CN112756918A - Double-layer chamfer type ring die preparation process - Google Patents
Double-layer chamfer type ring die preparation process Download PDFInfo
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- CN112756918A CN112756918A CN202011626695.6A CN202011626695A CN112756918A CN 112756918 A CN112756918 A CN 112756918A CN 202011626695 A CN202011626695 A CN 202011626695A CN 112756918 A CN112756918 A CN 112756918A
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- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
Abstract
The invention discloses a double-layer chamfer type ring die preparation process, belongs to the field of ring die preparation, and relates to a double-layer chamfer type ring die preparation process, which is characterized in that a hole-shaped column is formed by re-engraving a double-layer taper hole, can be detected after heat treatment only by putting the double-layer taper hole back, the operation is simple and rapid, when the thermal retraction is generated, the hole-shaped column is difficult to completely enter the double-layer taper hole, the thermal retraction degree is larger, the less the part of the reaction heat enters the hole, the more the reaction heat can be intuitively retracted, compared with the prior art, the detection difficulty and the workload are obviously reduced, and meanwhile, through the arrangement of the double-layer taper hole, the compression ratio is 1.5 times of the same compression ratio, compared with the prior art, the compression ratio can obviously improve the extrusion force to the feed during granulation, the compactness is higher, the loosening is not easy to occur, and the nutrient content in one feed is more than that in the prior art, so that the quality of the feed is obviously improved.
Description
Technical Field
The invention relates to the field of ring die preparation, in particular to a double-layer chamfer type ring die preparation process.
Background
A ring mould is a key part of a ring mould granulator of key equipment for processing granulated feeds and is also the most main vulnerable part, and a ring mould manufacturing machine (also known as a ring mould granulated feed machine and a ring mould granulated feed forming machine) belongs to feed granulating equipment. The feed processing machine is used for directly pressing crushed materials of corn, bean pulp, straw, grass, rice husk and the like into granules. The ring die granulator is the main feed machinery for producing granulated feed, the performance of the ring die granulator determines the feed processing yield to a great extent, and the ring die granulator plays a very important role in the feed processing process.
The ring mould is because the surface hole is too intensive, make the part between each hole less, make ring mould bulk strength not high, therefore when carrying out thermal treatment after drilling, the unavoidable hole inner wall has the thermal-retraction phenomenon, lead to after thermal treatment, certain deformation takes place for the mould hole on the ring mould, make the circularity impaired, therefore can detect the mould hole before dispatching from the factory among the prior art, show because mould hole itself is less, the detection degree of difficulty that leads to thermal-retraction volume is great, in addition, the compression ratio (hole depth/aperture) of mould hole to fodder is less among the prior art, lead to less to the extrusion force to the fodder, the closely knit degree of fodder is not enough, easily loose after the shaping.
Disclosure of Invention
1. Technical problem to be solved
Aiming at the problems in the prior art, the invention aims to provide a double-layer chamfer type ring die preparation process, which comprises the steps of forming a hole type column by re-engraving double-layer taper holes, can be detected after heat treatment only by putting the double-layer taper hole back, the operation is simple and rapid, when the thermal retraction is generated, the hole-shaped column is difficult to completely enter the double-layer taper hole, the thermal retraction degree is larger, the less the part of the reaction heat enters the hole, the more the reaction heat can be intuitively retracted, compared with the prior art, the detection difficulty and the workload are obviously reduced, and meanwhile, through the arrangement of the double-layer taper hole, the compression ratio is 1.5 times of the same compression ratio, compared with the prior art, the compression ratio can obviously improve the extrusion force to the feed during granulation, the compactness is higher, the loosening is not easy to occur, and the nutrient content in one feed is more than that in the prior art, so that the quality of the feed is obviously improved.
2. Technical scheme
In order to solve the above problems, the present invention adopts the following technical solutions.
