CN112701085A - Manufacturing method of flexible display and flexible display - Google Patents
Manufacturing method of flexible display and flexible display Download PDFInfo
- Publication number
- CN112701085A CN112701085A CN202011596032.4A CN202011596032A CN112701085A CN 112701085 A CN112701085 A CN 112701085A CN 202011596032 A CN202011596032 A CN 202011596032A CN 112701085 A CN112701085 A CN 112701085A
- Authority
- CN
- China
- Prior art keywords
- flexible
- substrate
- hard substrate
- display
- area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 38
- 239000000758 substrate Substances 0.000 claims abstract description 247
- 238000000034 method Methods 0.000 claims abstract description 15
- 230000001678 irradiating effect Effects 0.000 claims abstract description 6
- 239000000463 material Substances 0.000 claims description 63
- 239000010408 film Substances 0.000 claims description 39
- 239000010409 thin film Substances 0.000 claims description 13
- 230000004888 barrier function Effects 0.000 claims description 11
- 238000005538 encapsulation Methods 0.000 claims description 9
- 238000001179 sorption measurement Methods 0.000 claims description 8
- 238000004806 packaging method and process Methods 0.000 claims description 7
- 238000005507 spraying Methods 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000001291 vacuum drying Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 115
- 238000010586 diagram Methods 0.000 description 8
- 230000007547 defect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000000926 separation method Methods 0.000 description 4
- 239000011261 inert gas Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910004205 SiNX Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000052 poly(p-xylylene) Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1262—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention discloses a manufacturing method of a flexible display and the flexible display, the manufacturing method of the flexible display comprises the steps of forming a release layer in the middle area of a hard substrate, forming a flexible substrate on the release layer and the hard substrate, irradiating a non-display area by laser in the process of peeling the flexible substrate from the hard substrate so as to peel the non-display area from the edge area, and then peeling the display area from the middle area of the hard substrate by mechanical force. According to the technical scheme, the non-display area of the flexible substrate is irradiated by laser to separate the flexible substrate from the hard substrate, and due to the existence of the release layer, the display area of the flexible substrate can be separated from the hard substrate by mechanical force, so that the damage of the display area of the flexible substrate is avoided, and the yield of the manufactured flexible display is improved.
Description
Technical Field
The invention relates to the technical field of display screens, in particular to a flexible display and a manufacturing method thereof.
Background
In recent years, Flexible Display (Flexible Display) and Foldable Display (Foldable Display) technologies are rapidly developed, are key points of concern in colleges and universities and research at home and abroad, and are key technologies for related enterprises in disputed layout.
The flexible display comprises a flexible substrate, a Thin Film Transistor (TFT) array, a display device and a packaging layer, wherein the flexible substrate is used as a bearing substrate, and the flexibility of the flexible display can be realized only when the TFT array, the display device and the packaging layer have bending capability.
At present, a flexible display is mainly prepared by taking a hard substrate as a carrier, the flexible display is prepared by firstly attaching the flexible substrate to the hard substrate, and after the flexible display is prepared, the hard substrate is peeled off, and the flexible display is taken out, so that the method does not influence the manufacturing precision of the flexible display, and the manufacturing equipment and the manufacturing process are similar to those of the conventional TFT-LCD display, and the large adjustment is not needed, so that the flexible display can be used for mass production in a short time; the process for peeling the flexible display from the hard substrate comprises the following steps: the laser is directly acted on the interface of the flexible substrate and the hard substrate, the bonding force between the flexible substrate and the hard substrate is damaged through the high-energy laser, so that the flexible substrate and the hard substrate are separated, but dirt existing on the hard substrate or the flexible substrate can absorb the laser energy, so that the laser energy at the position of the flexible substrate with the dirt is weakened or disappeared, the flexible substrate and the hard substrate at the position are difficult to peel, the flexible substrate is damaged finally, and the yield of the flexible display is reduced.
