CN112708845A - Continuous jet deposition device with double atomization systems - Google Patents
Continuous jet deposition device with double atomization systems Download PDFInfo
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- CN112708845A CN112708845A CN202011552894.7A CN202011552894A CN112708845A CN 112708845 A CN112708845 A CN 112708845A CN 202011552894 A CN202011552894 A CN 202011552894A CN 112708845 A CN112708845 A CN 112708845A
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/12—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
- C23C4/123—Spraying molten metal
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/003—Apparatus, e.g. furnaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/115—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces by spraying molten metal, i.e. spray sintering, spray casting
Abstract
The invention relates to a continuous jet deposition device with double atomization systems, which comprises a smelting unit, a first atomization unit, a second atomization unit, a deposition unit and a control unit, wherein the smelting unit is used for smelting a molten metal; the first atomizing unit and the second atomizing unit are respectively connected with the smelting unit, the smelting unit heats the raw materials to be molten to form a melt, and the first atomizing unit and the second atomizing unit receive the melt formed by the smelting unit; the deposition unit is provided with a substrate, and atomized liquid drops sprayed by the first atomization unit and the second atomization unit are deposited on the substrate of the deposition unit; the control unit controls the start and stop of the first atomization unit and the second atomization unit and controls the first atomization unit and the second atomization unit to alternately spray atomized liquid. The invention can realize seamless switching and ensure the uninterrupted atomization and deposition process, thereby ensuring the continuity and stability of the spray deposition process.
Description
Technical Field
The invention relates to the technical field of development of metal and alloy preparation devices and application thereof, in particular to a continuous jet deposition device with a double atomization system.
Background
Spray deposition technology, also known as spray forming or spray casting technology, integrates melt atomization and deposition processes, and is a comprehensive process combining rapid solidification, semi-solid processing and near-net-shape forming. The spray deposition can be simply divided into two processes of atomization and deposition, wherein atomization is a process of crushing metal or alloy melt obtained by melting into fine droplets under the action of high-pressure gas, and deposition is a process of depositing the droplets which fly for a certain distance and are solidified (semi-solid state) to a certain degree on a substrate to form an ingot blank. Therefore, the stabilization of the spray deposition firstly needs to ensure the continuous stable operation of the melt atomization process, and the optimization and modification of the spray deposition key device are the basis for realizing the stabilized production.
In 1974 Brooks and Leatham et al, Osprey metals, UK, successfully applied the jet deposition principle to the production of forged blanks and evolved gradually to the well-known Osprey process. In 2000, an electronic packaging Al- (22-70%) Si alloy, also called a thermal expansion Controlled alloy (CE), is prepared by Osprey metal company by using spray deposition, and the diameter of an ingot blank of the electronic packaging Al- (22-70%) Si alloy reaches 250 mm; the obtained Al-Si alloy can be processed by using a common cutter, the surface of the Al-Si alloy can be plated with Ni, Cu, Ag, Au and the like, and the Al-Si alloy is successfully applied to the packaging of military, aerospace and avionic products.
In the current research and practice production, the spray deposition device mostly adopts a single nozzle or a fixed double nozzle to form atomized liquid drops. The spray deposition equipment with the structure is not beneficial to the continuous and stable operation of the spray deposition process because the discontinuity of external factors such as nozzle material, leakage packet, gas and the like is caused, for example, the atomization process is forced to be temporary due to the loss of the nozzle and needs to be replaced. In addition, in the process of replacing the atomization device, because the atomizer is arranged above the deposition substrate, part of residues are easy to fall on the upper surface of the deposited ingot blank and are involved in the middle of the ingot blank in the subsequent deposition process, thereby causing adverse effects on the quality and stability of the deposited ingot blank.
Disclosure of Invention
Based on this, the invention aims to provide a continuous spray deposition device with two atomization systems, which adopts two sets of atomization systems and is simultaneously connected with a gas connection and controller, thereby realizing seamless switching, ensuring the uninterrupted proceeding of atomization and deposition processes and further ensuring the continuity and stability of the spray deposition process.
