CN112693190A - Surface structure and preparation method thereof - Google Patents
Surface structure and preparation method thereof Download PDFInfo
- Publication number
- CN112693190A CN112693190A CN202110005059.XA CN202110005059A CN112693190A CN 112693190 A CN112693190 A CN 112693190A CN 202110005059 A CN202110005059 A CN 202110005059A CN 112693190 A CN112693190 A CN 112693190A
- Authority
- CN
- China
- Prior art keywords
- layer
- cooling
- surface structure
- gas
- equal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002360 preparation method Methods 0.000 title abstract description 7
- 239000010410 layer Substances 0.000 claims abstract description 188
- 238000001816 cooling Methods 0.000 claims abstract description 99
- 239000002245 particle Substances 0.000 claims abstract description 32
- 230000005855 radiation Effects 0.000 claims abstract description 32
- 239000002131 composite material Substances 0.000 claims abstract description 30
- 239000011241 protective layer Substances 0.000 claims abstract description 30
- 229920003023 plastic Polymers 0.000 claims abstract description 20
- 239000004033 plastic Substances 0.000 claims abstract description 20
- 230000017525 heat dissipation Effects 0.000 claims abstract description 17
- 238000005034 decoration Methods 0.000 claims abstract description 9
- 239000011159 matrix material Substances 0.000 claims abstract description 9
- 238000005516 engineering process Methods 0.000 claims abstract description 7
- 229920000642 polymer Polymers 0.000 claims description 32
- 229910052751 metal Inorganic materials 0.000 claims description 24
- 239000002184 metal Substances 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 15
- -1 polyethylene Polymers 0.000 claims description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 10
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 claims description 8
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 7
- 229910052709 silver Inorganic materials 0.000 claims description 7
- 239000004332 silver Substances 0.000 claims description 7
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 6
- 229920000515 polycarbonate Polymers 0.000 claims description 6
- 239000004417 polycarbonate Substances 0.000 claims description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 6
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 6
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 6
- 238000007740 vapor deposition Methods 0.000 claims description 6
- 239000012790 adhesive layer Substances 0.000 claims description 5
- 238000004080 punching Methods 0.000 claims description 5
- 239000000377 silicon dioxide Substances 0.000 claims description 5
- 229920002635 polyurethane Polymers 0.000 claims description 4
- 239000004814 polyurethane Substances 0.000 claims description 4
- 235000012239 silicon dioxide Nutrition 0.000 claims description 4
- 239000004408 titanium dioxide Substances 0.000 claims description 4
- 239000004698 Polyethylene Substances 0.000 claims description 3
- 239000004793 Polystyrene Substances 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 3
- 229920000573 polyethylene Polymers 0.000 claims description 3
- 229920002223 polystyrene Polymers 0.000 claims description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 238000000151 deposition Methods 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims 1
- 230000005611 electricity Effects 0.000 abstract description 4
- 238000010521 absorption reaction Methods 0.000 description 5
- 239000000243 solution Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000001746 injection moulding Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 238000003856 thermoforming Methods 0.000 description 2
- 229920002125 Sokalan® Polymers 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/283—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysiloxanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
- B32B27/365—Layered products comprising a layer of synthetic resin comprising polyesters comprising polycarbonates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B2038/0052—Other operations not otherwise provided for
- B32B2038/0076—Curing, vulcanising, cross-linking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/102—Oxide or hydroxide
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
- B32B2307/416—Reflective
Abstract
The invention provides a surface structural part and a preparation method thereof, wherein the surface structural part comprises a plastic matrix and a cooling composite layer integrally formed with the plastic matrix, the cooling composite layer comprises a bearing layer, a cooling layer and a protective layer, wherein the bearing layer is arranged on the plastic matrix, the cooling layer is arranged on the bearing layer, the protective layer is arranged on the cooling layer, radiation heat-dissipation particles are embedded in the cooling layer, the radiation heat-dissipation particles can transmit sunlight with the wavelength of 0.3-2.5 mu m, and can emit infrared light with the wavelength of 8-13 mu m. According to the invention, the cooling layer is arranged in the surface structural part through the in-film decoration technology, so that the surface structural part can be cooled by radiation. The cooling design occupies little space, has no influence on the appearance design of the surface structural member, has wide application range, does not consume electricity, and is energy-saving and environment-friendly.
Description
Technical Field
The invention relates to the technical field of cooling, in particular to a surface structural part and a preparation method thereof.
