CN112757554B - Ultrasonic transducer and manufacturing process thereof - Google Patents
Ultrasonic transducer and manufacturing process thereof Download PDFInfo
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- CN112757554B CN112757554B CN201911063767.8A CN201911063767A CN112757554B CN 112757554 B CN112757554 B CN 112757554B CN 201911063767 A CN201911063767 A CN 201911063767A CN 112757554 B CN112757554 B CN 112757554B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14467—Joining articles or parts of a single article
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
- A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
- B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
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Abstract
The present invention provides an ultrasonic transducer comprising: the plurality of conductive pins are arranged in an array to form a conductive pin array; the first back lining is fixedly combined with the lower parts of the conductive pins, and the lower ends of the conductive pins are exposed out of the first back lining; the second back lining is connected with one end face, away from the lower ends of the conductive pins, of the first back lining and is fixedly combined with the upper parts of the conductive pins; the piezoelectric body is connected to one end face, away from the lower end of the conductive needle, of the second backing; the upper ends of all the conductive pins in the conductive pin array are respectively and electrically connected with all the array element signal electrodes of the array element array in the piezoelectric body; the common electrode metal layer is formed on one end face, away from the lower end of the conductive pin, of the piezoelectric body and interconnects the common electrodes of the array elements in the piezoelectric body; and the matching layer is connected to the surface of the common electrode metal layer, which is far away from the lower end of the conductive needle. The invention solves the problem of array element electrode lead in the transducer, is convenient to install and realizes high-efficiency heat dissipation.
Description
Technical Field
The invention relates to the technical field of ultrasonic diagnostic equipment, in particular to an ultrasonic transducer.
Background
The ultrasonic imaging is to obtain an ultrasonic image of the human tissue property and structure of the object to be detected by receiving and processing the echo carrying the characteristic information of the tissue or structure property of the object to be detected and performing beam processing and the like after the ultrasonic wave is transmitted to the object to be detected.
Ultrasound, CT and MRI are diagnostic techniques commonly used in the clinic today. Compared with the latter two, ultrasound is not only free from the limitation of working environment, but also harmless to human body, so that it is widely applied in clinical application.
The matrix transducer with dense array elements generally has thousands to tens of thousands of array elements, the existing matrix transducer has large process difficulty and complex technology, especially the difficulty of the dense matrix transducer is multiplied, for example, the lead wires of the array element electrodes, and the conventional process needs to lead out a corresponding number of lead wires because the array elements are thousands to tens of thousands.
At present, the traditional method is to weld wires to realize circuit connection of dense array elements, but welding wires on the array elements with high density and fine spacing of the ultrasonic transducer has very high challenge for operators; or a plurality of flexible circuit boards are adopted to realize circuit connection, but the mode increases the bonding difficulty of the ultrasonic probe, and the flexible circuit boards can also cause great influence on the acoustic performance of the ultrasonic probe. The existing matrix transducer has the defects of complex process, much time consumption and low yield because array elements are dense and large in quantity, and a large number of leads need to be led out for connection in the existing process when electrodes are led out.
Meanwhile, because the matrix probe array elements are large in number and generate a large amount of heat, the conventional transducer generates heat seriously and cannot lead out the heat in time and efficiently.
Fig. 1 shows a transducer 300 and a manufacturing method in the prior art, the transducer includes a matching layer 310, a piezoelectric body 320, a grid 330, a conductive adhesive 340, a backing 350, and conductive pins 360, and the structure and the manufacturing method use a grid to fix the conductive pins, which has the following defects that 1) because the piezoelectric body and the grid are firstly pasted by a non-conductive adhesive, during the pasting process, the non-conductive adhesive may enter into the meshes of the grid, thereby affecting the conductive reliability; 2) during the process that the conductive pins are inserted into meshes of the grid, for the meshes at intervals, the conductive adhesive overflows due to the insertion of the conductive pins and is connected with the conductive adhesive of the adjacent meshes to form short circuits.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provides an ultrasonic transducer and a manufacturing process thereof, so as to solve the problem of electrode leads of array elements in the transducer, ensure that the transducer can be conveniently and electrically connected with a circuit board, and the welding of the array elements one by one is not needed, thereby reducing the process complexity; meanwhile, the heat conduction of the transducer is facilitated, and the heat is quickly dissipated. The technical scheme adopted by the invention is as follows:
a first aspect of the present invention provides an ultrasonic transducer comprising:
the plurality of conductive pins are arranged in an array to form a conductive pin array;
the first back lining is fixedly combined with the lower parts of the conductive pins, and the lower ends of the conductive pins are exposed out of the first back lining;
the second back lining is connected with one end face, away from the lower ends of the conductive pins, of the first back lining and is fixedly combined with the upper parts of the conductive pins;
the piezoelectric body is connected to one end face, away from the lower end of the conductive needle, of the second backing; the upper ends of all the conductive pins in the conductive pin array are respectively and electrically connected with all the array element signal electrodes of the array element array in the piezoelectric body;
the common electrode metal layer is formed on one end face, away from the lower end of the conductive pin, of the piezoelectric body and interconnects the common electrodes of the array elements in the piezoelectric body;
and the matching layer is connected to the surface of the common electrode metal layer, which is far away from the lower end of the conductive needle.
