CN112711311A - Computer mainframe with noise reduction function and heat dissipation function - Google Patents
Computer mainframe with noise reduction function and heat dissipation function Download PDFInfo
- Publication number
- CN112711311A CN112711311A CN202110020808.6A CN202110020808A CN112711311A CN 112711311 A CN112711311 A CN 112711311A CN 202110020808 A CN202110020808 A CN 202110020808A CN 112711311 A CN112711311 A CN 112711311A
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- noise reduction
- communicated
- cpu
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 112
- 230000009467 reduction Effects 0.000 title claims abstract description 52
- 238000001816 cooling Methods 0.000 claims abstract description 135
- 238000009423 ventilation Methods 0.000 claims abstract description 71
- 239000000428 dust Substances 0.000 claims abstract description 40
- 230000003068 static effect Effects 0.000 claims abstract description 29
- 229920000742 Cotton Polymers 0.000 claims abstract description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 69
- 239000006185 dispersion Substances 0.000 claims description 4
- 238000010521 absorption reaction Methods 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 11
- 230000006870 function Effects 0.000 abstract description 11
- 238000012546 transfer Methods 0.000 abstract description 9
- 230000005611 electricity Effects 0.000 abstract description 8
- 238000010438 heat treatment Methods 0.000 description 23
- 239000007788 liquid Substances 0.000 description 10
- 239000002826 coolant Substances 0.000 description 8
- 238000013461 design Methods 0.000 description 7
- 239000000110 cooling liquid Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000013016 damping Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 210000003169 central nervous system Anatomy 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/181—Enclosures
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/202—Air convective hinge
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A computer mainframe box with noise reduction and heat dissipation functions comprises a case, wherein a ventilation window is arranged on the front face of the case, and a noise reduction structure and a CPU heat dissipation system are arranged in the computer mainframe box. According to the invention, the cooling fan drives air to flow, so that the cooling efficiency is improved, the static electricity network can block dust, and further the CPU main body can be prevented from dust, so that the dust is prevented from entering the interior of the CPU main body, the sound-absorbing cotton on the periphery can eliminate the noise in the case, the noise box can eliminate the noise caused by air flow, and the noise reduction effect is improved. The invention transfers the heat of the CPU to the radiating fins through the heat conducting plate, and the heat conducting plate evenly distributes the heat to each radiating fin to disperse the heat, thereby effectively reducing the heat generated by the CPU.
Description
Technical Field
The invention relates to the field of computers, in particular to a computer mainframe with noise reduction and heat dissipation functions.
Background
The computer mainframe is a case body used for placing core processing components of the computer, a CPU, a display, a power supply and the like are installed in the case, the components can generate heat when the computer runs, and especially, a large amount of heat can be generated when the computer processes and operates larger data, so that the heat can be dissipated untimely, the temperature in the case can be increased, and the normal running of the components in the case can be influenced. The chassis in the prior art is generally provided with a heat dissipation port, the air circulation around the components is increased through a heat dissipation fan arranged at the position of the heating components, and heat dissipation is performed in a mode of removing hot air through the heat dissipation port.
A computer CPU is a functional unit that interprets and executes instructions, also called a central CPU or CPU, which is the central nervous system of the computer, in contrast to devices around the CPU and memory, called peripherals, such as keyboards, displays, diskettes, tape drives, etc. Each CPU has a unique set of operation commands, which may be referred to as the CPU's instruction set, such as store, call, etc. The central CPU is the computational core and control core of a computer. The computer CPU mainly interprets computer instructions and processes data in computer software, and is composed of an arithmetic unit, a controller, a register, and a bus for realizing data, control and status of the connection among the arithmetic unit, the controller and the register.
The conventional host case of a computer has the following problems:
problem 1: the noise that radiator fan can produce when rotating is the main source of quick-witted case noise, and simultaneously, the vibrations of fan drive quick-witted case and follow vibrations, and the noise of production can cause the interference to near the personnel of quick-witted case, influences personnel's work and study.
Problem 2: computer CPU can produce the heat when computer CPU works, and the too high heat can damage the part, and current CPU cooling system radiating effect is poor at present, and heat transfer efficiency is slow to external dust is more, if get into CPU inside then can influence CPU internal work.
Disclosure of Invention
Accordingly, to address the above-mentioned deficiencies, the present invention provides a computer main chassis having a noise reduction function and a heat dissipation function.
The invention is realized by constructing a computer mainframe with noise reduction function and heat dissipation function: the computer mainframe comprises a case 1, the front of the case is provided with a ventilation window 3, and a noise reduction structure and a CPU heat dissipation system are arranged in the computer mainframe; wherein the content of the first and second substances,
the noise reduction structure comprises a plurality of first supporting columns 1-4 which are fixedly arranged at the bottom of the case 1;
the noise reduction structure also comprises a plurality of second support columns 1-5 which are arranged at the lower parts of the plurality of first support columns 1-4 and elastically connected with the first support columns 1-5 in a sliding manner;
the noise reduction structure also comprises a plurality of sound absorption cotton 1-10 which are arranged on the inner wall surface of the case 1;
the noise reduction structure also comprises a mounting plate 1-11 which is fixedly arranged in the case 1;
the noise reduction structure also comprises a ventilation pipe 1-5 which is arranged on the upper end surface of the mounting plate 1-11; the first end parts of the ventilation pipes 1 to 5 are communicated with the ventilation window 3;
the noise reduction structure also comprises a plurality of static grids 1-22 which are arranged in the ventilation pipes 1-5;
the noise reduction structure also comprises a cooling fan 1-9 which is arranged at the second end part of the ventilation pipe 1-9 and is fixedly arranged on the upper end surface of the mounting plate 1-11;
the noise reduction structure also comprises a dust screen 1-23 which is arranged at the joint of the cooling fan 1-9 and the ventilation pipe 1-5;
the noise reduction structure also comprises a cooling module 1-8 which is arranged at the far ventilation pipe 1-5 side of the cooling fan 1-9 and is fixedly arranged on the upper end surface of the mounting plate 1-11;
the noise reduction structure also comprises a mute box 1-6 which is fixedly arranged on the upper end surface of the mounting plate 1-11 and communicated with a cooling module 1-8-element cooling fan 1-9;
the CPU heat dissipation system comprises a mounting plate 4 which is fixedly arranged in the case 1;
the CPU heat dissipation system also comprises a ventilation pipeline 13 which is arranged on the upper end surface of the mounting plate 4 and communicated with the ventilation window 3;
the CPU heat dissipation system also comprises a plurality of static grids which are arranged in the ventilation pipeline 13;
the CPU heat dissipation system also comprises a CPU main body 31 which is arranged on the mounting plate 4;
the CPU heat dissipation system also comprises a heat conducting plate 14 which is arranged on the upper end surface of the CPU main body 31 and keeps contact with the CPU main body 31;
the CPU heat dissipation system also comprises a pair of mounting frames 15 which are arranged at two sides of the heat conduction plate 14 and are detachably connected with the mounting plate 4;
the CPU heat dissipation system also comprises a plurality of heat dissipation fins 10 which are uniformly arranged on the upper end surface of the heat conduction plate 14 and are fixedly connected with the heat conduction plate 14;
the CPU heat dissipation system also comprises a pair of heat conduction pipes 11 which are U-shaped, penetrate through the plurality of heat dissipation fins 10 and are fixedly connected with the heat dissipation fins 10;
the CPU heat dissipation system also comprises a cooling plate 12 which is fixedly arranged at the upper part of the heat dissipation fin 10 and keeps contact with the heat dissipation fin 10;
the CPU heat dissipation system also comprises a heat dissipation fan 9 which is arranged between the heat dissipation fins 10 and the ventilation pipeline 13; a cooling module 21 is arranged between the radiating fan 9 and the radiating fin 10;
the CPU heat dissipation system further includes a dust screen 23 disposed on the side of the heat dissipation fan 9 close to the ventilation duct 13.
