CN112694716A - Double-component epoxy resin anhydride curing agent for solid insulation cabinet and preparation method thereof - Google Patents
Double-component epoxy resin anhydride curing agent for solid insulation cabinet and preparation method thereof Download PDFInfo
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- CN112694716A CN112694716A CN202110029645.8A CN202110029645A CN112694716A CN 112694716 A CN112694716 A CN 112694716A CN 202110029645 A CN202110029645 A CN 202110029645A CN 112694716 A CN112694716 A CN 112694716A
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- 150000008064 anhydrides Chemical class 0.000 title claims abstract description 44
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 44
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 44
- 239000003795 chemical substances by application Substances 0.000 title claims abstract description 43
- 238000009413 insulation Methods 0.000 title claims abstract description 17
- 238000002360 preparation method Methods 0.000 title claims abstract description 16
- 239000007787 solid Substances 0.000 title claims abstract description 15
- 239000000463 material Substances 0.000 claims abstract description 28
- 239000012745 toughening agent Substances 0.000 claims abstract description 17
- 239000003085 diluting agent Substances 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 11
- 238000003756 stirring Methods 0.000 claims description 24
- 239000000203 mixture Substances 0.000 claims description 12
- 229920000570 polyether Polymers 0.000 claims description 8
- 239000002994 raw material Substances 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 6
- 239000004593 Epoxy Substances 0.000 claims description 5
- 239000000945 filler Substances 0.000 claims description 5
- 229920000459 Nitrile rubber Polymers 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000011258 core-shell material Substances 0.000 claims description 4
- 239000004843 novolac epoxy resin Substances 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 4
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 claims description 3
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 claims description 3
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 claims description 3
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 claims description 3
- CAQWNKXTMBFBGI-UHFFFAOYSA-N C.[Na] Chemical compound C.[Na] CAQWNKXTMBFBGI-UHFFFAOYSA-N 0.000 claims description 3
- 239000004841 bisphenol A epoxy resin Substances 0.000 claims description 3
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 claims description 3
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 claims description 3
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical group C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 239000004842 bisphenol F epoxy resin Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 6
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 239000003607 modifier Substances 0.000 description 3
- YSUQLAYJZDEMOT-UHFFFAOYSA-N 2-(butoxymethyl)oxirane Chemical compound CCCCOCC1CO1 YSUQLAYJZDEMOT-UHFFFAOYSA-N 0.000 description 2
- DENMGZODXQRYAR-UHFFFAOYSA-N 2-(dimethylamino)ethanethiol Chemical compound CN(C)CCS DENMGZODXQRYAR-UHFFFAOYSA-N 0.000 description 2
- CPHGOBGXZQKCKI-UHFFFAOYSA-N 4,5-diphenyl-1h-imidazole Chemical compound N1C=NC(C=2C=CC=CC=2)=C1C1=CC=CC=C1 CPHGOBGXZQKCKI-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 238000007872 degassing Methods 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 229920005862 polyol Polymers 0.000 description 2
- 150000003077 polyols Chemical class 0.000 description 2
- 238000011417 postcuring Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- AYHLPQOWRMPEKH-UHFFFAOYSA-N 2-(6-methylheptoxymethyl)oxirane Chemical compound CC(C)CCCCCOCC1CO1 AYHLPQOWRMPEKH-UHFFFAOYSA-N 0.000 description 1
- SHKUUQIDMUMQQK-UHFFFAOYSA-N 2-[4-(oxiran-2-ylmethoxy)butoxymethyl]oxirane Chemical compound C1OC1COCCCCOCC1CO1 SHKUUQIDMUMQQK-UHFFFAOYSA-N 0.000 description 1
- YSWBFLWKAIRHEI-UHFFFAOYSA-N 4,5-dimethyl-1h-imidazole Chemical compound CC=1N=CNC=1C YSWBFLWKAIRHEI-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 150000005215 alkyl ethers Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003000 extruded plastic Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002991 molded plastic Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4215—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4223—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C08L63/04—Epoxynovolacs
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
Abstract
The invention provides a two-component epoxy resin anhydride curing agent for a solid insulation cabinet and a preparation method thereof, wherein the two-component epoxy resin anhydride curing agent comprises a component A and a component B, wherein the component A comprises 80-100 parts of epoxy resin, 5-15 parts of a toughening agent and 5-20 parts of an active diluent by weight; the component B comprises 70-90 parts of anhydride curing agent, 5-20 parts of flexibilizer and 0.3-5.1 parts of accelerator. The invention has the following beneficial effects: compared with the A/B material used in the traditional pressure gel (APG) process, the prepared special two-component epoxy resin anhydride curing agent for the solid insulation cabinet has obviously improved performance, can be more suitable for the production of the solid insulation cabinet with a complex structure, has the mechanical strength equivalent to that of CW/HW 229 of imported Hensman, has greatly reduced cost compared with the CW/HW 229 of imported Hensman, and has better market potential. Therefore, the two-component epoxy resin anhydride curing agent has better comprehensive performance.