Background
In summer, after the parked vehicle is exposed to the sun, the high temperature in the vehicle is unbearable. At present, the method for solving the high temperature in the vehicle mainly adopts an air conditioner for cooling, but the temperature in the vehicle can be reduced only after the vehicle is started and the air conditioner is started for a period of time; moreover, the air conditioner consumes extremely power for cooling, which is not beneficial to the use of the electric vehicle.
Disclosure of Invention
The invention mainly aims to provide a surface structural member, and aims to solve the problem of cooling in a vehicle parking space.
In order to achieve the above object, the present invention provides a surface structure, including a plastic substrate and a cooling composite layer integrally formed with the plastic substrate, wherein the cooling composite layer includes:
the bearing layer is arranged on the plastic base body;
the cooling layer is arranged on the bearing layer, radiation heat dissipation particles are embedded in the cooling layer, and the radiation heat dissipation particles can transmit sunlight with the wavelength of 0.3-2.5 mu m and emit infrared light with the wavelength of 8-13 mu m; and the number of the first and second groups,
and the protective layer is arranged on the cooling layer.
Optionally, the material of the radiation heat-dissipating particles comprises at least one of silicon dioxide, titanium dioxide and silicon carbide; and/or the presence of a gas in the gas,
the particle size of the radiation heat dissipation particles is D, and D is more than or equal to 1 mu m and less than or equal to 100 mu m.
Optionally, the cooling layer comprises a polymer layer, and the radiation heat dissipation particles are embedded in the polymer layer.
Optionally, the polymer layer comprises at least one of polystyrene, polyethylene, polymethyl methacrylate, and poly (4-methylpentene); and/or the presence of a gas in the gas,
the thickness of the polymer layer is H1, and H1 is more than or equal to 1 mu m and less than or equal to 500 mu m.
Optionally, the cooling layer further comprises a metal layer, and the metal layer is disposed between the polymer layer and the receiving layer.
Optionally, the material of the metal layer comprises at least one of silver, aluminum, gold and titanium; and/or the presence of a gas in the gas,
the thickness H2 of the metal layer satisfies that H2 is less than or equal to 100 mu m and less than or equal to 1000 mu m.
Optionally, the material of the protective layer comprises any one of polycarbonate, polyethylene terephthalate or polymethyl methacrylate; and/or the presence of a gas in the gas,
the material of the receiving layer comprises any one of polycarbonate, polyethylene terephthalate and polydimethylsiloxane; and/or the presence of a gas in the gas,
and bonding layers are respectively arranged between the cooling layer and the protective layer and between the cooling layer and the bearing layer.
Optionally, the material of the bonding layer includes any one of a water-based polyurethane adhesive and a polyacrylic adhesive.
The invention also provides a preparation method of the surface structural part, which comprises the following steps:
respectively forming a protective layer, a cooling layer and a bearing layer;
sequentially bonding and fixing the protective layer, the cooling layer and the bearing layer to obtain a cooling composite layer;
sequentially carrying out thermal forming and punching on the cooling composite layer to obtain a formed cooling composite layer;
and forming a plastic matrix on the forming cooling composite layer by an in-film decoration technology.
Optionally, the cooling layer comprises a polymer layer and a metal layer;
in the step of forming the protective layer, the cooling layer and the receiving layer respectively, the step of forming the cooling layer comprises the following steps:
depositing the metal layer on the polymer layer using a vapor deposition technique.
The surface structural member disclosed by the technical scheme of the invention comprises a cooling layer, wherein radiation heat dissipation particles are embedded in the cooling layer, and can transmit sunlight with the wavelength of 0.3-2.5 mu m and emit infrared light with the wavelength of 8-13 mu m. Radiation heat dissipation refers to a heat dissipation mode that an object dissipates self heat into an absolute low-temperature environment in space through waves of specific wave bands passing through an atmospheric layer. Any object will radiate infrared rays to the outside as long as it is not absolutely zero degrees, and will also absorb infrared rays. The heat carried by the infrared light with the radiation wavelength of 8-13 μm is almost perfectly absorbed by the atmosphere transmission window, namely, the light wave in the wave band can efficiently pass through the atmosphere and is not changed in the optical path to bring the heat back to the earth. The radiation heat dissipation particles have low infrared absorption rate, can excite phonon excimer with the wavelength of about 10 mu m and enhance the radiation of light waves with the wavelength of 8 mu m-13 mu m, thereby ensuring that the temperature of the surface structural member is not increased. Furthermore, according to the invention, the cooling layer is arranged in the surface structural part through the in-film decoration technology, so that the surface structural part can be cooled by radiation. The cooling design occupies little space, has no influence on the appearance design of the surface structural member, has wide application range, does not consume electricity, and is energy-saving and environment-friendly. When the sun is exposed to the sun, the temperature of the structural member in the vehicle does not rise, so that the temperature in the vehicle rises less, and the problem of cooling in the vehicle for parking the vehicle is solved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural view of an embodiment of a surface structure provided in the present invention.
