CN112719294A - Laser 3D printing manufacturing method of AISI660 chip prevention plate - Google Patents

Laser 3D printing manufacturing method of AISI660 chip prevention plate Download PDF

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Publication number
CN112719294A
CN112719294A CN202011590720.XA CN202011590720A CN112719294A CN 112719294 A CN112719294 A CN 112719294A CN 202011590720 A CN202011590720 A CN 202011590720A CN 112719294 A CN112719294 A CN 112719294A
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China
Prior art keywords
printing
aisi660
laser
chip
printed
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CN202011590720.XA
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Chinese (zh)
Inventor
秦国鹏
张丽英
尹富斌
陈仲权
李金魁
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China Jianzhong Nuclear Fuel Co Ltd
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China Jianzhong Nuclear Fuel Co Ltd
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Priority to CN202011590720.XA priority Critical patent/CN112719294A/en
Publication of CN112719294A publication Critical patent/CN112719294A/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/24After-treatment of workpieces or articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00Processes of additive manufacturing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y40/00Auxiliary operations or equipment, e.g. for material handling
    • B33Y40/20Post-treatment, e.g. curing, coating or polishing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y50/00Data acquisition or data processing for additive manufacturing
    • B33Y50/02Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/24After-treatment of workpieces or articles
    • B22F2003/245Making recesses, grooves etc on the surface by removing material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/24After-treatment of workpieces or articles
    • B22F2003/247Removing material: carving, cleaning, grinding, hobbing, honing, lapping, polishing, milling, shaving, skiving, turning the surface
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/24After-treatment of workpieces or articles
    • B22F2003/248Thermal after-treatment

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)

Abstract

The invention particularly relates to a laser 3D printing manufacturing method of an AISI660 chip prevention plate, which comprises the following steps: print pretreatment, laser 3D and print a aftertreatment, laser 3D prints and melts shaping AISI660 and prevents that many times chi of bits board prints a printing and many times chi of technology control sample and prints a printing, prints a aftertreatment and includes that the many times chi of board prints and the many times chi of technology control sample prints a printing to AISI660 and carries out the aftertreatment to the many times chi of anti-bits board of AISI660, obtains AISI660 anti-bits board and technology control sample. The laser 3D printing manufacturing method of the AISI660 chip prevention plate provided by the invention can ensure that the product size precision and the surface quality meet the product design requirements after the AISI660 chip prevention plate is printed.

Description

Laser 3D printing manufacturing method of AISI660 chip prevention plate
Technical Field
The invention relates to the technical field of nuclear fuel part manufacturing, in particular to a laser 3D printing manufacturing method of an AISI660 chip prevention plate.
Background
AISI660 chip prevention plate the AISI660 chip prevention plate is located at the top of the nuclear fuel assembly lower tube socket and is an important core function part for filtering debris in primary circuit fluid and preventing abrasion damage of nuclear fuel cladding. AISI660 prevents that bits board is filter screen column structure, need process nearly 2000 rectangular holes and round hole on the sheet metal about thickness 3mm, and the muscle width must be controlled at 0.5mm 0.1 mm's within range between the square hole, and the processing degree of difficulty is big. The existing product processing adopts a processing method of mechanical processing pre-hole and electric spark punching. As the size precision of the holes manufactured by the electric spark process depends on the machining precision of the electrodes, and the electrodes belong to consumables, the AISI660 chip prevention plate product has high manufacturing cost and difficulty. In addition, the AISI660 chip-proof plate hole system is complex, multiple different electrodes are required to be adopted for punching for multiple times during machining, the quality problems caused by people or equipment such as tool setting errors, electrode selection errors, no replacement of worn electrodes and the like are easily caused in the process, the machining efficiency is low, and the rejection rate is high. In the prior art, the processing only can be slowly processed by adopting electric sparks, and then a qualified product with better quality is selected from the finished product, thereby not only wasting time and labor, but also wasting a great deal of time and money.
