Aluminum/magnesium/copper composite board and powder hot-pressing preparation method
Technical Field
The invention belongs to the technical field of metal composite materials, and particularly relates to an aluminum/magnesium/copper composite plate and a powder hot-pressing preparation method.
Background
The metal composite material is a novel material formed by connecting two or more than two metal materials or metal and nonmetal materials with different physical and chemical properties by using a certain composite connection technology, and the advantages of all components can be fully utilized to meet the complex industrial application requirements through reasonable design and processing technology. The aluminum and copper matrix has good electric conduction, heat conduction, corrosion resistance and forming performance, and the magnesium matrix has the advantages of high specific strength, good heat dissipation, good shock absorption, strong impact load bearing capacity and the like. The aluminum/magnesium/copper composite board not only has the advantages of high conductivity, light weight, economy and the like, but also has certain strength, impact resistance and excellent shock absorption, and can be used as a conductor, a conductor connecting material and a structural member. At present, explosion welding, rolling and brazing are mainly adopted as composite connection technologies of aluminum/magnesium, aluminum/copper and magnesium/copper, wherein the explosion welding realizes the connection of two metal plate interfaces through explosion shock waves, but the explosion welding speed is high, uncontrollable factors are more, the preparation environment is severe, and the automatic production is not easy to realize. The magnesium plate is not easy to generate plastic deformation during cold rolling, the surface of the magnesium plate is easy to oxidize during hot rolling, the interface bonding quality of the composite plate is seriously influenced, the edge of the rolled composite plate is prone to cracking, and the yield is low. Brazing makes the interface wet by the braze, forming a diffusion bond, but the braze bond is not very strong at the interface. The effect of the above-described joining method is more limited, particularly for magnesium/copper joining.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide an aluminum/magnesium/copper composite plate and a powder hot-pressing preparation method.
The invention adopts the form of sequentially laying powder on the aluminum-aluminum/magnesium mixed thin layer-magnesium/copper mixed thin layer-copper, increases the contact area and the fluidity of the material at the interface, realizes the full diffusion and combination of aluminum/magnesium and magnesium/copper interface elements by optimizing hot pressing process parameters, improves the interface combination strength, obtains the aluminum/magnesium/copper composite board with excellent comprehensive mechanical property, and has the advantages of low powder quality requirement, simple preparation method, stable and reliable product quality, high yield, high production efficiency and production cost saving.
The purpose of the invention can be realized by the following technical scheme:
the invention provides a powder hot-pressing preparation method of an aluminum/magnesium/copper composite board, which comprises the following steps:
(1) respectively paving aluminum-containing powder, magnesium-containing powder and copper-containing powder in sequence through an aluminum-aluminum/magnesium mixed thin layer-magnesium/copper mixed thin layer-copper;
(2) in the step (1), each layer of powder is paved, a pressure head is used for pre-pressing the powder layer, the powder is pressed and compacted, and finally a pre-pressed composite powder block body with a certain layer thickness is formed;
(3) and (3) performing hot-pressing compounding on the pre-pressed composite powder block treated in the step (2), and maintaining the pressure and cooling to obtain the aluminum/magnesium/copper composite board.
Preferably, an aluminum/magnesium mixed thin powder layer is laid between the aluminum-containing powder layer and the magnesium-containing powder layer, and a magnesium/copper mixed thin powder layer is laid between the magnesium-containing powder layer and the copper-containing powder layer.
Preferably, the thickness of the aluminum/magnesium mixed thin powder layer is 1-3mm, and the aluminum-containing powder and the magnesium-containing powder in the aluminum/magnesium mixed thin powder layer both have 50% of content.
Preferably, the thickness of the magnesium/copper mixed thin powder layer is 1-3mm, and the content of magnesium-containing powder and copper-containing powder in the magnesium/copper mixed thin powder layer are both 50%.
Preferably, the mesh numbers of the aluminum-containing powder, the magnesium-containing powder and the copper-containing powder are controlled to be 220-800 meshes.
Preferably, the aluminum-containing powder comprises aluminum powder and aluminum alloy powder.
Preferably, the magnesium-containing powder comprises magnesium powder and magnesium alloy powder.
Preferably, the copper-containing powder comprises copper powder and copper alloy powder.