The utility model provides a two atomizing system continuous type spray deposition device which characterized in that: the device comprises a smelting unit, a first atomizing unit, a second atomizing unit, a deposition unit and a control unit; the first atomizing unit and the second atomizing unit are respectively connected with the smelting unit, the smelting unit heats the raw materials to be molten to form a melt, and the first atomizing unit and the second atomizing unit receive the melt formed by the smelting unit; the deposition unit is provided with a substrate, and atomized liquid drops sprayed by the first atomization unit and the second atomization unit are deposited on the substrate of the deposition unit; the control unit controls the start and stop of the first atomization unit and the second atomization unit and controls the first atomization unit and the second atomization unit to alternately spray atomized liquid.
The continuous jet deposition device with the double atomization systems can realize quick and seamless switching, and realize the uninterrupted operation of atomization and deposition processes, thereby ensuring the continuity and stability of the jet deposition process and improving the automation degree of the jet deposition process.
Further, the first atomization unit comprises a first leakage packet and a first blocking rod; the second atomization unit comprises a second leakage packet and a second blocking rod; the spatial positions of the first blocking rod and the second blocking rod are variable; when the first blocking rod blocks the opening at the bottom of the first filter bag, the first atomization unit stops spraying the atomized liquid; and when the second blocking rod blocks the opening at the bottom of the second filter bag, the second atomization unit stops spraying the atomized liquid.
Further, the device also comprises a gas connection and a controller; the gas connection and controller is fixedly connected with the first blocking rod and the second blocking rod, and the control unit changes the spatial positions of the first blocking rod and the second blocking rod by controlling the gas connection and controller, so that the starting and stopping of the first atomization unit and the second atomization unit are controlled.
Further, the control unit is specifically a PLC system; the PLC system is electrically connected with the gas connection and controller, and the gas connection and controller is controlled to further control the start and stop of the first atomization unit and the second atomization unit.
Further, the PLC system adjusts the pressure of atomizing gas through the gas connection and the controller according to the characteristics of different alloy melts.
Further, the first atomizing unit further comprises a first nozzle and a first atomizer, the first nozzle is arranged at the bottom opening of the first skip packet, and the first atomizer is arranged at the tail end of the first nozzle; the second atomization unit further comprises a second nozzle and a second atomizer, the second nozzle is arranged at the bottom opening of the second filter bag, and the second atomizer is arranged at the tail end of the second nozzle; the first atomizer and the second atomizer convert the melt into atomized droplets.
Further, the monitoring device also comprises a monitoring unit; the monitoring unit detects the first drain pocket, the second drain pocket, the first nozzle, the second nozzle and the deposition condition on the substrate of the deposition unit.
Further, the smelting unit comprises two sets of smelting devices, the two sets of smelting devices can be used for smelting different metal raw materials, and obtained melts are respectively transferred to the first atomizing unit and the second atomizing unit.
Further, the control unit controls the start-stop time of the first atomization unit and the second atomization unit according to the thickness of the gradient layer of the gradient material to be prepared.
Further, the deposition unit is provided with a lifting device which can control the vertical height of the substrate, and the substrate has a rotation function.
For a better understanding and practice, the invention is described in detail below with reference to the accompanying drawings.
Drawings
FIG. 1 is a schematic view showing the structure of a double atomization system continuous jet deposition apparatus in example 1 of the present invention;
FIG. 2 is a schematic diagram of the atomizing part of the continuous spray deposition device with a double atomizing system according to the present invention;
FIG. 3 is a schematic view showing the structure of a double atomization system continuous jet deposition apparatus in example 2 of the present invention;
FIG. 4 is a diagram of a high-silicon aluminum alloy ingot blank prepared by the continuous spray deposition device with double atomization systems according to the present invention;
FIG. 5 is an interface topography of the high silicon aluminum gradient material prepared by the dual atomization system continuous spray deposition apparatus of the present invention.
Detailed Description
The technical solution of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
Example 1
Referring to fig. 1, fig. 1 is a schematic structural diagram of a dual-atomization-system continuous spray deposition apparatus according to the present embodiment. The continuous jet deposition device with the double atomization systems comprises a smelting unit 10, an atomization platform 20, a first atomization unit 30, a second atomization unit 40, a gas connection and control device 50, a deposition unit 60, a monitoring unit 70, a dust removal unit 80 and a control unit 90 (not shown).