A preparation process of a double-layer chamfer type ring die comprises the following steps:
s1, selecting a proper ring die blank according to the required specification of the ring die;
s2, drilling the semi-finished product of the ring die through an eight-station numerical control deep hole gun drill to obtain a die hole;
s3, according to the required aperture requirement, carrying out inner side taper hole on the die hole by using a chamfering machine to obtain a semi-finished product of the ring die with a double-layer taper hole;
s4, then, carrying out hole pattern and hole diameter repeated engraving on the double-layer taper hole to obtain a hole pattern column;
s5, placing the ring die semi-finished product with the hole-shaped column taken out into a vacuum heat treatment system for quenching treatment, tempering and polishing treatment after quenching, detecting the thermal retraction amount of the double-layer taper hole through the hole-shaped column, and obtaining the qualified product, namely the optical ring die.
Further, the quenching temperature in the S5 is 1020-1060 ℃, and the tempering temperature is 180-220 ℃.
Further, the ring die is machined from a high-quality stainless steel forging, and 4Cr13 is preferred.
Further, the specific steps of the double-layer taper hole re-engraving of the hole pattern and the hole diameter are as follows:
s41, randomly selecting and marking a plurality of double-layer conical holes, filling air sheets into the middle parts of the selected double-layer conical holes, and then respectively extruding and filling ceramic mud into the inner parts of two orifices of the double-layer conical holes until the ceramic mud is compacted to form two separated hole type columns;
s42, extruding and sealing two orifices of the double-layer taper hole by using a hard plate, then performing heating treatment to expand the gas sheet, and extruding two hole-type columns from the middle part;
s43, cooling to restore the air sheet, taking down the hard plate, continuously extruding from the two orifices, filling new clay, and repeating S41-S42 for two to three times until the clay is pressed and molded;
and S44, heating again to make the gas sheet expand and push the upper hole-type column upwards, and then push the larger hole of the double-layer taper hole downwards and push the other hole-type column out.
Further, the hole pattern detection step of the double-layer taper hole in S5 specifically includes: the hole type columns are inserted into the marked double-layer taper holes and the two holes of the double-layer taper holes are randomly selected again, the double-layer taper holes which can be inserted into the hole type columns smoothly are qualified, more than 95% of the double-layer taper holes are qualified when detection is carried out, the ring die is a qualified optical ring die, the double-layer taper holes on the ring die after heat treatment can be effectively detected through the hole type columns, the hole type columns after repeated engraving are consistent with the hole type and the hole diameter before heat treatment, when detection is carried out, the hole type columns only need to be placed back into the double-layer taper holes, operation is simple and rapid, after the hole type columns are subjected to heat retraction, the hole type columns cannot completely enter the double-layer taper holes, the larger the heat retraction degree is, the fewer the parts of the hole type columns entering the holes are, and therefore the heat retraction degree can be visually reflected, and compared with the prior art.
Furthermore, the heating temperature in the step of re-engraving the hole pattern and the hole diameter of the double-layer taper hole is 90-120 ℃, and the temperature can not only enable the gas piece to expand, but also can not cause the thermal shrinkage of the semi-finished product of the ring die.
Further, the gas chip includes the inflation layer and a plurality of embedded hard pearl of inlaying in tip about the inflation layer, the inflation layer internal packing has high heat conduction gas, and the setting up of a plurality of embedded hard pearls can effectively improve the gas chip and the contact surface intensity of hole type post uprises, makes it better to the squeezing action of pottery mud end in inside, and then makes fashioned pass post intensity higher, is difficult for loosely.
Further, high heat-conducting gas's filling volume is the saturation packing, makes it be heated can expand fast, and is better to the extrusion effect of two hole type posts, the inflation layer is made for elastic sealing material, and adjacent two distance between the embedded hard pearl is less than its radius, and the distance is too big, influences the intensity of the contact surface of gas piece and pass post, and the distance undersize, embedded hard pearl are too much, lead to the elasticity of this department gas piece to receive the restriction, and is fragile during the inflation.
Furthermore, the double-layer taper holes comprise upper taper holes and lower taper holes, the upper taper holes and the lower taper holes are communicated with each other, the depth of the upper taper holes and the depth of the lower taper holes are the same, the hole type column located above is matched with the upper taper holes, and the hole type column located below is matched with the lower taper holes.