Disclosure of Invention
Based on this, it is necessary to provide a laser 3D printing manufacturing method of an AISI660 anti-dust plate, aiming at the defect problems in the prior art. According to the method, electrodes and raw material profiles do not need to be customized, metal 3D printing is directly achieved by using the powder, and manufacturing difficulty and manufacturing cost of the AISI660 anti-scrap plate are effectively reduced.
In order to achieve the above purpose, the invention provides the following technical scheme:
a laser 3D printing manufacturing method of an AISI660 chip prevention plate comprises the following steps:
step one, pretreatment before printing: preparing AISI660 metal powder and processing and manufacturing a printing substrate;
step two, laser 3D printing: mounting and preheating a printing substrate in laser 3D printing equipment, and controlling the temperature of the printing substrate to be 80-100 ℃; performing state inspection and laser focus calibration of laser 3D printing equipment before printing; performing a light spot compensation test and laser 3D printing process parameter inspection; metal powder is paved, laser selective melting is carried out on the paved powder, an area in the outline of the AISI660 chip-proof plate and the process control sample is melted and formed, and then the outline of the AISI660 chip-proof plate and the outline of the process control sample are melted and formed; after printing one layer, repeating powder laying and printing operations, and printing and growing along the thickness direction of the AISI660 anti-scrap plate until the AISI660 anti-scrap plate multi-scale printer and the process control sample multi-scale printed piece with the multiple scales in the thickness direction are printed; removing redundant powder on the printed piece, and removing the rigid limit of the printed piece and the printed substrate; visual inspection is carried out, and the surface of the printed product is inspected to have no defects such as pits with area larger than 5mm2, air holes, hard spots with abnormal color and the like; randomly spot-checking the rib width size between at least 10 adjacent square holes by using a vernier caliper, wherein the dimensional tolerance is not more than +/-0.10 mm; after the two detection items are all qualified, the next procedure can be carried out;
and step three, post-treatment of the printed piece, namely solution annealing heat treatment of the printed piece and the printed substrate, slicing of the printed piece, separation of a process control sample, thickness dimension processing, aging heat treatment, fine milling of a square and positioning hole system, ultrasonic cleaning, surface sand blasting treatment and final inspection of the appearance and the dimension of the product.
Further, the AISI660 metal powder is prepared by the following method: preparing the AISI660 metal powder by using qualified AISI660 wires, blocks or plates through vacuum gas atomization or other powder preparation methods; the prepared metal powder is subjected to raw material re-examination, the sphericity of the metal powder is required to be more than 85%, the loose packed density is 4.0-5.0(g/cm3), and the chemical components meet the requirements of AISI660 scrap-proof plate materials.
Further, the printed substrate processing and manufacturing method comprises the following steps: selecting austenitic stainless steel or 45# steel forgings with qualified chemical components; carrying out solution heat treatment according to a standard process; blanking by using a sawing machine or a lathe or a cold and hot cutting method; and (3) processing the printing substrate by using a numerical control device, wherein the dimensional tolerance of the printing substrate is not more than +/-0.1 mm, the surface roughness of the working surface is not more than 3.2 microns, and the flatness is not more than 0.1 mm.
Further, the pre-printing laser 3D printing device status check includes: checking whether a protective gas loop, a cooling water loop and a powder sieving system work normally or not; checking whether the atmosphere analysis probe and the temperature sensor of the molding bin work normally or not; and checking whether the 3D printing program called by the laser 3D printing device is correct.
Further, the laser focus calibration comprises: adjusting the origin of a tool coordinate system, adjusting the spot diameter of the laser focus, and correcting the positions of an optical path and an actual laser focus in a computer vision system.