Optimizing: the cooling module 1-8 comprises a frame 1-24, wherein first cavities 1-27 and second cavities 1-28 are formed in two sides of the frame 1-24, the cooling module 1-8 further comprises a plurality of first heat dissipation plates 1-15 and second heat dissipation plates 1-29, the first heat dissipation plates 1-15 are hollow and communicated with the first cavities 1-27 and the second cavities 1-28, the second heat dissipation plates 1-29 are arranged among the plurality of first heat dissipation plates 1-15, a first pipe orifice 1-25 is formed in the top of the frame, the first pipe orifice 1-25 is communicated with the first cavities 1-27, a second pipe orifice 1-26 is formed in the bottom of the frame, and the second pipe orifice 1-26 is communicated with the second cavities 1-28.
Optimizing: a water tank 1-16 and a water pump 1-17 are arranged in the case 1, the water pump 1-17 is communicated with the water tank 1-16 through a third pipeline 1-20, the water pump 1-17 is communicated with the cooling module 1-8 through a first pipeline 1-7, and the water tank 1-16 is communicated with the cooling module 1-8 through a second pipeline 1-18.
Optimizing: the connection part of the static electricity network 1-22 and the ventilation pipeline 1-5 is provided with a clamping groove 1-21, the clamping groove 1-21 is fixedly arranged in the ventilation pipeline 1-5, the static electricity network 1-22 is embedded in the clamping groove 1-21, and a pair of buckles are arranged at the two ends of the clamping groove 1-29, hinged with the clamping groove 1-22 and buckled with the static electricity network 1-20.
Optimizing: the side wall of the sound box 1-6 is provided with a porous plate, and an air dispersing roller 1-19 is rotatably connected in the sound box 1-6.
Optimizing: the first supporting columns 1-4 are hollow, the first end parts of first springs 1-12 are fixedly connected with the bottoms of the first supporting columns 1-4, the second end parts of the first springs are fixedly connected with sliding plates 1-14, the sliding plates 1-14 are slidably connected with the first supporting columns 1-4, the second supporting columns 1-5 are fixedly connected with the sliding plates 1-14, and the connecting sections of the second supporting columns 1-5 and the first supporting columns 1-4 are sleeved with second springs 1-13.
Optimizing: a snake-shaped water tank 19 is arranged in the cooling plate 12, a water inlet pipe 16 and a water outlet pipe 17 are arranged on one side of the cooling plate 12, the water inlet pipe 16 is communicated with a first end part of the water tank 19, and the water outlet pipe 17 is communicated with a second end part of the water tank 19.
Optimizing: the cooling module 21 comprises a frame, a first cavity 24 and a second cavity 25 are arranged on two sides of the frame, the cooling module 21 further comprises a plurality of first heat dissipation plates 26 and second heat dissipation plates 29, the first heat dissipation plates 26 are hollow and communicated with the first cavity 24 and the second cavity 25, the second heat dissipation plates 29 are arranged among the plurality of first heat dissipation plates 26, a first pipe orifice 27 is arranged at the top of the frame, the first pipe orifice 27 is communicated with the first cavity 24, a second pipe orifice 28 is arranged at the bottom of the frame, and the second pipe orifice 28 is communicated with the second cavity 25.
Optimizing: a water tank 5 and a water pump 6 are arranged in the case 1, the water pump 6 is communicated with the water tank 5 through a third pipeline 18, the water pump 6 is communicated with the cooling module 21 through a first pipeline 7, and the water tank 5 is communicated with the cooling module 21 through a second pipeline 8.
Optimizing: the connection part of the electrostatic net 20 and the ventilation duct 13 is provided with a clamping groove 22, the clamping groove 22 is fixedly arranged in the ventilation duct 13, the electrostatic net 20 is embedded in the clamping groove 22, and the pair of buckles 30 are arranged at two ends of the clamping groove 30, hinged with the clamping groove 22 and fastened with the electrostatic net 20.