The reference numbers illustrate:
reference numerals | Name (R) | Reference numerals | Name (R) |
100 | |
221 | Radiation heat-dissipating |
1 | |
222 | Polymer layer |
2 | Cooling |
223 | |
21 | Receiving |
23 | |
22 | |
24 | Adhesive layer |
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that, if directional indications (such as upper, lower, left, right, front, rear, outer and inner … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" appearing throughout includes three juxtapositions, exemplified by "A and/or B" including either A or B or both A and B. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
In order to solve the problem of cooling in a parked vehicle, the invention provides a surface structure member 100, which comprises a plastic base body 1 and a cooling composite layer 2 integrally formed with the plastic base body 1, wherein the cooling composite layer 2 comprises a bearing layer 21, a cooling layer 22 and a protective layer 23, the bearing layer 21 is arranged on the plastic base body 1, the cooling layer 22 is arranged on the bearing layer 21, the protective layer 23 is arranged on the cooling layer 22, radiation heat-dissipation particles 221 are embedded in the cooling layer 22, the radiation heat-dissipation particles 221 can transmit sunlight with the wavelength of 0.3-2.5 mu m, and can emit infrared light with the wavelength of 8-13 mu m.
Radiation heat dissipation refers to a heat dissipation mode that an object dissipates self heat into an absolute low-temperature environment in space through waves of specific wave bands passing through an atmospheric layer. Any object will radiate infrared rays to the outside as long as it is not absolutely zero degrees, and will also absorb infrared rays. The infrared light with the radiation wavelength of 8-13 μm carries the ear heat which is almost perfectly absorbed by the atmosphere transmission window, namely, the light wave of the wave band can efficiently pass through the atmosphere without changing the optical path to bring the heat back to the earth. The radiation heat-dissipating particles 221 of the present invention have a low infrared absorption rate, and can excite phonon excimer with a wavelength of about 10 μm, and enhance radiation to a light wave with a wavelength of 8 μm to 13 μm, so that the temperature of the surface structural member 100 is not excessively high. Further, in the present invention, the cooling layer 22 is disposed in the surface structure 100 by an in-film decoration technique, so that the surface structure 100 can be cooled by radiation. The cooling design occupies little space, has no influence on the appearance design of the surface structural part 100, has wide application range, does not consume electricity, and is energy-saving and environment-friendly. When the sun is exposed to the sun, the temperature of the structural member in the vehicle does not rise, so that the temperature in the vehicle rises less, and the problem of cooling in the vehicle for parking the vehicle is solved.
It should be noted that the surface structure 100 of the present invention can be applied to, but not limited to, the automotive field, and also can be applied to the fields of building, photovoltaic module, aerospace, ship, public facility, etc. For example, the method can be applied to a photovoltaic module, and can avoid the temperature rise of the photovoltaic module; the roof is applied to the public toilets, and can reduce the temperature in the toilets in summer so as to save the electricity used by the air conditioners. The surface structural member provided by the invention can realize energy-saving and environment-friendly cooling and has a wide application range.
The present invention does not limit the kind of the radiation heat-dissipating particles 221, and includes radiation heat-dissipating particles 221 commonly used in the art. In this embodiment, the material of the radiation heat-dissipating particles 221 includes at least one of silicon dioxide, titanium dioxide, and silicon carbide. Silicon dioxide, titanium dioxide and titanium carbide are polar dielectrics that can resonate with infrared light at a particular wavelength (8-13 μm) so that the heat carried by light at this wavelength (8-13 μm) is almost perfectly absorbed by the atmospheric window. Optionally, the particle size of the radiation heat-dissipating particles 221 is D, and D is greater than or equal to 1 μm and less than or equal to 100 μm. Optionally, radiation-dissipating particles 221 are transparent to further reduce absorption of infrared. In this embodiment, the radiation heat-dissipating particles 221 are preferably silica, and have a particle size of 8 μm.