Further, the speckle compensation test comprises the following steps: before each batch of AISI660 chip-proof plate is printed by laser, adopting AISI660 metal powder and the same laser printing parameters of the same batch in an area where the clamped printing substrate does not occupy the laser printing position of the AISI660 chip-proof plate, and printing and manufacturing an AISI660 chip-proof plate light spot compensation sample; after the AISI660 chip-proof plate light spot compensation sample is printed, the printing substrate is not loosened and taken down, and a vernier caliper is directly used for measuring the typical rib width size and the typical fillet size of the AISI660 chip-proof plate light spot compensation sample; calculating the shrinkage rate of the material in the direction X, Y according to the measured value and the standard value; and determining a light spot compensation value of the laser 3D printing equipment according to the shrinkage rate value.
Further, the laser 3D printing process parameters include: filling laser power 210w-225 w; filling laser scanning speed: 770mm/s-785 mm/s; filling laser scanning interval: 0.10mm-012 mm; profile boundary laser power 160w-170 w; profile boundary laser scanning speed: 470mm/s-485 mm/s; and (3) light spot compensation value: 0.078-0.085.
Further, the light spot compensation value is obtained through a light spot compensation test, and a corresponding light spot compensation value is set in the laser 3D printing process parameters according to a numerical value obtained through calculation of each light spot compensation test.
Further, the process control sample and the AISI660 chip prevention plate are printed, thermally treated, cut and mechanically processed simultaneously, finally, a damage inspection test is carried out, the process control sample is used for verifying whether printing equipment, process parameters and raw materials are in a controlled state or not, the process control sample is divided into a tensile sample and an impact toughness sample according to different test types, the tensile sample is used for inspecting the tensile mechanical property and the grain size grade of a printed piece, and the impact toughness sample is used for inspecting the impact toughness of the printed piece.
Further, the solution annealing heat treatment of the printed material and the printed substrate comprises the following steps: the printing substrate and the printing piece are charged together for continuous vacuum solution annealing heat treatment, and the thermal cycle parameters are as follows: the pressure in the furnace is less than 1Pa, the heat preservation temperature is 980 +/-10 ℃, the heat preservation time is 30-60 minutes, and the furnace is cooled to the room temperature at the cooling speed which is more than or equal to the air cooling speed after the heat preservation is finished.
Further, the printed piece slicing and process control sample separation comprises the following steps: and cutting the printed piece by adopting a linear cutting method or other cutting methods, reserving the processing amount of 0.2-0.5 mm in the thickness direction, ensuring that the thickness of each piece is greater than the final thickness of the AISI660 chip-proof plate, and cutting and separating the process control sample from the AISI660 chip-proof plate.
Further, the thickness dimension processing comprises the following steps: leveling an AISI660 chip-preventing plate by a mechanical method, wherein the flatness is required to be less than 0.2 mm; the AISI660 chip-proof plate and the thickness dimension of the process control sample are finely processed by using mechanical processing methods such as grinding, milling and the like; and removing burrs and sharp edges on the AISI660 chip preventing plate by a mechanical method or an electrochemical method.
Further, the aging heat treatment comprises the following steps: charging a plurality of AISI660 chip-preventing plates printed in the same batch, at least 5 tensile samples and at least 5 impact toughness samples into a furnace for vacuum aging heat treatment, wherein the heat treatment parameters are as follows: the pressure in the furnace is less than 1Pa, the temperature is raised to 720 +/-10 ℃ at the heating rate of 300 ℃/h +/-25 ℃/h, the heat preservation temperature is 720 +/-10 ℃, the heat preservation time is 16-17 hours, the furnace is filled with argon and rapidly cooled when the temperature is cooled to 400 +/-20 ℃ after the heat preservation is finished, and the furnace is discharged after the temperature is lower than 150 ℃.
Further, the fine milling of the four-way and positioning hole system comprises the following steps: after the printed piece is fixed, the dimensions of the square, the positioning pin sinking table and the positioning pin hole are finished by a processing machine tool, and burrs and flashes generated by the square and the positioning hole are removed by a mechanical method.
Further, the ultrasonic cleaning comprises the following steps: the ultrasonic degreasing cleans oil stain, cooling liquid and other foreign matters on the printed piece.
