CN112735979A - Semiconductor process chamber - Google Patents
Semiconductor process chamber Download PDFInfo
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- CN112735979A CN112735979A CN202011548111.8A CN202011548111A CN112735979A CN 112735979 A CN112735979 A CN 112735979A CN 202011548111 A CN202011548111 A CN 202011548111A CN 112735979 A CN112735979 A CN 112735979A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 47
- 238000000034 method Methods 0.000 title abstract description 52
- 230000008569 process Effects 0.000 title abstract description 52
- 230000000670 limiting effect Effects 0.000 claims description 23
- 238000012545 processing Methods 0.000 claims description 23
- 238000007789 sealing Methods 0.000 claims description 18
- 238000012423 maintenance Methods 0.000 abstract description 30
- 230000003287 optical effect Effects 0.000 description 6
- 238000001179 sorption measurement Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 230000005484 gravity Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000036961 partial effect Effects 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 230000008094 contradictory effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910001285 shape-memory alloy Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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Abstract
The application discloses a semiconductor process chamber, which comprises a chamber body and a cover plate, wherein the chamber body is provided with an inner cavity and an opening arranged on a supporting surface of the chamber body, the opening is communicated with the inner cavity, an assembling hole is arranged on the supporting surface, and the axis of the assembling hole is vertical to the supporting surface; the cover plate is covered on the supporting surface, a first bulge is arranged on one side, facing the cavity body, of the cover plate, the first bulge is inserted into the assembling hole, and the first bulge is movably arranged in the assembling hole and can respectively rotate around the assembling hole and slide along the axial direction of the assembling hole. The scheme can solve the problem that the maintenance work of the semiconductor process chamber is heavy.
Description
Technical Field
The application relates to the technical field of semiconductor processes, in particular to a semiconductor process chamber.
Background
Semiconductor processing chambers are important pieces of equipment for semiconductor processing. In the related art, a semiconductor process chamber includes a chamber body and a cover plate capable of being sealingly engaged with the chamber body to enclose a sealed process chamber. In the specific processing process, the sealed process cavity is vacuumized and then processed. In a specific structure, one end of the cover plate is rotatably connected with the chamber body, and after the sealed process chamber is vacuumized, a maintainer needs to lift the cover plate periodically, so that the maintenance of the inside of the chamber body is realized.
However, due to the heavy weight of the cover plate, the lifting of the cover plate usually requires a lot of maintenance personnel, which obviously results in the maintenance of the semiconductor process chamber becoming burdensome. Moreover, the lifted cover plate is easy to buckle, and further, the hidden danger to the safety belt of the maintenance personnel is great.
Disclosure of Invention
The application discloses a semiconductor process chamber, which aims to solve the problem that the maintenance work of the semiconductor process chamber is heavy.
In order to solve the above problems, the following technical solutions are adopted in the present application:
the application discloses a semiconductor process chamber, which comprises a chamber body and a cover plate, wherein the chamber body is provided with an inner cavity and an opening arranged on a supporting surface of the chamber body, the opening is communicated with the inner cavity, an assembling hole is arranged on the supporting surface, and the axis of the assembling hole is vertical to the supporting surface;
the cover plate is covered on the supporting surface, a first bulge is arranged on one side, facing the cavity body, of the cover plate, the first bulge is inserted into the assembly hole, and the first bulge is movably arranged in the assembly hole and can respectively rotate around the assembly hole and axially slide along the assembly hole.
The technical scheme adopted by the application can achieve the following beneficial effects:
when maintaining the semiconductor process cavity disclosed to this application, the maintainer can control the apron earlier, make first arch along pilot hole endwise slip, then make the apron rotatory around the axis of pilot hole through the grafting cooperation of first arch and pilot hole, thereby make maintainer promote apron pivoted process also comparatively laborsaving convenient, then, the apron is rotatable to the convenient safe position who maintains the inner chamber of maintainer, finally, maintainer can maintain the inner chamber, also need not pay attention to the position state of apron specially in this process, after the maintenance work is accomplished, maintainer promotes the apron again and makes it rotate to the position with the sealed complex of cavity main part, thereby solve the problem of the potential safety hazard in the maintenance work, and then make maintainer accomplish the maintenance work comparatively easily.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments or the background art of the present application, the drawings needed to be used in the description of the embodiments or the background art will be briefly described below, and it is obvious for those skilled in the art to obtain other drawings without any inventive exercise.