Further, the temperature reduction layer 22 includes a polymer layer 222, and the radiation heat-dissipating particles 221 are embedded in the polymer layer 222. The polymer layer 222 is used to carry the radiation-dissipating particles 221, and the radiation-dissipating particles 221 are randomly distributed in the polymer layer 222 to uniformly radiate and cool the surface structure 100. The polymer layer 222 includes at least one of polystyrene, polyethylene, polymethyl methacrylate, and poly (4-methylpentene). Optionally, the polymer layer 222 has a thickness H1, satisfying 1 μm H1 ≦ 500 μm. Optionally, the polymer layer 222 is transparent to further reduce infrared absorption. In this embodiment, the polymer layer 222 is preferably poly (4-methylpentene) having a thickness of 50 μm.
In addition, the temperature reduction layer 22 further includes a metal layer 223, and the metal layer 223 is disposed between the polymer layer 222 and the receiving layer 21. The metal layer 223 has a good reflection effect, and can reflect the sunlight back to prevent the sunlight from transmitting through the metal layer 223, and simultaneously, the sunlight transmitted through the polymer layer 222 is radiated and cooled through the polymer layer 222 again, so that higher cooling efficiency is obtained. The material of the metal layer 223 includes at least one of silver, aluminum, gold, and titanium. The thickness H2 of the metal layer 223 satisfies the condition that H2 is less than or equal to 100 mu m and less than or equal to 1000 mu m. In this embodiment, the metal is preferably silver and has a thickness of 200 nm. It should be noted that the metal layer 223 may be a metal film adhered to the polymer layer 222, or the metal layer 223 may be deposited on the polymer layer 222 by using a vapor deposition technique as in the present embodiment.
The protective layer 23 has a high surface hardness of 2-3H, so as to effectively protect the cooling layer 22. The material of the protective layer 23 includes any one of polycarbonate, polyethylene terephthalate or polymethyl methacrylate, and the protective layer 23 is a plastic film commonly used in IMD (in-film decoration technology), and can be designed by printing patterns and/or touch buttons on the surface as required.
The receiving layer 21 is made of a high temperature resistant material, is arranged between the cooling layer 22 and the plastic substrate 1, and is used for injection molding the plastic substrate 1 to protect the cooling layer 22. The material of the receiving layer 21 includes any one of polycarbonate, polyethylene terephthalate, and polydimethylsiloxane. Furthermore, a graphic layer, a circuit layer and the like can be arranged between the bearing layer 21 and the cooling layer 22 according to the requirements of the surface or the function of the product.
In addition, adhesive layers 24 are respectively arranged between the cooling layer 22 and the protective layer 23, and between the cooling layer 22 and the receiving layer 21, so that the cooling layer 22, the protective layer 23 and the receiving layer 21 form the cooling composite layer 2, and the adhesive layers 24 comprise any one of aqueous polyurethane adhesives or polyacrylic acid adhesives. The aqueous polyurethane adhesive or polyacrylic adhesive is cured by ultraviolet to realize bonding. The adhesive layer 24 is preferably transparent to reduce absorption of sunlight.
The invention also provides a preparation method of the surface structural part 100, which comprises the following steps:
forming a protective layer 23, a temperature-lowering layer 22 and a receiving layer 21;
sequentially bonding and fixing the protective layer 23, the cooling layer 22 and the bearing layer 21 to obtain a cooling composite layer 2;
sequentially carrying out thermal forming and punching on the cooling composite layer 2 to obtain a formed cooling composite layer 2;
and forming a plastic matrix 1 on the forming cooling composite layer 2 by an in-film decoration technology.
The method of forming the protective layer 23, the temperature-reducing layer 22 and the receiving layer 21 is not limited in the present invention, and any technique commonly used in the art may be used. For example, the protective layer 23 and the receiving layer 21 may be formed by a roll press. The polymer layer in the cooling layer 22 may be formed by mixing the radiation-emitting particles 221 into the polymer and then using a roll-to-roll method.
The step of bonding and fixing the protective layer 23, the cooling layer 22 and the receiving layer 21 in sequence comprises the following steps:
coating an adhesive on the front surface of the receiving layer 21, bonding the cooling layer 22 on the front surface of the receiving layer 21, and performing ultraviolet curing;
and coating adhesive on the back surface of the protective layer 23, adhering the protective layer 23 to the front surface of the cooling layer 22, and performing ultraviolet curing.
