CN112694844A - Antistatic adhesive tape and preparation method thereof - Google Patents

Antistatic adhesive tape and preparation method thereof Download PDF

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Publication number
CN112694844A
CN112694844A CN202011554232.3A CN202011554232A CN112694844A CN 112694844 A CN112694844 A CN 112694844A CN 202011554232 A CN202011554232 A CN 202011554232A CN 112694844 A CN112694844 A CN 112694844A
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parts
antistatic
adhesive
curing
agent
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廖平湘
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Hunan Province And New Material Co ltd
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Hunan Province And New Material Co ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0862—Nickel
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0893—Zinc
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/04—Antistatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2479/00—Presence of polyamine or polyimide
    • C09J2479/08—Presence of polyamine or polyimide polyimide
    • C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

The invention discloses an antistatic adhesive tape and a preparation method thereof, wherein the antistatic adhesive tape comprises a base material, a curing adhesive layer coated on the base material and a release film coated on the curing adhesive layer; the curing adhesive layer comprises the following raw materials in parts by weight: ethyl silicate series coating, epoxy resin, organic silicon rubber, bonding resin, photoinitiator, curing crosslinking agent, antistatic adhesive, toughening agent, polyester emulsion and platinum catalyst emulsion; the antistatic adhesive comprises the following raw materials in parts by weight: acrylic resin pressure-sensitive adhesive, silver-nickel-zinc powder, a dispersing agent, an antistatic agent and an organic solvent. Through reasonable formula design, the prepared adhesive tape integrates excellent antistatic property and conductive property, has the advantage of good bonding property, has good thermal stability, can be unchanged for several years at room temperature or higher temperature, is not influenced by environmental humidity, can normally play an antistatic role at high temperature, and is fast in curing, safe and reliable.

