CN111054926A - Zn solder reinforced interface aluminum/magnesium/aluminum composite board and powder hot-pressing preparation method - Google Patents
Zn solder reinforced interface aluminum/magnesium/aluminum composite board and powder hot-pressing preparation method Download PDFInfo
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
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- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/12—Both compacting and sintering
- B22F3/14—Both compacting and sintering simultaneously
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
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- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
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Abstract
The invention relates to an aluminum/magnesium/aluminum composite board with a Zn solder reinforced interface and a powder hot-pressing preparation method, which comprises the following steps: (1) respectively paving aluminum-containing powder and magnesium-containing powder in a die according to the sequence of aluminum/magnesium/aluminum, and adding Zn solder at an aluminum/magnesium interface; (2) in the step (1), each layer of powder is paved, a pressure head is used for pre-pressing the powder layer, the powder is pressed and compacted, and finally a pre-pressed composite powder block body with a certain layer thickness is formed; (3) and (3) carrying out hot-pressing compounding on the pre-pressed composite powder block treated in the step (2), and carrying out pressure maintaining cooling to obtain the aluminum/magnesium/aluminum composite plate with the Zn solder reinforced interface. The Zn solder reinforced interface aluminum/magnesium/aluminum composite board has the advantages of light weight, high specific strength, high interface bonding strength, excellent comprehensive mechanical property and the like. The invention has the advantages of low powder quality requirement, high composite board interface bonding quality, simple preparation method, high yield, high production efficiency, production cost saving and the like.
Description
Technical Field
The invention belongs to the technical field of metal composite materials, and particularly relates to an aluminum/magnesium/aluminum composite plate with a Zn solder reinforced interface and a powder hot-pressing preparation method.
Background
The magnesium alloy has a close-packed hexagonal crystal structure, has poor room-temperature plastic deformation capacity, high specific strength and low plasticity, but has a face-centered cubic crystal structure, more slip systems and better room-temperature plastic deformation capacity compared with the magnesium alloy. Moreover, because the aluminum alloy and the magnesium alloy are both non-ferrous light metals, the specific gravity is light, the structural mechanical property is excellent, the mutual insufficient exertion of the respective advantages can be made up by an aluminum/magnesium composite mode, the mechanical property of the aluminum/magnesium composite whole body is improved, and the aluminum/magnesium composite whole body has excellent specific strength and plasticity.
The key to making a bimetallic composite is to obtain an interface with good bonding properties. The metallurgical bonding interface is formed by tightly bonding two metal materials together through atomic interdiffusion, has the advantages of high bonding strength, good stability, few impurity defects and the like compared with a mechanical bonding interface, and becomes a main interface bonding mechanism for preparing the bimetal composite material. The preparation method of the existing bimetal composite material mainly comprises the following steps:
1) solid/solid combination. Including rolling composite, welding, extruding composite, explosion composite and other technology. CN101518848A discloses a method for preparing a magnesium and aluminum dissimilar metal composite plate, which obtains an aluminum/magnesium composite plate by high-temperature diffusion reaction after superposition welding. CN102642344A discloses a rolling composite preparation method of an aluminum-clad magnesium wire. CN101992345A discloses an explosive cladding preparation method of an aluminum alloy and magnesium alloy laminated plate. CN102689090A discloses a friction stir welding method for magnesium/aluminum alloy medium plates.
2) Solid/liquid compounding. Mainly adopts a casting compounding method. Because the forming temperature of the aluminum/magnesium intermetallic compound is far lower than the casting temperature of the alloy melt, the two metals can generate hard and brittle intermediate phases in the interface reaction in the casting compounding process, the bonding performance is seriously influenced, and the key point of the casting compounding process is to control and reduce the interface reaction. CN102350492A discloses a method for preparing a cast aluminum-clad magnesium composite ingot, which comprises the steps of pouring liquid magnesium alloy into an aluminum plate box with a certain shape and size, and cooling to obtain an aluminum-clad magnesium alloy ingot. However, the method needs to prefabricate the aluminum plate box, and needs to preheat and surface treat the aluminum plate box before casting, the process is complex, the interface reaction is violent during casting, and the uniform and good interface combination cannot be ensured. CN103691909A discloses an aluminum/magnesium solid-liquid composite casting molding method, which comprises the steps of placing an aluminum alloy pipe subjected to surface treatment and preheating into magnesium alloy liquid, then rapidly quenching into water at room temperature, and after interface solidification, placing into air for cooling to obtain a composite cast ingot. This approach reduces the aluminum/magnesium interface reaction, but the process is complex and limited by the die size. CN105964919A discloses a method for making liquid/liquid composite aluminum/magnesium bi-metal castings by lost foam molding, which comprises providing a composite foam mold containing magnesium alloy part, intermediate aluminum sheet and aluminum alloy part, coating the composite foam mold with paint and sand-burying molding, respectively pouring magnesium alloy liquid and aluminum alloy liquid, cooling and solidifying to obtain the aluminum/magnesium bi-metal castings. The method has the advantages that the interface reaction is hindered by adding the aluminum sheet in advance at the interface, the process is complex, the uniform and good metallurgical bonding can not be ensured, and the method is limited by the size of the die.
