Referring to fig. 2 to 5, the circuit layer 120 in the detection area 111 has a first identification feature and a second identification feature, the first identification feature is located in the first image capturing area 113a and formed on at least one of the parallel lines 121, the second identification feature is located in the second image capturing area 113b and formed on at least one of the parallel lines 121, and since the patterns (patterns) of the parallel lines 121 in the first image capturing area 113a and the second image capturing area 113b are completely the same, in order to distinguish the first image capturing area 113a from the second image capturing area 113b, the first identification feature and the second identification feature having different shapes or different positions are formed in the first image capturing area 113a and the second image capturing area 113b, respectively.
Referring to fig. 2 to 5, the first identification feature is formed by at least one first mark 122, the second identification feature is formed by at least one second mark 123, the first mark 122 is recessed on one of the parallel lines 121 in the first image capturing area 113a, and the second mark 123 is recessed on one of the parallel lines 121 in the second image capturing area 113b, in the aspect shown in fig. 2 to 5, geometric openings are etched on the parallel lines 121 to form the first mark 122 and the second mark 123, so that the first mark 122 and the second mark 123 expose the surface 112 of the thin film substrate 110, and preferably, the parallel lines 121, the first mark 122 and the second mark 123 are formed in the same etching process.
The shapes, positions, or combinations thereof of the first mark 122 and the second mark 123 constitute the first identification feature and the second identification feature, the first identification feature and the second identification feature have different shape features when the shape of the first mark 122 is different from the shape of the second mark 123, and the first identification feature and the second identification feature have different position features when the position of the first mark 122 in the first image capturing area 113a is different from the position of the second mark 123 in the second image capturing area 113 b.
Preferably, the first identification feature is composed of a plurality of first marks 122, and the second identification feature is composed of a plurality of second marks 123, so that the shapes of the first marks 122 and the second marks 123 can be adjusted according to different requirements (as shown in fig. 2 to 4), so that the shape of at least one of the first marks 122 is different from the shape of at least one of the second marks 123, or the arrangement of the first marks 122 and the second marks 123 (as shown in fig. 5) is adjusted, so that the relative position of the first mark 122 in the first image capturing area 113a is different from the relative position of the second mark 123 in the second image capturing area 113b, thereby enabling the first identification feature and the second identification feature to have different shape features or position features.
Referring to fig. 2, the shapes of the first marks 122 are the same (circular), the shapes of the second marks 123 are the same (inverted triangle), and the relative positions of the first marks 122 in the first image capturing area 113a are the same as the relative positions of the second marks 123 in the second image capturing area 113b (i.e. the first marks 122 and the second marks 123 are symmetrically arranged), but the shapes of the first marks 122 are different from the shapes of the second marks 123, so that the first identification feature and the second identification feature have different shape features and the same position feature.
Referring to fig. 3, the shapes of the first mark 122 and the second mark 123 are different, and the relative position of the first mark 122 in the first image capturing area 113a is the same as the relative position of the second mark 123 in the second image capturing area 113b, so that the first identification feature and the second identification feature have features of different shapes and the same position.
Referring to fig. 4, the shapes of the first mark 122 and the second mark 123 are different, and the relative position of the first mark 122 in the first image capturing area 113a is different from the relative position of the second mark 123 in the second image capturing area 113b (i.e., the first mark 122 and the second mark 123 are asymmetrically arranged), so that the first identification feature and the second identification feature have different shape features and different position features.
Referring to fig. 5, the shapes of the first mark 122 and the second mark 123 are the same (circular), but the relative position of the first mark 122 in the first image capturing area 113a is different from the relative position of the second mark 123 in the second image capturing area 113b, so that the first identification feature and the second identification feature have the same shape feature and different position features.
Referring to fig. 6, in another embodiment, the detection area 111 is divided into the first image capturing area 113a and the second image capturing area 113b which are arranged in a horizontal direction, so that different CCD cameras can be used to capture images of the first image capturing area 113a and the second image capturing area 113b, respectively.
Referring to fig. 7, the first identification feature is composed of a plurality of first marks 122 with different shapes, the second identification feature is composed of a plurality of second marks 123 with different shapes, the first marks 122 are recessed on different parallel lines 121 in the first image capturing area 113a, the second marks 123 are recessed on different parallel lines 121 in the second image capturing area 113b, but the relative position of the first marks 122 in the first image capturing area 113a is the same as the relative position of the second marks 123 in the second image capturing area 113b, so the first identification feature and the second identification feature have different shapes and the same position.
Referring to fig. 8, the first marks 122 are recessed in different positions of one of the parallel lines 121 in the first image capturing area 113a, the second marks 123 are recessed in different positions of one of the parallel lines 121 in the second image capturing area 113b, although the mark arrangement manners in fig. 7 and 8 are different, the first marks 122 and the second marks 123 are symmetrically arranged, so that the first identification feature and the second identification feature have the same position feature.
Referring to fig. 9, in another embodiment, the detection area 113 is divided into a first image capturing area 113a, a second image capturing area 113b, a third image capturing area 113c and a fourth image capturing area 113d, the first image capturing area 113a and the second image capturing area 113b are arranged longitudinally and capture images thereof respectively by a CCD camera, the third image capturing area 113c and the fourth image capturing area 113d are arranged longitudinally and capture images thereof respectively by another CCD camera, each image capturing area has an identification feature therein, so that each image capturing area has at least one mark therein, and the identification features have different shape features or position features by adjusting the shape or position of the mark to distinguish each image capturing area, the present invention does not limit the number of image capturing areas, the detection area 113 may be divided according to different needs or situations.
Referring to fig. 10, the first identification feature is composed of a plurality of first marks 122 with the same shape (triangle), the second identification feature is composed of a plurality of second marks 123 with the same shape (square), the third identification feature is composed of a plurality of third marks 124 with the same shape (circle), and the fourth identification feature is composed of a plurality of fourth marks 125 with the same shape (inverted triangle), but the mark shape in each image capture area is different from the mark shape in other image capture areas, so the identification features have different shape features.
Referring to fig. 11, the first identification feature is composed of a plurality of first marks 122 with different shapes, the second identification feature is composed of a plurality of second marks 123 with different shapes, the third identification feature is composed of a plurality of third marks 124 with different shapes, the fourth identification feature is composed of a plurality of fourth marks 125 with different shapes, and the mark shape combination in each image capturing area is different from the mark shape combination in other image capturing areas, so that the identification features have different shape features.
The scope of the present invention should be determined by the appended claims, and all changes and modifications that can be made by one skilled in the art without departing from the spirit and scope of the invention are intended to be covered by the appended claims.