More preferably, the lower ends of the conductive pins are flush or substantially flush.
More preferably, the lower end of each conductive pin is exposed to the first backing by 1201 mm to 10 mm.
Preferably, the upper end of each conductive pin is connected with a reinforced metal fragment, and the reinforced metal fragment is electrically connected with each corresponding array element signal electrode in the piezoelectric body.
Preferably, the lower ends of the conductive pins are pressed and can elastically retract; specifically, the lower end of the conductive pin is placed into the accommodating cavity at the lower part of the conductive pin body and is abutted against a spring arranged in the accommodating cavity of the conductive pin body.
As a preferred connection mode, the lower ends of the conductive pins are in point contact and electric connection with the corresponding pad points arranged in an array on the circuit board.
More preferably, the bonding surface between the first backing and the second backing is configured as an uneven bonding surface in the peripheral region of the conductive pin array.
More preferably, the primary backing is made of a thermally conductive resin material.
As a preferred heat sink and securing means, a heat sink is attached to the first backing side and serves as the mounting member.
More preferably, the connecting structure between the first backing side and the heat sink is configured as a male-female embedded structure.
The second aspect of the present invention provides a manufacturing process of an ultrasonic transducer, including the following steps:
fixedly combining the lower parts of the plurality of conductive pins arranged in an array with the first back lining through an injection molding process; the lower end of each conductive pin is exposed out of the first back lining for a distance, and the lower ends of the conductive pins in the conductive pin array are flush or approximately flush;
arranging a baffle on the periphery of one end face of the first backing, which is far away from the lower end of the conductive needle, pouring a second backing material containing a curing agent on one end face of the first backing, which is far away from the lower end of the conductive needle, and forming a second backing after curing; fixedly combining the second backing with the upper part of each conductive pin and the first backing;
grinding one end face of the second backing, which is far away from the lower ends of the conductive pins, and grinding the end face to be flat, wherein the end head of the upper end of each conductive pin is displayed on the end face and is kept to be flat with the end face;
gluing an end face, deviating from the lower ends of the conductive pins, of the piezoelectric body and the second backing through a thin insulating glue layer, and respectively and correspondingly bonding and connecting the upper ends of the conductive pins in the conductive pin array with the array element signal electrodes arranged in the piezoelectric body in an array manner;
cutting the piezoelectric body to divide the piezoelectric body into independent array elements; controlling the depth of the cutting groove during cutting so that the piezoelectric body and the thin insulating glue layer between the piezoelectric body and the second backing are cut;
filling insulating glue in each cutting groove formed after the piezoelectric body is cut, preparing a common electrode metal layer on one end face of the piezoelectric body, which is far away from the lower end of the conductive needle, and interconnecting the common electrodes of each array element;
and then manufacturing a matching layer on the surface of the common electrode metal layer, which is far away from the lower end of the conductive pin.
Preferably, before the piezoelectric body is glued with the second backing, a reinforcing metal layer is prepared on one end face, away from the lower end of the conductive needle, of the second backing, then a thin insulating glue layer is coated on the surface of the reinforcing metal layer, and then the piezoelectric body is glued with one end face, away from the lower end of the conductive needle, of the second backing, provided with the reinforcing metal layer; the upper end of each conductive pin in the conductive pin array is connected with the reinforced metal layer and is correspondingly bonded and connected with each array element signal electrode which is arranged in the array in the piezoelectric body;
when the piezoelectric body is cut, the depth of the cutting groove is controlled so that the piezoelectric body, the thin insulating glue layer between the piezoelectric body and the second back lining and the reinforcing metal layer are cut.
The invention has the advantages that:
1) the conductive pin array realizes the leading-out of the positive electrode of the transducer array, can be conveniently connected with a circuit board, and is electrically connected with the corresponding pad array on the circuit board through point contact, so that the process complexity is reduced, the yield and the processing efficiency are improved, and the product reliability is improved.
2) The heat that the piezoelectricity body produced can be conducted to the conducting pin, and first backing not only is the fixed baseplate of conducting pin, is the outside heat conduction's of conducting pin conduction part moreover, combines the radiator that first backing side set up, realizes high-efficient heat dissipation.