Preferably, the powder spreading thickness of the aluminum-containing powder is 1-20mm, the powder spreading thickness of the magnesium-containing powder is 1-20mm, and the powder spreading thickness of the copper-containing powder is 1-20 mm.
Preferably, the hot-press compounding in the step (3) comprises room-temperature pre-pressing and high-temperature hot-pressing.
Preferably, the room-temperature prepressing pressure is 50-200MPa, and the time is 10-60 s.
Preferably, the temperature of the high-temperature hot pressing is 300-600 ℃, the pressure is 100-600MPa, and the time is 10-480 min.
Preferably, the hot pressing method in the step (3) is as follows: the mould containing the prepressing composite powder block is provided with a pressure head, the mould is arranged between two thick steel plates with a plurality of heating resistance wires and thermocouples, and the periphery of the mould is enclosed and blocked by asbestos to prevent heat dissipation; mica plates are arranged on the outer sides of the thick steel plates for heat insulation, one mica plate is arranged on a press pressure head of the hot pressing device, and the other mica plate is arranged on a press base of the hot pressing device.
Preferably, after the aluminum/magnesium/copper composite plate is obtained by the method, the post-treatment operation can be carried out.
The post-processing method provided by the invention comprises the following steps:
(A) carrying out pre-rolling heat treatment on the aluminum/magnesium/copper composite plate of the powder hot-pressing Cu brazing filler metal reinforced interface;
(B) carrying out rolling plastic deformation treatment on the composite board subjected to the heat treatment in the step (A);
(C) and (C) carrying out post-rolling heat treatment on the composite treated in the step (B).
Preferably, the pre-rolling heat treatment method in the step (a) is as follows: the heat treatment temperature is 300-500 ℃, and the heat preservation time is 5-20 min.
Preferably, the rolling plastic deformation processing method of the step (B) is: the rolling temperature is 300-500 ℃, and the rolling reduction is 10-60%. The rolling plastic deformation treatment aims to densify the organization structure of the aluminum/magnesium/copper composite plate under the action of large plastic deformation, eliminate the defects of holes, virtual connection, disconnection and the like and further promote the combination among atoms.
Preferably, the post-rolling heat treatment method in the step (C) is: the heat treatment temperature is 100 ℃ and 300 ℃, and the heat preservation time is 0.5-8 h. The purpose of the heat treatment after rolling is to eliminate the internal stress formed in the rolling process, enable the structure to recover and recrystallize, promote element diffusion, ensure the interface bonding quality, improve the plasticity and the interface bonding strength and further improve the comprehensive mechanical property of the aluminum/magnesium/copper composite plate.
Preferably, steps (A) and (B) are alternately cycled a plurality of times before step (C) is performed.
By rolling plastic deformation of the powder hot-pressed aluminum/magnesium/copper composite board, the organization structure of the aluminum/magnesium/copper composite board is densified under the action of large plastic deformation, the defects of holes, virtual connection, disconnection and the like are eliminated, and the interatomic combination is further promoted. And then, matching with a subsequent heat treatment process (annealing treatment), on one hand, internal stress formed in the rolling process is eliminated, so that the structure is subjected to recovery recrystallization, on the other hand, element diffusion is promoted, the interface bonding quality is ensured, the plasticity and the interface bonding strength are improved, and the comprehensive mechanical property of the aluminum/magnesium/copper composite plate is further improved.
The invention also provides an aluminum/magnesium/copper composite board obtained by the powder hot-pressing preparation method.
The invention has the beneficial effects that:
due to the existence of the aluminum/magnesium mixed thin layer and the magnesium/copper mixed thin layer, transition and diffusion of aluminum/magnesium and magnesium/copper interface elements are effectively realized, the interface bonding strength is obviously improved, the aluminum/magnesium/copper composite board with excellent comprehensive mechanical properties is obtained, the powder quality requirement is low, the preparation method is simple, the product quality is stable and reliable, the yield is high, the production efficiency is high, and the production cost is saved.
Drawings
FIG. 1 is a schematic structural diagram of a pre-compacted composite powder block.
Fig. 2 is a schematic structural diagram of a powder hot press molding device.
