CN112706087A - Polishing disk for rapidly polishing surface of flaky diamond crystal and polishing method thereof - Google Patents
Polishing disk for rapidly polishing surface of flaky diamond crystal and polishing method thereof Download PDFInfo
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- CN112706087A CN112706087A CN202011554968.0A CN202011554968A CN112706087A CN 112706087 A CN112706087 A CN 112706087A CN 202011554968 A CN202011554968 A CN 202011554968A CN 112706087 A CN112706087 A CN 112706087A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/006—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the speed
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
- B24B49/165—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load for grinding tyres
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/007—Cleaning of grinding wheels
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
- B24D13/02—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by their periphery
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
- B24D13/20—Mountings for the wheels
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
A polishing disk for rapidly polishing the surface of diamond flaky crystals and a polishing method thereof are disclosed, wherein the polishing disk comprises a grinding body manufactured by the following method: mixing the diamond micro powder and the synthetic resin according to a proportion, adding an adhesive, shaping and drying; dividing the grinding body into a coarse polishing disk, a medium polishing disk and a fine polishing disk according to the granularity of the diamond micro powder; the polishing method comprises the steps of polishing the surface of the diamond crystal by using a rough polishing disk, a medium polishing disk and a fine polishing disk in sequence, flushing by water flow in the polishing process and cooling. The diamond micro powder with various particle size grades is used, the polishing efficiency can be obviously improved, the elasticity is also increased through materials such as synthetic resin, the damage such as crystal fracture and the like caused by the unevenness of the surface of the diamond crystal can not be caused in the polishing process, the generated abrasion-removing dust is taken away through water flow in the polishing process, the surface of the crystal can be cooled, and the quality of the crystal can be effectively protected.
Description
Technical Field
The invention relates to a polishing disk for rapidly polishing the surfaces of a flaky diamond monocrystal crystal and a flaky diamond polycrystal crystal, which aims to improve the efficiency of polishing the surfaces of the flaky crystal of the monocrystal diamond and the flaky crystal of the polycrystal diamond; belongs to the technical field of diamond crystal surface polishing.
Background
In the 21 st century, the diamond crystal has attracted attention worldwide due to its excellent physicochemical properties, and the single crystal diamond plate crystal and the polycrystalline diamond plate crystal have a wide application prospect and a wide research and development direction in the fields of semiconductor devices, optical windows, electronic devices, heat-conducting substrates, and the like.
To make full use of the diamond material, it is important to polish the diamond material to achieve the required surface roughness. Many methods have been used for polishing diamond, such as mechanical polishing, chemical mechanical polishing, thermal chemical polishing, dynamic friction polishing, etc. In addition, there are some methods involving energy polishing, such as laser polishing, ion beam polishing, spark polishing, and the like. The diamond polishing removal mechanism in the prior art can be divided into the following mechanisms: 1. micro-crushing; 2. graphitizing; 3. oxidizing; 4. evaporating; 5. sputtering, and one polishing method often involves multiple removal mechanisms.
Although there are many polishing methods for diamond, the industrialized polishing technology is not perfect for some high-end applications, such as grinding and polishing of semiconductor diamond materials. The polishing technology applied to the semiconductor diamond material not only requires a flat surface and nano-scale roughness, but also needs to reduce and avoid surface and sub-surface damages to the greatest extent, and the traditional polishing method has a plurality of problems at present.
Among them, mechanical polishing is commonly used for polishing granular diamond, and although nano-scale surface roughness can be achieved, the mechanical polishing causes great damage to the diamond surface and subsurface. The chemical mechanical polishing has high processing precision but low efficiency, and can also generate a large amount of waste liquid, pollute the environment and increase the polishing cost. Dynamic friction polishing has a high material removal rate, but only rough machining of diamond can be achieved, and its large polishing pressure may cause cracking of the diamond film. Non-contact polishing by laser, ion beam and the like has advantages in processing thin films and curved surfaces, but the processing method is not mature in technology and has limited processing range. Plasma etching is effective in removing surface and subsurface damage caused by polishing, but is extremely inefficient as a means of polishing. Spark polishing must be premised on diamond conductivity, and is only suitable for rough machining.