Description
Technical Field
The invention belongs to the field of curing agents, and particularly relates to a two-component epoxy resin anhydride curing agent for a solid insulation cabinet and a preparation method thereof.
Background
The solid insulation cabinet is a new product which is formed in the insulation part industry in these years, is applied to an electric ring main unit, has a complex internal structure, has a plurality of inserts and copper plates, is thin in wall and has high requirements on epoxy resin and anhydride curing agent.
The formulations of epoxy resin and anhydride curing agent AB materials for insulation parts in the market at present are many, but the formulations are not suitable for a solid insulation cabinet product, and a common AB material product is easy to crack, is further modified, has high viscosity, reduces the addition amount of fillers and greatly increases the cost.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides the two-component epoxy resin anhydride curing agent for the solid insulation cabinet and the preparation method thereof.
The technical scheme for solving the technical problems is as follows: the raw materials of the two-component epoxy resin anhydride curing agent comprise a component A and a component B, and the component A comprises 80-100 parts of epoxy resin, 5-15 parts of a toughening agent and 5-20 parts of an active diluent by weight; the component B comprises 70-90 parts of anhydride curing agent, 5-20 parts of flexibilizer and 0.3-5.1 parts of accelerator.
The invention is further provided that the epoxy resin is one or a mixture of any more of bisphenol A type epoxy resin, bisphenol F type epoxy resin and novolac epoxy resin.
The invention is further configured that the anhydride curing agent is one or a mixture of any more of methyl tetrahydrophthalic anhydride, methyl hexahydrophthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride and methyl sodium dick anhydride.
The invention is further set that the toughening agent is one or a mixture of any more of polyethers, nitrile rubbers and core-shell particles.
The invention is further provided that the accelerator is one of N, N-dimethylbenzylamine, 2,4, 6-tri- (dimethylaminomethyl) phenol and imidazole.
The invention is further configured such that the reactive diluent is a glycidyl ether epoxy diluent.
The invention is further set that the two-component epoxy resin anhydride curing agent for the solid insulation cabinet further comprises a modifier N, N-dimethyl-2-mercaptoethylamine.
The invention also provides a preparation method of the two-component epoxy resin anhydride curing agent, which comprises the following steps:
preparation of the component A: putting the epoxy resin and the toughening agent into a reaction kettle, starting stirring, slowly heating to 70-100 ℃, simultaneously slowly adjusting the rotating speed to 100 plus materials at 300rpm/min, vacuumizing for 1-2 hours, cooling to below 60 ℃, closing the vacuum, putting the active diluent, and continuously stirring to obtain a component A;
b, preparation of a component: adding an anhydride curing agent, a toughening agent and an accelerant into a reaction kettle, starting stirring, heating to 90-130 ℃, preserving heat, vacuumizing for 1-2 hours, cooling to below 60 ℃, adding the accelerant, and continuously stirring to obtain the component B.
The invention is further set that in the preparation of the component A, the temperature is slowly raised to 70-100 ℃, and the mixture is stirred for 0.5-1.5 hours at normal temperature, and the rotating speed is 50-100 rpm/min; after the reactive diluent is added, stirring is continued for 0.5 to 1.5 hours and then the reaction is stopped.
The invention is further arranged that in the preparation of the component B, the mixture is stirred for 0.5 to 1.5 hours at normal temperature with the rotating speed of 100-300rpm/min before the temperature is raised to 90 to 130 ℃; after the accelerator is added, stirring is continued for 0.5-1.5 hours and then the stirring is stopped.