3) The radiator arranged on the side face of the first back lining of the conductive pin is also used as a fixing part, so that the whole ultrasonic transducer can be directly contacted with a connecting circuit board without welding.
4) The manufacturing process of the invention avoids the condition that short circuit between the conductive pins is easy to occur in the prior art from the design of each step; the conductive reliability of the conductive pin is also better.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the description below are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic diagram of a transducer in the prior art.
Fig. 2 is a schematic view illustrating the conductive pins and the first backing being fixedly combined according to a first embodiment of the invention.
FIG. 3 is a schematic view of a second backing prepared according to a first embodiment of the present invention.
FIG. 4 is a schematic view of the second backing after grinding its upper end face according to a first embodiment of the present invention.
FIG. 5 is a schematic diagram of a piezoelectric body bonded to an upper end surface of a secondary backing according to an embodiment of the invention.
Fig. 6 is a schematic diagram of a piezoelectric body according to an embodiment of the invention.
FIG. 7 is a schematic diagram of a common electrode metal layer formed on the upper end surface of the piezoelectric element according to an embodiment of the invention.
Fig. 8 is a schematic diagram of preparing a matching layer on the surface of the common electrode metal layer according to a first embodiment of the invention.
Fig. 9a, 9b, 9c, and 9d are schematic illustrations of concave-convex bonding surfaces between a first backing and a second backing according to embodiments of the present invention.
Fig. 10 is a schematic diagram of a transducer structure according to a second embodiment of the present invention.
FIG. 11 is a perspective view of a transducer according to a second embodiment of the present invention.
Fig. 12 is a side view of a heat spreader attached to a primary backing in accordance with an embodiment of the present invention.
FIG. 13 is a diagram illustrating a conductive pin structure according to an embodiment of the present invention.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In addition, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
One embodiment of the present invention provides a process for manufacturing an ultrasonic transducer, comprising the following steps:
step S110, as shown in fig. 2, the lower portions of the plurality of conductive pins 110 arranged in an array are fixedly combined with the first backing 120 by an injection molding process (e.g., an insert molding process); the lower end 110b of each conductive pin 110 is exposed out of the first backing 120 by a distance, such as 1mm to 10mm, and the lower ends of the conductive pins 110 in the conductive pin array are flush or approximately flush;
the material of the first backing 120 in this step is resin, and this step is performed by an injection molding device, so that the resin material of the first backing is bonded to the lower portions of the conductive pins 110; the primary backing 120 may in one aspect serve to secure the conductive pins;
each conductive pin 110 may be arranged in an array of a rectangle, a circle, etc., and the conductive pin array may include hundreds to tens of thousands of conductive pins 110 corresponding to each array element in the piezoelectric body 140;
step S120, as shown in fig. 3, a barrier is disposed on the periphery of one end surface of the first backing 120 away from the lower end 110b of the conductive pin 110, a second backing material containing a curing agent is poured on one end surface of the first backing away from the lower end of the conductive pin 110, and a second backing 130 is formed after curing; fixedly bonding the second backing 130 to the upper portion of each conductive pin 110 and the first backing 120; the secondary backing 130 serves to block transmission of ultrasonic waves propagating backward from the piezoelectric body 140, thereby preventing image distortion;
in this step, the second backing material is in a liquid state at normal temperature, in which a curing agent is added, a barrier is arranged on the periphery of the array of the conductive pins 110 on one end surface (defined as the upper end surface of the first backing 120 in the embodiment) of the first backing 120 of the conductive pins, which is away from the lower ends 110b of the conductive pins 110, and then the second backing material is poured and placed into a drying device for curing, for example, an oven for curing;
in this step, the upper ends of the conductive pin array may be slightly exposed from the second backing 130 or slightly lower than the second backing 130;
step S130, as shown in fig. 4, grinding an end surface of the second backing 130 (defined as an upper end surface of the second backing 130 in the embodiment) away from the lower ends 110b of the conductive pins 110 to flatten the end surface, where the tip of the upper end of each conductive pin 110 appears and remains flat with the end surface;
in the step S120, in the case that the upper ends of the conductive pin arrays expose the second backing 130, the grinding in this step is mainly to grind the upper ends of the conductive pins 110 exposing the second backing 130, and the upper ends of the conductive pins 110 are ground, and the tips of the upper ends of the conductive pins 110 and the upper end surface of the second backing 130 are kept flat and are exposed on the upper end surface of the second backing 130, so as to be electrically connected with the array elements in the piezoelectric body 140 in the following step;