A computer case with noise reduction function and heat dissipation function comprises a case 1, wherein a ventilation window 3 is arranged on the front surface of the case, and a noise reduction structure and a CPU heat dissipation system are arranged in the computer case; the invention has the following advantages:
firstly, the noise reduction structure has the following improvements and advantages;
the invention comprises a case, wherein a ventilation window is arranged on the front surface of the case, a plurality of first support columns are fixedly arranged at the bottom of the case, a plurality of second support columns are arranged at the lower parts of the first support columns and elastically and slidably connected with the first support columns, a plurality of sound-absorbing cotton are arranged on the inner wall surface of the case, a mounting plate is fixedly arranged in the case, a ventilation pipe is arranged on the upper end surface of the mounting plate, the first end part of the ventilation pipe is communicated with the ventilation window, a plurality of static grids are arranged in the ventilation pipe, a cooling fan is arranged at the second end part of the ventilation pipe and fixedly arranged on the upper end surface of the mounting plate, a dustproof net is arranged at the joint of the cooling fan and the ventilation pipe, a cooling module is arranged at the far ventilation pipe side of the cooling fan and fixedly arranged.
The invention has reasonable design, the air is driven to flow by the cooling fan, the air takes away the heat of each component in the case, the cooling efficiency is improved, the static net adsorbs the dust in the air entering the case from the outside, the dust can be blocked, and then the dust can be prevented for the CPU main body, so that the dust is prevented from entering the interior of the CPU main body, the sound-absorbing cotton at the periphery eliminates the noise in the case, the noise box eliminates the noise caused by the flowing air, the noise reduction effect is improved, and when the case vibrates, the second support column slides relative to the first support column, so that the vibration amplitude of the case computer is reduced, and the noise is reduced.
The cooling module comprises a frame, a first cavity and a second cavity are arranged on two sides of the frame, the cooling module further comprises a plurality of first heating panels and a plurality of second heating panels, the first heating panels are hollow inside and communicated with the first cavity and the second cavity, the second heating panels are arranged between the plurality of first heating panels, a first pipe orifice is formed in the top of the frame and communicated with the first cavity, a second pipe orifice is formed in the bottom of the frame and communicated with the second cavity. The coolant liquid is discharged from the second pipe orifice in entering and being filled into the first cavity, the cavity in the first heating panel and the second cavity from the first pipe orifice, cooling fan drives the air flow, the air is through cooling module, the heat in the air is through the exchange of first heating panel and second heating panel, the coolant liquid takes away the heat of heating panel again, realize the cooling to flowing air, flowing air after the cooling blows to each part in the quick-witted case, take away the heat, improve the radiating efficiency.
And 3, a water tank and a water pump are arranged in the case, the water pump is communicated with the water tank through a third pipeline, the water pump is communicated with the cooling module through a first pipeline, and the water tank is communicated with the cooling module through a second pipeline to provide cooling liquid for the cooling module.
The connection part of the electrostatic net and the ventilation pipeline is provided with a clamping groove, the clamping groove is fixedly arranged in the ventilation pipeline, the electrostatic net is embedded in the clamping groove, a pair of buckles are arranged at two ends of the clamping groove, are hinged to the clamping groove and are buckled with the electrostatic net, the buckles are pulled off, and the electrostatic net can be detached to be cleaned and replaced. The reasonable design draw-in groove is convenient for dismantle and the installation with the electrostatic screen, is convenient for clear up and change the electrostatic screen.
Its 5, the silence case lateral wall is provided with the perforated plate, and an air dispersion roller rotates to be connected in the silence case, and the velocity of flow of mobile air can be slowed down to the perforated plate, and gaseous impulse is alleviated to the air dispersion roller to change gaseous direction, thereby reduce gaseous vibrations, improve the noise reduction effect.
The first support column is hollow, a first end of a first spring is fixedly connected with the bottom of the first support column, a sliding plate is fixedly connected with a second end of the first spring, the sliding plate is slidably connected with the first support column, a second support column is fixedly connected with the sliding plate, a second spring is sleeved on a connecting section of the second support column and the first support column, and when the case vibrates, the first spring is compressed and the second spring is stretched to buffer the vibration of the case, so that the noise reduction effect is improved.
And 7, the mounting plate is made of soft damping materials, so that the vibration of the cooling fan is further buffered.
Secondly, the CPU heat dissipation system has the following improvement and advantages;
the invention comprises a case, a ventilation window is arranged on the front surface of the case, a mounting plate is fixedly arranged in the case, a ventilation pipeline is arranged on the upper end surface of the mounting plate and communicated with the ventilation window, a plurality of static grids are arranged in the ventilation pipeline, a CPU main body is arranged on the mounting plate, a heat conducting plate is arranged on the upper end surface of the CPU main body and keeps contact with the CPU main body, a pair of mounting frames are arranged on two sides of the heat conducting plate and is detachably connected with the mounting plate, a plurality of radiating fins are uniformly arranged on the upper end surface of the heat conducting plate and are fixedly connected with the heat conducting plate, a pair of heat conducting pipes are U-shaped and penetrate through the radiating fins and are fixedly connected with the radiating fins, a cooling plate is fixedly arranged on the upper parts of the radiating fins and keeps contact with the radiating fins.
The heat-conducting plate is reasonable in design, heat of the CPU is transferred into the radiating fins through the heat-conducting plate, the heat is uniformly distributed into each radiating fin through the heat-conducting plate, the heat is dispersed, the heat generated during the work of the CPU can be effectively reduced, the cooling plate is in contact with the radiating fins, the radiating fins can be cooled, the cooling effect is improved, the cooling fan on the side face drives air to flow, the air blows to the radiating fins to take away the heat, the cooling efficiency is improved, the static net adsorbs dust in the air entering the case from the outside, the dust can be blocked, and the dust can be prevented from entering the CPU main body, so that the dust is prevented from entering the interior of the CPU main body.
Its 2, reasonable design dust screen can block the dust, and then can prevent dust for the CPU main part to avoid the dust to get into the inside of CPU main part.
And 3, the heat conduction pipe is made of copper, the heat conduction quality of the copper is good, and the heat generated by the CPU is conveniently and uniformly dispersed into the heat dissipation fins.
And 4, the heat conduction pipe is hollow, and heat conduction liquid is filled in the heat conduction pipe, so that the heat conduction efficiency is further improved.
And 5, the heat conducting plate is made of silver-copper composite material, and the thickness of the heat conducting plate is 0.7-0.95 mm, so that the heat transfer work is accelerated, the heat conductivity is accelerated through heat transfer, and the heat transfer efficiency is improved.