Description

Antistatic adhesive tape and preparation method thereof
Technical Field
The invention relates to the technical field of adhesive tape manufacturing, in particular to an antistatic adhesive tape and a preparation method thereof.
Background
With the rapid development of electronic science and technology, the application of adhesive tapes in the electronic industry field has also been developed rapidly, but due to the limitation of the processing method of the traditional adhesive tapes, various adhesive tapes have certain static electricity in different degrees, so that dust or other particles are adsorbed on the surface of a base material, and the service life of related electronic devices is further influenced. Meanwhile, because the adhesive tape is a chemical synthetic material, the processing method in the prior art mainly aims at improving the function of the adhesive tape, and the environmental protection problem of the adhesive tape is usually ignored by people.
However, the application of adhesive tapes in these industries currently has the following problems: due to the inherent physicochemical properties of the adhesive tapes, various adhesive tapes are charged with certain amounts of static electricity to different degrees, so that dust or other particles are adsorbed on the surface of a base material, and the service life of related electronic devices is further influenced.
Disclosure of Invention
The invention aims to provide an antistatic adhesive tape with high temperature resistance and simple production process and a preparation method thereof, so as to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme:
an antistatic adhesive tape comprises a substrate, a curing adhesive layer coated on the substrate and a release film coated on the curing adhesive layer; the curing adhesive layer comprises the following raw materials in parts by weight: 10-20 parts of ethyl silicate coating, 80-100 parts of epoxy resin, 3-5 parts of organic silicon rubber, 60-80 parts of bonding resin, 3-5 parts of photoinitiator, 4-6 parts of curing cross-linking agent, 61-82 parts of antistatic adhesive, 10-15 parts of flexibilizer, 20-30 parts of polyester emulsion and 5-10 parts of platinum catalyst emulsion; the antistatic adhesive comprises the following raw materials in parts by weight: 30-40 parts of acrylic resin pressure-sensitive adhesive, 5-7 parts of silver-nickel-zinc powder, 3-5 parts of dispersing agent, 8-10 parts of antistatic agent and 15-20 parts of organic solvent.
As a further scheme of the invention: the curing adhesive layer comprises the following raw materials in parts by weight: 12-18 parts of ethyl silicate coating, 85-95 parts of epoxy resin, 3.5-4.5 parts of organic silicon rubber, 65-75 parts of bonding resin, 3.5-4.5 parts of photoinitiator, 4.5-5.5 parts of curing cross-linking agent, 65.5-77.5 parts of antistatic adhesive, 11-14 parts of toughening agent, 22-28 parts of polyester emulsion and 6-9 parts of platinum catalyst emulsion; the antistatic adhesive comprises the following raw materials in parts by weight: 32-38 parts of acrylic resin pressure-sensitive adhesive, 5.5-6.5 parts of silver-nickel-zinc powder, 3.5-4.5 parts of dispersant, 8.5-9.5 parts of antistatic agent and 16-19 parts of organic solvent.
As a further scheme of the invention: the curing adhesive layer comprises the following raw materials in parts by weight: 15 parts of ethyl silicate coating, 90 parts of epoxy resin, 4 parts of organic silicon rubber, 70 parts of bonding resin, 4 parts of photoinitiator, 5 parts of curing cross-linking agent, 72 parts of antistatic adhesive, 12 parts of toughening agent, 25 parts of polyester emulsion and 8 parts of platinum catalyst emulsion; the antistatic adhesive comprises the following raw materials in parts by weight: 35 parts of acrylic resin pressure-sensitive adhesive, 6 parts of silver-nickel-zinc powder, 4 parts of dispersing agent, 9 parts of antistatic agent and 18 parts of organic solvent.
As a still further scheme of the invention: the substrate is a polyimide film.
The preparation method of the antistatic adhesive tape comprises the following specific steps:
(1) weighing raw materials for curing the bonding layer according to the parts by weight;
(2) uniformly mixing an acrylic resin solvent type pressure-sensitive adhesive, silver-nickel-zinc powder, a dispersing agent and an antistatic agent according to the proportion, standing and ageing for 6-10 hours, then stirring, vacuumizing and defoaming, wherein the stirring speed is 70-90r/min, the vacuum degree is 0.1-0.3MPa, and finally adding the organic solvent, stirring and uniformly mixing to obtain the antistatic adhesive;
