CN112698064B - Calibration method of magnetic pressure relief structure for power device test probe card - Google Patents
Calibration method of magnetic pressure relief structure for power device test probe card Download PDFInfo
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- CN112698064B CN112698064B CN202110032429.9A CN202110032429A CN112698064B CN 112698064 B CN112698064 B CN 112698064B CN 202110032429 A CN202110032429 A CN 202110032429A CN 112698064 B CN112698064 B CN 112698064B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06777—High voltage probes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R35/00—Testing or calibrating of apparatus covered by the other groups of this subclass
- G01R35/005—Calibrating; Standards or reference devices, e.g. voltage or resistance standards, "golden" references
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Abstract
The invention relates to a calibration method of a magnetic pressure relief structure for a power device test probe card, belonging to the technical field of semiconductor device test; firstly, calibrating the relation between the magnetic force and the distance between the annular magnet and the circular magnet, setting the threshold value of gas pressure intensity, and measuring the mass sum of the circular magnet and the sealing gasket; then multiplying the pressure intensity threshold value by the cross section area of a through hole at the middle upper part of the stepped pupil of the connecting piece, and adding the mass sum of the circular magnet and the sealing gasket by the gravity acceleration to obtain a magnetic force calculation result; obtaining the distance between the annular magnet and the circular magnet according to the relationship between the magnetic force and the distance and the magnetic force calculation result; then, inverting the adjusting piece, sleeving the annular magnet on the contact end, screwing the fixed end of the magnet and fixing the annular magnet; finally, the adjusting piece is rightly arranged, and a contact end of the adjusting piece is screwed into the pressure relief hole; the invention is applied to a power device test probe card, and can simultaneously inhibit abnormal discharge between probes in a high-voltage environment and warping deformation and probe position drift of the probe card in a high-temperature environment.
Description
The application is a divisional application of the patent application of the invention, namely a magnetic pressure relief structure for a power device test probe card and an installation calibration method thereof.
Application date of the original case: 2020-07-01.
Original application No.: 2020106210545.
the name of the original invention is: a magnetic pressure relief structure for a power device test probe card and an installation and calibration method thereof are provided.
Technical Field
The invention discloses a calibration method of a magnetic pressure relief structure for a power device test probe card, and belongs to the technical field of semiconductor device test.
Background
With the continuous development of MEMS technology and semiconductor technology, the yield of miniaturized high-power devices is rising year by year. Many devices operate in high voltage and high temperature environments. Ensuring that these devices can function properly in such harsh environments requires testing of their performance with a probe card.
An important index for power device testing is breakdown voltage, which can be as high as several thousand volts, and when testing is performed at such a high voltage, abnormal discharge may occur between probes of a probe card, which may instantaneously damage test equipment and a wafer to be tested.
Another important index for testing power devices is the operating temperature, generally speaking, a test chip is required to be able to normally operate at-40 ℃ to 125 ℃, while some chips in the field of automobiles are required to be able to normally operate at more than 180 ℃, so we need to test their operating conditions at more than 180 ℃. Because of the difference of thermal expansion coefficients of all parts of the probe card, the temperature change from room temperature to over 180 ℃ can cause the warping deformation of the probe card and the position drift of the probe, which not only reduces the testing effect and efficiency, but also even causes the problems of testing failure, probe card damage and the like in severe cases.
Therefore, how to suppress the abnormal discharge phenomenon between the probes in the high-voltage environment and how to suppress the warping deformation of the probe card and the position drift of the probes in the high-temperature environment is a key technical problem to be solved urgently in the technology of testing the probe card for the power device at the present stage, however, a probe card capable of breaking through the two technical problems at the same time is not found at present.
Disclosure of Invention
The invention discloses a magnetic pressure relief structure for a power device test probe card and an installation and calibration method thereof, aiming at the problems, the technology is applied to the probe card for the power device high-temperature and high-pressure test, and can inhibit the abnormal discharge phenomenon among probes in a high-voltage environment and the warping deformation and the probe position drift of the probe card in a high-temperature environment.
