CN112701060A - 半导体芯片焊线的检测方法及装置 - Google Patents
半导体芯片焊线的检测方法及装置 Download PDFInfo
- Publication number
- CN112701060A CN112701060A CN202110312419.0A CN202110312419A CN112701060A CN 112701060 A CN112701060 A CN 112701060A CN 202110312419 A CN202110312419 A CN 202110312419A CN 112701060 A CN112701060 A CN 112701060A
- Authority
- CN
- China
- Prior art keywords
- image
- bonding wire
- chip
- wire
- arc
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
- H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Image Analysis (AREA)
- Image Processing (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110312419.0A CN112701060B (zh) | 2021-03-24 | 2021-03-24 | 半导体芯片焊线的检测方法及装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110312419.0A CN112701060B (zh) | 2021-03-24 | 2021-03-24 | 半导体芯片焊线的检测方法及装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN112701060A true CN112701060A (zh) | 2021-04-23 |
CN112701060B CN112701060B (zh) | 2021-08-06 |
Family
ID=75515618
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202110312419.0A Active CN112701060B (zh) | 2021-03-24 | 2021-03-24 | 半导体芯片焊线的检测方法及装置 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN112701060B (zh) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113554054A (zh) * | 2021-06-04 | 2021-10-26 | 奕目(上海)科技有限公司 | 基于深度学习的半导体芯片金线缺陷分类方法及系统 |
CN114388418A (zh) * | 2021-12-28 | 2022-04-22 | 凌波微步半导体设备(常熟)有限公司 | 一种半导体焊线机的闭环位置补偿方法及系统 |
CN114898357A (zh) * | 2022-07-12 | 2022-08-12 | 深圳思谋信息科技有限公司 | 缺陷识别方法、装置、电子设备及计算机可读存储介质 |
CN117830316A (zh) * | 2024-03-05 | 2024-04-05 | 深圳市远望工业自动化设备有限公司 | 汽车油箱表面焊接缺陷检测方法及相关装置 |
CN117853482A (zh) * | 2024-03-05 | 2024-04-09 | 武汉软件工程职业学院(武汉开放大学) | 一种基于多尺度的复合材料缺陷检测方法和设备 |
CN117853559A (zh) * | 2024-03-05 | 2024-04-09 | 上海楷领科技有限公司 | 一种基于芯片二维数据获取三维数据的方法及其相关装置 |
CN117853559B (zh) * | 2024-03-05 | 2024-06-04 | 上海楷领科技有限公司 | 一种基于芯片二维数据获取三维数据的方法及其相关装置 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000012602A (ja) * | 1998-06-26 | 2000-01-14 | Nec Corp | ボンディングワイヤ不良検出装置および検出方法 |
US20030071615A1 (en) * | 2001-03-19 | 2003-04-17 | Jentek Sensors | Eddy current sensor arrays |
CN104573635A (zh) * | 2014-12-17 | 2015-04-29 | 华南理工大学 | 一种基于三维重建的微小高度识别方法 |
CN104713885A (zh) * | 2015-03-04 | 2015-06-17 | 中国人民解放军国防科学技术大学 | 一种用于pcb板在线检测的结构光辅助双目测量方法 |
CN109219730A (zh) * | 2017-05-02 | 2019-01-15 | 精益视觉科技私人有限公司 | 使用多视图立体视觉进行引脚角度检查的系统和方法 |
CN111260773A (zh) * | 2020-01-20 | 2020-06-09 | 深圳市普渡科技有限公司 | 小障碍物的三维重建方法、检测方法及检测系统 |
-
2021
- 2021-03-24 CN CN202110312419.0A patent/CN112701060B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000012602A (ja) * | 1998-06-26 | 2000-01-14 | Nec Corp | ボンディングワイヤ不良検出装置および検出方法 |
US20030071615A1 (en) * | 2001-03-19 | 2003-04-17 | Jentek Sensors | Eddy current sensor arrays |
CN104573635A (zh) * | 2014-12-17 | 2015-04-29 | 华南理工大学 | 一种基于三维重建的微小高度识别方法 |
CN104713885A (zh) * | 2015-03-04 | 2015-06-17 | 中国人民解放军国防科学技术大学 | 一种用于pcb板在线检测的结构光辅助双目测量方法 |
CN109219730A (zh) * | 2017-05-02 | 2019-01-15 | 精益视觉科技私人有限公司 | 使用多视图立体视觉进行引脚角度检查的系统和方法 |
CN111260773A (zh) * | 2020-01-20 | 2020-06-09 | 深圳市普渡科技有限公司 | 小障碍物的三维重建方法、检测方法及检测系统 |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113554054A (zh) * | 2021-06-04 | 2021-10-26 | 奕目(上海)科技有限公司 | 基于深度学习的半导体芯片金线缺陷分类方法及系统 |
CN114388418A (zh) * | 2021-12-28 | 2022-04-22 | 凌波微步半导体设备(常熟)有限公司 | 一种半导体焊线机的闭环位置补偿方法及系统 |
CN114388418B (zh) * | 2021-12-28 | 2022-12-13 | 凌波微步半导体设备(常熟)有限公司 | 一种半导体焊线机的闭环位置补偿方法及系统 |
CN114898357A (zh) * | 2022-07-12 | 2022-08-12 | 深圳思谋信息科技有限公司 | 缺陷识别方法、装置、电子设备及计算机可读存储介质 |
CN114898357B (zh) * | 2022-07-12 | 2022-10-18 | 深圳思谋信息科技有限公司 | 缺陷识别方法、装置、电子设备及计算机可读存储介质 |