(3) putting the ethyl silicate paint, the epoxy resin, the organic silicon rubber, the bonding resin, the photoinitiator, the antistatic adhesive, the toughening agent, the polyester emulsion and the platinum catalyst emulsion into a mixer at normal temperature and normal pressure, mixing, and stirring uniformly in a closed manner to complete mixing;
(4) placing the mixed material and the antistatic adhesive into a tray, transferring the tray to a three-roller grinding machine for grinding, and cooling by adopting jacket circulating cooling water, wherein the temperature is controlled to be 25-35 ℃;
(5) the material after grinding shifts to desorption moisture in the reation kettle through changeing the storage bucket, starts the stirring of stirring facility in the reation kettle, and reation kettle presss from both sides cover electric heating rod and begins the heating, and when heating temperature reached 70-90 ℃, the vacuum pump was started and vacuum dehydration was carried out, and the dehydration condition is: at 80-120 ℃ for 3-5h, naturally cooling the material after dehydration;
(6) transferring the naturally cooled material to a glue preparation filling machine in a packaging workshop through a material transferring barrel, directly adding a curing cross-linking agent into a galvanized iron barrel, and hermetically stirring uniformly to prepare a curing adhesive;
(7) uniformly coating the prepared cured adhesive on one side of a base material, and then placing the base material into a constant temperature box with an ultraviolet lamp for curing and crosslinking for 4-6 min;
(9) and covering a layer of release film on the surface of the cured bonding layer, and curing at constant temperature for 1-3d to obtain the finished product of the antistatic adhesive tape.
Compared with the prior art, the invention has the beneficial effects that:
through reasonable formula design, the prepared adhesive tape integrates excellent antistatic property and conductive property, has the advantage of good bonding property, has good thermal stability, can be unchanged for several years at room temperature or higher temperature, is not influenced by environmental humidity, can normally play an antistatic role at high temperature, and is fast in curing, safe and reliable.
Detailed Description
The technical solution of the present patent will be described in further detail with reference to the following embodiments.
Example 1
An antistatic adhesive tape comprises a substrate, a curing adhesive layer coated on the substrate and a release film coated on the curing adhesive layer; the curing adhesive layer comprises the following raw materials in parts by weight: 10 parts of ethyl silicate coating, 80 parts of epoxy resin, 3 parts of organic silicon rubber, 60 parts of bonding resin, 3 parts of photoinitiator, 4 parts of curing cross-linking agent, 61 parts of antistatic adhesive, 10 parts of toughening agent, 20 parts of polyester emulsion and 5 parts of platinum catalyst emulsion; the antistatic adhesive comprises the following raw materials in parts by weight: 30 parts of acrylic resin pressure-sensitive adhesive, 5 parts of silver-nickel-zinc powder, 3 parts of dispersing agent, 8 parts of antistatic agent and 15 parts of organic solvent.
The preparation method of the antistatic adhesive tape comprises the following specific steps:
(1) weighing raw materials for curing the bonding layer according to the parts by weight;
(2) uniformly mixing an acrylic resin solvent type pressure-sensitive adhesive, silver-nickel-zinc powder, a dispersing agent and an antistatic agent according to the proportion, standing and ageing for 6 hours, then stirring, vacuumizing and defoaming, wherein the stirring speed is 70r/min, the vacuum degree is 0.1MPa, and finally adding the organic solvent, stirring and uniformly mixing to obtain the antistatic adhesive;
(3) putting the ethyl silicate paint, the epoxy resin, the organic silicon rubber, the bonding resin, the photoinitiator, the antistatic adhesive, the toughening agent, the polyester emulsion and the platinum catalyst emulsion into a mixer at normal temperature and normal pressure, mixing, and stirring uniformly in a closed manner to complete mixing;
(4) placing the mixed material and the antistatic adhesive into a tray, transferring the tray to a three-roller grinding machine for grinding, and cooling by adopting jacket circulating cooling water, wherein the temperature is controlled to be 25 ℃;
(5) the material after the grinding shifts moisture in the desorption material in the reation kettle through changeing the storage bucket, starts the stirring of stirring facility in the reation kettle, and reation kettle presss from both sides cover electric heating rod and begins the heating, and when heating temperature reached 70 ℃, the vacuum pump was started and vacuum dehydration was carried out, and the dehydration condition is: at 80 ℃ for 3h, after dehydration, the material is naturally cooled;