The purpose of the invention is realized as follows:
the magnetic pressure relief structure for the power device test probe card is characterized in that a pressure relief hole is formed in an air inlet system, threads are tapped on the inner wall of the pressure relief hole, and an adjusting piece is screwed on the inner wall of the pressure relief hole and comprises a contact end, an annular magnet and an upper magnet fixing end, the cross section of the contact end is T-shaped, a through hole is formed in the middle of the contact end, threads are sleeved on the side wall of a wide part of the contact end and used for screwing on the inner wall of the pressure relief hole, the annular magnet is arranged on a narrow part, threads are sleeved on the side wall of the narrow part of the contact end, threads are tapped on the inner wall of the upper magnet fixing end and used for screwing on the side wall of the narrow part of the contact end, and the annular magnet is fixed above the upper magnet fixing end below the wide part of the contact end; the valve member is further screwed to the inner wall of the pressure relief hole, the valve member comprises a connecting piece, the cross section of the connecting piece is inverted T-shaped, the middle of the connecting piece is provided with a narrow lower wide step through hole, the side wall of the narrow part of the connecting piece is sleeved with threads and is used for screwing on the inner wall of the pressure relief hole, the wide part of the step through hole is provided with a circular magnet, the upper portion of the circular magnet is pasted with a sealing pad, the side wall of the connecting piece is provided with an opening, the bottom of the connecting piece is provided with an opening, the side wall opening is connected with the bottom opening, the inner wall of the wide part of the step through hole is tapped with threads, and the middle of the wide part of the step through hole is provided with a shielding ring with a through hole, and the circular magnet can move up and down on the shielding ring under the attraction of the annular magnet and the push of compressed air.
The mounting method of the magnetic pressure relief structure for the power device test probe card comprises the following steps:
step a, inverting the adjusting piece, sleeving the annular magnet on the contact end, screwing the fixed end of the magnet, and fixing the annular magnet;
b, righting the adjusting piece, and screwing a contact end of the adjusting piece into the pressure relief hole;
c, inverting the valve member, and placing the circular magnet with the sealing gasket adhered below into the stepped through hole of the valve member;
d, mounting the shielding ring in a stepped through hole of the valve member;
and e, rightly arranging the valve piece, and screwing the connecting piece of the valve piece into the pressure relief hole.
The calibration method of the magnetic pressure relief structure for the power device test probe card comprises the following steps:
step a, calibrating the relation between the magnetic force and the distance between the annular magnet and the circular magnet;
step b, setting a pressure threshold of the high-temperature high-pressure gas;
c, measuring the mass sum of the circular magnet and the sealing gasket;
wherein, step a, step b and step c can be carried out according to any sequence or synchronously;
step d, multiplying the pressure intensity threshold of the compressed air by the cross section area of a through hole at the middle upper part of the stepped pupil of the connecting piece, and multiplying the sum of the mass of the circular magnet and the mass of the sealing gasket by the gravity acceleration;
e, enabling the magnetic force to be equal to the result obtained by the calculation in the step d;
f, obtaining the distance between the annular magnet and the circular magnet according to the relationship between the magnetic force and the distance calibrated in the step a and the calculation result obtained in the step e;
step g, inverting the adjusting piece, sleeving the annular magnet on the contact end, screwing the fixed end of the magnet, and fixing the annular magnet;
step h, rightly placing the adjusting piece, screwing the contact end of the adjusting piece into the pressure relief hole, wherein the specific positions are as follows: and f, taking the distance from the connecting piece to the lower end face of the pressure relief hole as step f, subtracting the thickness of the sealing gasket from the distance between the annular magnet and the circular magnet, and then subtracting the distance from the lower end face of the pressure relief hole to the step position of the connecting piece, the thickness of the annular magnet and the distance from the upper end face of the annular magnet to the upper end face of the contact end.
Has the advantages that:
the invention discloses a probe card for testing a power device at high temperature and high pressure, which is provided with an air inlet system for providing high-temperature high-pressure gas and normal-temperature high-pressure gas, wherein the high-temperature high-pressure gas is supplied to a probe position, and the normal-temperature high-pressure gas is supplied to a PCB position; at the position of the probe, the breakdown voltage is increased along with the increase of the pressure intensity by utilizing the uniform electric field, so that the breakdown voltage of the probe can be improved by using high-temperature and high-pressure gas, the abnormal discharge between the probes is avoided, and the test equipment and the wafer to be tested are protected; meanwhile, the high-temperature high-pressure gas can improve the temperature of the probe and the tested wafer, so that high-temperature testing is realized; at the position of the PCB, because the normal-temperature high-pressure gas is supplied, the temperature of the whole probe card is always kept at the normal temperature except for the probes, the warping deformation of the probe card and the position drift of the probes, which are caused by the difference of thermal expansion coefficients among all parts of the probe card, are effectively avoided, and the test effect and efficiency are effectively improved.