Its 6, the inside snakelike basin that sets up of cooling plate, cooling plate one side is provided with inlet tube and outlet pipe, inlet tube and basin first end intercommunication, outlet pipe and basin second end intercommunication, and the coolant liquid enters into snakelike basin from the inlet tube in, from the outlet pipe drainage, and the circulation flows, gives off radiating fin and exchanges the heat of cooling plate and take away, improves the radiating efficiency.
According to the cooling structure, the cooling module is arranged between the cooling fan and the cooling fins, flowing air is cooled by the cooling module, and the cooled air blows to the cooling fins to take away heat, so that the cooling efficiency is improved. Optimized, the cooling module comprises a frame, a first cavity and a second cavity are arranged on two sides of the frame, the cooling module further comprises a plurality of first heating panels and a plurality of second heating panels, the first heating panels are hollow inside and communicated with the first cavity and the second cavity, the second heating panels are arranged between the plurality of first heating panels, a first pipe orifice is formed in the top of the frame and communicated with the first cavity, a second pipe orifice is formed in the bottom of the frame and communicated with the second cavity. The cooling module is reasonably designed, the cooling module cools flowing air, and the cooled air blows to the radiating fins to take away heat, so that the cooling efficiency is improved.
It 6, the coolant liquid is discharged from the second mouth of pipe in entering and being flooded first cavity, first heating panel inner cavity and the second cavity from first mouth of pipe, and cooling fan drives the air and flows, and the air is through cooling module, and the heat in the air is through the exchange of first heating panel and second heating panel, and the coolant liquid is taken away the heat of heating panel again, realizes the cooling to flowing air, and flowing air after the cooling blows to radiating fin, improves the radiating efficiency.
And 9, a water tank and a water pump are arranged in the case, the water pump is communicated with the water tank through a third pipeline, the water pump is communicated with the cooling module through a first pipeline, and the water tank is communicated with the cooling module through a second pipeline to provide cooling liquid for the cooling module.
The connection part of the electrostatic net and the ventilation pipeline is provided with a clamping groove, the clamping groove is fixedly arranged in the ventilation pipeline, the electrostatic net is embedded in the clamping groove, and the pair of buckles are arranged at the two ends of the clamping groove, hinged to the clamping groove and fastened with the electrostatic net, so that the electrostatic net can be conveniently detached and cleaned.
Drawings
FIGS. 1-2 are schematic structural views of the present invention;
FIG. 3 is a cross-sectional view A-A of FIG. 2;
FIG. 4 is a cross-sectional view B-B of FIG. 3;
FIG. 5 is a schematic structural view of a cooling module;
FIG. 6 is a cross-sectional view C-C of FIG. 5;
FIG. 7 is a cross-sectional view taken along line D-D of FIG. 6;
FIG. 8 is a schematic view of a portion I of FIG. 7;
FIG. 9 is a cross-sectional view E-E of FIG. 4;
FIGS. 10-13 are schematic views of the internal structure of the CPU heat dissipation system;
FIG. 14 is a sectional view taken along line A-A of FIG. 12;
FIG. 15 is a cross-sectional view B-B of FIG. 14;
FIG. 16 is a schematic view of the structure of the cooling die plate;
FIG. 17 is a cross-sectional view C-C of FIG. 16;
FIG. 18 is a cross-sectional view taken along line D-D of FIG. 17;
FIG. 19 is a schematic view of a portion I of FIG. 18;
fig. 20 is a schematic view of a partial enlarged view II in fig. 15.
Wherein: a chassis 1; a handle 2; a ventilation window 3; a first support column 1-4; a second support column 1-5; 1-6 of a mute box; a first conduit 1-7; cooling modules 1-8; 1-9 of a heat radiation fan; 1-10 parts of sound-absorbing cotton; mounting plates 1-11; a first spring 1-12; a second spring 1-13; sliding plates 1-14; first heat dissipation plates 1-15; 1-16 of a water tank; 1-17 parts of a water pump; a second conduit 1-18; air dispersion rollers 1-19; a third conduit 1-20; a card slot 1-21; 1-22 of a static grid; 1-23 parts of dust screens; frames 1-24; a first orifice 1-25; a second orifice 1-26; a first cavity 1-27; a second cavity 1-28; second heat dissipation plates 1-29; a mounting plate 4; a water tank 5; a water pump 6; a first duct 7; a second duct 8; a heat radiation fan 9; heat dissipating fins 10; a heat conductive pipe 11; a cooling plate 12; a ventilation duct 13; a heat-conducting plate 14; a mounting frame 15; a water inlet pipe 16; a water outlet pipe 17; a third conduit 18; a water tank 19; a static grid 20; a cooling module 21; a card slot 22; a dust screen 23; a first cavity 24; a second cavity 25; a first heat dissipation plate 26; a first nozzle 27; a second nozzle 28; a second heat dissipation plate 29; a buckle 30; a CPU body 31.
Detailed Description
The present invention will be described in detail with reference to fig. 1 to 20, and the technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Constructing a computer mainframe with noise reduction and heat dissipation functions: the computer mainframe comprises a case 1, a ventilation window 3 is arranged on the front face of the case, and a noise reduction structure and a CPU heat dissipation system are arranged in the computer mainframe.
The noise reduction structure comprises first support columns 1-4, a plurality of first support columns 1-4 are fixedly arranged at the bottom of a case 1, a plurality of second support columns 1-5 are arranged at the lower parts of the first support columns 1-4 and elastically and slidably connected with the first support columns 1-5, a plurality of sound absorption cotton 1-10 are arranged on the inner wall surface of the case 1, a mounting plate 1-11 is fixedly arranged in the case 1, a ventilation pipe 1-5 is arranged on the upper end surface of the mounting plate 1-11, the first end part of the ventilation pipe 1-5 is communicated with a ventilation window 3, a plurality of static grids 1-22 are arranged in the ventilation pipe 1-5, a cooling fan 1-9 is arranged at the second end part of the ventilation pipe 1-9 and is fixedly arranged on the upper end surface of the mounting plate 1-11, and a dustproof grid 1-23 is arranged at the joint, a cooling module 1-8 is arranged at the side of the far ventilation pipe 1-5 of the cooling fan 1-9 and is fixedly arranged on the upper end surface of the mounting plate 1-11, and a sound box 1-6 is fixedly arranged on the upper end surface of the mounting plate 1-11 and is communicated with the cooling module 1-8 heat dissipation fan 1-9.