(6) transferring the naturally cooled material to a glue preparation filling machine in a packaging workshop through a material transferring barrel, directly adding a curing cross-linking agent into a galvanized iron barrel, and hermetically stirring uniformly to prepare a curing adhesive;
(7) uniformly coating the prepared cured adhesive on one side of a base material, placing the base material into a constant temperature box with an ultraviolet lamp, and curing and crosslinking for 4 min;
(9) and covering a layer of release film on the surface of the cured bonding layer, and curing at constant temperature for 1d to obtain the finished product of the antistatic adhesive tape.
Example 2
An antistatic adhesive tape comprises a substrate, a curing adhesive layer coated on the substrate and a release film coated on the curing adhesive layer; the curing adhesive layer comprises the following raw materials in parts by weight: 12 parts of ethyl silicate coating, 85 parts of epoxy resin, 3.5 parts of organic silicon rubber, 65 parts of bonding resin, 3.5 parts of photoinitiator, 4.5 parts of curing cross-linking agent, 65.5 parts of antistatic adhesive, 11 parts of flexibilizer, 22 parts of polyester emulsion and 6 parts of platinum catalyst emulsion; the antistatic adhesive comprises the following raw materials in parts by weight: 32 parts of acrylic resin pressure-sensitive adhesive, 5.5 parts of silver-nickel-zinc powder, 3.5 parts of dispersing agent, 8.5 parts of antistatic agent and 16 parts of organic solvent.
The preparation method of the antistatic adhesive tape comprises the following specific steps:
(1) weighing raw materials for curing the bonding layer according to the parts by weight;
(2) uniformly mixing an acrylic resin solvent type pressure-sensitive adhesive, silver-nickel-zinc powder, a dispersing agent and an antistatic agent according to the proportion, standing and ageing for 7 hours, then stirring, vacuumizing and defoaming, wherein the stirring speed is 75r/min, the vacuum degree is 0.15MPa, and finally adding the organic solvent, stirring and uniformly mixing to obtain the antistatic adhesive;
(3) putting the ethyl silicate paint, the epoxy resin, the organic silicon rubber, the bonding resin, the photoinitiator, the antistatic adhesive, the toughening agent, the polyester emulsion and the platinum catalyst emulsion into a mixer at normal temperature and normal pressure, mixing, and stirring uniformly in a closed manner to complete mixing;
(4) placing the mixed material and the antistatic adhesive into a tray, transferring the tray to a three-roller grinding machine for grinding, and cooling by adopting jacket circulating cooling water, wherein the temperature is controlled to be 28 ℃;
(5) the material after grinding shifts to desorption moisture in the reation kettle through changeing the storage bucket, starts the stirring of stirring facility in the reation kettle, and reation kettle presss from both sides cover electric heating rod and begins the heating, and when heating temperature reached 70-90 ℃, the vacuum pump was started and vacuum dehydration was carried out, and the dehydration condition is: at 90 ℃, 3.5h, after dehydration, the material is naturally cooled;
(6) transferring the naturally cooled material to a glue preparation filling machine in a packaging workshop through a material transferring barrel, directly adding a curing cross-linking agent into a galvanized iron barrel, and hermetically stirring uniformly to prepare a curing adhesive;
(7) uniformly coating the prepared cured adhesive on one side of a base material, and then placing the base material into a constant temperature box with an ultraviolet lamp for curing and crosslinking for 4.5 min;
(9) and covering a layer of release film on the surface of the cured bonding layer, and curing at constant temperature for 1.5d to obtain the finished product of the antistatic adhesive tape.
Example 3
An antistatic adhesive tape comprises a substrate, a curing adhesive layer coated on the substrate and a release film coated on the curing adhesive layer; the curing adhesive layer comprises the following raw materials in parts by weight: 15 parts of ethyl silicate coating, 90 parts of epoxy resin, 4 parts of organic silicon rubber, 70 parts of bonding resin, 4 parts of photoinitiator, 5 parts of curing cross-linking agent, 72 parts of antistatic adhesive, 12 parts of toughening agent, 25 parts of polyester emulsion and 8 parts of platinum catalyst emulsion; the antistatic adhesive comprises the following raw materials in parts by weight: 35 parts of acrylic resin pressure-sensitive adhesive, 6 parts of silver-nickel-zinc powder, 4 parts of dispersing agent, 9 parts of antistatic agent and 18 parts of organic solvent.