Fig. 1 is a schematic structural view of a semiconductor process chamber in a sealed state according to an embodiment of the present disclosure;
FIG. 2 is a schematic diagram of a semiconductor processing chamber and auxiliary tool installation configuration as disclosed in an embodiment of the present application;
FIG. 3 is a schematic structural view of a semiconductor processing chamber disclosed in an embodiment of the present application in an open state;
FIG. 4 is a schematic structural diagram of a rotary tool disclosed in an embodiment of the present application;
FIG. 5 is a schematic diagram of a chamber body according to an embodiment of the disclosure;
FIG. 6 is a schematic structural diagram of a cover plate disclosed in an embodiment of the present application;
FIG. 7 is a schematic structural view of a threaded connection as disclosed in an embodiment of the present application;
FIG. 8 is a cross-sectional view of a semiconductor processing chamber disclosed in an embodiment of the present application in an open state;
FIG. 9 is a partial cross-sectional view of a semiconductor processing chamber disclosed in an embodiment of the present application in a sealed state;
FIG. 10 is a partial cross-sectional view of a semiconductor processing chamber disclosed in an embodiment of the present application in an open state;
fig. 11 is a cross-sectional view of a semiconductor processing chamber disclosed in an embodiment of the present application in a sealed state.
Description of reference numerals:
100-chamber body, 110-inner cavity, 120-opening, 130-threaded hole, 140-positioning groove, 150-assembly hole, 160-rotation limiting groove and 161-limiting inner wall;
200-cover plate, 210-positioning block, 230-first protrusion, 231-first connecting shaft, 232-second connecting shaft and 240-connecting hole;
300-a threaded connector, 310-a light shaft section, 311-a rotary matching groove, 320-a threaded section and 321-a second protrusion;
400-sealing the structural member;
500-rotating tool, 510-handle, 520-rocker, 530-rotation fit protrusion;
a-the gap.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be described in detail and completely with reference to the following specific embodiments of the present application and the accompanying drawings. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Technical solutions disclosed in the embodiments of the present application are described in detail below with reference to the accompanying drawings.
Referring to fig. 1 to 11, an embodiment of the present application discloses a semiconductor process chamber including a chamber body 100 and a cover plate 200.
The chamber body 100 may provide a mounting base for the cover plate 200, and particularly, the chamber body 100 has an inner cavity 110 and an opening 120 disposed on a supporting surface of the chamber body 100, the opening 120 is communicated with the inner cavity 110, wherein the supporting surface may be provided with an assembling hole 150, and an axis of the assembling hole 150 is perpendicular to the supporting surface, and during an assembling process of the semiconductor process chamber, the cover plate 200 may be covered on the supporting surface, so that the cover plate 200 may be in a sealing fit with the chamber body 100, thereby forming a sealed process chamber. In the working process of the semiconductor process chamber, the environment in the semiconductor process chamber is a vacuum environment, and the vacuum environment has a large vacuum adsorption force on the cover plate 200.
The cover plate 200 is provided with a first protrusion 230 on a side facing the chamber body 100, the first protrusion 230 can be inserted into the mounting hole 150, and the first protrusion 230 can be movably disposed in the mounting hole 150 and can respectively rotate around the mounting hole 150 and slide axially along the mounting hole 150. Specifically, the first protrusion 230 may be fixed on a surface of the cover plate 200 facing the chamber body 100. The first protrusion 230 may be a unitary structure with the cap plate 200.
In the prior art, the semiconductor process chamber is maintained by lifting the cover plate 200 by a plurality of maintainers in a combined force manner, and the lifted cover plate 200 is easily buckled under the influence of gravity, so that the maintainers are required to pay attention to the situation all the time, and safety accidents caused by buckling of the lifted cover plate 200 in the process of maintaining the inner cavity 110 are prevented, and great hidden dangers are caused to safety belts of the maintainers.
When the semiconductor process chamber disclosed in the embodiment of the present application is maintained, a maintainer may first operate the cover plate 200 to make the first protrusion 230 slide axially along the assembly hole 150, so as to relieve the vacuum adsorption of the vacuum environment in the semiconductor process chamber to the cover plate 200, and then make the cover plate 200 rotate around the axis of the assembly hole 150 through the insertion and engagement of the first protrusion 230 and the assembly hole 150, so that the process of the maintainer pushing the cover plate 200 to rotate is labor-saving and convenient, then the cover plate 200 may be rotated to a safe position where the maintainer can conveniently maintain the inner cavity 110, finally, the maintainer may maintain the inner cavity 110, and in this process, the maintainer does not need to pay special attention to the position state of the cover plate 200, after the maintenance work is completed, the maintainer pushes the cover plate 200 to rotate to a position where the cover plate is in sealing engagement with the chamber main body 100, thereby solving the problem of potential safety, and then the maintenance personnel can easily complete the maintenance work.