The existing single crystal diamond crystal polishing equipment adopts a cast iron polishing disk, utilizes a mechanical polishing method and a catalytic electrochemical method generated by friction between diamond crystals and the surface of the cast iron disk, has low removal rate and serious heating, influences the polishing efficiency of the single crystal diamond crystals, and simultaneously causes damages such as breakage and the like of diamond flaky crystals due to high hardness of the cast iron disk. In addition, because the thickness of the polycrystalline diamond flaky crystal is thin, the polishing efficiency of the existing equipment is low when the surface of the polycrystalline diamond flaky crystal is polished, and the damage such as crystal fracture is easily caused.
In summary, diamond has, on the one hand, a very high hardness and an excellent chemical stability, which are quite difficult to process. On the other hand, the existing methods cannot solve the polishing problem of diamond, and there is no polishing method for large-size single crystal diamond.
Disclosure of Invention
Aiming at the problems of the existing polishing technology of the flaky diamond monocrystal crystal and the flaky diamond polycrystal crystal, the invention provides the polishing disk for quickly polishing the surface of the flaky diamond crystal, which has the advantages of high polishing efficiency and high efficiency, can ensure that the polishing effect reaches the surface roughness controlled at the nanometer level, and also provides the polishing method of the polishing disk.
The invention relates to a polishing disk for rapidly polishing the surfaces of flaky diamond monocrystal crystals and flaky diamond polycrystal crystals, which adopts the following technical scheme:
the polishing disk comprises a grinding body and a substrate, wherein the grinding body is compounded on the substrate;
the grinding body is manufactured by the following method: mixing diamond micropowder and synthetic resin according to the proportion of 1: (100-1000) mixing into a micro powder resin solution, wherein the granularity of diamond micro powder is 0.5-36 microns, adding an adhesive into the micro powder resin solution to prepare a mixed solution, and the volume ratio of the micro powder resin solution to the adhesive is 100: 1, placing the mixed solution into a mould, and drying after shaping.
The grinding body is divided into a coarse grinding body, a medium grinding body and a fine grinding body according to the granularity of the adopted diamond micro powder; the granularity of the diamond micro powder in the coarse grinding body is 22-36 microns; the granularity of the diamond micro powder in the medium grinding body is 12-22 microns; the granularity of the diamond micro powder in the fine grinding body is 0.5-12 microns.
The polishing disk using the coarse grinding body is a coarse polishing disk, the polishing disk using the medium grinding body is a medium polishing disk, and the polishing disk using the fine grinding body is a fine polishing disk.
The outer diameter of the grinding body is 350mm, the inner diameter is 150mm, and the thickness is 30 mm.
The substrate is a stainless steel disc. The outer diameter of the substrate is 350mm, the inner diameter is 150mm, and the thickness is 10 mm.
The polishing method of the polishing disk comprises the following steps:
(1) rough polishing:
firstly, correcting the surface of the diamond crystal by using a rough polishing disk, wherein the rotating speed of the polishing disk is 1000-2000 r/min, and the polishing load is 2000 g-5000 g, so that the surface roughness of the diamond crystal is less than 10 microns. And simultaneously flushing the polishing disk by using water flow in the polishing process.
The flow rate of the flushing water flow is 10-50 ml/min.
(2) Polishing of medium
And then, carrying out secondary polishing on the surface of the diamond crystal by using a medium polishing disk, wherein the rotating speed of the polishing disk is 2000-3000 r/min, and the polishing load is 1000-2000 g, so that the surface roughness of the diamond crystal is less than 1 micron. And simultaneously flushing the polishing disk by using water flow in the polishing process.
The flow rate of the flushing water flow is 50-100 ml/min.
(3) Polishing of fine material
And finally, polishing the surface of the diamond crystal for the third time by using a fine polishing disk, wherein the rotating speed of the polishing disk is 3000-5000 r/min, and the polishing load is 1-1000 g, so that the surface roughness of the diamond crystal is less than 10 nanometers. And simultaneously flushing the polishing disk by using water flow in the polishing process.
The flow rate of the flushing water flow is more than 100 ml/min.