Secondly, the probe card for the high-temperature and high-pressure test of the power device can simultaneously inhibit the abnormal discharge phenomenon between the probes in a high-voltage environment and inhibit the warping deformation and the probe position drift of the probe card in a high-temperature environment, and has the beneficial effect of multiple functions.
The invention also discloses a probe card side air outlet structure, under the structure, the angle of the baffle can be changed by pulling the pull rope, and further, the injection angle and the pressure of the normal-temperature high-pressure gas can be adjusted simultaneously, so that the side air outlet has an adjusting function.
The invention also discloses a probe card carrying double-air inlet channel device, which is specially used for the probe card for high-temperature and high-pressure test of the power device and is used for simultaneously providing high-temperature and high-pressure gas and normal-temperature and high-pressure gas.
The invention also discloses a magnetic pressure relief structure, which can ensure that the pressure at the probe is required to be strong, and the pressure relief structure can automatically relieve pressure after the pressure exceeds a threshold value, so that the problem of uncontrollable pressure caused by overlarge pressure is avoided.
Sixthly, the invention also provides an installation method and a calibration method aiming at the provided magnetic pressure relief structure, and the adjustment of the pressure at the probe can be realized during the test.
Drawings
Fig. 1 is a schematic structural diagram of a probe card for high-temperature and high-pressure testing of a power device according to the present invention.
Fig. 2 is a schematic diagram of the position relationship between the relevant parts when the pressure relief hole is not in operation.
Fig. 3 is a schematic diagram of the position relationship between the relevant parts when the pressure relief hole works.
FIG. 4 is a schematic view of the structure between the side vent, the baffle, the pull cord and the fixed end of the pull cord.
Fig. 5 is a schematic structural view of the fixed end of the pulling rope.
Fig. 6 is a schematic diagram of a dual inlet arrangement.
In the figure: 1 air inlet system, 1-1 lower air outlet hole, 1-2 side air outlet hole, 1-2-1 baffle, 1-2-2 pull rope, 1-2-3 pull rope fixing end, 1-2-3-1 frame, 1-2-3-2 fixing plate, 1-2-3-3 pressure spring, 1-2-3-4 switch, 1-2-3-5 bracket, 1-3 pressure relief hole, 1-4 valve piece, 1-4-1 connecting piece, 1-4-2 circular magnet, 1-4-3 sealing gasket, 1-4-4 blocking ring, 1-5 adjusting piece, 1-5-1 contact end, 1-5-2 annular magnet, 1-5-3 upper magnet fixing end, The device comprises a 1-7 double air inlet channel device, a 1-7-1 air pump, a 1-7-2 first three-way valve, a 1-7-3 high-temperature high-pressure box, a 1-7-3-1 resistance wire, a 1-7-3-2 temperature sensor, a 1-7-3-3 first pressure gauge, a 1-7-4 normal-temperature high-pressure box, a 1-7-4-1 second pressure gauge, a 1-7-5 first valve, a 1-7-6 second three-way valve, a 1-7-7 second valve, a 2PCB, a 2-1 first through hole, a 3 switching layer, a 3-1 second through hole, a 4 guide plate, a 4-1 third through hole, a 4-2 inflatable air bag, a 5 probe and 6 wafers to be tested.
Detailed Description
The following detailed description of embodiments of the invention refers to the accompanying drawings.
Detailed description of the preferred embodiment
The following is a specific embodiment of a probe card for testing a power device under high temperature and high pressure.