In the specific process of opening the cover plate 200, the maintenance personnel may drive the cover plate 200 to move along the axial direction of the assembly hole 150, so as to allow air in the environment to enter the semiconductor process chamber, thereby relieving the vacuum environment, and then drive the cover plate 200 to rotate around the assembly hole 150 after the cover plate 200 is separated from the chamber body 100, thereby opening the opening 120.
In this application embodiment, the semiconductor process chamber may further include a jacking piece, the jacking piece is connected with the first protrusion 230 and the assembly hole 150 respectively, the jacking piece is used for driving the first protrusion 230 to move axially relative to the assembly hole 150, and in the maintenance process of the semiconductor process chamber, the jacking piece may drive the first protrusion 230 to move axially relative to the assembly hole 150, so as to remove vacuum adsorption of the vacuum environment in the semiconductor process chamber to the cover plate 200, and this kind of structure may conveniently remove vacuum adsorption of the vacuum environment to the cover plate 200.
In the embodiment of the present application, the jacking members may be various, for example, the jacking members may be hydraulic telescopic members or pneumatic telescopic members. Of course, the jacking members may also be threaded connectors 300 as described hereinafter.
In this embodiment, the assembly hole 150 may be a blind hole, and then, the bottom surface of the assembly hole 150 may be provided with a threaded hole 130, and accordingly, the first protrusion 230 may be provided with a through connection hole 240 corresponding to the threaded hole 130, and meanwhile, the jacking member may be a threaded connection member 300, and the threaded connection member 300 may be a stud.
Specifically, one end of the threaded connector 300 may be threadedly coupled with the threaded hole 130, and the other end of the threaded connector 300 may be inserted into the coupling hole 240.
In this embodiment, an end surface of one end of the threaded connector 300, which is far away from the threaded hole 130, may be used to be matched with the rotary tool 500, so that a maintenance worker may use the rotary tool 500 to drive the threaded connector 300 to rotate, so as to make the second protrusion 321 abut against the first protrusion 230, and further drive the cover plate 200 to move, and then the maintenance worker may push the cover plate 200 to rotate around the axis of the assembly hole 150 to a safe position where the maintenance worker can conveniently maintain the inner cavity 110.
In a further technical solution, the threaded connection member may be provided with a second protrusion 321, the second protrusion 321 may abut against the first protrusion 230, and the second protrusion 321 may drive the first protrusion 230 to drive the cover plate 200 to move between the first position and the second position along with the rotation of the threaded connection member 300. When the cover plate 200 is in the first position, the threaded connector 300 is threaded into the threaded hole 130, and the end of the cover plate 200 near the support surface contacts and sealingly engages the support surface of the chamber body 100, with a gap a between the second protrusion 321 and the first protrusion 230.
During the process of evacuating the semiconductor process chamber, the cover plate 200 is moved toward the chamber body 100 by the negative pressure, so that the sealing structure 400 between the cover plate 200 and the chamber body 100 can be tightly compressed, and finally, the cover plate 200 can be ensured to be in sealing fit with the chamber body 100. The gap a allows the cover plate 200 to move in a direction approaching the chamber body 100, thereby preventing the sealing structure 400 from being unable to be compressed and sealed due to interference between the first protrusion 230 and the second protrusion 321 during the process of approaching the chamber body 100.
When the cover plate 200 is at the second position, the maintenance personnel drives the threaded connector 300 to rotate in the threaded hole 130 by using the rotary tool 500, wherein the second protrusion 321 moves along with the threaded connector 300, so that the second protrusion 321 can abut against the first protrusion 230, so that the cover plate 200 is pressed on the surface of the second protrusion 321 away from the threaded hole 130 under the influence of gravity and negative pressure in the cavity, and the gap a disappears, the first protrusion 230 moves along the axis of the assembly hole 150 while rotating around the axis of the assembly hole 150, so that the cover plate 200 also moves along the axis of the assembly hole 150, and then the gravity of the cover plate 200 completely acts on the surface of the second protrusion 321 close to the first protrusion 230, so that the static friction force between the second protrusion 321 and the cover plate 200 is increased, that is, the static friction force between the threaded connector 300 and the cover plate 200 is increased, and then avoid appearing relative rotation between threaded connection 300 and the apron 200, the maintainer can reuse rotatory instrument 500 drive threaded connection 300 and rotate and drive apron 200 and rotate around the axis of assembly hole 150 to avoid apron 200 to rotate the time with the holding surface large tracts of land contact friction of chamber main part 100, finally realize that threaded connection 300 drives the rotation of apron 200 comparatively laborsavingly, reach the purpose of more conveniently opening 120.