The polishing disc is made of several kinds of diamond micropowder with different granularities, synthetic resin and adhesive in certain proportion, and during polishing, water flow is added to cool the diamond crystal and the polishing disc while the dust particles produced during polishing are taken away. The polishing effect is achieved by utilizing the hardness of the diamond micro powder and the elastic effect of the resin to polish the surface of the diamond crystal, and the damage such as polycrystalline diamond crystal fracture and the like caused by too high hardness of the polishing disk can be avoided, so that the polishing efficiency of the diamond crystal is greatly improved, and the quality of the diamond crystal is ensured.
Compared with the structure of the existing polishing disk, the polishing disk has the following beneficial effects:
according to the invention, the polishing discs made of diamond micro powder with different granularity levels are used for multi-step polishing, the rotating speed of the polishing discs is reasonably controlled, the polishing efficiency can be obviously improved, the diamond crystals and the polishing discs are protected, the polishing discs made of materials such as synthetic resin are added, the elasticity of the polishing discs is also increased, and the damage such as crystal fracture and the like caused by the unevenness of the surfaces of the diamond crystals can be avoided as much as possible in the polishing process. The generated abrasion-removing dust is taken away through water flow in the polishing process, the surface of the crystal can be cooled, and the quality of the crystal is effectively protected.
Drawings
FIG. 1 is a schematic view of the structure of the polishing pad of the present invention.
In the figure: 1. grinding body, 2, substrate.
Detailed Description
Firstly, three polishing disks, namely a coarse polishing disk, a medium polishing disk and a fine polishing disk, are manufactured by diamond micro powder with different particle sizes, as shown in fig. 1, each polishing disk comprises a grinding body 1 and a substrate 2, the grinding body 1 is arranged on the substrate 2 in a compounding way, and the substrate 2 is a stainless steel disk. The outer diameter A of the grinding body 1 is 350mm, the inner diameter B is 150mm, and the thickness H is 30 mm. The substrate 2 likewise has an outer diameter of 350mm, an inner diameter of 150mm and a thickness h of 10 mm. The three polishing disks only have the diamond micro powder with different particle sizes in the grinding body 1 of 0.5-36 microns.
1. Preparation of coarse polishing disks
Manufacturing a grinding body: mixing diamond micro powder with the granularity of 22-36 micrometers and synthetic resin according to the weight ratio of 1: uniformly mixing the materials in a mass ratio of 100-1000 to obtain micro powder resin liquid, and adding an adhesive into the micro powder resin liquid to prepare a mixed liquid, wherein the volume ratio of the micro powder resin liquid to the adhesive is 100: and 1, pouring the mixed solution into a mold for shaping for 24 hours, and drying to obtain the grinding body. Any of the synthetic resins and adhesives known in the art can be used.
And fixing the manufactured grinding body on a substrate, treating the flatness of the surface of the polishing disc by using a fine grinding wheel, and keeping the integral thickness difference of the polishing disc below 1 mm to obtain the coarse polishing disc.
2. Preparation of Medium polishing disk
Different from the rough polishing disk, the grinding body of the medium polishing disk adopts diamond micro powder with the grain size of 12-22 microns.
And fixing the manufactured grinding body on a substrate, treating the flatness of the surface of the polishing disk by using a fine grinding wheel, and keeping the integral thickness difference of the polishing disk below 1 mm to obtain the medium-quality polishing disk.
3. Preparation of fine polishing disk
Different from the rough polishing disk, the grinding body of the fine polishing disk adopts diamond micro powder with the granularity of 0.5-12 microns.
And fixing the manufactured grinding body on a substrate, treating the flatness of the surface of the polishing disk by using a fine grinding wheel, and keeping the integral thickness difference of the polishing disk below 1 mm to obtain the fine polishing disk.
After preparing a coarse polishing disk, a medium polishing disk and a fine polishing disk, the surface of the diamond flaky crystal is polished according to the following process. Because the polishing process has faster rotating speed and larger abrasion removal amount, a part of dust can be generated, the method for washing the polishing disk by water flow can wash away the abrasion removal dust on the polishing disk along with the water flow, and can also cool the polishing disk and the diamond crystal, wherein the flow speed of the water flow is set according to the rotating speed of the polishing disk, and the process can avoid the damage to equipment or the diamond crystal caused by overhigh temperature in the polishing process.