As shown in fig. 1, the probe card for testing the high temperature and the high pressure of the power device of the embodiment is provided with an air inlet system 1, a PCB 2, an adapting layer 3, a guide plate 4 and a probe 5 in sequence from top to bottom; the bottom of the air inlet system 1 is provided with a plurality of lower air outlet holes 1-1 and side air outlet holes 1-2, first through holes 2-1 with the same positions, shapes and numbers as those of the lower air outlet holes 1-1 are distributed on the PCB 2, second through holes 3-1 with the same positions, shapes and numbers as those of the lower air outlet holes 1-1 are distributed on the switching layer 3, third through holes 4-1 with the same positions, shapes and numbers as those of the lower air outlet holes 1-1 are distributed on the guide plate 4, the lower air outlet holes 1-1, the first through holes 2-1, the second through holes 3-1 and the third through holes 4-1 are coaxially arranged, high-temperature and high-pressure air ejected from the lower air outlet holes 1-1 sequentially passes through the first through holes 2-1, the second through holes 3-1 and the third through holes 4-1, blowing in between the guide plate 4 and the wafer 6 to be tested;
the air inlet system 1 also comprises a pressure relief hole 1-3, the inner wall of the pressure relief hole 1-3 is tapped with threads, an adjusting piece 1-5 is screwed, the adjusting piece 1-5 comprises a contact end 1-5-1 with a T-shaped section and a through hole in the middle, a ring magnet 1-5-2 and an upper magnet fixing end 1-5-3, the side wall of the wide part of the contact end 1-5-1 is sleeved with a thread, is used for screwing on the inner wall of the pressure relief hole 1-3, the narrow part is provided with an annular magnet 1-5-2, the side wall of the narrow part is sleeved with a thread, the inner wall of the fixed end 1-5-3 of the upper magnet is tapped with the thread, the annular magnet fixing device is used for fixing the annular magnet 1-5-2 on the side wall of the narrow part of the contact end 1-5-1, below the wide part of the contact end 1-5-1 and above the fixed end 1-5-3 of the upper magnet; the inner wall of the pressure relief hole 1-3 is further screwed with a valve member 1-4, the valve member 1-4 comprises a connecting piece 1-4-1 with an inverted T-shaped cross section and a step through hole with a narrow upper part and a wide lower part, a thread is sleeved on the side wall of the narrow part of the connecting piece 1-4-1 and is used for screwing on the inner wall of the pressure relief hole 1-3, a round magnet 1-4-2 is placed on the wide part of the step through hole, a sealing pad 1-4-3 is pasted above the round magnet 1-4-2, the side wall is provided with an opening, the bottom is provided with an opening, the side wall opening is connected with the opening at the bottom, a thread is tapped on the inner wall of the wide part of the step through hole and is screwed with a shielding ring 1-4-4 with a through hole in the middle, the round magnet 1-4-2 is attracted by the ring magnet 1-5-2 and pushed by compressed air, can move up and down above the shielding rings 1-4-4;
the connection relation among the pressure relief hole 1-3, the valve member 1-4 and the adjusting member 1-5 is shown in fig. 2 and 3, wherein fig. 2 is a schematic diagram of the position relation among the relevant parts when the pressure relief hole 1-3 does not work, and fig. 3 is a schematic diagram of the position relation among the relevant parts when the pressure relief hole 1-3 works;
the function of each structure of the probe card is as follows:
the thickness of the edge of the guide plate 4 is larger than that of the central area;
the gas inlet system 1 is used for providing high-temperature high-pressure gas and normal-temperature high-pressure gas, the lower gas outlet 1-1 is used for ejecting the high-temperature high-pressure gas to the probe 5, and the side gas outlet 1-2 is used for providing the normal-temperature high-pressure gas to the PCB 2;
the PCB 2 is used for connecting a tester and signal wiring;
the switching layer 3 is a medium between the probe and the PCB 2 and is used for realizing the space switching of signals;
the guide plate 4 is used for accommodating a probe 5;
the probes 5 are used for connecting a wafer 6 to be tested.
Detailed description of the invention
The following is a specific embodiment of a probe card for testing a power device under high temperature and high pressure.