Further, the surface sand blasting treatment comprises the following steps: use aluminium oxide granule to carry out sand blasting to AISI660 chip prevention board surface, improve the surface roughness of machining back product, reduce the surperficial reflection of light effect to increase AISI660 chip prevention board size optics CCD detection time measuring inspection efficiency.
Further, the final inspection of the appearance and the size of the product comprises the following steps: visually inspecting the appearance cleanliness and the surface roughness of the AISI660 chip-proof plate; the AISI660 chip-proof plate size is checked by using an optical CCD, an imager and the like.
Compared with the prior art, the invention has the beneficial technical effects that:
the laser 3D printing manufacturing method of the AISI660 chip prevention plate provided by the invention can ensure that the product size precision and the surface quality meet the product design requirements after the AISI660 chip prevention plate is printed. Extra work such as electrode customization, manual tool setting, printing electrode replacement and the like in the original process is avoided, finished products are directly printed from powder, and waste of materials, personnel and economy is reduced; meanwhile, the processing time of the process is only one half of that of the original process, the production efficiency is greatly improved, and the process has good economic value.
Drawings
FIG. 1 is a schematic view of a printing substrate structure according to the present invention;
FIG. 2 is a schematic diagram of the position and structure of a light spot compensation sample of an AISI660 chip prevention plate of the present invention;
FIG. 3 is a schematic view of a typical inspection dimension of AISI660 anti-debris plate spot compensation sample of the present invention;
FIG. 4 is a schematic view of an AISI660 chip prevention plate and process control sample multi-scale print of the present invention;
FIG. 5 is a front view of a tensile specimen of the present invention;
FIG. 6 is a left side view of a tensile specimen of the present invention;
FIG. 7 is a front view of an impact toughness specimen of the present invention;
FIG. 8 is a left side view of an impact toughness specimen of the present invention;
FIG. 9 is a schematic diagram of an AISI660 crumb-proof plate structure of the present invention;
fig. 10 is a process flow chart of the AISI660 dust guard laser 3D printing manufacturing method of the present invention.
In the figure, 1, a printing substrate; 2. AISI660 chip prevention plate light spot compensation sample, 3, typical rib width size; 4. typical fillet size; 5. the anti-scrap plate is a multi-time ruler printing piece; 6. stretching a sample; 7. impact toughness specimens.
Detailed Description
A laser 3D printing manufacturing method of an AISI660 chip prevention plate comprises the following steps:
step one, preparing AISI660 metal powder: preparing AISI660 metal powder by using qualified AISI660 wires, blocks or plates through vacuum gas atomization or other powder preparation methods; the prepared AISI660 metal powder is subjected to raw material re-inspection, the sphericity of the metal powder is required to be more than 85%, the apparent density is 4.0-5.0(g/cm3), and the chemical components meet the requirements of AISI660 chip-proof plate materials.
Step two, processing and manufacturing the printing substrate 1: selecting austenitic stainless steel or 45# steel forgings with qualified chemical components; carrying out solution heat treatment according to a standard process; blanking by using a sawing machine or a lathe or a cold and hot cutting method; and (3) processing the printing substrate 1 by using a numerical control device, wherein the dimensional tolerance of the printing substrate 1 is not more than +/-0.1 mm, the surface roughness of the working surface (to-be-printed surface) is not more than 3.2 mu m, and the flatness is not more than 0.1 mm.
Step three, mounting and preheating the printing substrate 1: the printing substrate 1 is installed in the laser 3D printing equipment, so that the printing substrate 1 is firmly installed and cannot loosen; the printing substrate 1 is preheated by adopting an electric heating mode, and the temperature of the printing substrate 1 is controlled to be stabilized at 80-100 ℃.
Fourthly, checking the state of the laser 3D printing equipment before printing: checking whether a protective gas loop, a cooling water loop and a powder sieving system work normally or not; checking whether the atmosphere analysis probe and the temperature sensor of the molding bin work normally or not; and checking whether the 3D printing program called by the laser 3D printing device is correct.