(1) Rough polishing
Firstly, quickly correcting the surface of the diamond crystal by using a rough polishing disk, controlling the rotating speed of the polishing disk to be between 1000 and 2000 revolutions per minute, and controlling the polishing load to be 2000g to 5000g, wherein the rough polishing disk is used for quickly polishing the defects or unevenness on the surface of the diamond crystal to ensure that the surface roughness of the whole diamond crystal is less than 10 microns; meanwhile, the polishing disc is flushed by water flow with the flow rate of 10-50 ml/min on the upper portion of the polishing disc, the diamond crystal and the polishing disc are protected, and high heat generated in the polishing process and dust generated in the polishing process can be taken away in the principle of adding the water flow. The actual speed of the water flow corresponds to the rotating speed of the polishing disc, and the higher the rotating speed of the polishing disc is, the higher the flow speed of the water flow is.
Because the used diamond micro powder has larger grain diameter, the surface of the diamond crystal can be quickly corrected, the defects or unevenness on the surface of the diamond crystal can be quickly ground flat, and conditions are established for subsequent processing.
(2) Polishing of medium
After the diamond crystal is roughly polished, the surface roughness is less than 10 microns. And (3) polishing the surface of the diamond crystal subjected to primary processing again by using a medium polishing disk, wherein the purpose is to polish the surface roughness of the diamond crystal to be less than 1 micron. The rotating speed of the polishing disc used in the polishing stage is controlled to be 2000-3000 rpm, the polishing load is controlled to be 1000-2000 g, and meanwhile, water flow with the flow speed of 50-100 ml/min is used for flushing the polishing disc in the polishing disc process, so that diamond crystals and the polishing disc are protected, and the principle is that high heat generated in the polishing process and dust generated in the polishing process can be taken away in a water flow adding mode. The actual speed of the water flow corresponds to the rotating speed of the polishing disc, and the higher the rotating speed of the polishing disc is, the higher the flow speed of the water flow is.
Because the used diamond micro powder has large grain diameter and can be used for quickly polishing the surface of the diamond crystal, the surface of the diamond crystal can be quickly polished to the surface roughness of less than 1 micron.
(3) Polishing of fine material
After the diamond crystal is subjected to secondary medium polishing, the surface roughness of the diamond crystal is less than 1 micron, and the processed diamond crystal is subjected to tertiary polishing on the surface of the diamond crystal by using a fine polishing disk, so that the surface roughness of the diamond crystal is polished to be less than 10 nanometers. The rotating speed of the polishing disc used in the polishing stage is controlled between 3000 rpm and 5000 rpm, the polishing load is controlled to be 1g to 1000g, and meanwhile, water flow with the flow rate larger than 100ml/min is used for flushing the polishing disc in the polishing disc process, so that diamond crystals and the polishing disc are protected, and high heat generated in the polishing process and dust generated in the polishing process can be taken away in a water flow adding mode. The actual speed of the water flow corresponds to the rotating speed of the polishing disc, and the higher the rotating speed of the polishing disc is, the higher the flow speed of the water flow is.
The diamond micro powder used in the stage has small grain size, so that the fine polishing disk is used for fine polishing of the surface of the diamond crystal and can polish the surface of the diamond crystal until the surface roughness is less than 10 nanometers.
Claims (9)
1. A polishing disk for rapidly polishing the surfaces of flaky diamond monocrystal crystals and flaky diamond polycrystal crystals is characterized by comprising a grinding body, wherein the grinding body is manufactured by the following method: mixing diamond micropowder and synthetic resin according to the proportion of 1: mixing the diamond micro powder into micro powder resin liquid in a mass ratio of 100-1000, wherein the granularity of the diamond micro powder is 0.5-36 microns, adding an adhesive into the micro powder resin liquid to prepare a mixed liquid, and the volume ratio of the micro powder resin liquid to the adhesive is 100: 1, placing the mixed solution into a mould, and drying after shaping.
2. The polishing disk for rapid surface polishing of single crystal crystals of sheet diamond and polycrystalline crystals of sheet diamond according to claim 1, wherein the abrasive body is divided into a coarse abrasive body, a medium abrasive body and a fine abrasive body according to the grain size of the diamond micropowder used; the granularity of the diamond micro powder in the coarse grinding body is 22-36 micrometers; the granularity of the diamond micro powder in the medium grinding body is 12-22 microns; the granularity of the diamond micro powder in the fine grinding body is 0.5-12 microns.