Disclosure of Invention
The invention mainly aims to provide a manufacturing method of a flexible display, and aims to solve the technical problem of low yield of the flexible display.
In order to achieve the above object, the present invention provides a method for manufacturing a flexible display, comprising the steps of:
forming a release layer in a middle area of a hard substrate, wherein the hard substrate comprises a middle area and an edge area surrounding the middle area;
forming a flexible substrate on the release layer and the hard substrate, wherein the flexible substrate comprises a display area and a non-display area surrounding the display area, the display area is formed on the release layer, and the non-display area is bonded with the edge area of the hard substrate;
in the process of peeling the flexible substrate from the hard substrate, the non-display area is irradiated with laser to peel the non-display area from the edge area, and then the display area is peeled from the central area of the hard substrate using mechanical force.
Optionally, the step of forming a release layer in the middle region of the hard substrate includes:
spraying and curing a release material solution on the hard substrate to form a release material solution film layer, wherein the release layer is formed by a plurality of release material solution film layers;
and removing the release layer on the edge area to form the release layer on the middle area.
Optionally, the step of removing the release layer on the edge region includes:
and removing the release layer on the edge region by using high-energy plasma bombardment.
Optionally, the step of forming a flexible substrate on the release layer and the hard substrate includes:
coating a solution made of a flexible material on the release layer and the edge area of the hard substrate to form a flexible material solution film layer;
and curing the flexible material solution film layer to form the flexible substrate.
Optionally, the step of curing the flexible material solution film layer comprises:
carrying out vacuum drying treatment on the flexible material solution film layer;
and heating the flexible material solution film layer by using an infrared furnace to solidify the flexible material solution film layer.
Optionally, the step of irradiating the non-display area with laser light includes:
arranging a shading plate on one side of the hard substrate, which is far away from the flexible substrate, so that the shading plate can shade the middle area of the hard substrate;
and irradiating the hard substrate with laser light so that the laser light passes through the hard substrate and is irradiated to the non-display area.
Optionally, the step of peeling the display region from the middle region of the hard substrate by using a mechanical force includes:
adsorbing the flexible substrate by using a first adsorption device;
adsorbing the hard substrate by using a second adsorption device;
moving the hard substrate through the second adsorption device, so that one side edge of the hard substrate moves towards a direction far away from the flexible substrate, and waiting for a preset time after the hard substrate and the flexible substrate form a preset angle;
repeating the steps until the display area is stripped from the middle area of the hard substrate.
Optionally, after the step of forming the flexible substrate on the release layer and the hard substrate and before peeling the flexible substrate from the hard substrate, the method further includes the following steps:
forming a barrier layer on the flexible substrate;
forming a thin film transistor array on the barrier layer;
forming a display device on the thin film transistor array;
forming an encapsulation layer on the display device;
and forming a polarizer on the packaging layer.
Optionally, after the step of forming a polarizer on the encapsulation layer, the method further includes the following steps:
forming a binding region in a non-display region of the flexible substrate;
and pressing the driving chip in the binding area.
The invention also provides a flexible display which is manufactured and formed based on the manufacturing method of the flexible display in any technical scheme.