During implementation, the cooling fans 1-9 drive air to flow, the cooling modules 1-8 cool flowing air, the flowing cooling air takes away heat of all parts in the case 1, the electrostatic nets 1-22 adsorb dust in air entering the case 1 from the outside, the dust can be blocked, and then the dust can be prevented for the CPU main body, so that the dust is prevented from entering the CPU main body, the surrounding sound-absorbing cotton 1-10 eliminates noise inside the case, the silent sound boxes 1-6 eliminate noise flowing through the air, the noise reduction effect is improved, when the case 1 vibrates, the second supporting columns 1-5 slide relative to the first supporting columns 1-1, so that the vibration amplitude of a computer of the case is reduced, and the noise is reduced.
The invention has reasonable design, the air is driven to flow by the cooling fan, the air takes away the heat of each component in the case, the cooling efficiency is improved, the static net adsorbs the dust in the air entering the case from the outside, the dust can be blocked, and then the dust can be prevented for the CPU main body, so that the dust is prevented from entering the interior of the CPU main body, the sound-absorbing cotton at the periphery eliminates the noise in the case, the noise box eliminates the noise caused by the flowing air, the noise reduction effect is improved, and when the case vibrates, the second support column slides relative to the first support column, so that the vibration amplitude of the case computer is reduced, and the noise is reduced.
Preferably, the cooling module 1-8 comprises a frame 1-24, first cavities 1-27 and second cavities 1-28 are arranged on two sides of the frame 1-24, the cooling module 1-8 further comprises a plurality of first heat dissipation plates 1-15 and second heat dissipation plates 1-29, the first heat dissipation plates 1-15 are hollow and communicated with the first cavities 1-27 and the second cavities 1-28, the second heat dissipation plates 1-29 are arranged among the plurality of first heat dissipation plates 1-15, a first pipe orifice 1-25 is arranged on the top of the frame, the first pipe orifice 1-25 is communicated with the first cavities 1-27, a second pipe orifice 1-26 is arranged on the bottom of the frame, and the second pipe orifice 1-26 is communicated with the second cavities 1-28.
The cooling liquid enters the first cavity 1-27, the inner cavity of the first heat dissipation plate 1-15 and the second cavity 1-28 from the first pipe orifice 1-25, is discharged from the second pipe orifice 1-26, the cooling fan 1-9 drives the air to flow, the air passes through the cooling module 1-8, the heat in the air is exchanged through the first heat dissipation plate 1-15 and the second heat dissipation plate 1-29, the cooling liquid takes away the heat of the heat dissipation plates, the cooling of the flowing air is realized, the cooled flowing air blows to each part in the case, the heat is taken away, and the heat dissipation efficiency is improved.
Preferably, a water tank 1-16 and a water pump 1-17 are arranged in the case 1, the water pump 1-17 is communicated with the water tank 1-16 through a third pipeline 1-20, the water pump 1-17 is communicated with the cooling module 1-8 through a first pipeline 1-7, and the water tank 1-16 is communicated with the cooling module 1-8 through a second pipeline 1-18 to provide cooling liquid for the cooling module 1-8.
Preferably, the joint of the static electricity network 1-22 and the ventilation pipeline 1-5 is provided with a clamping groove 1-21, the clamping groove 1-21 is fixedly arranged in the ventilation pipeline 1-5, the static electricity network 1-22 is embedded in the clamping groove 1-21, a pair of buckles are arranged at two ends of the clamping groove 1-29 and hinged with the clamping groove 1-22 and buckled with the static electricity network 1-20, the buckles are pulled off, and the static electricity network 1-20 can be detached for cleaning and replacement. The reasonable design draw-in groove is convenient for dismantle and the installation with the electrostatic screen, is convenient for clear up and change the electrostatic screen.
Preferably, the side walls of the sound boxes 1 to 6 are provided with porous plates, an air dispersing roller 1 to 19 is rotatably connected in the sound boxes 1 to 6, the porous plates can reduce the flow velocity of flowing air, the air dispersing roller 1 to 19 can reduce the impulse of the air and change the direction of the air, so that the vibration of the air is reduced, and the noise reduction effect is improved.
Preferably, the first support columns 1-4 are hollow, the first end portions of first springs 1-12 are fixedly connected with the bottoms of the first support columns 1-4, the second end portions of the first springs 1-12 are fixedly connected with a sliding plate 1-14, the sliding plate 1-14 is slidably connected with the first support columns 1-4, the second support columns 1-5 are fixedly connected with the sliding plate 1-14, the connecting sections of the second support columns 1-5 and the first support columns 1-4 are sleeved with second springs 1-13, when the case 1 vibrates, the first springs 1-12 are compressed, the second springs 1-13 are elongated, the vibration of the case 1 is buffered, and the noise reduction effect is improved.
Preferably, the top of the case 1 is provided with a handle 2, so that the case 1 is convenient to move.
Optimally, the mounting plates 1-11 are made of soft damping materials, so that the vibration of the cooling fan is further buffered.
The CPU heat dissipation system comprises a mounting plate 4, the mounting plate 4 is fixedly arranged in the case 1, a ventilation pipeline 13 is arranged on the upper end surface of the mounting plate 4, communicating with the ventilation window 3, a plurality of static grids are arranged in the ventilation duct 13, a CPU main body 31 is arranged on the mounting plate 4, a heat conducting plate 14 is arranged on the upper end surface of the CPU main body 31, in contact with the CPU body 31, a pair of mounting frames 15 are provided on both sides of the heat conductive plate 14, detachably connected with the mounting plate 4, a plurality of radiating fins 10 are uniformly arranged on the upper end surface of the heat conducting plate 14, a pair of heat conduction pipes 11, which are fixedly connected to the heat conduction plate 14, are U-shaped and penetrate through the plurality of heat dissipation fins 10, and is fixedly connected with the heat radiating fins 10, a cooling plate 12 is fixedly installed on the upper portions of the heat radiating fins 10, keeping contact with the heat dissipation fins 10, a heat dissipation fan 9 is disposed between the heat dissipation fins 10 and the ventilation duct 13, and a dust screen 23 is disposed on the side of the heat dissipation fan 9 close to the ventilation duct 13. The heat-conducting plate is reasonable in design, heat of the CPU is transferred into the radiating fins through the heat-conducting plate, the heat is uniformly distributed into each radiating fin through the heat-conducting plate, the heat is dispersed, the heat generated during the work of the CPU can be effectively reduced, the cooling plate is in contact with the radiating fins, the radiating fins can be cooled, the cooling effect is improved, the cooling fan on the side face drives air to flow, the air blows to the radiating fins to take away the heat, the cooling efficiency is improved, the static net adsorbs dust in the air entering the case from the outside, the dust can be blocked, and the dust can be prevented from entering the CPU main body, so that the dust is prevented from entering the interior of the CPU main body.