Furthermore, the opening angle of the upper conical hole is 30-60 degrees, the opening angle of the lower conical hole is 10-30 degrees, the total depth of the upper conical hole and the lower conical hole is 2-4cm and is influenced by the grain size of the feed, the depth of the hole is 1-2cm due to the single-layer hole design in the prior art, the compression ratio of the feed is small and is maintained at about 5, and the total depth of the double-layer conical hole is about 2 times of that of the prior art, the compression ratio can reach about 10, so that the same compression ratio is 1.5 times of that of the same compression ratio.
3. Advantageous effects
Compared with the prior art, the invention has the advantages that:
(1) this scheme is through the hole type post of carving formation again to double-deck taper hole, can be when heat treatment after-detection, only need with it put back in the double-deck taper hole can, easy operation is swift, after it takes place the heat and contracts back, the hole type post is difficult to enter into the double-deck taper hole completely, the heat degree of contracting is big more, it enters into downthehole part less, thereby can audio-visual reaction heat degree of contracting that contracts, compared with the prior art, show and reduce the detection degree of difficulty and work load, simultaneously through the setting of double-deck taper hole, its compression ratio is 1.5 times with the compression ratio, compared with the prior art, during the granulation, can show the improvement to the extrusion force of fodder, make closely knit degree higher, be difficult for loose, and nutrient content is more than prior art in a grain fodder, and then show the quality that improves the fodder.
(2) The hole pattern detection step of the double-layer taper hole in the S5 specifically comprises the following steps: the hole type columns are inserted into the marked double-layer taper holes and the two holes of the double-layer taper holes are randomly selected again, the double-layer taper holes which can be smoothly inserted into the hole type columns are qualified, more than 95% of the detected double-layer taper holes are qualified, the ring die is a qualified optical ring die, the double-layer taper holes on the ring die after heat treatment can be effectively detected through the hole type columns, the hole type columns after repeated engraving are consistent with the hole type and the hole diameter before heat treatment, when detection is carried out, the hole type columns only need to be placed back into the double-layer taper holes, the operation is simple and rapid, after the hole type columns are subjected to heat retraction, the hole type columns cannot completely enter the double-layer taper holes, the larger the heat retraction degree is, the fewer the parts of the hole type columns entering the holes are, and therefore the heat retraction degree can be visually reflected, and compared with the prior art, the.
(3) The heating temperature in the step of re-engraving the hole shape and the hole diameter of the double-layer taper hole is 90-120 ℃, and the temperature can not only enable the gas sheet to expand, but also can not cause the thermal retraction of the semi-finished product of the ring die.
(4) The gas piece includes the inflation layer and a plurality of embedded hard pearl of inlaying in tip about the inflation layer, and the inflation layer internal packing has high heat-conducting gas, and the contact surface intensity that sets up of a plurality of embedded hard pearls can effectively improve gas piece and hole type post uprises, makes it better to the squeezing action of pottery mud powder in inside, and then makes fashioned pass post intensity higher, is difficult for loosely.
(5) The packing volume of high heat conduction gas is the saturation packing, makes it be heated can quick inflation, and is better to the extrusion effect of two hole type posts, and the inflation layer is made for elastic sealing material, and distance between two adjacent embedded hard pearls is less than its radius, and the distance is too big, influences the intensity of the contact surface of gas piece and pass post, and apart from the undersize, embedded hard pearl is too much, leads to the elasticity of this department gas piece to receive the restriction, easily damaged during the inflation.
(6) The double-layer taper holes comprise upper taper holes and lower taper holes, the upper taper holes and the lower taper holes are communicated with each other, the depth of the upper taper holes and the depth of the lower taper holes are the same, the hole type columns located above are matched with the upper taper holes, and the hole type columns located below are matched with the lower taper holes.