Step five, adjusting the origin: adjusting the coordinate system of the tool, adjusting the diameter of the laser spot, and correcting the positions of the optical path and the actual laser focus in the computer vision system.
Step six, light spot compensation test: before each batch of AISI660 anti-dust plate is printed by laser, the AISI660 metal powder and the same laser printing parameters of the same batch are adopted at the upper left corner (or other areas which do not occupy the laser printing position of the AISI660 anti-dust plate) of the clamped printing substrate 1, and an AISI660 anti-dust plate light spot compensation sample 2 is printed and manufactured; after the AISI660 chip prevention plate light spot compensation sample 2 is printed, the printing substrate 1 is not loosened and taken down, and a vernier caliper is directly used for measuring a typical rib width size 3 and a typical fillet size 4 of the AISI660 chip prevention plate light spot compensation sample 2; calculating the shrinkage rate of the material in the direction X, Y according to the measured value and the standard value; and determining a light spot compensation value of the laser 3D printing equipment according to the shrinkage rate value.
Step seven, checking and adjusting laser 3D printing parameters: checking the parameter filling laser power 210w-225 w; filling laser scanning speed: 770mm/s-785 mm/s; filling laser scanning interval: 0.10mm-012 mm; profile boundary laser power 160w-170 w; profile boundary laser scanning speed: 470mm/s-485 mm/s; and selecting and adjusting a proper light spot compensation value according to the light spot compensation test result.
Eighthly, selecting a laser area for melting and forming an AISI660 chip-preventing plate and a process control sample: metal powder is paved and laser selective melting is carried out on the paved powder, the area in the outline of the AISI660 chip-proof plate product and the process control sample is melted and formed firstly, and then the outline of the AISI660 chip-proof plate product and the process control sample is melted and formed; after printing one layer, repeatedly spread powder, print the operation, prevent bits board thickness direction along AISI660 and print the growth, until printing out the AISI660 of many times chi of thickness direction and prevent bits board and the printing of technology control sample (once print many AISI660 in thickness direction and prevent bits board and the printing of technology control sample, prevent that many times chi of bits board prints 5 and the printing of many times chi of technology control sample promptly).
Ninth, printed matter is relieved and spacing and inspection: removing redundant powder on the printed piece, and removing the rigid limit of the printed piece and the printed substrate 1; visual inspection is carried out, and the surface of the printed product is inspected to have no defects such as pits with area larger than 5mm2, air holes, hard spots with abnormal color and the like; and randomly spot checking the rib width dimension between at least 10 adjacent square holes by using a vernier caliper, wherein the dimensional tolerance is not more than +/-0.10 mm.
Step ten, solution annealing heat treatment of the printed piece and the substrate: the printing substrate 1 and the printing piece are charged together for continuous vacuum solution annealing heat treatment, and the thermal cycle parameters are as follows: the pressure in the furnace is less than 1Pa, the heat preservation temperature is 980 +/-10 ℃, the heat preservation time is 30-60 minutes, and the furnace is cooled to the room temperature at the cooling speed which is more than or equal to the air cooling speed after the heat preservation is finished.
Eleven, printed piece slicing and process control sample separation: cutting the printed product into slices by adopting a linear cutting method or other cutting methods, reserving the processing amount in the thickness direction to be 0.2-0.5 mm, and ensuring that the thickness of each slice is greater than the final thickness of an AISI660 chip-proof plate product; the process control samples were cut and separated from the AISI660 chip guard.
Step twelve, thickness dimension processing: leveling an AISI660 chip-preventing plate by a mechanical method, wherein the flatness is required to be less than 0.2 mm; the AISI660 chip-proof plate and the thickness dimension of the process control sample are finely processed by using mechanical processing methods such as grinding, milling and the like; and removing burrs and sharp edges on the AISI660 chip preventing plate by a mechanical method or an electrochemical method.