The invention also provides a using method of the two-component epoxy resin anhydride curing agent, which comprises the following steps: the component B comprises: putting the silica powder filler (80-120) = (80-120): (300-; preheating the mold to 120-180 ℃, injecting the uniformly mixed material into the mold, opening the mold for 10-60 minutes, transferring the cured product to an oven at 100-160 ℃, and then curing for more than 6 hours.
In conclusion, the invention has the following beneficial effects: compared with the A/B material used in the traditional pressure gel (APG) process, the prepared special two-component epoxy resin anhydride curing agent for the solid insulation cabinet has obviously improved performance, can be more suitable for the production of the solid insulation cabinet with a complex structure, has the mechanical strength equivalent to that of CW/HW 229 of imported Hensman, has greatly reduced cost compared with the CW/HW 229 of imported Hensman, and has better market potential. Therefore, the two-component epoxy resin anhydride curing agent has better comprehensive performance.
Detailed Description
The technical solutions in the embodiments of the present invention are clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
The raw materials of the two-component epoxy resin anhydride curing agent comprise a component A and a component B, and the component A comprises 100 parts of bisphenol A epoxy resin, 5 parts of polyether polyol 330n and 5 parts of isooctyl glycidyl ether epoxy active diluent 746; the component B comprises 72 parts of methyl tetrahydrophthalic anhydride, 17 parts of polyether polyol 330N and 4 parts of N, N-dimethylbenzylamine.
Example 2
The raw materials of the two-component epoxy resin anhydride curing agent comprise a bisphenol F type A component and a bisphenol F type B component, and the component A comprises 80 parts of epoxy resin, 15 parts of V1300x nitrile rubber epoxy flexibilizer and 20 parts of glycidyl 12-14 alkyl ether by weight; the component B comprises 88 parts of methyl hexahydrophthalic anhydride, 18 parts of V1300x nitrile rubber epoxy flexibilizer and 3 parts of 2,4, 6-tri- (dimethylaminomethyl) phenol.
Example 3
The raw materials of the two-component epoxy resin anhydride curing agent comprise a component A and a component B, and the component A comprises 90 parts by weight of novolac epoxy resin, 10 parts by weight of organosilicon core-shell particle toughening agent and 12 parts by weight of butyl glycidyl ether; the component B comprises 80 parts of tetrahydrophthalic anhydride, 14 parts of organosilicon core-shell particle toughening agent and 2 parts of dimethyl imidazole.
Example 4
The raw materials of the two-component epoxy resin anhydride curing agent comprise a component A and a component B, and the component A comprises 95 parts of bisphenol A epoxy resin, 9 parts of polyether alcohol toughening agent BP-65 and 15 parts of 1, 4-butanediol diglycidyl ether according to parts by weight; the component B comprises 7 parts of methyl sodium dick anhydride, 5 parts of polyether alcohol toughening agent BP-65 and 0.3 part of diphenyl imidazole.
Example 5
The raw materials of the two-component epoxy resin anhydride curing agent comprise a component A and a component B, wherein the component A comprises 85 parts of novolac epoxy resin, 12 parts of polyether alcohol toughening agent BP-65 and 18 parts of butyl glycidyl ether; the component B comprises 90 parts of hexahydrophthalic anhydride, 20 parts of polyether alcohol toughening agent BP-65 and 5.1 parts of diphenyl imidazole.
Example 6
On the basis of example 5, different from example 5, the component A also comprises N, N-dimethyl-2-mercaptoethylamine as a modifier.
The above examples 1 to 6 were arranged as follows:
preparation of the component A: putting the epoxy resin and the toughening agent into a reaction kettle, starting stirring, stirring at normal temperature for 1 hour at the rotating speed of 70rpm/min, slowly heating to 90 ℃, meanwhile, slowly adjusting the rotating speed to 200rpm/min, vacuumizing for 1 hour, cooling to below 60 ℃, closing the vacuum, adding the active diluent (in the embodiment 6, the modifier is also needed to be added), continuously stirring for 1 hour, and stopping to obtain a component A;
b, preparation of a component: adding an anhydride curing agent, a toughening agent and an accelerant into a reaction kettle, starting stirring, stirring at normal temperature for 1 hour at the rotating speed of 200rpm/min, heating to 100 ℃, preserving heat, vacuumizing for 1 hour, cooling to below 60 ℃, adding the accelerant, continuing stirring for 1 hour, and stopping to obtain the component B.