In the case that the cover plate 200 is at the first position, the cover plate 200 covers the opening 120, the maintenance person can drive the cover plate 200 to move along the axis of the assembly hole 150 by driving the screw connector 300 to rotate using the rotating tool 500, and in the case that the cover plate 200 is at the second position, the second protrusion 321 supports the cover plate 200 by contacting with the first protrusion 230, the cover plate 200 can rotate relative to the chamber body 100 to open the opening 120 or close the opening 120, specifically, the maintenance person can push the cover plate or drive the end cap 200 to rotate around the axis of the assembly hole 150 by driving the screw connector 300 to rotate using the rotating tool 500, thereby achieving that the cover plate 200 can rotate around the axis of the assembly hole 150 with relative ease.
In this embodiment, the cover plate 200 may be provided with a first positioning structure, and the chamber body 100 may be provided with a second positioning structure, wherein, when the cover plate 200 is located at the first position, the cover plate 200 and the chamber body 100 may be positioned and matched in the circumferential direction of the threaded connection member 300 through the positioning and matching of the first positioning structure and the second positioning structure, and when the cover plate 200 is located at the second position, the first positioning structure may be separated from the second positioning structure, thereby preventing the cover plate 200 from rotating excessively in the maintenance process, and preventing the maintenance personnel from continuously adjusting the position of the cover plate 200, and further improving the work efficiency of the maintenance personnel through the positioning and matching or separation of the first positioning structure and the second positioning structure.
Similarly, after the maintenance of the semiconductor process chamber is completed, the maintainer uses the rotary tool 500 to drive the threaded connector 300 to rotate to the first position, and then the first positioning structure is in positioning fit with the second positioning structure, so that the cover plate 200 is prevented from deviating from the first position due to the fact that the threaded connector 300 rotates excessively, the precision of the sealing fit between the cover plate 200 and the chamber body 100 is further improved, and the working efficiency of the maintainer is finally improved.
In a further embodiment, the first positioning structure may be a positioning block 210, the second positioning structure may be a positioning groove 140, then, the support surface may be provided with a rotation-restricting groove 160 surrounding the port of the fitting hole 150, and the rotation-restricting groove 160 communicates with the fitting hole 150, wherein, in order to satisfy the movement of the cover plate 200 between the first position and the second position, the bottom wall of the rotation limiting groove 160 along the axial direction of the assembly hole 150 is higher than the bottom wall of the positioning groove 140 along the axial direction of the assembly hole 150, the maintenance person drives the screw connector 300 to rotate around the axis of the assembly hole 150 using the rotary tool 500, and moves along the axis of the fitting hole 150 to move the threaded connector 300 along the threaded hole 130, so that the length of the distance between the bottom wall of the rotation limiting groove 160 and the bottom wall of the positioning groove 140 is less than the length of the thread provided on the surface of the threaded connection member 300, thereby ensuring that the positioning block 210 can move from the positioning groove 140 into the limiting groove 160.
In a further technical solution, the rotation limiting groove 160 is communicated with the positioning groove 140, and when the cover plate 200 is located at the second position, the positioning block 210 may be slidably engaged with the rotation limiting groove 160 in the rotation direction of the threaded connection member 300, so that the cover plate 200 may also be rotated around the axis of the assembly hole 150 by the sliding engagement of the positioning block 210 and the rotation limiting groove 160, in this case, the cover plate 200 is separated from the supporting surface of the chamber body 100, and compared with the case that the cover plate 200 is attached to the supporting surface to rotate around the axis of the assembly hole 150, the structure can reduce the friction resistance received during the rotation of the cover plate 200.