According to the technical scheme, the non-display area of the flexible substrate is irradiated by laser through the hard substrate, the bonding force between the flexible substrate and the hard substrate is damaged by laser energy, the flexible substrate and the hard substrate are separated by laser irradiation, and even if a small amount of dirt exists, the dirt absorbs the laser energy, the flexible substrate is not separated from the hard substrate, so that the flexible substrate has a small defect, but the defect is located in the non-display area of the flexible substrate, so that the display effect of the flexible substrate is not influenced; on the other hand, after the flexible substrate and the hard substrate are separated by the laser, only the release layer is connected with the hard substrate, and at the moment, the display area of the flexible substrate is separated from the hard substrate by mechanical force, so that the display area of the flexible substrate is not damaged, the display effect of the flexible display is not influenced, the flexible substrate and the hard substrate can be completely peeled off, and the yield of manufacturing the flexible display is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a first manufacturing state diagram of a flexible display according to an embodiment of the present invention;
FIG. 2 is a second manufacturing state diagram of a flexible display according to an embodiment of the present invention;
FIG. 3 is a third manufacturing state diagram of a flexible display according to an embodiment of the present invention;
FIG. 4 is a fourth manufacturing state diagram of a flexible display according to one embodiment of the present invention;
FIG. 5 is a fifth manufacturing state diagram of a flexible display according to an embodiment of the present invention;
FIG. 6 is a sixth manufacturing state diagram of a flexible display according to an embodiment of the present invention;
FIG. 7 is a seventh manufacturing state diagram of a flexible display according to an embodiment of the present invention;
FIG. 8 is a manufacturing state diagram eight of the flexible display according to the embodiment of the present invention;
FIG. 9 is a flow chart of a method for manufacturing a flexible display according to an embodiment of the present invention;
fig. 10 is a flowchart of step S1 in fig. 9;
fig. 11 is a flowchart of step S2 in fig. 9;
fig. 12 is a flowchart of the mechanical separation in step S3 in fig. 9.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 1 | |
2 | |
| 3 | |
31 | |
| 32 | |
33 | |
| 34 | |
35 | |
| 36 | Thin |
37 | Display device with a light- |
| 38 | |
39 | Polaroid |
| 4 | |
5 | Second adsorption device |
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
The invention provides a flexible display.
In the embodiment of the present invention, as shown in fig. 3 and 4, the flexible display includes a release layer 31, a flexible substrate 32, a barrier layer 33, a thin film transistor array 36, a display device 37, a packaging layer 38, a polarizer 39, a bonding region 34, and a driving chip 35, the flexible substrate 32, the barrier layer 33, the thin film transistor array 36, the display device 37, the packaging layer 38, and the polarizer 39 are sequentially stacked, the release layer 31 is embedded in a side of the flexible substrate 32 facing away from the display device 37, the flexible substrate 32 includes a display region and a non-display region disposed around the display region, the release layer 31, the thin film transistor array 36, the display device 37, the packaging layer 38, and the polarizer 39 are disposed facing the display region, the bonding region 34 is disposed in the non-display region of the flexible substrate 32, and the driving chip 35 is connected to the bonding region.
The release layer 31 of the technical scheme of the invention can play a role in separating the hard substrate 1 from the flexible substrate 32, the flexible substrate 32 is used as a carrier substrate of each device (such as the thin film transistor array 36, the display device 37, the polarizer 39, and the like), and the thin film transistor array 36, the display device 37, the encapsulation layer 38, and the like have a certain bending radius, so that each device can be arranged on the flexible substrate 32 to manufacture the flexible display 3.
In one embodiment, the display device 37 is an OLED device, the barrier layer 33 is used for blocking moisture and oxygen, the binding region 34 is a conductive particle layer to connect the binding region 34 with the driving chip 35, and the encapsulation layer 38 has a function of encapsulating the OLED device.
The invention also provides a method for manufacturing the flexible display 3, wherein the method for manufacturing the flexible display 3 comprises the following steps:
s1: a release layer 31 is formed in a central region of the hard substrate 1, wherein the hard substrate 1 includes a central region and an edge region surrounding the central region, as shown in fig. 2 and 9.
Because the flexible display 3 is flexible and can be curled, a carrier is required to be supported during manufacturing, the hard substrate 1 can be used as a carrier for forming the flexible display 3, and the release layer 31 is formed in the middle area of the hard substrate 1, so that the flexible display can be conveniently separated from the hard substrate 1.
As an alternative embodiment, the hard substrate 1 is a glass substrate.
S2: a flexible substrate 32 is formed on the release layer 31 and the rigid substrate 1, wherein the flexible substrate 32 includes a display area and a non-display area surrounding the display area, the display area is formed on the release layer 31, the non-display area is adhered to an edge area of the rigid substrate 1, specifically, as shown in fig. 3 and 9, the release layer 31 in fig. 3 is located between the rigid substrate 1 and the flexible substrate 32.