3. The polishing disk for rapid surface polishing of single crystal crystals of sheet diamond and polycrystalline crystals of sheet diamond according to claim 1, wherein the abrasive body has an outer diameter of 350mm, an inner diameter of 150mm and a thickness of 30 mm.
4. The polishing disk for rapid surface polishing of single crystal crystals of sheet diamond and polycrystalline crystals of sheet diamond according to claim 1, wherein the abrasive body is compounded on a substrate.
5. The polishing disk for rapid surface polishing of single crystal crystals of sheet diamond and polycrystalline crystals of sheet diamond according to claim 4, wherein the substrate has an outer diameter of 350mm, an inner diameter of 150mm and a thickness of 10 mm.
6. A method of polishing a polishing pad as recited in any one of claims 1 to 5, comprising the steps of:
(1) rough polishing:
firstly, correcting the surface of the diamond crystal by using a polishing disk of a rough grinding body, wherein the rotating speed of the polishing disk is 1000-2000 r/min, and the polishing load is 2000 g-5000 g, so that the surface roughness of the diamond crystal is less than 10 microns. And simultaneously flushing the polishing disk by using water flow in the polishing process.
(2) Polishing of medium
And then, polishing the surface of the diamond crystal for the second time by using a polishing disk of the medium-quality grinding body, wherein the rotating speed of the polishing disk is 2000-3000 r/min, and the polishing load is 1000-2000 g, so that the surface roughness of the diamond crystal is less than 1 micron. And simultaneously flushing the polishing disk by using water flow in the polishing process.
(3) Polishing of fine material
And finally, polishing the surface of the diamond crystal for the third time by using a polishing disk of a fine grinding body, wherein the rotating speed of the polishing disk is 3000-5000 r/min, and the polishing load is 1-1000 g, so that the surface roughness of the diamond crystal is less than 10 nanometers. And simultaneously flushing the polishing disk by using water flow in the polishing process.
7. The polishing method as set forth in claim 6, wherein the flow rate of the rinsing water flow in the rough polishing in the step (1) is 10 to 50 ml/min.
8. The polishing method as set forth in claim 6, wherein the flow rate of the rinsing water flow in the medium polishing in the step (2) is 50 to 100 ml/min.
9. The polishing method as set forth in claim 6, wherein the flow rate of the rinsing water stream in the fine polishing of the step (3) is more than 100 ml/min.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011554968.0A CN112706087A (en) | 2020-12-23 | 2020-12-23 | Polishing disk for rapidly polishing surface of flaky diamond crystal and polishing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011554968.0A CN112706087A (en) | 2020-12-23 | 2020-12-23 | Polishing disk for rapidly polishing surface of flaky diamond crystal and polishing method thereof |
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| CN208543356U (en) * | 2018-07-16 | 2019-02-26 | 济南中乌新材料有限公司 | A kind of large dimond single wafer surface chemical mechanical polishing apparatus |
| CN111805415A (en) * | 2020-07-16 | 2020-10-23 | 湖南圣高机械科技有限公司 | Porous resin grinding disc and preparation method thereof |
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2020
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|---|---|---|---|---|
| CN1569396A (en) * | 2003-07-16 | 2005-01-26 | 上海新华霞实业有限公司 | Grind process for optical sapphire crystal substrate |
| CN102120315A (en) * | 2010-12-01 | 2011-07-13 | 浙江浦江敏锐精密机械科技有限公司 | Polishing disk for polishing crystal glass |
| CN102172879A (en) * | 2011-02-23 | 2011-09-07 | 南京航空航天大学 | Method for processing soft and crisp LBO crystals based on consolidated abrasive polishing pad |
| US20140154961A1 (en) * | 2011-05-16 | 2014-06-05 | Ren S.R.L. | Multi-abrasive tool |
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| CN103252708A (en) * | 2013-05-29 | 2013-08-21 | 南京航空航天大学 | Sapphire substrate ultraprecision machining method based on fixed abrasive pad |
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Application publication date: 20210427 |