In addition, the dust screen is reasonably designed, so that dust can be blocked, and then the CPU main body can be prevented from dust, so that the dust is prevented from entering the interior of the CPU main body.
During the implementation, heat conduction plate 14 is to in radiator fin 10 to the heat transfer of CPU main part 31, heat pipe 11 is with in each radiator fin 10 of heat evenly distributed, disperse the heat, cooling plate 12 and the contact of radiator fin 10 can cool off radiator fin 10, radiator fan 9 drives the air flow, the air gets into air pipe 13 from ventilation window 3, the dust in the air is adsorbed to the static net 20 in the air pipe, blow to radiator fin 10 at last, take away the heat of radiator fin 10.
Optimally, the heat conducting pipe 11 is made of copper, so that the heat conducting property of the copper is good, and the heat generated by the CPU can be rapidly and uniformly dispersed into the heat radiating fins 10.
Optimally, the heat conduction pipe 11 is hollow, and the heat conduction pipe 11 is filled with heat conduction liquid, so that the heat conduction efficiency is further improved.
Optimally, the heat conducting plate 14 is made of a silver-copper composite material, and the thickness of the heat conducting plate 14 is 0.7mm-0.95mm, so that the heat transfer work is accelerated, the heat conductivity is accelerated through heat transfer, and the heat transfer efficiency is improved.
Optimized, cooling plate 12 is inside to be set up a snakelike basin 19, and cooling plate 12 one side is provided with inlet tube 16 and outlet pipe 17, inlet tube 16 and 19 first end intercommunications in basin, and outlet pipe 17 and 19 second end intercommunications in basin, the coolant liquid enters into snakelike basin 10 from inlet tube 11 in, from outlet pipe 12 drainage, the circulation flows, gives off fin 6 and exchanges the heat of cooling plate and take away, improves the radiating efficiency.
Furthermore, a cooling module 21 is arranged between the cooling fan 9 and the cooling fins 10, the cooling module 21 cools the flowing air, and the cooled air blows to the cooling fins 10 to take away heat, so that the cooling efficiency is improved.
Preferably, the cooling module 21 includes a frame, a first cavity 24 and a second cavity 25 are disposed on two sides of the frame, the cooling module 21 further includes a plurality of first heat dissipation plates 26 and a plurality of second heat dissipation plates 29, the first heat dissipation plates 26 are hollow and communicated with the first cavity 24 and the second cavity 25, the second heat dissipation plates 29 are disposed between the plurality of first heat dissipation plates 26, a first pipe orifice 27 is disposed on the top of the frame, the first pipe orifice 27 is communicated with the first cavity 24, a second pipe orifice 28 is disposed on the bottom of the frame, and the second pipe orifice 28 is communicated with the second cavity 25. The cooling module is reasonably designed, the cooling module cools flowing air, and the cooled air blows to the radiating fins to take away heat, so that the cooling efficiency is improved.
The coolant liquid enters from first mouth of pipe 27 and fills in first cavity 24, cavity and second cavity 25 in the first heating panel 26, discharge from second mouth of pipe 28, cooling fan 9 drives the air and flows, the air is through cooling module 21, the heat in the air is through the exchange of first heating panel 26 and second heating panel 27, the coolant liquid takes away the heat of heating panel again, realize the cooling to flowing air, the flowing air after the cooling blows to radiating fin 10, the efficiency of heat dissipation is improved.
Preferably, a water tank 5 and a water pump 6 are arranged in the case 1, the water pump 6 is communicated with the water tank 5 through a third pipeline 18, the water pump 6 is communicated with the cooling module 21 through a first pipeline 7, and the water tank 5 is communicated with the cooling module 21 through a second pipeline 8 to provide cooling liquid for the cooling module.