for the case that the upper ends of the conductive pin array are lower than the second backing 130 in step S120, the grinding of this step is mainly performed on the top of the second backing 130; so that the tip of the upper end of each conductive pin 110 appears on and remains flat with the upper end face of the second backing 130;
step S140, as shown in fig. 5, coating a thin insulating adhesive layer on an end surface of the second backing 130 away from the lower ends 110b of the conductive pins 110, and then gluing the piezoelectric body 140 and an end surface of the second backing 130 away from the lower ends 110b of the conductive pins 110, wherein the upper ends of the conductive pins 110 in the conductive pin array are respectively and correspondingly bonded to the array element signal electrodes arranged in the array in the piezoelectric body 140;
in this step, the thickness of the coated thin insulating adhesive layer is less than 3 μm, and under the action of a proper pressure, the thin insulating adhesive layer becomes thin and uniform, and the upper ends of the conductive pins 110 are electrically connected with the array element signal electrodes in the piezoelectric body 140 one by one through the thin insulating adhesive layer; in this step, because of the quantum tunneling effect, the electrical conduction between the conductive pin 110 and the piezoelectric body 140 is achieved, compared with the prior art in fig. 1, the complexity of the prior art is greatly simplified, the production cost is reduced, and the reliability and the production efficiency are improved;
step S150, as shown in fig. 6, cutting the piezoelectric body 140 so that the piezoelectric body 140 is divided into independent array elements, which are isolated from each other; controlling the depth of the cutting groove during cutting so that the piezoelectric body 140 and the thin insulating adhesive layer between the piezoelectric body 140 and the second backing 130 are cut;
step S160, as shown in fig. 7, filling insulating glue in each cutting groove formed after the piezoelectric body 140 is cut, and electroplating or sputtering a common electrode metal layer 150 on an end surface (defined as an upper end surface of the piezoelectric body 140 in the embodiment) of the piezoelectric body 140 away from the lower end 110b of the conductive pin 110 to interconnect the common electrodes of the array elements;
in the drawings of the present embodiment, the common electrode of each array element is on the upper end surface of the piezoelectric body 140; the side surface of the common electrode metal layer 150 can be connected with a lead wire, so that the leading-out of the common electrode of each array element is realized; each conducting pin 110 realizes the leading-out of each array element signal electrode;
step S170, as shown in fig. 8, a matching layer 160 is then formed on the surface of the common electrode metal layer 150 away from the lower end 110b of the conductive pin 110, where the matching layer 160 is for reducing the difference in acoustic impedance between the piezoelectric body 140 and the object to be detected, so as to effectively transmit the ultrasonic wave generated by the piezoelectric body 140 to the object to be detected, and this step is a conventional step in the art and is not described again.
On one hand, each conductive pin 110 is used for leading out a signal electrode of the piezoelectric array element array, and on the other hand, the conductive pin can also realize heat conduction; the conductive pins 110 are usually made of metal material, and have a good thermal conductivity coefficient, which is much larger than that of the piezoelectric body 140, so that heat generated by the piezoelectric body 140 can be conducted; in addition, the conductive pin 110 itself generates some heat during operation; the primary backing 120, in addition to holding the conductive pins 110, also functions to dissipate heat; preferably, the first backing 120 is made of a heat conductive resin material, such as two-component epoxy resin heat conductive resin, Hasuncast6210 epoxy resin, etc., because each conductive pin 110 is fixedly combined with the first backing 120, the heat generated by the piezoelectric body 140 is rapidly conducted to the first backing 120 through the conductive pin 110, the heat generated by the conductive pin 110 itself is also rapidly conducted to the first backing 120, and the first backing 120 is used as a heat sink for heat dissipation, which has a large volume and a good heat dissipation effect; preferably, the side of the first backing 120 can also be connected with a heat sink for better heat dissipation; the second function of the heat sink may also be as a mounting component for connection to a circuit board.
In some embodiments, the bonding side between the first backing 120 and the second backing 130 is configured, at least in part, as an uneven bonding side, so that the second backing 130 and the first backing 120 have an increased contact area for rapid heat transfer; for example, in step S110, when the insert molding process is performed, a concave-convex surface is formed on the region outside the conductive pin array of one end surface of the first backing 120 facing away from the lower ends 110b of the conductive pins 110 by using a suitable mold, and when the second backing material is poured in the subsequent step S120, a concave-convex bonding surface between the first backing 120 and the second backing 130 is naturally formed; fig. 9a, 9b, 9c, 9d exemplarily show several kinds of concave-convex bonding surfaces between the first backing 120 and the second backing 130, such as a rectangular engaging concave-convex bonding surface, a cylindrical engaging concave-convex bonding surface, a toothed engaging concave-convex bonding surface, an arc engaging concave-convex bonding surface.