Claims (14)

1. A flexible circuit board, comprising:
the film substrate is provided with a surface and a plurality of transmission holes, the surface is defined with detection areas, the transmission holes are longitudinally arranged at two sides of the detection areas, and the detection areas are provided with a first image acquisition area and a second image acquisition area; and
the circuit layer is formed on the surface, the circuit layer located in the detection area is provided with a plurality of parallel circuits, a first identification feature and a second identification feature, the length of each parallel circuit is not smaller than the distance between the adjacent transmission holes on the same side, the first identification feature is located in the first image capturing area and formed on at least one parallel circuit, the second identification feature is located in the second image capturing area and formed on at least one parallel circuit, and the first identification feature and the second identification feature have different shape features or position features.
2. The flexible wiring board of claim 1, wherein: the first identification feature is formed by at least one first mark concavely arranged on one of the parallel lines in the first image capturing area, the second identification feature is formed by at least one second mark concavely arranged on one of the parallel lines in the second image capturing area.
3. The flexible wiring board of claim 2, wherein: wherein the first mark and the second mark expose the surface.
4. The flexible wiring board of claim 2, wherein: wherein the first identifying feature is constituted by a plurality of first marks, the second identifying feature is constituted by a plurality of second marks, and the shape of at least one of the first marks is different from the shape of at least one of the second marks.
5. The flexible wiring board of claim 4, wherein: wherein the relative position of the first mark in the first image capturing area is the same as the relative position of the second mark in the second image capturing area.
6. The flexible wiring board of claim 4, wherein: wherein the relative position of the first mark in the first image capturing area is different from the relative position of the second mark in the second image capturing area.
7. A flexible wiring board according to any one of claims 4 to 6, wherein: the first mark is concavely arranged on different parallel lines in the first image capturing area.
8. A flexible wiring board according to any one of claims 4 to 6, wherein: the first mark is concavely arranged at different positions of one of the parallel lines in the first image capturing area.
9. A flexible wiring board according to any one of claims 4 to 6, wherein: wherein the first marks are different in shape.
10. A flexible wiring board according to any one of claims 4 to 6, wherein: wherein the first marks are identical in shape.
11. The flexible wiring board of claim 2, wherein: the first identification feature is composed of a plurality of first marks, the second identification feature is composed of a plurality of second marks, and the relative position of the first marks in the first image capturing area is different from the relative position of the second marks in the second image capturing area.
12. A flexible wiring board according to claim 11, wherein: wherein the first mark and the second mark are identical in shape.
13. The flexible wiring board of claim 1, wherein: wherein, the two sides of the film substrate are respectively provided with not less than 7 transmission holes.
14. The flexible wiring board of claim 1, wherein: wherein the coverage rate of the circuit layer on the surface of the film substrate is not less than 47.2%.
CN201911106838.8A 2019-11-01 2019-11-13 Flexible circuit board Active CN112770479B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW108139838A TWI717886B (en) 2019-11-01 2019-11-01 Flexible circuit board
TW108139838 2019-11-01