Form flexible substrate 32 on leaving type layer 31 and rigid substrate 1 to make flexible substrate 32 cover completely and leave type layer 31, and make the area of flexible substrate 32 be greater than from type layer 31, from this, can make flexible substrate 32 be connected with leaving type layer 31 and rigid substrate 1 simultaneously, make things convenient for follow-up formation other basic units and separation flexible substrate 32 and rigid substrate 1 at the display area of flexible substrate 32.
S3: in the process of peeling the flexible substrate 32 from the hard substrate 1, the non-display region is irradiated with laser light to peel the non-display region from the edge region, and then the display region is peeled from the central region of the hard substrate 1 by mechanical force, as shown in fig. 9.
Through the hard substrate 1, the non-display area of the flexible substrate is irradiated by laser, the bonding force between the flexible substrate 32 and the hard substrate 1 is damaged by laser energy, the flexible substrate 32 and the hard substrate 1 are separated by laser irradiation, even if a small amount of dirt exists, the flexible substrate 32 is not separated from the hard substrate 1 after the dirt absorbs the laser energy, so that the flexible substrate 32 has a little defect, but the defect is positioned in the non-display area of the flexible substrate 32, so that the display effect of the flexible substrate 32 is not influenced; on the other hand, after the flexible substrate 32 and the hard substrate 1 are separated by the laser, only the release layer 31 is connected with the hard substrate 1, and at this time, the display area of the flexible substrate 32 is separated from the hard substrate 1 by mechanical force, so that the display area of the flexible substrate 32 is not damaged, the display effect of the flexible display 3 is not affected, and therefore the flexible substrate 32 and the hard substrate 1 can be completely peeled off, and the yield of manufacturing the flexible display 3 is improved.
In one embodiment, step S1 includes the following steps:
s11: spraying and curing a release material solution on the hard substrate 1 to form a release material solution film layer, wherein a plurality of release material solution film layers form a release layer 31, as shown in fig. 1 and 10;
s12: the release layer 31 on the edge region is removed to form the release layer 31 on the middle region, as shown in fig. 2 and 10.
Firstly spraying a solution made of a release material on a hard substrate 1, then solidifying the release material solution to form a release material solution film layer, connecting the release material solution film layer and the hard substrate 1 together, then repeating the steps of spraying the release material solution and solidifying the release material solution to enable a plurality of release material solution film layers to be arranged in a stacking manner to form a release layer 31, then removing the release layer 31 distributed on the edge area of the hard substrate 1 to form the release layer 31 in the middle area of the hard substrate 1, therefore, the release layer 31 comprises a plurality of release material solution film layers, the bonding force between two adjacent release material solution film layers is smaller than the bonding force between the release material solution film layer and the hard substrate 1 and is also smaller than the bonding force between the release material solution film layer and the flexible substrate 32, and the bonding force between two adjacent release material solution film layers is relatively weaker, therefore, the hard substrate 1 and the flexible substrate 32 can be separated by mechanical force, so that one release material solution film layer is separated from the other release material solution film layer, thereby achieving the purpose of separating the middle area of the hard substrate 1 from the display area of the flexible substrate 32.
As an optional embodiment, the thickness of the cured release material solution film layer is about 2nm, the thickness of the cured release material solution film layer is about 3-5 layers, and the thickness of the release layer 31 is about 10 nm.
In one embodiment, the step of removing the release layer 31 on the edge region includes:
s121: and removing the release layer 31 on the edge area by using high-energy plasma bombardment.
The release layer 31 is removed by high-energy plasma bombardment to etch the shape of the release layer 31, that is, the release layer 31 located in the edge region of the hard substrate 1 is removed, and only the release layer 31 in the middle region of the hard substrate 1 is left, so that the release layer 31 is formed in the middle region of the hard substrate 1.