In a further technical scheme, one end of the rotary limiting groove 160 can be communicated with the positioning groove 140, the other end of the rotary limiting groove can be provided with a limiting inner wall 161, the limiting inner wall 161 can be in limiting fit with the positioning block 210 in the rotating direction, when the cover plate 200 rotates to the best position of the maintenance personnel for maintaining the inner cavity 110, the positioning block 210 is close to the end surface of the limiting inner wall 161 and in limiting fit with the limiting inner wall 161, so that the maintenance personnel can be prevented from rotating the position of the cover plate 200 again to complete the maintenance work in the process of maintaining the inner cavity 110, and further the work efficiency of the maintenance personnel can be.
In the embodiment of the present application, the first protrusion 230 may have a stepped shaft structure, and specifically, the first protrusion 230 may include a first connection shaft 231 and a second connection shaft 232, wherein a first end of the first connection shaft 231 may be fixedly connected to the cover plate 200, a positioning block 210 may be disposed on a surface of the first connection shaft 231, a second end of the first connection shaft 231 may be connected to the second connection shaft 232, a connection hole 240 sequentially penetrates through the first connection shaft 231 and the second connection shaft 232, and the threaded connection member 300 is in plug-in fit with the connection hole 240, so that the first connection shaft 231 and the second connection shaft 232 can provide protection for the threaded connection member 300, the first connection shaft 231 may be in rotational fit with the assembly hole 150, and a shaft diameter of the second connection shaft 232 may be smaller than a shaft diameter of the first connection shaft 231, thereby reducing a volume and a weight of the first protrusion 230, further reducing a weight of the cover plate 200, and facilitating a maintenance worker to rotate the cover plate 200 more laborsavingly, and also facilitates the insertion assembly of the first protrusion 230 into the assembly hole 150.
In the embodiment of the present application, the cover plate 200 has a corner portion, the first protrusion 230 may be disposed at the corner portion, and accordingly, the assembly hole 150 may be disposed at a position of the chamber body 100 corresponding to the first protrusion 230, so that a worker may use the rotary tool 500 to drive the cover plate 200 to rotate with relative convenience due to the corner portion at the edge of the cover plate 200.
In this embodiment, the threaded connection member 300 may include the optical axis section 310 and the threaded section 320, specifically, the optical axis section 310 may be disposed coaxially with the threaded section 320, and the diameter of the threaded section 320 is greater than that of the optical axis section 310, the optical axis section 310 has a smaller friction force due to a smooth surface when being inserted into the connection hole 240, so that the threaded connection member 300 is conveniently inserted into the cover plate 200, the portion of the threaded section 320 protruding from the optical axis section 310 is the second protrusion 321, in the processing process of the threaded connection member 300, it is avoided that the processing time is too long due to the fact that the surface of the threaded connection member 300 is threaded by a numerically controlled lathe, so that the processing time of the threaded connection member 300 may be effectively reduced, and the manufacturing cost of the threaded connection member 300 may be. Moreover, this structure enables the second protrusion 321 to be formed by changing the diameter sizes of the threaded section 320 and the optical axis section 310, and thus has an advantage that the second protrusion 321 is easily formed.
In this embodiment, a maintainer uses the rotary tool 500 to drive the rotation of the threaded connector 300, in an alternative mode, a rotary matching groove 311 can be formed on the end surface of one end of the threaded connector 300 far away from the threaded hole 130, accordingly, the rotary tool 500 comprises a handle 510, a rocker 520 and a rotary matching protrusion 530, wherein the rotary matching protrusion 530 is in limit matching with the rotary matching groove 311, the maintainer uses the axis of the assembly hole 150 as the center, and rotates the handle 510, the rocker 520 can transmit the rotation torque, then the rotary matching protrusion 530 is in limit matching with the rotary matching groove 311 to enable the threaded connector 300 to rotate around the axis of the assembly hole 150, so that the maintainer can rotate the threaded connector 300 in a more labor-saving manner.
In the embodiment of the present application, the semiconductor process chamber may further include a sealing structure 400, during the installation of the sealing structure 400, the sealing structure 400 may be disposed on the supporting surface, the sealing structure 400 is disposed around the outer side of the opening 120, and the cover plate 200 and the chamber body 100 enclose a sealed process chamber through the sealing structure 400, so as to improve the sealing performance of the sealed process chamber and improve the working efficiency of the semiconductor process chamber.
In addition, the sealing structure 400 may be made of rubber, memory alloy, or other materials, and the embodiment of the present application is not limited thereto.