Further, a clamping groove 22 is formed in the joint of the electrostatic net 20 and the ventilation pipeline 13, the clamping groove 22 is fixedly installed in the ventilation pipeline 13, the electrostatic net 20 is embedded in the clamping groove 22, and the pair of buckles 30 are arranged at two ends of the clamping groove 30, hinged to the clamping groove 22 and fastened to the electrostatic net 20, so that the electrostatic net 20 can be conveniently detached and cleaned.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. The utility model provides a computer mainframe with function and the heat dissipation function of making an uproar falls which characterized in that: the computer mainframe comprises a case (1), the front of the case is provided with a ventilation window (3), and a noise reduction structure and a CPU heat dissipation system are arranged in the computer mainframe; wherein the content of the first and second substances,
the noise reduction structure comprises a plurality of first supporting columns (1-4) which are fixedly arranged at the bottom of the case (1);
the noise reduction structure also comprises a plurality of second supporting columns (1-5) which are arranged at the lower parts of the plurality of first supporting columns (1-4) and elastically connected with the first supporting columns (1-5) in a sliding manner;
the noise reduction structure also comprises a plurality of sound absorption cotton (1-10) which are arranged on the inner wall surface of the case (1);
the noise reduction structure also comprises an installation plate (1-11) which is fixedly installed in the case (1);
the noise reduction structure also comprises a ventilation pipe (1-5) which is arranged on the upper end surface of the mounting plate (1-11); the first end of the ventilation pipe (1-5) is communicated with the ventilation window (3);
the noise reduction structure also comprises a plurality of static grids (1-22) which are arranged in the ventilation pipes (1-5);
the noise reduction structure also comprises a cooling fan (1-9) which is arranged at the second end part of the ventilation pipe (1-9) and fixedly arranged on the upper end surface of the mounting plate (1-11);
the noise reduction structure also comprises a dust screen (1-23) which is arranged at the joint of the cooling fan (1-9) and the ventilation pipe (1-5);
the noise reduction structure also comprises a cooling module (1-8) which is arranged at the far ventilation pipe (1-5) side of the cooling fan (1-9) and fixedly arranged on the upper end surface of the mounting plate (1-11);
the noise reduction structure also comprises a mute box (1-6) which is fixedly arranged on the upper end surface of the mounting plate (1-11) and is communicated with the cooling module (1-8) unit cooling fan (1-9);
the CPU heat dissipation system comprises a mounting plate (4) which is fixedly arranged in the case (1);
the CPU heat dissipation system also comprises a ventilation pipeline (13) which is arranged on the upper end surface of the mounting plate (4) and communicated with the ventilation window (3);
the CPU heat dissipation system also comprises a plurality of static grids which are arranged in the ventilation pipeline (13);
the CPU heat dissipation system also comprises a CPU main body (31) which is arranged on the mounting plate (4);
the CPU heat dissipation system also comprises a heat conduction plate (14) which is arranged on the upper end surface of the CPU main body (31) and keeps contact with the CPU main body (31);
the CPU heat dissipation system also comprises a pair of mounting frames (15) which are arranged on two sides of the heat conduction plate (14) and detachably connected with the mounting plate (4);
the CPU heat dissipation system also comprises a plurality of heat dissipation fins (10) which are uniformly arranged on the upper end surface of the heat conduction plate (14) and are fixedly connected with the heat conduction plate (14);
the CPU heat dissipation system also comprises a pair of heat conduction pipes (11) which are U-shaped, penetrate through the plurality of heat dissipation fins (10) and are fixedly connected with the heat dissipation fins (10);
the CPU heat dissipation system also comprises a cooling plate (12) which is fixedly arranged at the upper part of the heat dissipation fin (10) and keeps contact with the heat dissipation fin (10);
the CPU heat dissipation system also comprises a heat dissipation fan (9) which is arranged between the heat dissipation fins (10) and the ventilation pipeline (13); a cooling module (21) is arranged between the radiating fan (9) and the radiating fins (10);
the CPU heat dissipation system also comprises a dust screen (23) which is arranged on the side of the heat fan (9) close to the ventilation pipeline (13).
2. The computer main cabinet with noise reduction function and heat dissipation function according to claim 1, wherein: the cooling module (1-8) comprises a frame (1-24), a first cavity (1-27) and a second cavity (1-28) are arranged on two sides of the frame (1-24), the cooling module (1-8) further comprises a plurality of first cooling plates (1-15) and second cooling plates (1-29), the first cooling plates (1-15) are hollow, the heat dissipation plate is communicated with the first cavities (1-27) and the second cavities (1-28), the second heat dissipation plates (1-29) are arranged among the plurality of first heat dissipation plates (1-15), the top of the frame is provided with a first pipe orifice (1-25), the first pipe orifice (1-25) is communicated with the first cavities (1-27), the bottom of the frame is provided with a second pipe orifice (1-26), and the second pipe orifice (1-26) is communicated with the second cavities (1-28).
3. The computer main cabinet with noise reduction function and heat dissipation function according to claim 1, wherein: a water tank (1-16) and a water pump (1-17) are arranged in the case (1), the water pump (1-17) is communicated with the water tank (1-16) through a third pipeline (1-20), the water pump (1-17) is communicated with the cooling module (1-8) through a first pipeline (1-7), and the water tank (1-16) is communicated with the cooling module (1-8) through a second pipeline (1-18).
4. The computer main cabinet with noise reduction function and heat dissipation function according to claim 1, wherein: clamping grooves (1-21) are arranged at the joints of the static grids (1-22) and the ventilation pipelines (1-5), the clamping grooves (1-21) are fixedly arranged in the ventilation pipelines (1-5), the static grids (1-22) are embedded in the clamping grooves (1-21), and a pair of buckles are arranged at two ends of the clamping grooves (1-29), hinged with the clamping grooves (1-22) and buckled with the static grids (1-20).
5. The computer main cabinet with noise reduction function and heat dissipation function according to claim 1, wherein: the side wall of the sound box (1-6) is provided with a porous plate, and an air dispersion roller (1-19) is rotatably connected in the sound box (1-6).
6. The computer main cabinet with noise reduction function and heat dissipation function according to claim 1, wherein: the first supporting columns (1-4) are hollow, the first end portions of first springs (1-12) are fixedly connected with the bottoms of the first supporting columns (1-4), the second end portions of the first springs are fixedly connected with a sliding plate (1-14), the sliding plate (1-14) is slidably connected with the first supporting columns (1-4), the second supporting columns (1-5) are fixedly connected with the sliding plate (1-14), and the connecting sections of the second supporting columns (1-5) and the first supporting columns (1-4) are sleeved with second springs (1-13).
7. The computer main cabinet with noise reduction function and heat dissipation function according to claim 1, wherein: a snake-shaped water tank (19) is arranged in the cooling plate (12), a water inlet pipe (16) and a water outlet pipe (17) are arranged on one side of the cooling plate (12), the water inlet pipe (16) is communicated with a first end part of the water tank (19), and the water outlet pipe (17) is communicated with a second end part of the water tank (19).
8. The computer main cabinet with noise reduction function and heat dissipation function according to claim 1, wherein: the cooling module (21) comprises a frame, a first cavity (24) and a second cavity (25) are formed in two sides of the frame, the cooling module (21) further comprises a plurality of first heat dissipation plates (26) and second heat dissipation plates (29), the first heat dissipation plates (26) are hollow inside and communicated with the first cavity (24) and the second cavity (25), the second heat dissipation plates (29) are arranged between the plurality of first heat dissipation plates (26), a first pipe orifice (27) is formed in the top of the frame, the first pipe orifice (27) is communicated with the first cavity (24), a second pipe orifice (28) is formed in the bottom of the frame, and the second pipe orifice (28) is communicated with the second cavity (25).