As an alternative embodiment, as shown in fig. 2, the distance between the edge of the release layer 31 and the edge of the rigid substrate 1 on the same side is 8-15 mm.
In one embodiment, the step of curing the release material solution comprises:
s111: blowing inert gas to the surface of the release material solution;
s112: and (4) carrying out high-temperature baking treatment on the release material solution to solidify the release material solution.
Blow inert gas (like nitrogen) to from type material solution surface to and carry out the high temperature baking to handle from type material solution, can both accelerate to evaporate the solvent in the type material solution, and inert gas then can avoid taking place chemical reaction with from type material solution, consequently can accelerate the solidification from type material solution, improve the efficiency of preparation from type layer 31.
As an alternative embodiment, the release material solution is a graphene solution or a carbon nanotube solution.
In one embodiment, as shown in fig. 3 and 11, step S2 includes the following steps:
s21: coating a solution made of a flexible material on the release layer 31 and the edge area of the hard substrate 1 to form a flexible material solution film layer;
s22: the flexible material solution film layer is cured to form the flexible substrate 32.
A solution made of a flexible material is coated on the edge area of the release layer 31 and the hard substrate 1 to form a flexible material solution film layer, such that the flexible material solution film layer is simultaneously in contact with the release layer 31 and the hard substrate 1, and then the flexible material solution film layer is cured to form the flexible substrate 32.
As an alternative embodiment, as shown in fig. 3, the spacing between the edge of the flexible substrate 32 and the edge of the rigid substrate 1 on the same side is 5-10 mm.
In one embodiment, step S22 includes the following steps:
s221: carrying out vacuum drying treatment on the flexible material solution film layer;
s222: and (4) heating the flexible material solution film layer by using an infrared furnace to solidify the flexible material solution film layer.
The curing of the flexible material solution film layer can be accelerated through the processing modes of vacuum drying and infrared furnace heating, and the flexible substrate 32 and the release layer 31 are crosslinked and cured, so that the forming efficiency of the flexible substrate 32 is improved.
As an alternative embodiment, the flexible material solution is a polyimide solution.
In an embodiment, the step of irradiating the non-display area with laser light includes:
s31: a shading plate 2 is arranged on one side of the hard substrate 1, which is far away from the flexible substrate 32, so that the shading plate 2 shades the middle area of the hard substrate 1, as shown in fig. 6 specifically;
s32: the hard substrate 1 is irradiated with laser light so that the laser light passes through the hard substrate 1 and is irradiated to the non-display region.
Through setting up the middle part region that light screen 2 sheltered from stereoplasm base plate 1, when utilizing laser scanning, the laser can not shine on leaving type layer 31, and can only shine in the not sheltered zone of light screen 2, flexible substrate 32's non-display area promptly to with flexible substrate 32 and stereoplasm base plate 1 separation, avoid the unexpected irradiation of laser from type layer 31, thereby improved the yields of making flexible display 3.
As an alternative embodiment, the shielding plate is a ferrous metal plate.
As an alternative embodiment, the light shielding plate 2 shields the display area, the wiring area, and the driving chip 35 of the flexible substrate 32.
In one embodiment, the step of peeling the display region from the central region of the rigid substrate 1 by using a mechanical force comprises:
s33: the first suction device 4 is used to suck the flexible substrate 32, as shown in fig. 5 and 12;
s34: the hard substrate 1 is sucked by the second suction device 5, as shown in fig. 7 and 12;
s35: moving the hard substrate 1 by the second adsorption device 5, so that one side edge of the hard substrate 1 moves away from the flexible substrate 32, and waiting for a predetermined time after the hard substrate 1 and the flexible substrate 32 form a predetermined angle, as shown in fig. 8 and 12;
s36: the above steps are repeated until the display area is peeled off from the central area of the hard substrate 1.