Thirteen step, aging heat treatment: and (3) charging a plurality of AISI660 chip-preventing plates printed in the same batch, at least 5 tensile samples 6 and at least 5 impact toughness samples 7 together for vacuum aging heat treatment. The heat treatment parameters are as follows: the pressure in the furnace is less than 1Pa, the temperature is raised to 720 +/-10 ℃ at the heating rate of 300 ℃/h +/-25 ℃/h, the heat preservation temperature is 720 +/-10 ℃, the heat preservation time is 16-17 hours, the furnace is filled with argon and rapidly cooled when the temperature is cooled to 400 +/-20 ℃ after the heat preservation is finished, and the furnace is discharged after the temperature is lower than 150 ℃.
Step fourteen, fine milling the four directions and the positioning hole system: after the printed piece is fixed, the dimensions of the square, the positioning pin sinking table and the positioning pin hole are finished by a processing machine tool, and burrs and flashes generated by the square and the positioning hole are removed by a mechanical method.
Fifteen, ultrasonic cleaning: the ultrasonic degreasing cleans oil stain, cooling liquid and other foreign matters on the printed piece.
Sixthly, performing surface sand blasting: use aluminium oxide granule to carry out sand blasting to AISI660 chip prevention board surface, improve the surface roughness of machining back product, reduce the surperficial reflection of light effect to increase AISI660 chip prevention board size optics CCD detection time measuring inspection efficiency.
Seventhly, final checking of the appearance and the size of the product: visually inspecting the appearance cleanliness and the surface roughness of the AISI660 chip-proof plate; the AISI660 chip-proof plate size is checked by using an optical CCD, an imager and the like.
The process control sample and the AISI660 chip prevention plate are printed, thermally treated, cut and mechanically processed at the same time, and finally a damage inspection test is carried out. The process control samples are used to verify that the printing equipment, process parameters, and raw materials are in a controlled state. The process control samples were divided into tensile sample 6 and impact toughness sample 7, depending on the type of test. Tensile specimen 6 was used to examine the tensile mechanical properties and grain size grade of the printed matter, and impact toughness specimen 7 was used to examine the impact toughness of the printed matter.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. A laser 3D printing manufacturing method of an AISI660 chip prevention plate is characterized by comprising the following steps: print pretreatment, laser 3D and print a aftertreatment, laser 3D prints and melts shaping AISI660 and prevents that many times chi of bits board prints a printing and many times chi of technology control sample and prints a printing, prints a aftertreatment and includes that the many times chi of board prints and the many times chi of technology control sample prints a printing to AISI660 and carries out the aftertreatment to the many times chi of anti-bits board of AISI660, obtains AISI660 anti-bits board and technology control sample.
2. The method for manufacturing the AISI660 dust guard by laser 3D printing according to claim 1, wherein the laser 3D printing is performed by first melt-forming the area inside the profile of the AISI660 dust guard and the process control sample, and then melt-forming the outline of the AISI660 dust guard and the process control sample; after printing one layer, repeatedly spreading powder and printing operation, printing and growing along the thickness direction of the AISI660 anti-scrap plate until printing the AISI660 anti-scrap plate multi-time ruler printing piece with the thickness direction of multiple squares and the process control sample multi-time ruler printing piece.
3. The laser 3D printing manufacturing method of AISI660 dust guard according to claim 1, characterized in that the laser 3D printing comprises the following steps: mounting and preheating a printing substrate in laser 3D printing equipment, and controlling the temperature of the printing substrate to be 80-100 ℃; performing state inspection and laser focus calibration of laser 3D printing equipment before printing; performing a light spot compensation test and laser 3D printing process parameter inspection; metal powder is paved, laser selective melting is carried out on the paved powder, an area in the outline of the AISI660 chip-proof plate and the process control sample is melted and formed, and then the outline of the AISI660 chip-proof plate and the outline of the process control sample are melted and formed; after printing one layer, repeating powder laying and printing operations, printing and growing along the thickness direction of the AISI660 anti-scrap plate, and printing an AISI660 anti-scrap plate multi-time ruler printing piece and a process control sample multi-time ruler printing piece with multiple scales in the thickness direction; removing redundant powder on the printed piece, and removing the rigid limit of the printed piece and the printed substrate; visual inspection of the appearance is carried out, and the surface of the printed matter is inspected to have no area larger than 5mm2A defective region of (a); randomly spot-checking the rib width size between at least 10 adjacent square holes by using a vernier caliper, wherein the dimensional tolerance is not more than +/-0.10 mm; and after the two detection items are all qualified, a post-processing procedure of the printed product can be carried out.