9. The computer main cabinet with noise reduction function and heat dissipation function according to claim 1, wherein: a water tank (5) and a water pump (6) are arranged in the case (1), the water pump (6) is communicated with the water tank (5) through a third pipeline (18), the water pump (6) is communicated with the cooling module (21) through a first pipeline (7), and the water tank (5) is communicated with the cooling module (21) through a second pipeline (8).
10. The computer main cabinet with noise reduction function and heat dissipation function according to claim 1, wherein: a clamping groove (22) is formed in the joint of the static grid (20) and the ventilation pipeline (13), the clamping groove (22) is fixedly installed in the ventilation pipeline (13), the static grid (20) is embedded in the clamping groove (22), and a pair of buckles (30) are arranged at two ends of the clamping groove (30), hinged to the clamping groove (22) and buckled with the static grid (20).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110020808.6A CN112711311A (en) | 2021-01-08 | 2021-01-08 | Computer mainframe with noise reduction function and heat dissipation function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110020808.6A CN112711311A (en) | 2021-01-08 | 2021-01-08 | Computer mainframe with noise reduction function and heat dissipation function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112711311A true CN112711311A (en) | 2021-04-27 |
Family
ID=75548499
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110020808.6A Pending CN112711311A (en) | 2021-01-08 | 2021-01-08 | Computer mainframe with noise reduction function and heat dissipation function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112711311A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113220083A (en) * | 2021-05-12 | 2021-08-06 | 浙江农林大学 | Data quality processing equipment capable of automatically controlling temperature |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1694246A (en) * | 2004-05-08 | 2005-11-09 | 采石科技有限公司 | Convection radiating air ventilation cover |
| US20060050480A1 (en) * | 2004-09-07 | 2006-03-09 | Wen-Lung Yu | Computer heat dissipating system |
| WO2013123899A1 (en) * | 2012-02-23 | 2013-08-29 | Zhou Zheming | Low-noise computer heat dissipation device |
| CN106406477A (en) * | 2016-10-31 | 2017-02-15 | 华南理工大学 | Tandem type CPU heat dissipating and cooling device |
| CN208314721U (en) * | 2018-07-19 | 2019-01-01 | 沧州师范学院 | A kind of mute water-cooling cabinet |
| CN109213283A (en) * | 2018-09-11 | 2019-01-15 | 苏州苏琼网络科技有限公司 | A kind of computer host box of high-efficient noise-reducing |
| CN209765410U (en) * | 2019-06-14 | 2019-12-10 | 浙江商业职业技术学院 | dustproof mainframe box with efficient heat dissipation function |
| CN212181382U (en) * | 2020-06-10 | 2020-12-18 | 齐齐哈尔工程学院 | Device of making an uproar falls in quick-witted case for computer |
-
2021
- 2021-01-08 CN CN202110020808.6A patent/CN112711311A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1694246A (en) * | 2004-05-08 | 2005-11-09 | 采石科技有限公司 | Convection radiating air ventilation cover |
| US20060050480A1 (en) * | 2004-09-07 | 2006-03-09 | Wen-Lung Yu | Computer heat dissipating system |
| WO2013123899A1 (en) * | 2012-02-23 | 2013-08-29 | Zhou Zheming | Low-noise computer heat dissipation device |
| CN106406477A (en) * | 2016-10-31 | 2017-02-15 | 华南理工大学 | Tandem type CPU heat dissipating and cooling device |
| CN208314721U (en) * | 2018-07-19 | 2019-01-01 | 沧州师范学院 | A kind of mute water-cooling cabinet |
| CN109213283A (en) * | 2018-09-11 | 2019-01-15 | 苏州苏琼网络科技有限公司 | A kind of computer host box of high-efficient noise-reducing |
| CN209765410U (en) * | 2019-06-14 | 2019-12-10 | 浙江商业职业技术学院 | dustproof mainframe box with efficient heat dissipation function |
| CN212181382U (en) * | 2020-06-10 | 2020-12-18 | 齐齐哈尔工程学院 | Device of making an uproar falls in quick-witted case for computer |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113220083A (en) * | 2021-05-12 | 2021-08-06 | 浙江农林大学 | Data quality processing equipment capable of automatically controlling temperature |
| CN113220083B (en) * | 2021-05-12 | 2022-11-01 | 浙江农林大学 | Data quality processing equipment capable of automatically controlling temperature |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN213659404U (en) | Heat radiator for computer processor | |
| CN112711311A (en) | Computer mainframe with noise reduction function and heat dissipation function | |
| CN206584299U (en) | A kind of computer automatic dust removing heat radiation host computer case | |
| CN113467583A (en) | Heat dissipation mechanism for enhancing heat dissipation of high-heat component in computer | |
| CN211577839U (en) | General ventilation unit of computer | |
| CN213844008U (en) | Computer comprehensive noise reduction device | |
| CN216357968U (en) | Computer network safety control device | |
| CN212873416U (en) | Noise reduction structure of computer case | |
| CN111651011A (en) | Dustproof computer heat radiation structure | |
| CN213601179U (en) | Tablet personal computer with good heat conduction | |
| CN219936361U (en) | Heat abstractor of information processor | |
| CN210432278U (en) | Heat radiator with radiating fins | |
| CN213182595U (en) | Microcomputer protection box | |
| CN207779196U (en) | It is capable of the high efficiency and heat radiation equipment of dust removal and filtration | |
| CN111631514A (en) | Novel computer desk | |
| CN218544786U (en) | Central air-conditioning control device with high-efficient filtering and purifying functions | |
| CN212781904U (en) | Computer case with good heat dissipation performance | |
| CN219625950U (en) | Dustproof heat dissipation type industrial control computer | |
| CN218735607U (en) | Module power pack convenient to use | |
| CN212749708U (en) | Computer motherboard static-removing device | |
| CN213042200U (en) | Industrial control cabinet with efficient heat dissipation structure | |
| CN218471206U (en) | Low-noise notebook computer easy to radiate heat | |
| CN219590783U (en) | Electronic information processor | |
| CN219999894U (en) | Electronic information communication system capable of radiating and preventing dust | |
| CN215679292U (en) | Network data safety evaluation device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210427 |
|
| RJ01 | Rejection of invention patent application after publication |