Moving the hard substrate 1 connected by suction by the second suction means 5 so that the hard substrate 1 and the flexible substrate 32 connected by suction by the first suction means 4 are separated away from each other to peel them, to mechanically peel the hard substrate 1 and the flexible substrate 32; only one side edge of the hard substrate 1 is moved, so that air can enter between the release layer 31 and the hard substrate 1, and the peeling difficulty and the damage to the release layer 31 are reduced; after the hard substrate 1 and the flexible substrate 32 are separated by the preset angle, the preset time is waited, air can fully enter between the release layer 31 and the hard substrate 1, the step of moving the hard substrate 1 is repeated, air can also fully enter between the release layer 31 and the hard substrate 1, and the separation difficulty and the damage to the release layer 31 are reduced.
As an alternative embodiment, the angle of each movement of the hard substrate 1 is gradually increased compared to the previous one, for example, the predetermined angle is 3-5 °, 5-10 °, etc., the speed of each movement of the hard substrate 1 is 3-5mm/s, and the predetermined time of each waiting is 1-2 s.
In one embodiment, step S3 further includes the following steps:
s37: the rigid substrate 1 is inverted so that the rigid substrate 1 is on top and the flexible substrate 32 is on the bottom, as shown in particular in fig. 8.
Steps S33 and S37 may be performed before step S31 to irradiate the hard substrate 1 with laser light so that the laser light is transmitted through the hard substrate 1.
In one embodiment, the first suction device 4 is a vacuum platform.
In an embodiment, as shown in fig. 4, after step S2, before peeling the flexible substrate 32 from the rigid substrate 1, the method further includes the following steps:
s23: forming a barrier layer 33 on the flexible substrate 32;
s24: forming a thin film transistor array 36 on the barrier layer 33;
s25: forming a display device 37 on the thin film transistor array 36;
s26: forming an encapsulation layer 38 on the display device 37;
s27: a polarizer 39 is formed on the encapsulation layer 38.
The flexible display 3 can be formed by step S23, step S24, step S25, step S26, and step S27.
As an alternative embodiment, the barrier layer 33 is formed by alternating organic and inorganic layers, or alternating inorganic and inorganic layers, wherein the organic layer is parylene and the inorganic layer is SiNx.
As an alternative embodiment, the TFT array 36 is an Oxide-TFT or LTPS TFT.
It is understood that the laser is selected based on the material of the flexible substrate 32 so that the flexible material itself is decomposed and carbonized by laser irradiation to separate the flexible substrate 32 from the hard substrate 1.
In an embodiment, as shown in fig. 4 and 5, the step S27 further includes the following steps:
s28: forming a bonding region 34 in the non-display region of the flexible substrate 32;
s29: the driver chip 35 is crimped to the bonding region 34.
The bonding region 34 is provided in the non-display region of the flexible substrate 32, and since the non-display region is connected to the hard substrate 1, the flexible substrate 32 is not wrinkled to cause displacement of the bonding region 34 when the driver chip 35 is pressed against the bonding region 34, so that the driver chip 35 can be accurately pressed against the bonding region 34.
The invention also provides a flexible display 3, and the flexible display 3 is manufactured and formed based on any one of the manufacturing methods of the flexible display 3.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A method of manufacturing a flexible display, the method comprising:
forming a release layer in a middle area of a hard substrate, wherein the hard substrate comprises a middle area and an edge area surrounding the middle area;
forming a flexible substrate on the release layer and the hard substrate, wherein the flexible substrate comprises a display area and a non-display area surrounding the display area, the display area is formed on the release layer, and the non-display area is bonded with the edge area of the hard substrate;
in the process of peeling the flexible substrate from the hard substrate, the non-display area is irradiated with laser to peel the non-display area from the edge area, and then the display area is peeled from the central area of the hard substrate using mechanical force.
2. The method of manufacturing a flexible display according to claim 1, wherein the step of forming a release layer in the middle region of the rigid substrate comprises:
spraying and curing a release material solution on the hard substrate to form a release material solution film layer, wherein the release layer is formed by a plurality of release material solution film layers;
and removing the release layer on the edge area to form the release layer on the middle area.