4. The laser 3D printing manufacturing method of AISI660 dust guard according to claim 3, characterized in that the flare compensation test comprises the following steps: before each batch of AISI660 chip-proof plate is printed by laser, adopting AISI660 metal powder and the same laser printing parameters of the same batch in an area where the clamped printing substrate does not occupy the laser printing position of the AISI660 chip-proof plate, and printing and manufacturing an AISI660 chip-proof plate light spot compensation sample; after the AISI660 chip-proof plate light spot compensation sample is printed, the printing substrate is not loosened and taken down, and a vernier caliper is directly used for measuring the typical rib width size and the typical fillet size of the AISI660 chip-proof plate light spot compensation sample; calculating the shrinkage rate of the material in the direction X, Y according to the measured value and the standard value; and determining a light spot compensation value of the laser 3D printing equipment according to the shrinkage rate value.
5. The laser 3D printing manufacturing method of the AISI660 dust guard according to claim 1, wherein the laser 3D printing process parameters include: filling laser power 210w-225 w; filling laser scanning speed: 770mm/s-785 mm/s; filling laser scanning interval: 0.10mm-012 mm; profile boundary laser power 160w-170 w; profile boundary laser scanning speed: 470mm/s-485 mm/s; and (3) light spot compensation value: 0.078-0.085.
6. The AISI660 chip prevention plate laser 3D printing manufacturing method according to claim 5, wherein the spot compensation value is obtained through a spot compensation test, and the corresponding spot compensation value is set in the laser 3D printing process parameters according to a value calculated by each spot compensation test.
7. The laser 3D printing fabrication method of the AISI660 dust guard of claim 1, wherein the process control specimens comprise tensile specimens subjected to tensile mechanical property and grain size grade tests and impact toughness specimens subjected to impact toughness tests.
8. The method for manufacturing the AISI660 chip-proof plate by laser 3D printing according to claim 1, wherein the pre-printing treatment comprises preparing AISI660 metal powder, wherein the AISI660 metal powder has a sphericity of more than 85%, a bulk density of 4.0-5.0(g/cm3), a chemical composition meeting AISI660 chip-proof plate material requirements, and processing and manufacturing a printing substrate, wherein the printing substrate has a dimensional tolerance of not more than +/-0.1 mm, a working surface roughness of not more than 3.2 μm, and a flatness of not more than 0.1 mm.
9. The laser 3D printing fabrication method of AISI660 dust guard according to claim 1, wherein the print post-processing comprises: the method comprises the following steps of solution annealing heat treatment of a printed piece and a printed substrate, separation of a printed piece slice and a process control sample, thickness dimension processing, aging heat treatment, fine milling of a square and positioning hole system, ultrasonic cleaning, surface sand blasting and final inspection of the appearance and the dimension of a product.
10. The laser 3D printing manufacturing method of AISI660 dust guard according to any one of claims 1-9, characterized in that the printing and printing substrate solution annealing heat treatment comprises the following steps: charging the printing substrate and the printing piece together into a furnace for continuous vacuum solution treatment and annealing; the aging heat treatment comprises the following steps: and (3) charging a plurality of AISI660 chip-preventing plates printed in the same batch, at least 5 tensile samples and at least 5 impact toughness samples together for vacuum aging heat treatment.
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