CN117830316A (zh) * | 2024-03-05 | 2024-04-05 | 深圳市远望工业自动化设备有限公司 | 汽车油箱表面焊接缺陷检测方法及相关装置 |
CN117853482A (zh) * | 2024-03-05 | 2024-04-09 | 武汉软件工程职业学院(武汉开放大学) | 一种基于多尺度的复合材料缺陷检测方法和设备 |
CN117853559A (zh) * | 2024-03-05 | 2024-04-09 | 上海楷领科技有限公司 | 一种基于芯片二维数据获取三维数据的方法及其相关装置 |
CN117830316B (zh) * | 2024-03-05 | 2024-05-07 | 深圳市远望工业自动化设备有限公司 | 汽车油箱表面焊接缺陷检测方法及相关装置 |
CN117853482B (zh) * | 2024-03-05 | 2024-05-07 | 武汉软件工程职业学院(武汉开放大学) | 一种基于多尺度的复合材料缺陷检测方法和设备 |
CN117853559B (zh) * | 2024-03-05 | 2024-06-04 | 上海楷领科技有限公司 | 一种基于芯片二维数据获取三维数据的方法及其相关装置 |
Also Published As
Publication number | Publication date |
---|---|
CN112701060B (zh) | 2021-08-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN112701060B (zh) | 半导体芯片焊线的检测方法及装置 | |
CN112767398B (zh) | 晶圆缺陷的检测方法及装置 | |
US7162073B1 (en) | Methods and apparatuses for detecting classifying and measuring spot defects in an image of an object | |
Chen et al. | Light field stereo matching using bilateral statistics of surface cameras | |
US8831334B2 (en) | Segmentation for wafer inspection | |
WO2021011190A1 (en) | Methods, systems, and computer readable media for three-dimensional (3d) reconstruction of colonoscopic surfaces for determining missing regions | |
US9171364B2 (en) | Wafer inspection using free-form care areas | |
US7162089B2 (en) | Method for segmenting and recognizing an image in industry radiation imaging | |
CN109447979B (zh) | 基于深度学习和图像处理算法的目标检测方法 | |
CN112858318B (zh) | 屏幕异物缺陷与灰尘的区分方法、电子设备及存储介质 | |
CN112734756B (zh) | 基于光度立体视觉的检测方法及系统 | |
JPH0676062A (ja) | 画像処理装置 | |
CN112767399B (zh) | 半导体焊线缺陷检测方法、电子设备及存储介质 | |
Priya et al. | Object recognition and 3D reconstruction of occluded objects using binocular stereo | |
TW201434010A (zh) | 具有在預處理層及一或多個更高層之間之多通道介面之影像處理器 | |
CN107358624B (zh) | 单目稠密即时定位与地图重建方法 | |
JPH04130587A (ja) | 3次元画像評価装置 | |
CN116468968A (zh) | 一种融合注意力机制的天文图像小目标检测方法 | |
CN115222653B (zh) | 测试方法和装置 | |
CN113628212B (zh) | 不良偏光片识别方法、电子设备和存储介质 | |
CN111462099A (zh) | 一种基于快速积分图监测的图像细胞区域定位方法 | |
WO2023026703A1 (ja) | 画像解析装置、方法及びプログラム | |
CN114018215B (zh) | 基于语义分割的单目测距方法、装置、设备及存储介质 | |
CN115983364A (zh) | 图像处理模型的训练方法、图像处理方法及装置 | |
Munisankar et al. | Defect detection in printed board circuit using image processing |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information | ||
CB02 | Change of applicant information |
Address after: 215163 rooms 101, 102, 901 and 902, floor 1, building 11, 198 Jialingjiang Road, high tech Zone, Suzhou City, Jiangsu Province Applicant after: Gaoshi Technology (Suzhou) Co.,Ltd. Address before: 516000 west side of the fourth floor, building CD, science and technology entrepreneurship center, No.2, South Huatai Road, Huinan hi tech Industrial Park, huiao Avenue, Huicheng District, Huizhou City, Guangdong Province Applicant before: HUIZHOU GOVION TECHNOLOGY Co.,Ltd. |
|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract | ||
EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20210423 Assignee: Suzhou Gaoshi Semiconductor Technology Co.,Ltd. Assignor: Gaoshi Technology (Suzhou) Co.,Ltd. Contract record no.: X2021990000430 Denomination of invention: Detection method and device of semiconductor chip welding wire License type: Common License Record date: 20210722 |
|
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: 215129 Rooms 101, 102, 901, 902, Floor 9, Building 11, No. 198, Jialing River Road, High tech Zone, Suzhou City, Jiangsu Province Patentee after: Gaoshi Technology (Suzhou) Co.,Ltd. Address before: 215163 rooms 101, 102, 901 and 902, floor 1, building 11, 198 Jialingjiang Road, high tech Zone, Suzhou City, Jiangsu Province Patentee before: Gaoshi Technology (Suzhou) Co.,Ltd. |