3) Liquid/liquid compounding. Mainly adopts a continuous casting compounding method. Compared with other methods, the continuous casting composite method for preparing the bimetallic material has the advantages of low cost, short flow, high efficiency, easy realization of metallurgical bonding and the like, and has wide development prospect. CN106216618A discloses a method for preparing bimetal composite material by pouring continuous casting, which comprises adding metal semi-solid slurry into a solidification cavity formed by a crystallizer for liquid metal melt, and obtaining a bimetal composite ingot with gradient transition after solidification. CN104174823A discloses a solid/liquid composite continuous casting forming device and method for cladding material, which is suitable for continuous casting forming of large-size cladding material which has a melting point of cladding layer metal lower than that of core material metal and is difficult to curl. CN1927504A discloses a cladding material horizontal continuous casting direct composite forming device and a process. However, these processes are only suitable for dissimilar metal composites with widely differing melting points or without the creation of mesophases, such as aluminum/steel, aluminum/copper, aluminum/aluminum composites, and the like. Because the interface temperature is high during liquid/liquid compounding, atomic diffusion is aggravated, the melting points of aluminum and magnesium are only different by about 10 ℃, and a large amount of brittle second phases can be formed at the aluminum/magnesium interface, thereby limiting the application of a continuous casting method in the aspect of preparing the aluminum/magnesium composite material.
The method commonly used for preparing the aluminum/magnesium alloy layered composite board at present mainly takes hot working or large plastic deformation working as follows: explosion welding, rolling, diffusion welding, and the like. The explosion welding method is characterized in that the metal material interface is subjected to high-speed collision by using explosion shock waves generated by explosion, and the connection of metal plates is realized under the action of high pressure. The hot-rolled aluminum/magnesium composite plate is easy to form oxidation on the surface of a metal plate, so that oxide inclusions are generated on a rolling interface, and the interface bonding quality of the composite plate is seriously influenced. Meanwhile, the aluminum/magnesium composite plate is easy to have edge cracks in the rolling process, and the yield is relatively low. The diffusion welding can enable the brazing filler metal and the base metal to be mutually wetted, diffused and dissolved by adding the brazing filler metal, so that the combination of the interface of the composite plate is realized, but the wetting capacity of the brazing filler metal on aluminum and magnesium alloy plates, the filling capacity of the brazing filler metal on the interface gaps and the formation of interface brittle intermetallic compounds caused by diffusion directly influence the combination quality of the interface of the composite plate.
At present, the preparation of the magnesium-aluminum composite plate mainly comprises a solid/solid compounding method, a solid/liquid compounding method and a liquid/liquid compounding method, rolling and hot pressing are used as the most used methods, and a powder preparation method is not adopted.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide an aluminum/magnesium/aluminum composite plate with a Zn solder reinforced interface and a powder hot-pressing preparation method.
According to the invention, aluminum and magnesium powder are spread layer by layer to increase the contact area and the fluidity of materials at an interface, and the thin Zn brazing filler metal is added at the aluminum/magnesium interface to realize the sufficient diffusion of interface Zn elements and the dispersion distribution of Zn-rich particles under the action of high pressure and high temperature, so that the sufficient diffusion and combination of the aluminum/magnesium interface elements are realized, the interface combination strength is improved, and the aluminum/magnesium/aluminum composite board with excellent comprehensive mechanical properties is obtained. The Zn solder reinforced interface aluminum/magnesium/aluminum composite board has the advantages of light weight, high specific strength, high interface bonding strength, excellent comprehensive mechanical property and the like.