The whole device is arranged in an atomization cavity, a feed opening is formed in the top end of the atomization cavity, a smelting unit 10 is arranged below the feed opening, the smelting unit 10 is used for heating raw materials until the raw materials are melted to form a melt, and the melt can be kept warm to maintain the physical form of the melt. Smelt unit 10 below and be provided with atomizing platform 20, atomizing platform 20's horizontal width runs through whole atomizing cavity, is equipped with first atomizing unit 30 and second atomizing unit 40 on atomizing platform 20, first atomizing unit 30 is fixed on the inside lateral wall of atomizing cavity with second atomizing unit 40 to the geometric centre of relative atomizing cavity is the symmetric distribution. The first atomization unit 30 and the second atomization unit 40 are simultaneously connected with a gas connection and controller 50, and the gas connection and controller 50 can control the start and stop of the first atomization unit 30 and the second atomization unit 40. The deposition unit 60 is arranged below the atomization platform 20 and is used for receiving atomized liquid drops ejected from the first atomization unit 30 and the second atomization unit 40, a substrate is arranged at the top end of the deposition unit 60, and the atomized liquid drops can be bonded with each other to form an alloy ingot blank with a certain size in the deposition process on the substrate; the substrate of the deposition unit 60 has a rotation function and is attached with a lifting device so that the vertical height of the substrate can be changed. The monitoring unit 70 is disposed on a sidewall of the atomizing chamber, and is configured to monitor a missing packet, a loss condition of the nozzle, and a deposition condition on a substrate of the deposition unit 60, where information monitored by the monitoring unit 70 can be used as a basis for controlling starting and stopping of the atomizing unit. The dust removal unit 80 is arranged at the bottom end of the atomization cavity and used for removing impurities in the atomization cavity. The control unit 90 is specifically a PLC (programmable logic controller) system, the gas connection and controller 50 is electrically connected to the PLC system, and the PLC system can control the gas connection and controller 50 to further control the operating states of the two atomizing units, thereby controlling the switching of the two atomizing units and adjusting the pressure of the atomizing gas according to the characteristics of different alloy melts.
The smelting unit 10, the first atomizing unit 30, the second atomizing unit 40, the gas connection and control device 50 and the deposition unit 60 are all in a fully-closed environment, meanwhile, the double-atomizing system continuous jet deposition device is also provided with a vacuum system and a gas protection system, and when the double-atomizing system continuous jet deposition device is used, a cavity is vacuumized firstly and then protective gas is filled in.
Referring to fig. 2, fig. 2 is a schematic structural diagram of an atomizing part of a dual-atomizing-system continuous-jet deposition apparatus according to the present invention. Fig. 2 shows the detailed structure of the first atomizing unit 30 and the second atomizing unit 40, the first atomizing unit 30 and the second atomizing unit 40 have the same specific composition and are symmetrically distributed with the substrate of the deposition unit 60 as the center, and the structure of the first atomizing unit 30 is described as an example below.
The first atomizing unit 30 includes a first tundish 31, a first stopper 32, a first nozzle 33, and a first atomizer 34. The first drain ladle 31 is arranged below the smelting unit 10, a cover is not arranged above the first drain ladle, the bottom of the first drain ladle is funnel-shaped, and melt smelted by the smelting unit 10 can be transferred into the first drain ladle 31 through an opening above the first drain ladle. The first blocking rod 32 is divided into two sections, one section is horizontal, the other section is vertical, the horizontal blocking rod is perpendicular to the vertical blocking rod, the horizontal blocking rod is arranged on the inner side wall of the atomization cavity and perpendicular to the side wall direction, extends to the inside of the first leaky bag 31 and is fixedly connected with the vertical blocking rod, the lower portion of the vertical blocking rod extends to the lower opening of the first leaky bag 31, and the gas connection and controller 50 controls the opening and closing of the lower opening of the first leaky bag 31 through controlling the movement of the vertical blocking rod, so that the starting and stopping of the first atomization unit 30 are controlled. The first nozzle 33 is disposed at the lower opening of the first nozzle pack 31, is in the form of a segment of a broken line, and is directed toward the bottom of the deposition unit 60 for guiding the melt onto the bottom. The first atomizer 34 is arranged at the tail end of the first nozzle 33, the shape of an atomizing cone is controlled by a high-frequency swing mechanism through a jet orifice of the first atomizer 34, the swing frequency of the first atomizer is controlled by the PLC system, the melt can be converted into atomized liquid drops through the jet orifice of the first atomizer 34, the liquid drops fly under the action of high-pressure gas and are gradually cooled and solidified, and semi-solid slurry which is not completely solidified is continuously deposited and cooled on the substrate of the deposition unit 60 to form an alloy ingot blank.