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CN112770479A true CN112770479A (en) 2021-05-07
CN112770479B CN112770479B (en) 2021-12-24

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Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05267802A (en) * 1992-03-17 1993-10-15 Matsushita Electric Ind Co Ltd Printed circuit board for surface mounting
JP2003258395A (en) * 2002-02-27 2003-09-12 Seiko Epson Corp Wiring substrate and method of manufacturing tape type wiring substrate
JP2007067272A (en) * 2005-09-01 2007-03-15 Nitto Denko Corp Tape carrier for tab, and manufacturing method thereof
JP2007134658A (en) * 2005-11-14 2007-05-31 Nitto Denko Corp Wiring circuit substrate and method for manufacturing the same and mounting electronic component
CN101309550A (en) * 2008-06-16 2008-11-19 友达光电(苏州)有限公司 Circuit board and electronic device applying the same
CN101713635A (en) * 2008-10-06 2010-05-26 鸿富锦精密工业(深圳)有限公司 Printed circuit board (PCB) and positioning system as well as positioning method thereof
JP2011227363A (en) * 2010-04-22 2011-11-10 Nitto Denko Corp Method of detecting alignment mark and method of manufacturing wiring circuit board
CN103118482A (en) * 2012-12-28 2013-05-22 威力盟电子(苏州)有限公司 Circuit board with quality identification tag and identification method thereof
CN107895064A (en) * 2017-10-19 2018-04-10 上海望友信息科技有限公司 Component polarity detection method, system, computer-readable recording medium and equipment

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI300677B (en) * 2006-05-09 2008-09-01 Unimicron Technology Corp Manufacturing and apparatus for printing mark on detective board
TWM387995U (en) * 2010-04-09 2010-09-01 Shanghai Microtek Technology Co Ltd Automated optical inspection system
CN105136818B (en) * 2015-09-18 2018-03-09 联策科技股份有限公司 The image detection method of printed base plate
KR101751518B1 (en) * 2016-08-24 2017-06-27 주식회사 아이디디 Marking apparatus and method for PCB panel

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05267802A (en) * 1992-03-17 1993-10-15 Matsushita Electric Ind Co Ltd Printed circuit board for surface mounting
JP2003258395A (en) * 2002-02-27 2003-09-12 Seiko Epson Corp Wiring substrate and method of manufacturing tape type wiring substrate
JP2007067272A (en) * 2005-09-01 2007-03-15 Nitto Denko Corp Tape carrier for tab, and manufacturing method thereof
JP2007134658A (en) * 2005-11-14 2007-05-31 Nitto Denko Corp Wiring circuit substrate and method for manufacturing the same and mounting electronic component
CN101309550A (en) * 2008-06-16 2008-11-19 友达光电(苏州)有限公司 Circuit board and electronic device applying the same
CN101713635A (en) * 2008-10-06 2010-05-26 鸿富锦精密工业(深圳)有限公司 Printed circuit board (PCB) and positioning system as well as positioning method thereof
JP2011227363A (en) * 2010-04-22 2011-11-10 Nitto Denko Corp Method of detecting alignment mark and method of manufacturing wiring circuit board
CN103118482A (en) * 2012-12-28 2013-05-22 威力盟电子(苏州)有限公司 Circuit board with quality identification tag and identification method thereof
CN107895064A (en) * 2017-10-19 2018-04-10 上海望友信息科技有限公司 Component polarity detection method, system, computer-readable recording medium and equipment

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Publication number Publication date
CN112770479B (en) 2021-12-24
TW202119875A (en) 2021-05-16
TWI717886B (en) 2021-02-01

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