The purpose of the invention can be realized by the following technical scheme:
the invention provides a powder hot-pressing preparation method of an aluminum/magnesium/aluminum composite plate with a Zn solder reinforced interface, which comprises the following steps:
(1) respectively paving aluminum-containing powder and magnesium-containing powder in a die according to the sequence of aluminum/magnesium/aluminum, and adding Zn solder at an aluminum/magnesium interface;
(2) in the step (1), each layer of powder is paved, a pressure head is used for pre-pressing the powder layer, the powder is pressed and compacted, and finally a pre-pressed composite powder block body with a certain layer thickness is formed;
(3) and (3) carrying out hot-pressing compounding on the pre-pressed composite powder block treated in the step (2), and carrying out pressure maintaining cooling to obtain the aluminum/magnesium/aluminum composite plate with the Zn solder reinforced interface.
Preferably, the mesh number of the aluminum-containing powder and the magnesium-containing powder is controlled to be 220-800 meshes.
Preferably, the aluminum-containing powder comprises aluminum powder and aluminum alloy powder.
Preferably, the magnesium-containing powder comprises magnesium powder and magnesium alloy powder.
Preferably, the powder thickness of the aluminiferous powder is 1-20 mm.
Preferably, the powder thickness of the magnesium-containing powder is 1-20 mm.
Preferably, the thickness of the Zn brazing filler layer is 0.1-1 mm.
Preferably, the Zn-based braze is selected from pure zinc foil or zinc-based brazes of the respective series.
Preferably, the hot-press compounding in the step (3) comprises room-temperature pre-pressing and high-temperature hot-pressing.
Preferably, the room-temperature prepressing pressure is 50-200MPa, and the time is 10-60 s.
Preferably, the temperature of the high-temperature hot pressing is 300-550 ℃, the pressure is 100-500MPa, and the time is 10-480 min.
Preferably, the hot pressing method in the step (3) is as follows: the mould containing the prepressing composite powder block is provided with a pressure head, the mould is arranged between two thick steel plates with a plurality of heating resistance wires and thermocouples, and the periphery of the mould is enclosed and blocked by asbestos to prevent heat dissipation; mica plates are arranged on the outer sides of the thick steel plates for heat insulation, one mica plate is arranged on a press pressure head of the hot pressing device, and the other mica plate is arranged on a press base of the hot pressing device.
Preferably, after the aluminum/magnesium/aluminum composite plate with the Zn solder reinforced interface is obtained by the method, the post-treatment operation can be carried out.
The post-processing method provided by the invention comprises the following steps:
(A) carrying out pre-rolling heat treatment on the powder hot-pressed aluminum/magnesium/aluminum composite plate;
(B) carrying out rolling plastic deformation treatment on the composite board subjected to the heat treatment in the step (A);
(C) and (C) carrying out post-rolling heat treatment on the composite treated in the step (B).
Preferably, the pre-rolling heat treatment method in the step (a) is as follows: the heat treatment temperature is 300-500 ℃, and the heat preservation time is 5-20 min.
Preferably, the rolling plastic deformation processing method of the step (B) is: the rolling temperature is 300-500 ℃, and the rolling reduction is 10-60%. The rolling plastic deformation treatment aims to densify the structure of the aluminum/magnesium/aluminum composite plate under the action of large plastic deformation, eliminate the defects of holes, virtual connection, disconnection and the like and further promote the combination among atoms.
Preferably, the post-rolling heat treatment method in the step (C) is: the heat treatment temperature is 100 ℃ and 300 ℃, and the heat preservation time is 0.5-8 h. The purpose of the heat treatment after rolling is to eliminate the internal stress formed in the rolling process, enable the structure to recover and recrystallize, promote element diffusion, ensure the interface bonding quality, improve the plasticity and the interface bonding strength and further improve the comprehensive mechanical property of the aluminum/magnesium/aluminum composite plate.
Preferably, steps (A) and (B) are alternately cycled a plurality of times before step (C) is performed.
By carrying out rolling plastic deformation on the powder hot-pressed aluminum/magnesium/aluminum composite plate, the aluminum/magnesium/aluminum composite plate with the Zn solder reinforced interface is densified in organization structure under the action of large plastic deformation, the defects of holes, virtual connection, disconnection and the like are eliminated, and the interatomic combination is further promoted. And then, matching with a subsequent heat treatment process (annealing treatment), on one hand, internal stress formed in the rolling process is eliminated, so that the structure is subjected to recovery recrystallization, on the other hand, element diffusion is promoted, the interface bonding quality is ensured, the plasticity and the interface bonding strength are improved, and the comprehensive mechanical property of the aluminum/magnesium/aluminum composite plate is further improved.
The invention also provides an aluminum/magnesium/aluminum composite plate with a Zn solder reinforced interface, which is obtained by adopting the powder hot-pressing preparation method.