According to the probe card for testing the high temperature and the high pressure of the power device, the cross section area of the side air outlet 1-2 is gradually increased according to the flowing direction of constant temperature air, and the shape of the outer end part of the side air outlet 1-2 is a rectangle with the width larger than the height; a baffle plate 1-2-1 is connected with the rotating shaft below the outer end part of the side air outlet hole 1-2, a pull rope 1-2-2 is installed at the edge of the other side of the baffle plate 1-2-1, the pull rope 1-2-2 penetrates out from the upper part of the side air outlet hole 1-2, a pull rope fixing end 1-2-3 is also arranged above the side air outlet hole 1-2, the pull rope fixing end 1-2-3 comprises a frame 1-2-3-1, a fixing plate 1-2-3-2 which is arranged in the frame 1-2-3-1 and can move up and down along the frame 1-2-3-1, and a pressure spring 1-2-3-3 which is positioned below the fixing plate 1-2-3-2 and above the bottom of the frame 1-2-3-1, the switch 1-2-3-4 is positioned above the frame 1-2-3-1, the switch 1-2-3-4 is connected to the fixed plate 1-2-3-2 through a bracket 1-2-3-5 penetrating through the frame 1-2-3-1, the pull rope 1-2-2 penetrates through the frame 1-2-3-1 from the upper part of the fixed plate 1-2-3-2, the pull rope is squeezed between the fixed plate 1-2-3-2 and the frame 1-2-3-1 under the action of the pressure spring 1-2-3-3, when adjustment is needed, the switch 1-2-3-4 is pressed to enable the fixed plate 1-2-3-2 to move downwards, adjusting the pull rope 1-2-2, and loosening the switch 1-2-3-4 after the position is adjusted;
the schematic structural diagram among the side air outlet 1-2, the baffle 1-2-1, the pull rope 1-2-2 and the pull rope fixing end 1-2-3 is shown in fig. 4; the schematic structure of the fixed end 1-2-3 of the pull rope is shown in fig. 5.
Detailed description of the preferred embodiment
The following is a specific embodiment of a probe card for testing a power device under high temperature and high pressure.
The probe card for testing the high temperature and the high pressure of the power device in this embodiment further defines that the air intake system 1 further includes a dual air intake passage device 1-7, the dual air intake passage device 1-7 includes, according to an air flow direction, an air pump 1-7-1, a first three-way valve 1-7-2, a high temperature high pressure tank 1-7-3 connected to a first outlet of the first three-way valve 1-7-2, and a normal temperature high pressure tank 1-7-4 connected to a second outlet of the first three-way valve 1-7-2, the high temperature high pressure tank 1-7-3 is provided with a resistance wire 1-7-3-1, a temperature sensor 1-7-3-2, and a first pressure gauge 1-7-3-3, a second pressure gauge 1-7-4-1 is arranged in the normal-temperature high-pressure tank 1-7-4, the high-temperature high-pressure tank 1-7-3 is provided with two outlets, the first outlet is connected with a lower air outlet 1-1 through a first valve 1-7-5, the second outlet is connected with a second three-way valve 1-7-6, the second three-way valve 1-7-6 is also respectively connected with the outlet of the normal-temperature high-pressure tank 1-7-4 and the second valve 1-7-7, and the second valve 1-7-7 is connected with a side air outlet 1-2;
the schematic structural diagram of the double air inlet channel device 1-7 is shown in fig. 6.
Detailed description of the invention
The following is a specific embodiment of a probe card for testing a power device at high temperature and high pressure.
The probe card for testing the high temperature and the high pressure of the power device in this embodiment further defines that the thickness of the edge of the guide plate 4 is greater than that of the central area on the basis of the first embodiment, the second embodiment or the third embodiment, and is implemented by the following technical features: the lower periphery of the guide plate 4 is provided with an inflatable air bag 4-2.
Detailed description of the preferred embodiment
The following is a specific embodiment of the air vent on the loading side of the probe card.