Another embodiment of the present invention provides another manufacturing process of an ultrasonic transducer, as shown in fig. 10 and 11, including the following steps:
step S210, fixedly combining the lower portions of the plurality of conductive pins 110 arranged in an array with the first backing 120 by an injection molding process (e.g., insert molding process); the lower end 110b of each conductive pin 110 is exposed out of the first backing 120 by a distance, such as 1mm to 10mm, and the lower ends of the conductive pins 110 in the conductive pin array are flush or approximately flush;
the material of the first backing 120 in this step is resin, and this step is performed by an injection molding device, so that the resin material of the first backing is bonded to the lower portions of the conductive pins 110; the primary backing 120 may in one aspect serve to secure the conductive pins;
each conductive pin 110 may be arranged in an array of a rectangle, a circle, etc., and the conductive pin array may include hundreds to tens of thousands of conductive pins 110 corresponding to each array element in the piezoelectric body 140;
step S220, arranging a baffle on the periphery of one end face of the first backing 120, which is far away from the lower end 110b of the conductive pin 110, pouring a second backing material containing a curing agent on one end face of the first backing, which is far away from the lower end of the conductive pin 110, and forming a second backing 130 after curing; fixedly bonding the second backing 130 to the upper portion of each conductive pin 110 and the first backing 120; the secondary backing 130 serves to block transmission of ultrasonic waves propagating backward from the piezoelectric body 140, thereby preventing image distortion;
in this step, the second backing material is in a liquid state at normal temperature, in which a curing agent is added, a barrier is arranged on the periphery of the array of the conductive pins 110 on one end surface (defined as the upper end surface of the first backing 120 in the embodiment) of the first backing 120 of the conductive pins, which is away from the lower ends 110b of the conductive pins 110, and then the second backing material is poured and placed into a drying device for curing, for example, an oven for curing;
in this step, the upper ends of the conductive pin array may be slightly exposed from the second backing 130 or slightly lower than the second backing 130;
step S230, grinding an end surface of the second backing 130 (defined as an upper end surface of the second backing 130 in the embodiment) away from the lower ends 110b of the conductive pins 110, and flattening the end surface, where the tip of the upper end of each conductive pin 110 appears and remains flat with the end surface;
in the step S220, in the case that the upper ends of the conductive pin arrays expose the second backing 130, the grinding in this step is mainly performed on the portions of the upper ends of the conductive pins 110 exposing the second backing 130, the upper ends of the conductive pins 110 are ground after grinding, the tips of the upper ends of the conductive pins 110 and the upper end surface of the second backing 130 are kept flat, and are exposed on the upper end surface of the second backing 130, so as to be electrically connected with the array elements in the piezoelectric body 140 in the following step;
for the case that the upper ends of the conductive pin array are lower than the second backing 130 in step S220, the grinding of this step is mainly performed on the top of the second backing 130; so that the tip of the upper end of each conductive pin 110 appears on and remains flat with the upper end face of the second backing 130;
step S240, electroplating or sputtering a reinforcing metal layer 170 on an end surface of the second backing 130 away from the lower end 110b of the conductive pin 110, then coating a thin insulating adhesive layer on the surface of the reinforcing metal layer 170, then gluing the piezoelectric body 140 and the end surface of the second backing 130 away from the lower end 110b of the conductive pin 110, where the reinforcing metal layer 170 is disposed, and connecting the upper end of each conductive pin 110 in the conductive pin array to the reinforcing metal layer 170 and to each array element signal electrode in the piezoelectric body 140 in an array manner in a corresponding bonding connection respectively;
the reinforcing metal layer 170 functions to improve the reliability of the electrical conduction between the conductive pin and the piezoelectric body; in this step, the thickness of the coated thin insulating adhesive layer is less than 3 μm, and the thin insulating adhesive layer becomes thin and uniform under the action of a proper pressure, and in this step, the electrical conduction between the conductive pin 110 and the piezoelectric body 140 is realized due to the quantum tunneling effect, so that compared with the prior art in fig. 1, the complexity of the prior art is greatly simplified, the production cost is reduced, and the reliability and the production efficiency are improved;
step S250, cutting the piezoelectric body 140 to divide the piezoelectric body 140 into independent array elements, which are isolated from each other; controlling the depth of the cutting groove during cutting so that the piezoelectric body 140 and the thin insulating adhesive layer and the reinforcing metal layer 170 between the piezoelectric body 140 and the second backing 130 are cut; the reinforced metal layer 170 is cut to form reinforced metal fragments corresponding to the array elements in the piezoelectric body one by one; the reinforced metal is divided into thin metal sheets;
step S260, filling insulating glue in each cutting groove formed after the piezoelectric body 140 is cut, electroplating or sputtering a common electrode metal layer 150 on an end surface (defined as the upper end surface of the piezoelectric body 140 in the embodiment) of the piezoelectric body 140 away from the lower end 110b of the conductive pin 110, and interconnecting the common electrodes of each array element;
in the drawings of the present embodiment, the common electrode of each array element is on the upper end face of the piezoelectric body 140; the side surface of the common electrode metal layer 150 can be connected with a lead wire, so that the leading-out of the common electrode of each array element is realized; each conducting pin 110 realizes the leading-out of each array element signal electrode;
step S270, then, a matching layer 160 is formed on the surface of the common electrode metal layer 150 away from the lower end 110b of the conductive pin 110, where the matching layer 160 is for reducing the difference in acoustic impedance between the piezoelectric body 140 and the object to be detected, so as to effectively transmit the ultrasonic wave generated by the piezoelectric body 140 to the object to be detected, and this step is a conventional step in the art and is not described again.