The preparation method of the antistatic adhesive tape comprises the following specific steps:
(1) weighing raw materials for curing the bonding layer according to the parts by weight;
(2) uniformly mixing an acrylic resin solvent type pressure-sensitive adhesive, silver-nickel-zinc powder, a dispersing agent and an antistatic agent according to the proportion, standing and aging for 8 hours, then stirring, vacuumizing and defoaming, wherein the stirring speed is 80r/min, the vacuum degree is 0.2MPa, and finally adding the organic solvent, stirring and uniformly mixing to obtain the antistatic adhesive;
(3) putting the ethyl silicate paint, the epoxy resin, the organic silicon rubber, the bonding resin, the photoinitiator, the antistatic adhesive, the toughening agent, the polyester emulsion and the platinum catalyst emulsion into a mixer at normal temperature and normal pressure, mixing, and stirring uniformly in a closed manner to complete mixing;
(4) placing the mixed material and the antistatic adhesive into a tray, transferring the tray to a three-roller grinding machine for grinding, and cooling by adopting jacket circulating cooling water, wherein the temperature is controlled to be 30 ℃;
(5) the material after the grinding shifts moisture in the desorption material in the reation kettle through changeing the storage bucket, starts the stirring of stirring facility in the reation kettle, and reation kettle presss from both sides cover electric heating rod and begins the heating, and when heating temperature reached 80 ℃, the vacuum pump was started and vacuum dehydration was carried out, and the dehydration condition is: at 100 ℃, 4 hours, and naturally cooling the materials after dehydration;
(6) transferring the naturally cooled material to a glue preparation filling machine in a packaging workshop through a material transferring barrel, directly adding a curing cross-linking agent into a galvanized iron barrel, and hermetically stirring uniformly to prepare a curing adhesive;
(7) uniformly coating the prepared cured adhesive on one side of a base material, placing the base material into a constant temperature box with an ultraviolet lamp, and curing and crosslinking for 5 min;
(9) and covering a layer of release film on the surface of the cured bonding layer, and curing at constant temperature for 2d to obtain the finished product of the antistatic adhesive tape.
Example 4
An antistatic adhesive tape comprises a substrate, a curing adhesive layer coated on the substrate and a release film coated on the curing adhesive layer; the curing adhesive layer comprises the following raw materials in parts by weight: 18 parts of ethyl silicate coating, 95 parts of epoxy resin, 4.5 parts of organic silicon rubber, 75 parts of bonding resin, 4.5 parts of photoinitiator, 5.5 parts of curing cross-linking agent, 77.5 parts of antistatic adhesive, 14 parts of flexibilizer, 28 parts of polyester emulsion and 9 parts of platinum catalyst emulsion; the antistatic adhesive comprises the following raw materials in parts by weight: 38 parts of acrylic resin pressure-sensitive adhesive, 6.5 parts of silver-nickel-zinc powder, 4.5 parts of dispersing agent, 9.5 parts of antistatic agent and 19 parts of organic solvent.
The preparation method of the antistatic adhesive tape comprises the following specific steps:
(1) weighing raw materials for curing the bonding layer according to the parts by weight;
(2) uniformly mixing an acrylic resin solvent type pressure-sensitive adhesive, silver-nickel-zinc powder, a dispersing agent and an antistatic agent according to the proportion, standing and ageing for 9 hours, then stirring, vacuumizing and defoaming, wherein the stirring speed is 85r/min, the vacuum degree is 0.25MPa, and finally adding the organic solvent, stirring and uniformly mixing to obtain the antistatic adhesive;
(3) putting the ethyl silicate paint, the epoxy resin, the organic silicon rubber, the bonding resin, the photoinitiator, the antistatic adhesive, the toughening agent, the polyester emulsion and the platinum catalyst emulsion into a mixer at normal temperature and normal pressure, mixing, and stirring uniformly in a closed manner to complete mixing;
(4) placing the mixed material and the antistatic adhesive into a tray, transferring the tray to a three-roller grinding machine for grinding, and cooling by adopting jacket circulating cooling water, wherein the temperature is controlled to be 32 ℃;
(5) the material after the grinding shifts moisture in the desorption material in the reation kettle through changeing the storage bucket, starts the stirring of stirring facility in the reation kettle, and reation kettle presss from both sides cover electric heating rod and begins the heating, and when heating temperature reached 85 ℃, the vacuum pump was started and vacuum dehydration was carried out, and the dehydration condition is: at 110 ℃, 4.5 hours, and naturally cooling the materials after dehydration;