A probe card carries the side air vent, according to the direction of flow of air of constant temperature, the cross-sectional area is increased gradually, in the outer end of the side air vent 1-2, the shape is a rectangle whose width is greater than height; a baffle plate 1-2-1 is connected with the rotating shaft below the outer end part of the side air outlet hole 1-2, a pull rope 1-2-2 is installed at the edge of the other side of the baffle plate 1-2-1, the pull rope 1-2-2 penetrates out from the upper part of the side air outlet hole 1-2, a pull rope fixing end 1-2-3 is also arranged above the side air outlet hole 1-2, the pull rope fixing end 1-2-3 comprises a frame 1-2-3-1, a fixing plate 1-2-3-2 which is arranged in the frame 1-2-3-1 and can move up and down along the frame 1-2-3-1, and a pressure spring 1-2-3-3 which is positioned below the fixing plate 1-2-3-2 and above the bottom of the frame 1-2-3-1, the switch 1-2-3-4 is positioned above the frame 1-2-3-1, the switch 1-2-3-4 is connected to the fixed plate 1-2-3-2 through a bracket 1-2-3-5 penetrating through the frame 1-2-3-1, the pull rope 1-2-2 penetrates through the frame 1-2-3-1 from the upper part of the fixed plate 1-2-3-2, the pull rope is squeezed between the fixed plate 1-2-3-2 and the frame 1-2-3-1 under the action of the pressure spring 1-2-3-3, when adjustment is needed, the switch 1-2-3-4 is pressed to enable the fixed plate 1-2-3-2 to move downwards, adjusting the pull rope 1-2-2, and loosening the switch 1-2-3-4 after the position is adjusted;
the schematic structural diagram among the side air outlet 1-2, the baffle 1-2-1, the pull rope 1-2-2 and the pull rope fixing end 1-2-3 is shown in fig. 4; the schematic structure of the fixed end 1-2-3 of the pull rope is shown in fig. 5.
Detailed description of the preferred embodiment
The following is an embodiment of a probe card mounted dual inlet device.
The probe card loaded double-air-inlet-channel device comprises an air pump 1-7-1, a first three-way valve 1-7-2, a high-temperature high-pressure box 1-7-3 connected with a first outlet of the first three-way valve 1-7-2, and a normal-temperature high-pressure box 1-7-4 connected with a second outlet of the first three-way valve 1-7-2, wherein a resistance wire 1-7-3-1, a temperature sensor 1-7-3-2 and a first pressure gauge 1-7-3-3 are arranged in the high-temperature high-pressure box 1-7-3, a second pressure gauge 1-7-4-1 is arranged in the normal-temperature high-pressure box 1-7-4, and the high-temperature high-pressure box 1-7-3 is provided with two outlets, the first outlet is connected with a lower air outlet 1-1 through a first valve 1-7-5, the second outlet is connected with a second three-way valve 1-7-6, the second three-way valve 1-7-6 is also respectively connected with an outlet of a normal-temperature high-pressure box 1-7-4 and the second valve 1-7-7, and the second valve 1-7-7 is connected with a side air outlet 1-2;
the schematic structural diagram of the double air inlet channel device 1-7 is shown in fig. 6.
Detailed description of the preferred embodiment
The following is a specific embodiment of a magnetic pressure relief structure for a power device test probe card.
A magnetic pressure relief structure for a power device test probe card is characterized in that a pressure relief hole 1-3 is formed in an air inlet system 1, threads are tapped on the inner wall of the pressure relief hole 1-3, an adjusting piece 1-5 is screwed on the pressure relief hole 1-3, the adjusting piece 1-5 comprises a contact end 1-5-1 with a T-shaped cross section and a through hole in the middle, an annular magnet 1-5-2 and an upper magnet fixing end 1-5-3, threads are sleeved on the side wall of a wide part of the contact end 1-5-1 and used for being screwed on the inner wall of the pressure relief hole 1-3, an annular magnet 1-5-2 is arranged on the narrow part, threads are sleeved on the side wall of the narrow part, threads are tapped on the side wall of the narrow part of the contact end 1-5-1, and the annular magnet 1-5-3 are arranged below the wide part and above the upper magnet fixing end 1-5-3 -5-2 fixation; the inner wall of the pressure relief hole 1-3 is further screwed with a valve member 1-4, the valve member 1-4 comprises a connecting piece 1-4-1 with an inverted T-shaped cross section and a step through hole with a narrow upper part and a wide lower part, a thread is sleeved on the side wall of the narrow part of the connecting piece 1-4-1 and is used for screwing on the inner wall of the pressure relief hole 1-3, a round magnet 1-4-2 is placed on the wide part of the step through hole, a sealing pad 1-4-3 is pasted above the round magnet 1-4-2, the side wall is provided with an opening, the bottom is provided with an opening, the side wall opening is connected with the opening at the bottom, a thread is tapped on the inner wall of the wide part of the step through hole and is screwed with a shielding ring 1-4-4 with a through hole in the middle, the round magnet 1-4-2 is attracted by the ring magnet 1-5-2 and pushed by compressed air, can move up and down above the shielding rings 1-4-4;
the connection relationship among the pressure relief hole 1-3, the valve member 1-4 and the adjusting member 1-5 is shown in fig. 2 and 3, wherein fig. 2 is a schematic diagram of the position relationship among the relevant parts when the pressure relief hole 1-3 does not work, and fig. 3 is a schematic diagram of the position relationship among the relevant parts when the pressure relief hole 1-3 works.