The invention has the beneficial effects that:
the effective contact area and material fluidity of the material at the interface can be increased by adopting a powder hot pressing mode, the sufficient diffusion and combination of the aluminum/magnesium interface elements are realized, meanwhile, the thin Zn brazing filler metal is added at the aluminum/magnesium interface, the sufficient diffusion of the interface Zn elements and the dispersion distribution of Zn-rich particles are realized under the action of high pressure and high temperature, so that the sufficient diffusion and combination of the aluminum/magnesium interface elements are realized, the interface combination strength is improved, and the aluminum/magnesium/aluminum composite board with excellent comprehensive mechanical property is obtained. The Zn solder reinforced interface aluminum/magnesium/aluminum composite board has the advantages of light weight, high specific strength, high interface bonding strength, excellent comprehensive mechanical property and the like. Compared with the prior art, the invention has the advantages of low powder quality requirement, high composite board interface bonding quality, simple preparation method, high yield, high production efficiency, production cost saving and the like.
Drawings
FIG. 1 is a schematic structural diagram of a pre-compacted composite powder block.
FIG. 2 is a microstructure of an aluminum/magnesium/aluminum composite plate cross section of a Zn solder reinforced interface.
Fig. 3 is a tensile stress-strain curve of an aluminum/magnesium/aluminum composite plate with a Zn solder reinforced interface.
Fig. 4 shows the tensile fracture of the aluminum/magnesium/aluminum composite plate at the Zn solder reinforced interface.
Fig. 5 is a schematic structural diagram of a powder hot press molding device.
Detailed Description
A powder hot-pressing preparation method of an aluminum/magnesium/aluminum composite plate with a Zn solder reinforced interface comprises the following steps:
(1) respectively paving aluminum-containing powder and magnesium-containing powder in a die according to the sequence of aluminum/magnesium/aluminum, and adding Zn solder at an aluminum/magnesium interface;
(2) in the step (1), each layer of powder is paved, a pressure head is used for pre-pressing the powder layer, the powder is pressed and compacted, and finally a pre-pressed composite powder block body with a certain layer thickness is formed;
(3) and (3) carrying out hot-pressing compounding on the pre-pressed composite powder block treated in the step (2), and carrying out pressure maintaining cooling to obtain the aluminum/magnesium/aluminum composite plate with the Zn solder reinforced interface.
Wherein, the mesh number of the aluminum-containing powder and the magnesium-containing powder is controlled to be 220-800 meshes.
The aluminum-containing powder comprises aluminum powder and aluminum alloy powder. The magnesium-containing powder comprises magnesium powder and magnesium alloy powder. The powder spreading thickness of the aluminum-containing powder is 1-20 mm. The spreading thickness of the magnesium-containing powder is 1-20 mm. The thickness of the Zn brazing filler metal layer is 0.1-1 mm. The Zn solder is selected from pure zinc foil or zinc-based solders of various series.
And (3) performing hot-pressing compounding, wherein the hot-pressing compounding comprises room-temperature prepressing and high-temperature hot pressing. The room temperature prepressing pressure is 50-200MPa, and the time is 10-60 s. The temperature of the high-temperature hot pressing is 300-550 ℃, the pressure is 100-500MPa, and the time is 10-480 min.
The hot pressing in the step (3) is carried out by using powder hot press molding equipment, the powder hot press molding equipment comprises a press head 1, mica plates 2, thick steel plates 3, a die head 4, a die 5, a resistance wire 6, a thermocouple 7 and a press base 8, the die 5 is used for containing metal powder 9, the die head 4 and the die 5 are matched for pressing the metal powder 9, the die 5 and the die head 4 are arranged between the two thick steel plates 3, the resistance wire 6 for heating and the thermocouple 7 for detecting temperature are arranged in the thick steel plates 3, the two mica plates 2 are respectively arranged on the outer sides of the two thick steel plates 3 for heat insulation, one mica plate 2 is arranged below the press head 1, the other mica plate 2 is arranged on the press base 8, the press head 1 presses down to drive the die head 4 to press down, the pressing of the metal powder 9 is achieved with the fitting mold 5. The peripheries of the die pressing head 4 and the die 5 are enclosed by asbestos.