Detailed Description
A powder hot-pressing preparation method of an aluminum/magnesium/copper composite plate comprises the following steps:
(1) respectively paving aluminum-containing powder, magnesium-containing powder and copper-containing powder in sequence through an aluminum-aluminum/magnesium mixed thin layer-magnesium/copper mixed thin layer-copper;
(2) in the step (1), each layer of powder is paved, a pressure head is used for pre-pressing the powder layer, the powder is pressed and compacted, and finally a pre-pressed composite powder block body with a certain layer thickness is formed;
(3) and (3) performing hot-pressing compounding on the pre-pressed composite powder block treated in the step (2), and maintaining the pressure and cooling to obtain the aluminum/magnesium/copper composite board.
Wherein, an aluminum/magnesium mixed thin powder layer is laid between the aluminum-containing powder layer and the magnesium-containing powder layer, and a magnesium/copper mixed thin powder layer is laid between the magnesium-containing powder layer and the copper-containing powder layer. The thickness of the aluminum/magnesium mixed thin powder layer is 1-3mm, and the aluminum-containing powder and the magnesium-containing powder in the aluminum/magnesium mixed thin powder layer both have the content of 50%. The thickness of the magnesium/copper mixed thin powder layer is 1-3mm, and the content of magnesium-containing powder and copper-containing powder in the magnesium/copper mixed thin powder layer is 50%. The mesh numbers of the aluminum-containing powder, the magnesium-containing powder and the copper-containing powder are controlled to be 800 meshes 220-220. The aluminum-containing powder comprises aluminum powder and aluminum alloy powder. The magnesium-containing powder comprises magnesium powder and magnesium alloy powder. The copper-containing powder comprises copper powder and copper alloy powder. The powder spreading thickness of the aluminum-containing powder is 1-20mm, the powder spreading thickness of the magnesium-containing powder is 1-20mm, and the powder spreading thickness of the copper-containing powder is 1-20 mm. And (3) performing hot-pressing compounding, wherein the hot-pressing compounding comprises room-temperature prepressing and high-temperature hot pressing. The room temperature prepressing pressure is 50-200MPa, and the time is 10-60 s. The temperature of the high-temperature hot pressing is 300-600 ℃, the pressure is 100-600MPa, and the time is 10-480 min.
The hot pressing method in the step (3) comprises the following steps: the hot pressing is carried out by using powder hot pressing forming equipment which comprises a press head 1, a mica plate 2, a thick steel plate 3, a mould head 4, a mould 5, a resistance wire 6, a thermocouple 7 and a press base 8 as shown in figure 2, the die 5 is used for containing metal powder 9, the die pressure head 4 is matched with the die 5 for pressing the metal powder 9, the die 5 and the die pressure head 4 are arranged between the two thick steel plates 3, a resistance wire 6 for heating and a thermocouple 7 for detecting temperature are arranged in the thick steel plates 3, the two mica plates 2 are respectively arranged at the outer sides of the two thick steel plates 3 for heat insulation, one mica plate 2 is arranged below the press head 1 of the press, the other mica plate 2 is arranged on the press base 8, the pressing of the press head 1 drives the die head 4 to press downwards, and the pressing of the metal powder 9 is realized by matching with the die 5. The peripheries of the die pressing head 4 and the die 5 are enclosed by asbestos.
In one embodiment of the present invention, after the aluminum/magnesium/copper composite plate is obtained by the above method, a post-treatment operation may be further performed. The post-treatment method comprises the following steps:
(A) carrying out pre-rolling heat treatment on the aluminum/magnesium/copper composite plate of the powder hot-pressing Cu brazing filler metal reinforced interface;
(B) carrying out rolling plastic deformation treatment on the composite board subjected to the heat treatment in the step (A);
(C) and (C) carrying out post-rolling heat treatment on the composite treated in the step (B).
Preferably, the pre-rolling heat treatment method in the step (a) is as follows: the heat treatment temperature is 300-500 ℃, and the heat preservation time is 5-20 min.
Preferably, the rolling plastic deformation processing method of the step (B) is: the rolling temperature is 300-500 ℃, and the rolling reduction is 10-60%. The rolling plastic deformation treatment aims to densify the organization structure of the aluminum/magnesium/copper composite plate under the action of large plastic deformation, eliminate the defects of holes, virtual connection, disconnection and the like and further promote the combination among atoms.