Detailed description of the preferred embodiment
The following is a specific embodiment of a method for mounting a magnetic pressure relief structure for a power device test probe card.
The method for installing the magnetic pressure relief structure for the power device test probe card comprises the following steps of:
step a, inverting an adjusting piece 1-5, sleeving a ring-shaped magnet 1-5-2 on a contact end 1-5-1, screwing a magnet fixing end 1-5-3, and fixing the ring-shaped magnet 1-5-2;
b, righting the adjusting piece 1-5, and screwing the contact end 1-5-1 of the adjusting piece 1-5 into the pressure relief hole 1-3;
c, inverting the valve member 1-4, and placing the circular magnet 1-4-2 with the sealing gasket 1-4-3 adhered below into the stepped through hole of the valve member 1-4;
d, installing the shielding ring 1-4-4 in a step through hole of the valve member 1-4;
and e, rightly arranging the valve member 1-4, and screwing the connecting member 1-4-1 of the valve member 1-4 into the pressure relief hole 1-3.
Detailed description of the preferred embodiment
The following is a specific embodiment of a calibration method of a magnetic pressure relief structure for a probe card for testing a power device.
The calibration method of the magnetic pressure relief structure for the power device test probe card comprises the following steps:
step a, calibrating the relation between the magnetic force and the distance between the annular magnet 1-5-2 and the circular magnet 1-4-2;
step b, setting a pressure threshold of the high-temperature high-pressure gas;
c, measuring the mass sum of the circular magnet 1-4-2 and the sealing gasket 1-4-3;
wherein, the step a, the step b and the step c can be carried out according to any sequence or synchronously;
step d, multiplying the pressure intensity threshold of the compressed air by the cross section area of the through hole at the middle upper part of the stepped pupil of the connecting piece 1-4-1, and multiplying the sum of the mass of the circular magnet 1-4-2 and the mass of the sealing pad 1-4-3 by the gravity acceleration;
e, enabling the magnetic force to be equal to the result obtained by the calculation in the step d;
f, obtaining the distance between the annular magnet 1-5-2 and the circular magnet 1-4-2 according to the relationship between the magnetic force and the distance calibrated in the step a and the calculation result obtained in the step e;
step g, inverting the adjusting piece 1-5, sleeving the annular magnet 1-5-2 on the contact end 1-5-1, screwing the magnet fixing end 1-5-3, and fixing the annular magnet 1-5-2;
step h, righting the adjusting piece 1-5, screwing the contact end 1-5-1 of the adjusting piece 1-5 into the pressure relief hole 1-3, and specifically setting the positions as follows: and f, subtracting the thickness of the sealing gasket 1-4-3 from the distance between the annular magnet 1-5-2 and the circular magnet 1-4-2, subtracting the distance from the lower end face of the pressure relief hole 1-3 to the step position of the connecting piece 1-4-1, adding the thickness of the annular magnet 1-5-2 and adding the distance from the upper end face of the annular magnet 1-5-2 to the upper end face of the contact end 1-5-1.