3. The method of manufacturing a flexible display according to claim 2, wherein the step of removing the release layer on the edge region comprises:
and removing the release layer on the edge region by using high-energy plasma bombardment.
4. The method of manufacturing a flexible display according to claim 1, wherein the step of forming a flexible substrate on the release layer and the hard substrate comprises:
coating a solution made of a flexible material on the release layer and the edge area of the hard substrate to form a flexible material solution film layer;
and curing the flexible material solution film layer to form the flexible substrate.
5. The method of manufacturing a flexible display according to claim 4, wherein the step of curing the flexible material solution film layer comprises:
carrying out vacuum drying treatment on the flexible material solution film layer;
and heating the flexible material solution film layer by using an infrared furnace to solidify the flexible material solution film layer.
6. The method of manufacturing a flexible display according to claim 1, wherein the step of irradiating the non-display region with laser light includes:
arranging a shading plate on one side of the hard substrate, which is far away from the flexible substrate, so that the shading plate can shade the middle area of the hard substrate;
and irradiating the hard substrate with laser light so that the laser light passes through the hard substrate and is irradiated to the non-display area.
7. The method of manufacturing a flexible display according to claim 1, wherein the step of peeling the display area from the central region of the rigid substrate using a mechanical force comprises:
adsorbing the flexible substrate by using a first adsorption device;
adsorbing the hard substrate by using a second adsorption device;
moving the hard substrate through the second adsorption device, so that one side edge of the hard substrate moves towards a direction far away from the flexible substrate, and waiting for a preset time after the hard substrate and the flexible substrate form a preset angle;
repeating the steps until the display area is stripped from the middle area of the hard substrate.
8. The method of manufacturing a flexible display according to claim 1, wherein after the step of forming the flexible substrate on the release layer and the hard substrate and before peeling the flexible substrate from the hard substrate, further comprising the steps of:
forming a barrier layer on the flexible substrate;
forming a thin film transistor array on the barrier layer;
forming a display device on the thin film transistor array;
forming an encapsulation layer on the display device;
and forming a polarizer on the packaging layer.
9. The method of manufacturing a flexible display according to claim 8, wherein the step of forming a polarizer on the encapsulation layer further comprises the steps of:
forming a binding region in a non-display region of the flexible substrate;
and pressing the driving chip in the binding area.
10. A flexible display, characterized in that the flexible display is manufactured and formed based on the method for manufacturing a flexible display according to any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011596032.4A CN112701085A (en) | 2020-12-28 | 2020-12-28 | Manufacturing method of flexible display and flexible display |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011596032.4A CN112701085A (en) | 2020-12-28 | 2020-12-28 | Manufacturing method of flexible display and flexible display |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112701085A true CN112701085A (en) | 2021-04-23 |
Family
ID=75511846
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011596032.4A Pending CN112701085A (en) | 2020-12-28 | 2020-12-28 | Manufacturing method of flexible display and flexible display |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112701085A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102176435A (en) * | 2010-12-27 | 2011-09-07 | 友达光电股份有限公司 | Flexible substrate structure and manufacturing method thereof |
| CN102509719A (en) * | 2011-09-21 | 2012-06-20 | 友达光电股份有限公司 | Manufacturing method of flexible display and flexible display |