The lens 180 may be disposed on the matching layer 160, which is not a technical problem and important point to be solved by the present invention, and will not be described.
In yet another embodiment, a heat sink 190 is attached to the side of the primary backing 120; the heat sink 190 may be attached to two opposite sides of the primary backing 120, such as the left and right sides of the primary backing 120, or around the primary backing 120, to the entire sides of the primary backing 120; the radiator is provided with a mounting hole so that the radiator together with the whole structure formed by the steps S110 to S170 or the steps S210 to S270 is mounted on the circuit board 200 by screws; the heat sink can help the heat conducted through the conductive pins and the first backing to be quickly dissipated, and can be used as a mounting component for fixing the structure formed through steps S110 to S170 or steps S210 to S270 to the circuit board 200;
as shown in fig. 12, preferably, the connection structure between the side of the primary backing 120 and the heat sink 190 is configured as a concave-convex embedded structure; on one hand, the connection between the two can be firmer, and on the other hand, the contact area between the two is also increased, so that the heat on the primary backing 120 can be quickly conducted to the heat sink 190; protrusions may be provided on the side of the primary backing 120 and corresponding grooves or recesses may be provided on the side of the heat sink 190, or vice versa, to enable the two to be connected in a male-female interfitting configuration;
in another embodiment, the structure formed by steps S110 to S170 or steps S210 to S270 is mounted on the circuit board 200, and the lower end 110b of each conductive pin 110 in the conductive pin array is electrically connected to the corresponding pad 210 arranged in an array on the circuit board 200 in a point contact manner; other components 220, such as various chips, are also mounted on the circuit board 200;
in yet another embodiment, one transverse dimension of the primary backing 120 is greater than the corresponding transverse dimension of the secondary backing 130; for example, in fig. 8, the left-right lateral dimension of the first backing 120 may be larger than the left-right lateral dimension of the second backing 130, so that the first backing 120 itself may be used as a mounting member, and the structure formed through steps S110 to S170 or steps S210 to S270 may be mounted on the circuit board 200 by using screws by providing mounting holes at the outer side portions of the first backing 120 beyond the second backing 130;
in some embodiments, the ultrasonic transducer is preferably connected to the circuit board by a point contact electrical connection, as shown in fig. 13, an upper end 110a of the conductive pin 110 is integrally configured with a conductive pin body 110c, and a lower end 110b of the conductive pin 110 is placed in a lower accommodating cavity of the conductive pin body 110c and abuts against a spring disposed in the accommodating cavity of the conductive pin body 110 c; therefore, the lower ends of the conductive pins 110 can elastically retract under the pressure, and can be pressed to the bonding pad in a pressure state, so that the problem that the lower ends 110b of the conductive pins 110 are not in contact with the bonding pad or are in poor contact due to the fact that the individual conductive pins are not in parallel is solved; in the prior art, the connection is carried out by a conductive pin and a connector, because the diameter of the conductive pin is very thin, the jack of the corresponding connector is very thin, and when the conductive pin is inserted and connected with the connector, because the jack of the connector is very thin and the conductive pin is very thin, the conductive pin is not easy to insert and the conductive pin is easy to break; in the preferred embodiment of the invention, the conductive pins are in point contact electrical connection with the corresponding pads on the circuit board, so that the installation is convenient, the yield is improved, the processing time can be shortened in the process, and the process is better than the process of connecting each array element of the piezoelectric body through the lead and then welding the lead and the corresponding pads on the circuit board in the prior art;
by the above process, an ultrasonic transducer is obtained, comprising:
a plurality of conductive pins 110 arranged in an array to form a conductive pin array;
a first backing 120 fixedly coupled to a lower portion of each conductive pin 110, and a lower end of each conductive pin 110 is exposed out of the first backing 120;
a second backing 130 connected to an end surface of the first backing 120 facing away from the lower ends 110b of the conductive pins 110, and fixedly coupled to the upper portions of the conductive pins 110;
a piezoelectric body 140 connected to one end surface of the second backing 130 facing away from the lower end 110b of the conductive pin 110; the upper end 110a of each conductive pin 110 in the conductive pin array is electrically connected with each array element signal electrode of the array element array in the piezoelectric body 140;
a common electrode metal layer 150 formed on an end surface of the piezoelectric body 140 away from the lower end 110b of the conductive pin 110, for interconnecting the common electrodes of the array elements in the piezoelectric body;
and a matching layer 160 connected to a surface of the common electrode metal layer 150 facing away from the lower end 110b of the conductive pin 110.