(7) The opening angle of the upper taper hole is 30-60 degrees, the opening angle of the lower taper hole is 10-30 degrees, the total depth of the upper taper hole and the lower taper hole is 2-4cm and is influenced by the grain diameter of the feed, the depth of the hole is 1-2cm through single-layer hole design in the prior art, the compression ratio of the feed is small and is maintained at about 5, the total depth of the double-layer taper hole is about 2 times that of the prior art, the compression ratio can reach about 10, the same compression ratio is 1.5 times that of the same compression ratio, compared with the prior art, when the double-layer taper hole granulator is used for granulating the feed, the extrusion force of the feed can be obviously improved, the compactness of the feed is obviously improved, the inner gap of the feed is small, the distance between particles is small, the nutrient content in the feed is more than that in the prior art, and the quality of the feed is.
Drawings
FIG. 1 is a schematic flow chart of the present invention;
FIG. 2 is a schematic structural diagram of an optical ring mode solid according to the present invention;
FIG. 3 is a schematic structural diagram of a double-layer taper hole re-engraving process according to the present invention;
FIG. 4 is a schematic view of the structure of the gas tablet of the present invention;
FIG. 5 is a schematic structural view of a double-layer taper hole of the present invention;
fig. 6 is a schematic structural view of a die hole in the prior art of the present invention.
The reference numbers in the figures illustrate:
11 upper taper holes, 12 lower taper holes, 21 expansion layers and 22 embedded hard beads.
Detailed Description
The drawings in the embodiments of the invention will be combined; the technical scheme in the embodiment of the invention is clearly and completely described; obviously; the described embodiments are only some of the embodiments of the invention; but not all embodiments, are based on the embodiments of the invention; all other embodiments obtained by a person skilled in the art without making any inventive step; all fall within the scope of protection of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top/bottom", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "sleeved/connected," "connected," and the like are to be construed broadly, e.g., "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example 1:
referring to fig. 1-2, a process for manufacturing a double-layer chamfered ring mold includes the following steps:
s1, selecting a proper ring die blank according to the specification of the required ring die, wherein the ring die is formed by processing a high-quality stainless steel forging, and 4Cr13 is preferred;
s2, drilling the semi-finished product of the ring die through an eight-station numerical control deep hole gun drill to obtain a die hole;
s3, according to the required aperture requirement, carrying out inner side taper hole on the die hole by using a chamfering machine to obtain a semi-finished product of the ring die with a double-layer taper hole;
s4, then, carrying out hole pattern and hole diameter repeated engraving on the double-layer taper hole to obtain a hole pattern column;
s5, placing the ring mold semi-finished product with the hole type column taken out into a vacuum heat treatment system for quenching treatment, tempering and polishing treatment after quenching, wherein the quenching temperature is 1020-1060 ℃, the tempering treatment temperature is 180-220 ℃, the heat retraction amount of the double-layer taper hole is detected through the hole type column, and the qualified product is the optical ring mold.
Referring to fig. 3, the specific steps of the double-layer taper hole re-engraving are as follows:
s41, randomly selecting and marking a plurality of double-layer conical holes, filling air sheets into the middle parts of the selected double-layer conical holes, and then respectively extruding and filling ceramic mud into the inner parts of two orifices of the double-layer conical holes until the ceramic mud is compacted to form two separated hole type columns;
s42, extruding and sealing two orifices of the double-layer taper hole by using a hard plate, then performing heating treatment to expand the gas sheet, and extruding two hole-type columns from the middle part;
s43, cooling to restore the air sheet, taking down the hard plate, continuously extruding from the two orifices, filling new clay, and repeating S41-S42 for two to three times until the clay is pressed and molded;
and S44, reheating the gas sheet to enable the gas sheet to expand and push the upper hole type column upwards, then pushing the larger hole opening of the double-layer taper hole downwards, and pushing the other hole type column out, wherein the heating temperature in the step of re-engraving the hole type and the hole diameter of the double-layer taper hole is 90-120 ℃, and the temperature can enable the gas sheet to expand and simultaneously can not cause thermal retraction of the ring die semi-finished product.