The second atomizing unit 40 includes a second leakage packet 41, a second blocking rod 42, a second nozzle 43, and a second atomizer 44. All the components and the dimensions of the second atomization unit 40 are the same as those of the first atomization unit 30, and are symmetrically distributed with the first atomization unit 30 by taking the substrate of the deposition unit 60 as the center, which is not described herein again.
The dual atomization system continuous spray deposition apparatus of this embodiment operates as follows:
s1, before use, placing the metal raw material into the smelting unit 10 through a feed opening in advance, pumping the whole atomization cavity to vacuum, and then filling protective gas, wherein the protective gas can be high-purity nitrogen;
s2, after the cavity to be atomized is filled with protective gas, the raw materials are smelted at high temperature by using the smelting unit 10, after all the raw materials are converted into melt, the smelting unit 10 is converted into a heat preservation state from the smelting state, then the metal melt is transferred into the first leakage packet 31 and the second leakage packet 41 in the first atomizing unit 30 and the second atomizing unit 40, and at the moment, the lower openings of the corresponding leakage packets are tightly sealed by the first blocking rod 32 and the second blocking rod 42;
s3, controlling the first blocking rod 31 to be opened through a PLC system, simultaneously opening high-pressure gas through the gas connection and controller 50, adjusting the gas pressure of the atomizer to be 0.8-0.95 MPa, and atomizing the molten metal flowing through the nozzle into fine liquid drops through the atomizer;
s4, when the atomized liquid drops start to deposit on the substrate of the deposition unit 60 under the action of the high-pressure gas, controlling the substrate of the deposition unit 60 to rotate and the vertical height of the substrate to descend, and simultaneously starting the monitoring unit 70 and the dust removal unit 80, wherein semi-solid liquid drops are mutually bonded to gradually form an alloy ingot blank with a certain size due to the continuous deposition of the atomized liquid drops;
s5, controlling the first plugging rod 32 and the second plugging rod 42 by adopting a PLC system according to the loss condition of the leaky bag, the nozzle and the like monitored by the monitoring unit 70 and the deposition condition on the deposition unit 60, specifically, enabling the first plugging rod 32 to recover the state of blocking the lower end opening of the first leaky bag 31, and enabling the second plugging rod 42 to be in an open state, namely, replacing the first atomizing unit 30 with the second atomizing unit 40 to continue to perform spray deposition, and repeating the process from S3 to S5;
s6, the above steps can be continuously replaced between the first atomizing unit 30 and the second atomizing unit 40 according to specific needs, so as to realize continuous and stable atomization and deposition process, thereby obtaining the required spray-deposited metal ingot.
In the above description of the operation process, the first atomizing unit 30 is used to perform the spray deposition, and in practical use, the order of using the first atomizing unit 30 and the second atomizing unit 40 may be replaced with each other.
Referring to FIG. 4, FIG. 4 shows a physical state of the Al-50% Si alloy prepared in this example. In this preparation example, in step S2, the melting temperature is 1300 to 1400 ℃, the holding temperature is 1150 to 1200 ℃, and the nozzle diameter is set to 3.5 mm.
Example 2
Referring to fig. 3, fig. 3 is a schematic structural diagram of a dual-atomization-system continuous jet deposition apparatus according to the present embodiment. In the present embodiment, atomization and deposition of two different component alloys are achieved by adding a melting system, that is, the melting unit 10 includes two melting devices, which correspond to the first atomization unit 30 and the second atomization unit 40, respectively. Each atomizing unit corresponds to one smelting device respectively, and the atomizing unit can be used for preparing gradient materials, and the thickness of a gradient layer can be controlled by adjusting the atomizing time of the two atomizing units according to actual requirements.