Preferably, the post-rolling heat treatment method in the step (C) is: the heat treatment temperature is 100 ℃ and 300 ℃, and the heat preservation time is 0.5-8 h. The purpose of the heat treatment after rolling is to eliminate the internal stress formed in the rolling process, enable the structure to recover and recrystallize, promote element diffusion, ensure the interface bonding quality, improve the plasticity and the interface bonding strength and further improve the comprehensive mechanical property of the aluminum/magnesium/copper composite plate.
Preferably, steps (A) and (B) are alternately cycled a plurality of times before step (C) is performed.
By rolling plastic deformation of the powder hot-pressed aluminum/magnesium/copper composite board, the organization structure of the aluminum/magnesium/copper composite board is densified under the action of large plastic deformation, the defects of holes, virtual connection, disconnection and the like are eliminated, and the interatomic combination is further promoted. And then, matching with a subsequent heat treatment process (annealing treatment), on one hand, internal stress formed in the rolling process is eliminated, so that the structure is subjected to recovery recrystallization, on the other hand, element diffusion is promoted, the interface bonding quality is ensured, the plasticity and the interface bonding strength are improved, and the comprehensive mechanical property of the aluminum/magnesium/copper composite plate is further improved.
The invention is described in detail below with reference to the figures and specific embodiments.
Example 1
In the embodiment, 400-mesh AZ31 magnesium alloy powder and AlSi10Mg aluminum alloy powder are respectively selected, 400-mesh AZ31 magnesium alloy powder, pure aluminum powder and pure copper powder are respectively selected according to the aluminum/embodiment, powder is spread layer by layer in a die according to the sequence of aluminum-aluminum/magnesium mixed thin layer-magnesium/copper mixed thin layer-copper, wherein the thickness of each layer of powder spread layer is 5mm, the thickness of the mixed thin layer spread powder is 3mm, each layer of powder is flattened and compacted after being spread, and a prepressed composite powder block is obtained, and the structure is shown in figure 1, wherein A, B, C, D, E respectively represents an aluminum alloy powder layer, an aluminum/magnesium mixed thin layer, a magnesium alloy powder layer, a magnesium/copper mixed thin layer and a copper alloy powder layer.
The mould containing the prepressing composite powder block is arranged between two rear steel plates with a plurality of heating resistance wires and thermocouples, the periphery of the mould is enclosed and blocked by asbestos so as to prevent heat dissipation, mica plates are arranged on the outer sides of the thick steel plates to insulate heat, one mica plate is arranged on a press pressure head of the hot-pressing device, and the other mica plate is arranged on a press base of the hot-pressing device.
And after the operation is finished, hot pressing the pre-pressed composite powder block, firstly pre-pressing at room temperature under the pressure of 100MPa, and maintaining the pressure for 30 s. Then heating is started, after the temperature reaches 500 ℃, the pressure is increased to 600MPa, the pressure is maintained for 1h, then the heating device is closed to cool to the room temperature, and the pressure is kept unchanged until the cooling to the room temperature is finished.
The aluminum/magnesium/copper composite board with good interface combination and excellent comprehensive mechanical property can be obtained by the powder hot pressing method.
The aluminum/magnesium/copper composite board obtained in this embodiment is subjected to performance tests of tensile strength, elongation, bending strength and interfacial shear strength, wherein the performance test methods of tensile strength, elongation, bending strength and interfacial shear strength are tested by adopting a standard test method in the field.
The properties of the aluminum/magnesium/copper composite plate obtained in this example are shown in the following table:
the aluminum/magnesium/copper composite plate prepared by the traditional explosive welding and rolling process generally has the tensile strength of about 300MPa, but the plasticity is relatively low, the composite plate is easy to generate the layering phenomenon after being broken, and the interface bonding is weaker. The aluminum/magnesium/copper composite board prepared by the hot pressing process has better plasticity and interface bonding quality under the same tensile strength. Compared with the traditional rolling and explosion welding, the composite board manufactured by the powder hot pressing method has the advantages that: no layering, good interface bonding quality, arbitrary molding, various forms, high efficiency, low rejection rate, high utilization rate and no need of reprocessing.
The embodiments described above are described to facilitate an understanding and use of the invention by those skilled in the art. It will be readily apparent to those skilled in the art that various modifications to these embodiments may be made, and the generic principles described herein may be applied to other embodiments without the use of the inventive faculty. Therefore, the present invention is not limited to the above embodiments, and those skilled in the art should make improvements and modifications within the scope of the present invention based on the disclosure of the present invention.