As can be seen from the above description, the screw 300 not only serves to rotatably couple the lid plate 200 and the chamber body 100, but also serves to lift the lid plate 200 and move the lid plate 200 away from the chamber body 100. In the process of operating the semiconductor process chamber, the sealed process chamber therein is in a vacuum state, so that before the opening 120 is opened, the movable cover plate 200 moves along the assembly hole 150 in a direction away from the chamber body 100, which is beneficial to releasing the adsorption of the vacuum environment to the cover plate 200, thereby enabling the cover plate 200 to rotate more easily.
Of course, there are various ways to realize the movement of the cover plate 200 along the assembly hole 150 toward the direction away from the chamber body 100, for example, the cover plate 200 and the chamber body 100 may be rotatably engaged through an air pressure telescopic member or a hydraulic telescopic member, and the air pressure telescopic member or the hydraulic telescopic member not only serves as a rotation connection shaft, but also can jack up the cover plate 200 from the support surface, thereby releasing the adsorption of the vacuum environment to the cover plate 200.
In the embodiments of the present application, the difference between the embodiments is described in detail, and different optimization features between the embodiments can be combined to form a better embodiment as long as the differences are not contradictory, and further description is omitted here in view of brevity of the text.
The above are merely examples of the present application and are not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.
Claims (10)
1. A semiconductor processing chamber, comprising a chamber body (100) and a cover plate (200), wherein the chamber body (100) is provided with an inner cavity (110) and an opening (120) arranged on a supporting surface of the chamber body (100), the opening (120) is communicated with the inner cavity (110), the supporting surface is provided with an assembling hole (150), and the axis of the assembling hole (150) is vertical to the supporting surface;
the cover plate (200) is covered on the supporting surface, a first protrusion (230) is arranged on one side, facing the chamber main body (100), of the cover plate (200), the first protrusion (230) is inserted into the assembling hole (150), the first protrusion (230) is movably arranged in the assembling hole (150) and can respectively rotate around the assembling hole (150) and axially slide along the assembling hole (150).
2. The semiconductor processing chamber of claim 1, further comprising lifters coupled to the first protrusion (230) and the mounting aperture (150), respectively, for driving the first protrusion (230) to move axially relative to the mounting aperture (150).
3. The semiconductor processing chamber as claimed in claim 2, wherein the mounting hole (150) is a blind hole, a threaded hole (130) is formed in a bottom surface of the mounting hole (150), and the first protrusion (230) is provided with a through connection hole (240) corresponding to the threaded hole (130);
the jacking piece is a threaded connecting piece (300), one end of the threaded connecting piece (300) is in threaded connection with the threaded hole (130), the other end of the threaded connecting piece (300) is inserted into the connecting hole (240), and the end face of one end, far away from the threaded hole (130), of the threaded connecting piece (300) is used for being matched with a rotary tool (500);
a second protrusion (321) is arranged on the threaded connecting piece (300), the second protrusion (321) is abutted to the first protrusion (230), and the second protrusion (321) can drive the first protrusion (230) to drive the cover plate (200) to move between a first position and a second position along with the rotation of the threaded connecting piece (300);
-with the cover plate (200) in the first position, the cover plate (200) covers over the opening (120);
the second protrusion (321) supports the cover plate (200) by contact with the first protrusion (230) with the cover plate (200) in the second position, and the cover plate (200) is rotatable with respect to the chamber body (100) to open the opening (120) or close the opening (120).
4. The semiconductor processing chamber of claim 3, wherein the lid plate (200) is provided with a first positioning structure and the chamber body (100) is provided with a second positioning structure, wherein:
with the cover plate (200) in the first position, the cover plate (200) is in positioning engagement with the chamber body (100) in a circumferential direction of the threaded connection (300) through positioning engagement of the first and second positioning structures;
the first locating structure is disengaged from the second locating structure with the cover plate (200) in the second position.
5. The semiconductor processing chamber of claim 4, wherein the first positioning structure is a positioning block (210) and the second positioning structure is a positioning groove (140); a rotation limiting groove (160) surrounding the port of the assembly hole (150) is formed in the supporting surface, and the rotation limiting groove (160) is communicated with the assembly hole (150);
the rotation limiting groove (160) is communicated with the positioning groove (140), and under the condition that the cover plate (200) is located at the second position, the positioning block (210) is in sliding fit with the rotation limiting groove (160) in the rotation direction of the threaded connecting piece (300).