(6) transferring the naturally cooled material to a glue preparation filling machine in a packaging workshop through a material transferring barrel, directly adding a curing cross-linking agent into a galvanized iron barrel, and hermetically stirring uniformly to prepare a curing adhesive;
(7) uniformly coating the prepared cured adhesive on one side of a base material, and then placing the base material into a constant temperature box with an ultraviolet lamp for curing and crosslinking for 5.5 min;
(9) and covering a layer of release film on the surface of the cured bonding layer, and curing at constant temperature for 2.5d to obtain the finished product of the antistatic adhesive tape.
Example 5
An antistatic adhesive tape comprises a substrate, a curing adhesive layer coated on the substrate and a release film coated on the curing adhesive layer; the curing adhesive layer comprises the following raw materials in parts by weight: 20 parts of ethyl silicate coating, 100 parts of epoxy resin, 5 parts of organic silicon rubber, 80 parts of bonding resin, 5 parts of photoinitiator, 6 parts of curing cross-linking agent, 82 parts of antistatic adhesive, 15 parts of toughening agent, 30 parts of polyester emulsion and 10 parts of platinum catalyst emulsion; the antistatic adhesive comprises the following raw materials in parts by weight: 40 parts of acrylic resin pressure-sensitive adhesive, 7 parts of silver-nickel-zinc powder, 5 parts of dispersing agent, 10 parts of antistatic agent and 20 parts of organic solvent.
The preparation method of the antistatic adhesive tape comprises the following specific steps:
(1) weighing raw materials for curing the bonding layer according to the parts by weight;
(2) uniformly mixing an acrylic resin solvent type pressure-sensitive adhesive, silver-nickel-zinc powder, a dispersing agent and an antistatic agent according to the proportion, standing for 10 hours, stirring, vacuumizing and defoaming, wherein the stirring speed is 90r/min, the vacuum degree is 0.3MPa, and finally adding the organic solvent, stirring and uniformly mixing to obtain the antistatic adhesive;
(3) putting the ethyl silicate paint, the epoxy resin, the organic silicon rubber, the bonding resin, the photoinitiator, the antistatic adhesive, the toughening agent, the polyester emulsion and the platinum catalyst emulsion into a mixer at normal temperature and normal pressure, mixing, and stirring uniformly in a closed manner to complete mixing;
(4) placing the mixed material and the antistatic adhesive into a tray, transferring the tray to a three-roller grinding machine for grinding, and cooling by adopting jacket circulating cooling water, wherein the temperature is controlled to be 35 ℃;
(5) the material after the grinding shifts moisture in the desorption material in the reation kettle through changeing the storage bucket, starts the stirring of stirring facility in the reation kettle, and reation kettle presss from both sides cover electric heating rod and begins the heating, and when heating temperature reached 90 ℃, the vacuum pump was started and vacuum dehydration was carried out, and the dehydration condition is: at 120 ℃ for 5 hours, and naturally cooling the materials after dehydration;
(6) transferring the naturally cooled material to a glue preparation filling machine in a packaging workshop through a material transferring barrel, directly adding a curing cross-linking agent into a galvanized iron barrel, and hermetically stirring uniformly to prepare a curing adhesive;
(7) uniformly coating the prepared cured adhesive on one side of a base material, placing the base material into a constant temperature box with an ultraviolet lamp, and curing and crosslinking for 6 min;
(9) and covering a layer of release film on the surface of the cured bonding layer, and curing at constant temperature for 3d to obtain the finished product of the antistatic adhesive tape.
Through reasonable formula design, the prepared adhesive tape integrates excellent antistatic property and conductive property, has the advantage of good bonding property, has good thermal stability, can be unchanged for several years at room temperature or higher temperature, is not influenced by environmental humidity, can normally play an antistatic role at high temperature, and is fast in curing, safe and reliable.
Although the preferred embodiments of the present patent have been described in detail, the present patent is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present patent within the knowledge of those skilled in the art.