The hole pattern detection step of the double-layer taper hole in the S5 specifically comprises the following steps: the hole type columns are inserted into the marked double-layer taper holes and the two holes of the double-layer taper holes are randomly selected again, the double-layer taper holes which can be smoothly inserted into the hole type columns are qualified, more than 95% of the detected double-layer taper holes are qualified, the ring die is a qualified optical ring die, the double-layer taper holes on the ring die after heat treatment can be effectively detected through the hole type columns, the hole type columns after repeated engraving are consistent with the hole type and the hole diameter before heat treatment, when detection is carried out, the hole type columns only need to be placed back into the double-layer taper holes, the operation is simple and rapid, after the hole type columns are subjected to heat retraction, the hole type columns cannot completely enter the double-layer taper holes, the larger the heat retraction degree is, the fewer the parts of the hole type columns entering the holes are, and therefore the heat retraction degree can be visually reflected, and compared with the prior art, the.
Referring to fig. 4, the gas sheet includes an expansion layer 21 and a plurality of embedded hard beads 22 embedded in the upper and lower end portions of the expansion layer 21, the expansion layer 21 is filled with high heat-conducting gas, the strength of the contact surface between the gas sheet and the porous column can be effectively improved by the arrangement of the plurality of embedded hard beads 22, so that the internal extrusion effect on the clay dust is better, the strength of the formed porous column is higher, the porous column is not easy to loosen, the filling amount of the high heat-conducting gas is saturated filling, the high heat-conducting gas can be rapidly expanded by heating, the extrusion effect on the two porous columns is better, the expansion layer 21 is made of an elastic sealing material, the distance between two adjacent embedded hard beads 22 is smaller than the radius of the porous column, the distance is too large, the strength of the contact surface between the gas sheet and the porous column is affected, the distance is too large, the elasticity of the gas sheet is limited, and the gas.
Referring to fig. 5, the double-layer tapered hole includes an upper tapered hole 11 and a lower tapered hole 12, the upper tapered hole 11 and the lower tapered hole 12 are communicated with each other and have the same depth, the hole type column located above is matched with the upper tapered hole 11, the hole type column located below is matched with the lower tapered hole 12, the opening angle of the upper tapered hole 11 is 30-60 degrees, the opening angle of the lower tapered hole 12 is 10-30 degrees, the total depth of the upper tapered hole 11 and the lower tapered hole 12 is 2-4cm, and is affected by the grain size of the feed, referring to fig. 6, in the prior art, the single-layer hole type design has a hole depth of 1-2cm, the compression ratio of the feed is kept small, and is maintained at about 5, while the double-layer tapered hole has a total depth of about 2 times that of the prior art, the compression ratio can reach about 10, so that the same compression ratio is 1.5 times that, compared with the prior art, when the feed is granulated, the extrusion force on the feed can be obviously improved, the compactness of the feed is obviously improved, the gap inside the feed is small, the distance between particles is small, the nutrient content in one feed is more than that in the prior art, and the quality of the feed is obviously improved.
Through the hole type post of carving formation again to double-deck taper hole, can be when heat treatment after-detection, only need with it put back in the double-deck taper hole can, easy operation is swift, after it takes place the heat and contracts back, the hole type post is difficult to enter into the double-deck taper hole completely, the heat degree of contracting is big more, it is less that it enters into downthehole part, thereby can the audio-visual degree of reaction heat and contract back, compared with the prior art, show and reduce detection degree of difficulty and work load, simultaneously through the setting of double-deck taper hole, its compression ratio is 1.5 times with the compression ratio, compared with the prior art, during the granulation, can show the improvement to the extrusion force of fodder, make closely knit degree higher, be difficult for loose, and the nutrient content is more than prior art in a grain fodder, and then show the quality that improves the fodder.
The above; but are merely preferred embodiments of the invention; the scope of the invention is not limited thereto; any person skilled in the art is within the technical scope of the present disclosure; the technical scheme and the improved concept of the invention are equally replaced or changed; are intended to be covered by the scope of the present invention.