6. The semiconductor processing chamber of claim 5, wherein one end of the rotation limiting groove (160) is communicated with the positioning groove (140), the other end is provided with a limiting inner wall (161), and the limiting inner wall (161) can be in limiting fit with the positioning block (210) in the rotation direction.
7. The semiconductor processing chamber as claimed in claim 3, wherein the first protrusion (230) has a stepped shaft structure, the first protrusion (230) comprises a first connection shaft (231) and a second connection shaft (232), a first end of the first connection shaft (231) is fixedly connected to the cover plate (200), a second end of the first connection shaft (231) is connected to the second connection shaft (232), the connection hole (240) sequentially penetrates through the first connection shaft (231) and the second connection shaft (232), the first connection shaft (231) is rotatably fitted to the fitting hole (150), and a shaft diameter of the second connection shaft (232) is smaller than a shaft diameter of the first connection shaft (231).
8. The semiconductor processing chamber of claim 3, wherein the threaded connection (300) comprises a light axis segment (310) and a threaded segment (320), the light axis segment (310) is coaxially arranged with the threaded segment (320), the threaded segment (320) has a diameter larger than that of the light axis segment (310), and the portion of the threaded segment (320) protruding from the light axis segment (310) is the second protrusion (321).
9. The semiconductor processing chamber according to claim 3, wherein an end surface of the threaded connector (300) at an end remote from the threaded hole (130) is provided with a rotation fitting groove (311).
10. The semiconductor processing chamber of claim 1, further comprising a sealing structure (400), wherein the sealing structure (400) is disposed on the support surface, the sealing structure (400) is disposed around the outside of the opening (120), and the cover plate (200) and the chamber body (100) enclose a sealed processing chamber through the sealing structure (400).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011548111.8A CN112735979B (en) | 2020-12-24 | 2020-12-24 | Semiconductor Process Chamber |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011548111.8A CN112735979B (en) | 2020-12-24 | 2020-12-24 | Semiconductor Process Chamber |
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| CN112735979A true CN112735979A (en) | 2021-04-30 |
| CN112735979B CN112735979B (en) | 2024-06-21 |
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Citations (7)
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| JPH0745684A (en) * | 1993-07-27 | 1995-02-14 | Kokusai Electric Co Ltd | Treatment chamber of semiconductor manufacturing device |
| TW200629453A (en) * | 2005-02-04 | 2006-08-16 | Advanced Display Proc Eng Co | Vacuum processing apparatus |
| KR20070014876A (en) * | 2005-07-29 | 2007-02-01 | 삼성전자주식회사 | Lid hinge structure of semiconductor manufacturing equipment |
| KR100688954B1 (en) * | 2005-09-16 | 2007-03-02 | 주식회사 아이피에스 | Opening and shutting structure of plasma processing apparatus |
| CN101740336A (en) * | 2008-11-12 | 2010-06-16 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Cavity window and plasma process cavity |
| CN111721110A (en) * | 2020-06-24 | 2020-09-29 | 北京北方华创微电子装备有限公司 | Vertical reaction furnace |
| CN112071801A (en) * | 2020-09-16 | 2020-12-11 | 北京北方华创微电子装备有限公司 | Thimble lifting device and semiconductor process cavity |
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2020
- 2020-12-24 CN CN202011548111.8A patent/CN112735979B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0745684A (en) * | 1993-07-27 | 1995-02-14 | Kokusai Electric Co Ltd | Treatment chamber of semiconductor manufacturing device |
| TW200629453A (en) * | 2005-02-04 | 2006-08-16 | Advanced Display Proc Eng Co | Vacuum processing apparatus |
| KR20070014876A (en) * | 2005-07-29 | 2007-02-01 | 삼성전자주식회사 | Lid hinge structure of semiconductor manufacturing equipment |
| KR100688954B1 (en) * | 2005-09-16 | 2007-03-02 | 주식회사 아이피에스 | Opening and shutting structure of plasma processing apparatus |
| CN101740336A (en) * | 2008-11-12 | 2010-06-16 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Cavity window and plasma process cavity |
| CN111721110A (en) * | 2020-06-24 | 2020-09-29 | 北京北方华创微电子装备有限公司 | Vertical reaction furnace |
| CN112071801A (en) * | 2020-09-16 | 2020-12-11 | 北京北方华创微电子装备有限公司 | Thimble lifting device and semiconductor process cavity |
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| CN112735979B (en) | 2024-06-21 |
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