More preferably, the lower end of each conductive pin 110 is flush or substantially flush.
More preferably, the lower end of each conductive pin 110 is exposed to the first backing by 1201 mm to 10 mm.
Preferably, the upper end of each conductive pin 110 is connected to a reinforcing metal segment, and is electrically connected to the corresponding array element signal electrode in the piezoelectric body 140 through the reinforcing metal segment.
More preferably, the lower end of each conductive pin 110 is elastically retractable when pressed; specifically, the lower end of the conductive pin 110 is placed in the accommodating cavity at the lower part of the conductive pin body 110c, and abuts against a spring arranged in the accommodating cavity of the conductive pin body 110 c.
As a preferred connection mode, the lower end of each conductive pin 110 is electrically connected to the corresponding pad 210 arranged in an array on the circuit board 200 in a point contact manner.
More preferably, the bonding surface between the first backing 120 and the second backing 130 is configured as an uneven bonding surface at the peripheral region of the conductive pin array.
More preferably, the first backing 120 is made of a thermally conductive resin material.
As a preferred heat sink and fixing means, a heat sink is attached to the side of the first backing 120 and serves as a mounting member.
More preferably, the connection structure between the side of the first backing 120 and the heat sink 190 is configured as a concave-convex embedded structure.
Finally, it should be noted that the above embodiments are only for illustrating the technical solutions of the present invention and not for limiting, and although the present invention has been described in detail with reference to examples, it should be understood by those skilled in the art that modifications or equivalent substitutions may be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, which should be covered by the claims of the present invention.
Claims (13)
1. An ultrasonic transducer, comprising:
the conductive pins (110) are arranged in an array to form a conductive pin array;
the first backing (120) is fixedly combined with the lower parts of the conductive pins (110) through an injection molding process, and the lower ends of the conductive pins (110) are exposed out of the first backing (120);
a second backing (130), after the first backing (120) is formed, the second backing (130) is fixed to the conductive pins (110) through a pouring mode, the second backing (130) is connected to one end face, away from the lower ends (110b) of the conductive pins (110), of the first backing (120) and is fixedly combined with the upper parts of the conductive pins (110);
a piezoelectric body (140) connected to one end surface of the second backing (130) facing away from the lower end (110b) of the conductive pin (110); the upper end (110a) of each conductive pin (110) in the conductive pin array is respectively and electrically connected with each array element signal electrode of the array element array in the piezoelectric body (140);
a common electrode metal layer (150) which is formed on one end surface of the piezoelectric body (140) departing from the lower end (110b) of the conductive needle (110) and interconnects the common electrodes of the array elements in the piezoelectric body;
and the matching layer (160) is connected to the surface of the common electrode metal layer (150) which is far away from the lower end (110b) of the conductive needle (110).
2. The ultrasonic transducer of claim 1,
the lower ends of the conductive pins (110) are flush or substantially flush.
3. The ultrasonic transducer of claim 1,
the lower end of each conductive pin (110) is exposed out of the first back lining (120) by 1-10 mm.
4. The ultrasonic transducer according to claim 1, wherein a reinforcing metal segment is connected to an upper end of each conductive pin (110), and is electrically connected to corresponding array element signal electrodes in the piezoelectric body (140) through the reinforcing metal segment.
5. The ultrasonic transducer of claim 1,
the lower end of each conductive pin (110) is pressed and can elastically retract.
6. The ultrasonic transducer of claim 4,
the lower end of the conductive pin (110) is placed into the containing cavity at the lower part of the conductive pin body (110c) and is propped against a spring arranged in the containing cavity of the conductive pin body (110 c).
7. The ultrasonic transducer according to any one of claims 1 to 6,
the lower end of each conductive pin (110) is in point contact and electric connection with corresponding pads (210) arranged in an array on the circuit board (200).