Claims (10)
1. A preparation process of a double-layer chamfer type ring die is characterized by comprising the following steps: the method comprises the following steps:
s1, selecting a proper ring die blank according to the required specification of the ring die;
s2, drilling the semi-finished product of the ring die through an eight-station numerical control deep hole gun drill to obtain a die hole;
s3, according to the required aperture requirement, carrying out inner side taper hole on the die hole by using a chamfering machine to obtain a semi-finished product of the ring die with a double-layer taper hole;
s4, then, carrying out hole pattern and hole diameter repeated engraving on the double-layer taper hole to obtain a hole pattern column;
s5, placing the ring die semi-finished product with the hole-shaped column taken out into a vacuum heat treatment system for quenching treatment, tempering and polishing treatment after quenching, detecting the thermal retraction amount of the double-layer taper hole through the hole-shaped column, and obtaining the qualified product, namely the optical ring die.
2. The process for preparing a double-layer chamfer type ring die according to claim 1, wherein: the quenching temperature in the S5 is 1020-1060 ℃, and the tempering temperature is 180-220 ℃.
3. The process for preparing a double-layer chamfer type ring die according to claim 1, wherein: the ring die is machined from a high-quality stainless steel forging, and 4Cr13 is preferred.
4. The process for preparing a double-layer chamfer type ring die according to claim 1, wherein: the specific steps of the hole pattern and the hole diameter repeated engraving of the double-layer taper hole are as follows:
s41, randomly selecting and marking a plurality of double-layer conical holes, filling air sheets into the middle parts of the selected double-layer conical holes, and then respectively extruding and filling ceramic mud into the inner parts of two orifices of the double-layer conical holes until the ceramic mud is compacted to form two separated hole type columns;
s42, extruding and sealing two orifices of the double-layer taper hole by using a hard plate, then performing heating treatment to expand the gas sheet, and extruding two hole-type columns from the middle part;
s43, cooling to restore the air sheet, taking down the hard plate, continuously extruding from the two orifices, filling new clay, and repeating S41-S42 for two to three times until the clay is pressed and molded;
and S44, heating again to make the gas sheet expand and push the upper hole-type column upwards, and then push the larger hole of the double-layer taper hole downwards and push the other hole-type column out.
5. The process for preparing a double-layer chamfer type ring die according to claim 1, wherein: the hole pattern detection step of the double-layer taper hole in the S5 specifically comprises the following steps: and inserting the hole model columns into the marked double-layer taper holes and two holes of a plurality of double-layer taper holes randomly selected again, wherein the double-layer taper holes which can be smoothly inserted into the hole model columns are qualified, and if more than 95% of the detected double-layer taper holes are qualified, the ring model is a qualified optical ring model.
6. The process for preparing a double-layer chamfer type ring die according to claim 4, wherein: the heating temperature in the step of re-engraving the hole pattern and the hole diameter of the double-layer taper hole is 90-120 ℃.
7. The process for preparing a double-layer chamfer type ring die according to claim 1, wherein: the gas piece comprises an expansion layer (21) and a plurality of embedded hard beads (22) embedded in the upper end part and the lower end part of the expansion layer (21), and high-heat-conductivity gas is filled in the expansion layer (21).
8. The process for preparing a double-layer chamfer type ring die according to claim 7, wherein: the filling amount of the high-heat-conductivity gas is saturated filling, the expansion layer (21) is made of elastic sealing materials, and the distance between every two adjacent embedded hard beads (22) is smaller than the radius of the embedded hard beads.
9. The process for preparing a double-layer chamfer type ring die according to claim 1, wherein: the double-layer taper hole comprises an upper taper hole (11) and a lower taper hole (12), wherein the upper taper hole (11) and the lower taper hole (12) are communicated with each other, and the depth of the upper taper hole and the depth of the lower taper hole are the same.
10. The process for preparing a double-layer chamfered ring mold according to claim 9, wherein: the opening angle of the upper taper hole (11) is 30-60 degrees, the opening angle of the lower taper hole (12) is 10-30 degrees, and the total depth of the upper taper hole (11) and the lower taper hole (12) is 2-4 cm.
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