Except for the above features, other technical features of this embodiment are the same as those of embodiment 1, and are not described herein again.
The dual atomization system continuous spray deposition apparatus of this embodiment operates as follows:
s1, before use, placing two different metal raw materials in two smelting devices of the smelting unit 10 through a feed opening in advance, pumping the whole atomization cavity to vacuum, and then filling protective gas, wherein the protective gas can be high-purity nitrogen;
s2, after the cavity to be atomized is filled with protective gas, two different raw materials are respectively subjected to high-temperature smelting by using two smelting devices in the smelting unit 10, the smelting unit 10 is converted into a heat preservation state from a smelting state after all the raw materials are converted into melt, then the metal melts in the two smelting devices are respectively transferred into a first leaky bag 31 and a second leaky bag 41 in the first atomizing unit 30 and the second atomizing unit 40, and at the moment, the lower openings of the corresponding leaky bags are tightly sealed by the first blocking rod 32 and the second blocking rod 42;
s3, controlling one of the first blocking rod 32 and the second blocking rod 42 to be opened through a PLC system according to actual use requirements and melt components in the leaky bags of the two atomizing units, simultaneously opening high-pressure gas through a gas connection and controller 50, adjusting the gas pressure of the atomizer to be 0.8-0.95 MPa, and atomizing the metal melt flowing through the nozzle into fine liquid drops by the atomizer;
s4, when the atomized liquid drops start to deposit on the substrate of the deposition unit 60 under the action of the high-pressure gas, controlling the substrate of the deposition unit 60 to rotate and the vertical height of the substrate to descend, and simultaneously starting the monitoring unit 70 and the dust removal unit 80, wherein semi-solid liquid drops are mutually bonded to gradually form an alloy ingot blank with a certain size due to the continuous deposition of the atomized liquid drops;
s5, controlling the first blocking rod 32 and the second blocking rod 42 by adopting a PLC system according to the thickness requirement of the gradient layer, the loss condition of the leakage packet, the nozzle and the like monitored by the monitoring unit 70 and the deposition condition on the deposition unit 60, specifically, enabling the opened blocking rod to restore and block the corresponding leakage packet, and enabling the other blocking rod to be in an opened state, namely replacing the other atomization unit to continue to perform spray deposition, wherein the process is repeated from S3 to S5;
and S6, continuously replacing the first atomizing unit 30 and the second atomizing unit 40 according to specific requirements by the steps, realizing continuous and stable atomization and deposition processes, and controlling the thickness of the gradient layer by adjusting the atomization time of the two sets of atomizing systems so as to obtain the required ingot blank of the high-silicon aluminum alloy gradient material for spray deposition.
Referring to FIG. 5, FIG. 5 shows the macro-morphology of the Al-27% Si/Al-50% Si gradient material prepared in this example. In the preparation example, the melting temperature of a melting device corresponding to Al-50% Si is 1300-1400 ℃, the heat preservation temperature is 1150-1200 ℃, and the diameter of a nozzle is set to be 3.5 mm; the melting temperature of a melting device corresponding to the Al-27% Si is 1000-1200 ℃, the heat preservation temperature is 900-950 ℃, and the diameter of a nozzle is set to be 3.0 mm.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention.
Claims (10)
1. The utility model provides a two atomizing system continuous type spray deposition device which characterized in that: the device comprises a smelting unit, a first atomizing unit, a second atomizing unit, a deposition unit and a control unit; the first atomizing unit and the second atomizing unit are respectively connected with the smelting unit, the smelting unit heats the raw materials to be molten to form a melt, and the first atomizing unit and the second atomizing unit receive the melt formed by the smelting unit; the deposition unit is provided with a substrate, and atomized liquid drops sprayed by the first atomization unit and the second atomization unit are deposited on the substrate of the deposition unit; the control unit controls the start and stop of the first atomization unit and the second atomization unit and controls the first atomization unit and the second atomization unit to alternately spray atomized liquid.