Secondly, mixing the component A and the component B after the configuration according to the following method:
according to the component A: the component B comprises: putting the silicon micro powder filler =100: 100: 330 into a stirring tank, starting stirring, controlling the temperature at 35 ℃, and degassing for 150 minutes under vacuum of 200 Pa; preheating the mold to 160 ℃, injecting the uniformly mixed material into the mold, opening the mold for 30 minutes, transferring the cured product to a 140 ℃ oven, and post-curing for more than 6 hours.
Respectively obtaining a material 1, a material 2, a material 3, a material 4, a material 5 and a material 6.
Thirdly, AL-928A/B and CW/HW 229 are respectively mixed and reacted according to the following methods:
according to the component C: putting the silicon micro powder filler =200: 330 into a stirring tank in proportion, starting stirring, controlling the temperature at 35 ℃, vacuumizing at 200Pa, and degassing for 150 minutes; preheating the mold to 160 ℃, injecting the uniformly mixed material into the mold, opening the mold for 30 minutes, transferring the cured product to a 140 ℃ oven, and post-curing for more than 6 hours. Wherein the component C is AL-928A/B or CW/HW 229, and the final products are respectively material 7 and material 8.
Compared with the prior mature APG process formula material AL-928A/B (domestic) and imported material CW/HW 229 (imported abroad), the mechanical strength of the cured product of the invention is as follows:
| item | Material 1 | Material 2 | Material 3 | Material 4 | Material 5 | Material 6 | Material 7 | Material 8 |
| Impact strength KJ/M2 | 11.7 | 12.2 | 11.9 | 13.5 | 13.2 | 13.6 | 11.6 | 10.2 |
| Tensile strength MPa | 74.5 | 79.6 | 82.6 | 80.1 | 80.2 | 81.0 | 67.4 | 76.8 |
| Bending strength MPa | 127.6 | 126.8 | 129.6 | 130.3 | 129.2 | 129.3 | 115.2 | 128.9 |
As can be seen from the table, compared with AL-928A/B used in the traditional pressure gel (APG) process, the special two-component epoxy resin anhydride curing agent for the solid insulation cabinet, prepared by the invention, has obviously improved performance, can be more suitable for the production of the solid insulation cabinet with a complex structure, has the mechanical strength equivalent to that of CW/HW 229 of imported Hensman, has greatly reduced cost compared with the cost, and has better market potential.
Tensile Strength determination according to "tensile Properties of GBT 1040.2-2006 plastics part 2: test conditions for molded and extruded plastics "; the bending strength is measured according to ISO-178-; the hit intensity is determined according to' GBT 1043.1-2008: and (4) measuring.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (10)
1. The two-component epoxy resin anhydride curing agent for the solid insulation cabinet is characterized in that the raw materials of the two-component epoxy resin anhydride curing agent comprise a component A and a component B, and the component A comprises 80-100 parts of epoxy resin, 5-15 parts of a toughening agent and 5-20 parts of an active diluent by weight; the component B comprises 70-90 parts of anhydride curing agent, 5-20 parts of flexibilizer and 0.3-5.1 parts of accelerator.
2. The two-component epoxy resin anhydride curing agent according to claim 1, wherein the epoxy resin is one or a mixture of any two of bisphenol A epoxy resin, bisphenol F epoxy resin and novolac epoxy resin.
3. The two-component epoxy resin anhydride curing agent of claim 1, wherein the anhydride curing agent is one or a mixture of several of methyl tetrahydrophthalic anhydride, methyl hexahydrophthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride and methyl sodium dick anhydride.
4. The two-component epoxy resin anhydride curing agent of claim 1, wherein the toughening agent is one or a mixture of any two of polyethers, nitrile rubbers and core-shell particles.