In the step of sequentially thermoforming and punching the cooling composite layer 2 to obtain the formed cooling composite layer 2, the cooling composite layer 2 is formed into the shape of the surface structure member 100 by thermoforming, and then the peripheral shape is cut by punching, so that the waste material of the cooling composite layer 2 is cut off to obtain the formed cooling composite layer 2.
The step of forming the plastic matrix 1 on the forming cooling composite layer 2 by the in-film decoration technology comprises the following steps: and (3) placing the formed cooling composite layer 2 into a mold cavity for injection molding, performing injection molding on the back surface of the formed cooling composite layer 2, and solidifying to form the integrated plastic matrix 1.
When temperature reduction layer 22 further includes metal layer 223, a vapor deposition technique is used to deposit metal layer 223 on polymer layer 222. The vapor deposition technique includes physical vapor deposition technique, chemical vapor deposition technique, and plasma vapor deposition technique. Taking physical vapor deposition of a silver layer as an example, the silver is melted and vaporized by heating with a resistor, a high frequency, or an electron beam in a vacuum environment, and a silver layer is deposited on the back side of the polymer layer 222.
In addition, the cooling layer 22 is disposed in the surface structure 100, so that the cooling layer 22 can be protected, and the service life of the cooling layer 22 can be prolonged. In the present invention, the surface structure 100 is provided with the cooling layer 22 by the in-film decoration technique, so that the surface structure 100 can be cooled by radiation.
According to the preparation method, the cooling layer 22 is arranged under the protective layer 23, so that the cooling layer 22 can be prevented from being damaged, and the service life of the cooling layer 22 is prolonged; meanwhile, the appearance design of the surface structural member 100 is not affected, the application range is wide, and the energy conservation and the environmental protection are realized.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. The utility model provides a surface structure spare, its characterized in that, including the plastic base member and with plastic base member integrated into one piece's cooling composite bed, the cooling composite bed includes:
the bearing layer is arranged on the plastic base body;
the cooling layer is arranged on the bearing layer, radiation heat dissipation particles are embedded in the cooling layer, and the radiation heat dissipation particles can transmit sunlight with the wavelength of 0.3-2.5 mu m and emit infrared light with the wavelength of 8-13 mu m; and the number of the first and second groups,
and the protective layer is arranged on the cooling layer.
2. The surface structure of claim 1, wherein the material of the radiation-dissipating particles comprises at least one of silicon dioxide, titanium dioxide, and silicon carbide; and/or the presence of a gas in the gas,
the particle size of the radiation heat dissipation particles is D, and D is more than or equal to 1 mu m and less than or equal to 100 mu m.
3. The surface structure of claim 1, wherein the cooling layer comprises a polymer layer, and the radiation-dissipating particles are embedded in the polymer layer.
4. The surface structure of claim 3, wherein the polymer layer comprises at least one of polystyrene, polyethylene, polymethyl methacrylate, and poly (4-methylpentene); and/or the presence of a gas in the gas,
the thickness of the polymer layer is H1, and H1 is more than or equal to 1 mu m and less than or equal to 500 mu m.
5. The surface structure of claim 3, wherein the cooling layer further comprises a metal layer disposed between the polymer layer and the receiving layer.
6. The surface structure of claim 5, wherein the material of the metal layer comprises at least one of silver, aluminum, gold, and titanium; and/or the presence of a gas in the gas,
the thickness H2 of the metal layer satisfies that H2 is less than or equal to 100 mu m and less than or equal to 1000 mu m.
7. The surface structure of claim 1, wherein the material of the protective layer comprises any one of polycarbonate, polyethylene terephthalate, or polymethyl methacrylate; and/or the presence of a gas in the gas,
the material of the receiving layer comprises any one of polycarbonate, polyethylene terephthalate and polydimethylsiloxane; and/or the presence of a gas in the gas,
and bonding layers are respectively arranged between the cooling layer and the protective layer and between the cooling layer and the bearing layer.
8. The surface structure according to claim 7, wherein the material of the adhesive layer comprises any one of a water-based polyurethane adhesive and a polyacrylic adhesive.
9. A method for preparing a surface structure is characterized by comprising the following steps:
respectively forming a protective layer, a cooling layer and a bearing layer;
sequentially bonding and fixing the protective layer, the cooling layer and the bearing layer to obtain a cooling composite layer;
sequentially carrying out thermal forming and punching on the cooling composite layer to obtain a formed cooling composite layer;
and forming a plastic matrix on the forming cooling composite layer by an in-film decoration technology.