Claims (1)
1. The calibration method of the magnetic pressure relief structure for the probe card for testing the power device is characterized in that a pressure relief hole (1-3) is formed in an air inlet system (1) of the magnetic pressure relief structure for testing the probe card for the power device, threads are tapped on the inner wall of the pressure relief hole (1-3), an adjusting piece (1-5) is screwed on the inner wall of the pressure relief hole (1-3), the adjusting piece (1-5) comprises a contact end (1-5-1), an annular magnet (1-5-2) and an upper magnet fixing end (1-5-3), the section of the contact end (1-5-1) is T-shaped, a through hole is formed in the middle of the contact end, threads are sleeved on the side wall of a wide part of the contact end (1-5-1) and are used for being screwed on the inner wall of the pressure relief hole (1-3), and an annular magnet (1-5-2) is arranged at a narrow part of the contact end (1-5-1), the side wall of the narrow part of the contact end (1-5-1) is sleeved with a thread, the inner wall of the upper magnet fixing end (1-5-3) is tapped with a thread and is used for screwing on the side wall of the narrow part of the contact end (1-5-1), and the lower part of the wide part of the contact end (1-5-1) and the upper part of the upper magnet fixing end (1-5-3) fix the annular magnet (1-5-2); the inner wall of the pressure relief hole (1-3) is further screwed with a valve piece (1-4), the valve piece (1-4) comprises a connecting piece (1-4-1) with an inverted T-shaped cross section and a step through hole with a narrow upper part and a wide lower part, a thread is sleeved on the side wall of the narrow part of the connecting piece (1-4-1) and used for screwing on the inner wall of the pressure relief hole (1-3), a round magnet (1-4-2) is placed on the wide part of the step through hole, a sealing gasket (1-4-3) is pasted above the round magnet (1-4-2), a notch is arranged on the side wall of the round magnet (1-4-2), a notch is arranged at the bottom of the round magnet (1-4-2), the side wall notch is connected with the bottom notch, and a thread is tapped on the inner wall of the wide part of the step through hole, a shielding ring (1-4-4) with a through hole in the middle is screwed, and the circular magnet (1-4-2) can move up and down above the shielding ring (1-4-4) under the attraction of the annular magnet (1-5-2) and the push of compressed air;
the calibration method of the magnetic pressure relief structure for the power device test probe card comprises the following steps:
step a, calibrating the relation between the magnetic force and the distance between the annular magnet (1-5-2) and the circular magnet (1-4-2);
step b, setting a pressure threshold of the high-temperature high-pressure gas;
c, measuring the mass sum of the circular magnet (1-4-2) and the sealing gasket (1-4-3);
wherein, the step a, the step b and the step c can be carried out according to any sequence or synchronously;
d, summing two values
First value: the pressure threshold value of the compressed air is multiplied by the cross section area of the upper through hole in the stepped through hole of the connecting piece (1-4-1);
second value: multiplying the total mass of the circular magnet (1-4-2) and the sealing gasket (1-4-3) by the gravity acceleration;
e, enabling the magnetic force to be equal to the result obtained by the calculation in the step d;
f, obtaining the distance between the annular magnet (1-5-2) and the circular magnet (1-4-2) according to the relationship between the magnetic force and the distance calibrated in the step a and the calculation result obtained in the step e;
step g, inverting the adjusting piece (1-5), sleeving the annular magnet (1-5-2) on the contact end (1-5-1), screwing the magnet fixing end (1-5-3), and fixing the annular magnet (1-5-2);
step h, rightly arranging the adjusting piece (1-5), screwing the contact end (1-5-1) of the adjusting piece (1-5) into the pressure relief hole (1-3), wherein the specific positions are as follows: and f, subtracting the thickness of the sealing gasket (1-4-3) from the distance between the annular magnet (1-5-2) and the circular magnet (1-4-2), subtracting the distance from the lower end face of the pressure relief hole (1-3) to the step position of the connecting piece (1-4-1), adding the thickness of the annular magnet (1-5-2) and adding the distance from the upper end face of the annular magnet (1-5-2) to the upper end face of the contact end (1-5-1).
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| CN202010621054.5A CN111624373B (en) | 2020-07-01 | 2020-07-01 | Magnetic pressure relief structure for power device test probe card and installation and calibration method thereof |
| CN202110032429.9A CN112698064B (en) | 2020-07-01 | 2020-07-01 | Calibration method of magnetic pressure relief structure for power device test probe card |
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Also Published As
| Publication number | Publication date |
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| CN112698064A (en) | 2021-04-23 |
| CN111624373B (en) | 2021-02-02 |
| CN112649630A (en) | 2021-04-13 |
| CN111624373A (en) | 2020-09-04 |
| CN112649630B (en) | 2022-08-16 |
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