5. The two-component epoxy resin anhydride curing agent according to claim 1, wherein the accelerator is one of N, N-dimethylbenzylamine, 2,4, 6-tris- (dimethylaminomethyl) phenol, and imidazole.
6. The two-part epoxy resin anhydride curing agent of claim 1, wherein the reactive diluent is a glycidyl ether based epoxy diluent.
7. The method for preparing the two-component epoxy resin anhydride curing agent according to any one of claims 1 to 6, comprising the steps of:
preparation of the component A: putting the epoxy resin and the toughening agent into a reaction kettle, starting stirring, slowly heating to 70-100 ℃, simultaneously slowly adjusting the rotating speed to 100 plus materials at 300rpm/min, vacuumizing for 1-2 hours, cooling to below 60 ℃, closing the vacuum, putting the active diluent, and continuously stirring to obtain a component A;
b, preparation of a component: adding an anhydride curing agent, a toughening agent and an accelerant into a reaction kettle, starting stirring, heating to 90-130 ℃, preserving heat, vacuumizing for 1-2 hours, cooling to below 60 ℃, adding the accelerant, and continuously stirring to obtain the component B.
8. The use method of the two-component epoxy resin anhydride curing agent according to claim 7, wherein in the preparation of the component A, the mixture is slowly heated to 70-100 ℃ and stirred at normal temperature for 0.5-1.5 hours at the rotation speed of 50-100 rpm/min; after the reactive diluent is added, stirring is continued for 0.5 to 1.5 hours and then the reaction is stopped.
9. The method for using the two-component epoxy resin anhydride curing agent as claimed in claim 7, wherein in the preparation of the component B, the mixture is stirred at normal temperature for 0.5-1.5 hours at a rotation speed of 100-300rpm/min before being heated to 90-130 ℃; after the accelerator is added, stirring is continued for 0.5-1.5 hours and then the stirring is stopped.
10. The use method of the two-component epoxy resin anhydride curing agent according to claim 7, characterized in that the curing agent comprises the following components in percentage by weight: the component B comprises: putting the silica powder filler (80-120) = (80-120): (300-; preheating the mold to 120-180 ℃, injecting the uniformly mixed material into the mold, opening the mold for 10-60 minutes, transferring the cured product to an oven at 100-160 ℃, and then curing for more than 6 hours.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110029645.8A CN112694716A (en) | 2021-01-11 | 2021-01-11 | Double-component epoxy resin anhydride curing agent for solid insulation cabinet and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110029645.8A CN112694716A (en) | 2021-01-11 | 2021-01-11 | Double-component epoxy resin anhydride curing agent for solid insulation cabinet and preparation method thereof |
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| CN112694716A true CN112694716A (en) | 2021-04-23 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103963200A (en) * | 2014-04-23 | 2014-08-06 | 南通东源互感器制造有限公司 | Pouring method for current transformer |
| CN107629412A (en) * | 2017-09-29 | 2018-01-26 | 安徽众博新材料有限公司 | High-strength epoxy insulator material and preparation method thereof |
| CN110698814A (en) * | 2019-10-09 | 2020-01-17 | 安徽众博新材料有限公司 | Anhydride cured epoxy resin-silicon micro powder composite material for processing low-voltage electrical products |
| CN111393800A (en) * | 2020-05-02 | 2020-07-10 | 精功（绍兴）复合材料有限公司 | Epoxy resin suitable for pultrusion process and carbon fiber composite material thereof |
-
2021
- 2021-01-11 CN CN202110029645.8A patent/CN112694716A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103963200A (en) * | 2014-04-23 | 2014-08-06 | 南通东源互感器制造有限公司 | Pouring method for current transformer |
| CN107629412A (en) * | 2017-09-29 | 2018-01-26 | 安徽众博新材料有限公司 | High-strength epoxy insulator material and preparation method thereof |
| CN110698814A (en) * | 2019-10-09 | 2020-01-17 | 安徽众博新材料有限公司 | Anhydride cured epoxy resin-silicon micro powder composite material for processing low-voltage electrical products |
| CN111393800A (en) * | 2020-05-02 | 2020-07-10 | 精功（绍兴）复合材料有限公司 | Epoxy resin suitable for pultrusion process and carbon fiber composite material thereof |
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Application publication date: 20210423 |