10. The method of manufacturing a surface structure according to claim 9, wherein the cooling layer comprises a polymer layer and a metal layer;
in the step of forming the protective layer, the cooling layer and the receiving layer respectively, the step of forming the cooling layer comprises the following steps:
depositing the metal layer on the polymer layer using a vapor deposition technique.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110005059.XA CN112693190A (en) | 2021-01-04 | 2021-01-04 | Surface structure and preparation method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110005059.XA CN112693190A (en) | 2021-01-04 | 2021-01-04 | Surface structure and preparation method thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
CN112693190A true CN112693190A (en) | 2021-04-23 |
Family
ID=75514598
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202110005059.XA Pending CN112693190A (en) | 2021-01-04 | 2021-01-04 | Surface structure and preparation method thereof |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN112693190A (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008154692A1 (en) * | 2007-06-19 | 2008-12-24 | University Of Technology, Sydney | An element for emission of thermal radiation |
CN108769342A (en) * | 2018-05-04 | 2018-11-06 | 珠海格力电器股份有限公司 | A kind of mobile phone battery cover and mobile phone |
CN108891115A (en) * | 2018-08-24 | 2018-11-27 | 宁波瑞凌节能环保创新与产业研究院 | A kind of radiation refrigeration film of achievable passive cooling |
CN110103559A (en) * | 2019-05-13 | 2019-08-09 | 宁波瑞凌新能源科技有限公司 | A kind of radiation cooling material and its preparation method and application |
-
2021
- 2021-01-04 CN CN202110005059.XA patent/CN112693190A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008154692A1 (en) * | 2007-06-19 | 2008-12-24 | University Of Technology, Sydney | An element for emission of thermal radiation |
CN108769342A (en) * | 2018-05-04 | 2018-11-06 | 珠海格力电器股份有限公司 | A kind of mobile phone battery cover and mobile phone |
CN108891115A (en) * | 2018-08-24 | 2018-11-27 | 宁波瑞凌节能环保创新与产业研究院 | A kind of radiation refrigeration film of achievable passive cooling |
CN110103559A (en) * | 2019-05-13 | 2019-08-09 | 宁波瑞凌新能源科技有限公司 | A kind of radiation cooling material and its preparation method and application |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN110972467B (en) | Composite radiation refrigeration film, composite radiation refrigeration film material and application thereof | |
CN108891115A (en) | A kind of radiation refrigeration film of achievable passive cooling | |
EP3252414A1 (en) | Metamaterials-enhanced passive radiative cooling panel | |
US20120291845A1 (en) | Solar cell backsheet and solar cell module | |
US20150047693A1 (en) | Coatings for aircraft window surfaces to produce electricity for mission-critical systems and maintenance load on commercial aircraft | |
CN113072737B (en) | Porous polydimethylsiloxane with daytime radiation refrigeration and preparation method thereof | |
CN114714692A (en) | Visible-near infrared frequency division type radiation refrigeration film based on bionic rose petal micro-nano structure and preparation method and application thereof | |
CN110744900A (en) | Radiation refrigeration film and preparation method and application thereof | |
CN114506141A (en) | Radiation refrigeration film | |
CN112693190A (en) | Surface structure and preparation method thereof | |
CN210970215U (en) | Degradable radiation refrigeration film | |
CN201233471Y (en) | Integrated composite solar energy reflecting concentrating board | |
CN112937005A (en) | Cooling surface structural member and manufacturing method thereof | |
CN112266491B (en) | Single-layer adhesive film, multilayer co-extrusion adhesive film and photovoltaic cell assembly | |
CN208914733U (en) | A kind of radiation refrigeration film of achievable passive cooling | |
CN110098311B (en) | Multilayer infrared stealth nanostructure for improving infrared absorption efficiency | |
CN210337160U (en) | Composite glass | |
CN113400750A (en) | Liquid metal flexible composite film and preparation method and application thereof | |
JP4639913B2 (en) | Skin material and interior parts | |
Inada | Thermal management materials | |
CN210970216U (en) | Radiation refrigeration seat cover | |
JP4325180B2 (en) | Interior heat dissipation structure | |
JP2003212056A (en) | Panel structure | |
CN216002452U (en) | Anti-scratch automobile exterior trimming part | |
CN113004566B (en) | All-weather high-performance condensed water film and preparation method thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210423 |
|
RJ01 | Rejection of invention patent application after publication |