8. The ultrasonic transducer according to any one of claims 1 to 6,
the bonding surface between the first backing (120) and the second backing (130) is configured as an uneven bonding surface at the peripheral area of the conductive pin array.
9. The ultrasonic transducer according to any one of claims 1 to 6,
the first backing (120) is made of a heat-conducting resin material.
10. The ultrasonic transducer according to any one of claims 1 to 6,
also included is a heat sink (190) attached to the side of the first backing (120) and serving as a mounting component.
11. The ultrasonic transducer of claim 10,
the connection structure between the side of the first backing (120) and the heat sink (190) is configured as a concave-convex embedded structure.
12. The manufacturing process of the ultrasonic transducer is characterized by comprising the following steps of:
fixedly combining the lower parts of the plurality of conductive pins (110) arranged in an array with a first backing (120) through an injection molding process; the lower end (110b) of each conductive pin (110) is exposed out of the first back lining (120) for a distance, and the lower ends of the conductive pins (110) in the conductive pin array are flush or approximately flush;
arranging a surrounding block on the periphery of one end face of the first backing (120) away from the lower end (110b) of the conductive pin (110), pouring a second backing material containing a curing agent on one end face of the first backing away from the lower end of the conductive pin (110), and forming a second backing (130) after curing; fixedly combining the second backing (130) with the upper part of each conductive pin (110) and the first backing (120);
grinding an end face of the second backing (130) far away from the lower ends (110b) of the conductive pins (110), and grinding and flattening the end face, wherein the end head of the upper end of each conductive pin (110) is displayed on the end face and is kept flat with the end face;
gluing end faces of the piezoelectric body (140) and the second backing (130) which are far away from the lower ends (110b) of the conductive pins (110) through a thin insulating glue layer, and respectively and correspondingly bonding and connecting the upper ends of the conductive pins (110) in the conductive pin array with the array element signal electrodes arranged in the piezoelectric body (140);
cutting the piezoelectric body (140) to divide the piezoelectric body (140) into independent array elements; controlling the depth of the cutting groove during cutting so that the piezoelectric body (140) and the thin insulating glue layer between the piezoelectric body (140) and the second backing (130) are cut;
filling insulating glue in each cutting groove formed after the piezoelectric body (140) is cut, preparing a common electrode metal layer (150) on one end face of the piezoelectric body (140) deviating from the lower end (110b) of the conductive needle (110), and interconnecting the common electrodes of each array element;
then, a matching layer (160) is manufactured on the surface of the common electrode metal layer (150) which is far away from the lower end (110b) of the conductive pin (110).
13. The process for manufacturing an ultrasonic transducer according to claim 12,
before the piezoelectric body (140) is glued with the second backing (130), firstly, preparing a reinforcing metal layer (170) on one end face of the second backing (130) departing from the lower end (110b) of the conductive pin (110), then, coating a thin insulating glue layer on the surface of the reinforcing metal layer (170), and then gluing the piezoelectric body (140) with one end face of the second backing (130) departing from the lower end (110b) of the conductive pin (110) and provided with the reinforcing metal layer (170); the upper end of each conductive pin (110) in the conductive pin array is connected with an enhanced metal layer (170) and is correspondingly bonded and connected with each array element signal electrode which is arranged in the piezoelectric body (140) in an array manner;
when the piezoelectric body (140) is cut, the depth of the cutting groove is controlled so that the piezoelectric body (140) and the thin insulating glue layer and the reinforcing metal layer (170) between the piezoelectric body (140) and the second backing (130) are all cut.
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| US7105986B2 (en) * | 2004-08-27 | 2006-09-12 | General Electric Company | Ultrasound transducer with enhanced thermal conductivity |
| US7834522B2 (en) * | 2007-08-03 | 2010-11-16 | Mr Holdings (Hk) Limited | Diagnostic ultrasound transducer |
| JP2009060501A (en) * | 2007-09-03 | 2009-03-19 | Fujifilm Corp | Backing material, ultrasonic probe, ultrasonic endoscope, ultrasonic diagnostic device, and ultrasonic endoscope device |
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| US6541896B1 (en) * | 1997-12-29 | 2003-04-01 | General Electric Company | Method for manufacturing combined acoustic backing and interconnect module for ultrasonic array |
| CN205786486U (en) * | 2016-05-17 | 2016-12-07 | 中国大唐集团科学技术研究院有限公司 | Phased-array technique detection turbine bearing pad ultrasound probe |
| CN106111510A (en) * | 2016-06-27 | 2016-11-16 | 深圳先进技术研究院 | A kind of full Wiring type two dimensional surface battle array ultrasonic transducer and manufacture method thereof |
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