In an embodiment of the present invention, after the aluminum/magnesium/aluminum composite plate with Zn solder reinforced interface is obtained by the above method, a post-treatment operation may be further performed, and the post-treatment method includes the following steps:
(A) carrying out pre-rolling heat treatment on the powder hot-pressed aluminum/magnesium/aluminum composite plate;
(B) carrying out rolling plastic deformation treatment on the composite board subjected to the heat treatment in the step (A);
(C) and (C) carrying out post-rolling heat treatment on the composite treated in the step (B).
Preferably, the pre-rolling heat treatment method in the step (a) is as follows: the heat treatment temperature is 300-500 ℃, and the heat preservation time is 5-20 min.
Preferably, the rolling plastic deformation processing method of the step (B) is: the rolling temperature is 300-500 ℃, and the rolling reduction is 10-60%. The rolling plastic deformation treatment aims to densify the structure of the aluminum/magnesium/aluminum composite plate under the action of large plastic deformation, eliminate the defects of holes, virtual connection, disconnection and the like and further promote the combination among atoms.
Preferably, the post-rolling heat treatment method in the step (C) is: the heat treatment temperature is 100 ℃ and 300 ℃, and the heat preservation time is 0.5-8 h. The purpose of the heat treatment after rolling is to eliminate the internal stress formed in the rolling process, enable the structure to recover and recrystallize, promote element diffusion, ensure the interface bonding quality, improve the plasticity and the interface bonding strength and further improve the comprehensive mechanical property of the aluminum/magnesium/aluminum composite plate.
Preferably, steps (A) and (B) are alternately cycled a plurality of times before step (C) is performed.
By carrying out rolling plastic deformation on the powder hot-pressed aluminum/magnesium/aluminum composite plate, the aluminum/magnesium/aluminum composite plate with the Zn solder reinforced interface is densified in organization structure under the action of large plastic deformation, the defects of holes, virtual connection, disconnection and the like are eliminated, and the interatomic combination is further promoted. And then, matching with a subsequent heat treatment process (annealing treatment), on one hand, internal stress formed in the rolling process is eliminated, so that the structure is subjected to recovery recrystallization, on the other hand, element diffusion is promoted, the interface bonding quality is ensured, the plasticity and the interface bonding strength are improved, and the comprehensive mechanical property of the aluminum/magnesium/aluminum composite plate is further improved.
The invention is described in detail below with reference to the figures and specific embodiments.
Example 1
In this embodiment, 400-mesh AZ31 magnesium alloy powder, AlSi10Mg aluminum alloy powder and 0.1mm thick pure zinc solder are respectively selected, powder is spread layer by layer in a die according to the aluminum/magnesium/aluminum sequence, Zn solder is added at the aluminum/magnesium interface, the thickness of each layer of powder spread layer is 5mm, each layer of powder is flattened and compacted after powder is spread, and a prepressed composite powder block is obtained, the structure is shown in fig. 1, wherein A, B, C respectively represents a magnesium alloy powder layer, a Zn solder and an aluminum alloy powder layer.
The mould containing the prepressing composite powder block is arranged between two rear steel plates with a plurality of heating resistance wires and thermocouples, the periphery of the mould is enclosed and blocked by asbestos so as to prevent heat dissipation, mica plates are arranged on the outer sides of the thick steel plates to insulate heat, one mica plate is arranged on a press pressure head of the hot-pressing device, and the other mica plate is arranged on a press base of the hot-pressing device.
And after the operation is finished, hot pressing the pre-pressed composite powder block, firstly pre-pressing at room temperature under the pressure of 100MPa, and maintaining the pressure for 30 s. Then heating is started, after the temperature reaches 450 ℃, the pressure is increased to 500MPa, the pressure is maintained for 1h, then the heating device is closed to cool to the room temperature, and the pressure is kept unchanged until the cooling to the room temperature is finished.
The aluminum/magnesium/aluminum composite board with good interface combination and excellent comprehensive mechanical property can be obtained by the powder hot pressing method.
The performance tests of tensile strength, elongation, bending strength and interface shear strength are performed on the Zn solder reinforced interface aluminum/magnesium/aluminum composite plate obtained in this example, wherein the performance test methods of tensile strength, elongation, bending strength and interface shear strength are performed by using the standard test method in the field.