2. The dual atomization system continuous jet deposition apparatus of claim 1, wherein: the first atomization unit comprises a first leakage packet and a first blocking rod; the second atomization unit comprises a second leakage packet and a second blocking rod; the spatial positions of the first blocking rod and the second blocking rod are variable; when the first blocking rod blocks the opening at the bottom of the first filter bag, the first atomization unit stops spraying the atomized liquid; and when the second blocking rod blocks the opening at the bottom of the second filter bag, the second atomization unit stops spraying the atomized liquid.
3. The dual atomization system continuous jet deposition apparatus of claim 2, wherein: also comprises a gas connection and a controller; the gas connection and controller is fixedly connected with the first blocking rod and the second blocking rod, and the control unit changes the spatial positions of the first blocking rod and the second blocking rod by controlling the gas connection and controller, so that the starting and stopping of the first atomization unit and the second atomization unit are controlled.
4. The dual atomization system continuous jet deposition apparatus of claim 3, wherein: the control unit is specifically a PLC system; the PLC system is electrically connected with the gas connection and controller, and the gas connection and controller is controlled to further control the start and stop of the first atomization unit and the second atomization unit.
5. The dual atomization system continuous jet deposition apparatus of claim 4, wherein: and the PLC system adjusts the pressure of atomizing gas through the gas connection and controller according to the characteristics of different alloy melts.
6. The dual atomization system continuous jet deposition apparatus of claim 2, wherein: the first atomizing unit further comprises a first nozzle and a first atomizer, the first nozzle is arranged at the bottom opening of the first skip ladle, and the first atomizer is arranged at the tail end of the first nozzle; the second atomization unit further comprises a second nozzle and a second atomizer, the second nozzle is arranged at the bottom opening of the second filter bag, and the second atomizer is arranged at the tail end of the second nozzle; the first atomizer and the second atomizer convert the melt into atomized droplets.
7. The dual atomization system continuous jet deposition apparatus of claim 6, wherein: the monitoring device also comprises a monitoring unit; the monitoring unit detects the first drain pocket, the second drain pocket, the first nozzle, the second nozzle and the deposition condition on the substrate of the deposition unit.
8. The dual atomization system continuous jet deposition apparatus of any one of claims 1 to 7, wherein: the smelting unit comprises two sets of smelting devices, the two sets of smelting devices can smelt different metal raw materials and respectively transfer the obtained fusants to the first atomizing unit and the second atomizing unit.
9. The dual atomization system continuous jet deposition apparatus of claim 8, wherein: the control unit controls the start-stop time of the first atomization unit and the second atomization unit according to the thickness of the gradient layer of the gradient material to be prepared.
10. The dual atomization system continuous jet deposition apparatus of any one of claims 1 to 7, wherein: the deposition unit is provided with a lifting device which can control the vertical height of the substrate, and the substrate has a rotating function.
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| CN102151828A (en) * | 2011-03-18 | 2011-08-17 | 西南交通大学 | Method for preparing gradient materials through multi-crucible and multi-nozzle spray forming |
| CN105170980A (en) * | 2015-10-20 | 2015-12-23 | 江苏豪然喷射成形合金有限公司 | Method for establishing inclined twin-jet-nozzle scanning spray forming technological parameters |
| US20190108941A1 (en) * | 2017-10-11 | 2019-04-11 | Ford Global Technologies, Llc | Method for three-dimensional printing of magnetic materials |
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2020
- 2020-12-24 CN CN202011552894.7A patent/CN112708845A/en active Pending
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| JPH07195168A (en) * | 1992-10-19 | 1995-08-01 | Wieland Werke Ag | Production of rotation symmetry semiprocessed products wherein property changes over cross section and its rotation symmetry base stock |
| CN1144276A (en) * | 1995-08-25 | 1997-03-05 | 中国科学院金属研究所 | Method for preparing alloy by double-fluid double-spray codeposition |
| CN102151828A (en) * | 2011-03-18 | 2011-08-17 | 西南交通大学 | Method for preparing gradient materials through multi-crucible and multi-nozzle spray forming |
| CN102145387A (en) * | 2011-03-24 | 2011-08-10 | 江苏豪然喷射成形合金有限公司 | Double-nozzle-scanning inclined spray type cylinder blank injection moulding device |
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| US20190108941A1 (en) * | 2017-10-11 | 2019-04-11 | Ford Global Technologies, Llc | Method for three-dimensional printing of magnetic materials |
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