Claims (5)

1. The antistatic adhesive tape is characterized by comprising a substrate, a cured adhesive layer coated on the substrate and a release film coated on the cured adhesive layer; the curing adhesive layer comprises the following raw materials in parts by weight: 10-20 parts of ethyl silicate coating, 80-100 parts of epoxy resin, 3-5 parts of organic silicon rubber, 60-80 parts of bonding resin, 3-5 parts of photoinitiator, 4-6 parts of curing cross-linking agent, 61-82 parts of antistatic adhesive, 10-15 parts of flexibilizer, 20-30 parts of polyester emulsion and 5-10 parts of platinum catalyst emulsion; the antistatic adhesive comprises the following raw materials in parts by weight: 30-40 parts of acrylic resin pressure-sensitive adhesive, 5-7 parts of silver-nickel-zinc powder, 3-5 parts of dispersing agent, 8-10 parts of antistatic agent and 15-20 parts of organic solvent.
2. The antistatic tape of claim 1 wherein the cured adhesive layer comprises the following raw materials in parts by weight: 12-18 parts of ethyl silicate coating, 85-95 parts of epoxy resin, 3.5-4.5 parts of organic silicon rubber, 65-75 parts of bonding resin, 3.5-4.5 parts of photoinitiator, 4.5-5.5 parts of curing cross-linking agent, 65.5-77.5 parts of antistatic adhesive, 11-14 parts of toughening agent, 22-28 parts of polyester emulsion and 6-9 parts of platinum catalyst emulsion; the antistatic adhesive comprises the following raw materials in parts by weight: 32-38 parts of acrylic resin pressure-sensitive adhesive, 5.5-6.5 parts of silver-nickel-zinc powder, 3.5-4.5 parts of dispersant, 8.5-9.5 parts of antistatic agent and 16-19 parts of organic solvent.
3. The antistatic tape of claim 1 wherein the cured adhesive layer comprises the following raw materials in parts by weight: 15 parts of ethyl silicate coating, 90 parts of epoxy resin, 4 parts of organic silicon rubber, 70 parts of bonding resin, 4 parts of photoinitiator, 5 parts of curing cross-linking agent, 72 parts of antistatic adhesive, 12 parts of toughening agent, 25 parts of polyester emulsion and 8 parts of platinum catalyst emulsion; the antistatic adhesive comprises the following raw materials in parts by weight: 35 parts of acrylic resin pressure-sensitive adhesive, 6 parts of silver-nickel-zinc powder, 4 parts of dispersing agent, 9 parts of antistatic agent and 18 parts of organic solvent.
4. The antistatic tape of any one of claims 1 to 3 wherein the substrate is a polyimide film.
5. A method for preparing an antistatic adhesive tape according to any one of claims 1 to 3, characterized by comprising the following steps:
(1) weighing raw materials for curing the bonding layer according to the parts by weight;
(2) uniformly mixing an acrylic resin solvent type pressure-sensitive adhesive, silver-nickel-zinc powder, a dispersing agent and an antistatic agent according to the proportion, standing and ageing for 6-10 hours, then stirring, vacuumizing and defoaming, wherein the stirring speed is 70-90r/min, the vacuum degree is 0.1-0.3MPa, and finally adding the organic solvent, stirring and uniformly mixing to obtain the antistatic adhesive;
(3) putting the ethyl silicate paint, the epoxy resin, the organic silicon rubber, the bonding resin, the photoinitiator, the antistatic adhesive, the toughening agent, the polyester emulsion and the platinum catalyst emulsion into a mixer at normal temperature and normal pressure, mixing, and stirring uniformly in a closed manner to complete mixing;
(4) placing the mixed material and the antistatic adhesive into a tray, transferring the tray to a three-roller grinding machine for grinding, and cooling by adopting jacket circulating cooling water, wherein the temperature is controlled to be 25-35 ℃;
(5) the material after grinding shifts to desorption moisture in the reation kettle through changeing the storage bucket, starts the stirring of stirring facility in the reation kettle, and reation kettle presss from both sides cover electric heating rod and begins the heating, and when heating temperature reached 70-90 ℃, the vacuum pump was started and vacuum dehydration was carried out, and the dehydration condition is: at 80-120 ℃ for 3-5h, naturally cooling the material after dehydration;
(6) transferring the naturally cooled material to a glue preparation filling machine in a packaging workshop through a material transferring barrel, directly adding a curing cross-linking agent into a galvanized iron barrel, and hermetically stirring uniformly to prepare a curing adhesive;
(7) uniformly coating the prepared cured adhesive on one side of a base material, and then placing the base material into a constant temperature box with an ultraviolet lamp for curing and crosslinking for 4-6 min;
(9) and covering a layer of release film on the surface of the cured bonding layer, and curing at constant temperature for 1-3d to obtain the finished product of the antistatic adhesive tape.
CN202011554232.3A 2020-12-24 2020-12-24 Antistatic adhesive tape and preparation method thereof Withdrawn CN112694844A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202011554232.3A CN112694844A (en) 2020-12-24 2020-12-24 Antistatic adhesive tape and preparation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202011554232.3A CN112694844A (en) 2020-12-24 2020-12-24 Antistatic adhesive tape and preparation method thereof

Publications (1)

Publication Number Publication Date
CN112694844A true CN112694844A (en) 2021-04-23

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202011554232.3A Withdrawn CN112694844A (en) 2020-12-24 2020-12-24 Antistatic adhesive tape and preparation method thereof

Country Status (1)

Country Link
CN (1) CN112694844A (en)

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Application publication date: 20210423