The properties of the aluminum/magnesium/aluminum composite plate with Zn solder reinforced interface obtained in this example are shown in the following table:
from fig. 2, it can be seen that the interface layer of the aluminum/magnesium/aluminum composite plate with Zn solder reinforced interface contains Zn layer solder, the tensile stress-strain curve of the composite plate is shown in fig. 3, the tensile strength is more than 300MPa, the elongation is 17%, the tensile fracture is shown in fig. 4, and it can be seen that no delamination occurs at the composite plate interface, indicating that the interface bonding of the composite plate is good. The aluminum/magnesium/aluminum composite board prepared by the traditional explosive welding and rolling process generally has the tensile strength of 300MPa, but the plasticity is relatively low, the delamination phenomenon is easy to occur after the composite board is broken, and the interface bonding is weak. The Zn solder reinforced interface aluminum/magnesium/aluminum composite board prepared by the hot pressing process has better plasticity and interface bonding quality under the same tensile strength.
Compared with the traditional rolling and explosion welding, the composite board manufactured by the powder hot pressing method has the advantages that: good plasticity, no layering, good interface bonding quality, arbitrary molding, various forms, high efficiency, low rejection rate, high utilization rate and no need of reprocessing.
The embodiments described above are described to facilitate an understanding and use of the invention by those skilled in the art. It will be readily apparent to those skilled in the art that various modifications to these embodiments may be made, and the generic principles described herein may be applied to other embodiments without the use of the inventive faculty. Therefore, the present invention is not limited to the above embodiments, and those skilled in the art should make improvements and modifications within the scope of the present invention based on the disclosure of the present invention.
Claims (10)
1. A powder hot-pressing preparation method of an aluminum/magnesium/aluminum composite board with a Zn solder reinforced interface is characterized by comprising the following steps:
(1) respectively paving aluminum-containing powder and magnesium-containing powder in a die according to the sequence of aluminum/magnesium/aluminum, and adding Zn solder at an aluminum/magnesium interface;
(2) in the step (1), each layer of powder is paved, a pressure head is used for pre-pressing the powder layer, the powder is pressed and compacted, and finally a pre-pressed composite powder block body with a certain layer thickness is formed;
(3) and (3) carrying out hot-pressing compounding on the pre-pressed composite powder block treated in the step (2), and carrying out pressure maintaining cooling to obtain the aluminum/magnesium/aluminum composite plate with the Zn solder reinforced interface.
2. The powder hot-pressing preparation method of the Zn solder reinforced interface aluminum/magnesium/aluminum composite plate as claimed in claim 1, wherein the mesh number of the aluminum-containing powder and the magnesium-containing powder is controlled to be 220-800 meshes.
3. The powder hot-pressing preparation method of the aluminum/magnesium/aluminum composite plate with the Zn solder reinforced interface according to claim 1, wherein the aluminum-containing powder comprises aluminum powder and aluminum alloy powder;
the magnesium-containing powder comprises magnesium powder and magnesium alloy powder.
4. The powder hot-pressing preparation method of the Zn solder reinforced interface aluminum/magnesium/aluminum composite board according to claim 1, wherein the powder spreading thickness of the aluminum-containing powder is 1-20mm, the powder spreading thickness of the magnesium-containing powder is 1-20mm, and the Zn solder spreading layer thickness is 0.1-1 mm.
5. The powder hot-pressing preparation method of the Zn solder reinforced interface aluminum/magnesium/aluminum composite board according to claim 1, wherein the Zn solder is selected from pure zinc foil or zinc-based solder.
6. The powder hot pressing preparation method of the Zn solder reinforced interface aluminum/magnesium/aluminum composite plate according to claim 1, wherein the hot pressing compounding of the step (3) comprises room temperature pre-pressing and high temperature hot pressing.
7. The powder hot-pressing preparation method of the Zn solder reinforced interface aluminum/magnesium/aluminum composite board according to claim 6, wherein the room temperature pre-pressing pressure is 50-200MPa and the time is 10-60 s.
8. The powder hot-pressing preparation method of the Zn solder reinforced interface aluminum/magnesium/aluminum composite plate as claimed in claim 6, wherein the temperature of the high-temperature hot-pressing is 300-.
9. The powder hot-pressing preparation method of the Zn solder reinforced interface aluminum/magnesium/aluminum composite board according to claim 1, wherein the hot-pressing method in the step (3) is as follows: the mould containing the prepressing composite powder block is provided with a pressure head, the mould is arranged between two thick steel plates with a plurality of heating resistance wires and thermocouples, and the periphery of the mould is enclosed and blocked by asbestos to prevent heat dissipation; mica plates are arranged on the outer sides of the thick steel plates for heat insulation, one mica plate is arranged on a press pressure head of the hot pressing device, and the other mica plate is arranged on a press base of the hot pressing device.
10. An aluminum/magnesium/aluminum composite plate with Zn solder reinforced interface obtained by the powder hot pressing preparation method of any one of claims 1 to 9.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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