| CN102636898A (en) * | 2012-03-14 | 2012-08-15 | 京东方科技集团股份有限公司 | Manufacturing method of flexible display devices |
| CN103325731A (en) * | 2013-05-20 | 2013-09-25 | Tcl集团股份有限公司 | Manufacturing method of flexible display device |
| CN104009044A (en) * | 2014-05-22 | 2014-08-27 | 京东方科技集团股份有限公司 | Array substrate, manufacturing method thereof, display substrate and display device |
| KR20150019434A (en) * | 2013-08-14 | 2015-02-25 | 코스텍시스템(주) | A method for bonding / de-bonding of device wafer and carrier wafer and apparatus for bonding/de-bonding |
| CN106098939A (en) * | 2016-08-26 | 2016-11-09 | 武汉华星光电技术有限公司 | The method of laser nondestructively peeling flexible base board |
| CN109836858A (en) * | 2017-11-29 | 2019-06-04 | 上海和辉光电有限公司 | A kind of release film, flexible device preparation method, release film and flexible device |
-
2020
- 2020-12-28 CN CN202011596032.4A patent/CN112701085A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102176435A (en) * | 2010-12-27 | 2011-09-07 | 友达光电股份有限公司 | Flexible substrate structure and manufacturing method thereof |
| CN102509719A (en) * | 2011-09-21 | 2012-06-20 | 友达光电股份有限公司 | Manufacturing method of flexible display and flexible display |
| CN102636898A (en) * | 2012-03-14 | 2012-08-15 | 京东方科技集团股份有限公司 | Manufacturing method of flexible display devices |
| CN103325731A (en) * | 2013-05-20 | 2013-09-25 | Tcl集团股份有限公司 | Manufacturing method of flexible display device |
| KR20150019434A (en) * | 2013-08-14 | 2015-02-25 | 코스텍시스템(주) | A method for bonding / de-bonding of device wafer and carrier wafer and apparatus for bonding/de-bonding |
| CN104009044A (en) * | 2014-05-22 | 2014-08-27 | 京东方科技集团股份有限公司 | Array substrate, manufacturing method thereof, display substrate and display device |
| CN106098939A (en) * | 2016-08-26 | 2016-11-09 | 武汉华星光电技术有限公司 | The method of laser nondestructively peeling flexible base board |
| CN109836858A (en) * | 2017-11-29 | 2019-06-04 | 上海和辉光电有限公司 | A kind of release film, flexible device preparation method, release film and flexible device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103378314B (en) | Transfer membrane and the method using this transfer membrane manufacture flat faced display | |
| JP5881209B2 (en) | Method for manufacturing a flexible device | |
| KR101508544B1 (en) | Method of flexible display device | |
| US10026635B2 (en) | Packaging apparatus and packaging device | |
| CN107819072A (en) | Support membrane, oganic light-emitting display device and its manufacture method | |
| CN108538762B (en) | Display mother board and preparation method thereof, display substrate and preparation method thereof, and display device | |
| US20150231858A1 (en) | Releasable substrate on a carrier | |
| TWI421809B (en) | Method for isolating a flexible substrate from a carrier and method for fabricating an electric device | |
| CN104409408A (en) | Manufacture method of rigid substrate and flexible display | |
| US9925754B2 (en) | Method for manufacturing flexible device | |
| JP2000310759A (en) | Device for manufacturing liquid crystal display element and its method | |
| CN101685829A (en) | Vehicle, display device and manufacturing method for a semiconductor device | |
| CN106935547B (en) | Manufacturing method of flexible display device and flexible display device | |
| WO2017000330A1 (en) | Preparation method for flexible display panel, and flexible display panel | |
| JP2012178262A (en) | Manufacturing method of light emitting device | |
| US10147901B2 (en) | Packaging method, display panel and display apparatus | |
| JP2012513079A5 (en) | ||
| JP2009224437A (en) | Apparatus for manufacturing thin film electronic device and method for manufacturing thin film electronic device | |
| KR101947070B1 (en) | Method of fabricating display device using flexible film | |
| CN112701085A (en) | Manufacturing method of flexible display and flexible display | |
| CN113053812A (en) | Method for manufacturing flexible display driving chip | |
| JP2015116698A (en) | Method for manufacturing glass laminate and method for manufacturing electronic device | |
| JP3028951B1 (en) | Method for manufacturing organic thin film electroluminescent device | |
| KR101868867B1 (en) | Fabricating method of flexible display device | |
| JPH07235583A (en) | Adhesive tape |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |