CN112692970A - Ceramic insulating material processing die for electronic device - Google Patents
Ceramic insulating material processing die for electronic device Download PDFInfo
- Publication number
- CN112692970A CN112692970A CN202011443024.6A CN202011443024A CN112692970A CN 112692970 A CN112692970 A CN 112692970A CN 202011443024 A CN202011443024 A CN 202011443024A CN 112692970 A CN112692970 A CN 112692970A
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- China
- Prior art keywords
- mounting
- installation
- inner cavity
- insulating material
- ceramic
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B7/00—Moulds; Cores; Mandrels
- B28B7/02—Moulds with adjustable parts specially for modifying at will the dimensions or form of the moulded article
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B11/00—Apparatus or processes for treating or working the shaped or preshaped articles
- B28B11/24—Apparatus or processes for treating or working the shaped or preshaped articles for curing, setting or hardening
- B28B11/243—Setting, e.g. drying, dehydrating or firing ceramic articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B7/00—Moulds; Cores; Mandrels
- B28B7/0002—Auxiliary parts or elements of the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B7/00—Moulds; Cores; Mandrels
- B28B7/40—Moulds; Cores; Mandrels characterised by means for modifying the properties of the moulding material
- B28B7/46—Moulds; Cores; Mandrels characterised by means for modifying the properties of the moulding material for humidifying or dehumidifying
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- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Structural Engineering (AREA)
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
- Press-Shaping Or Shaping Using Conveyers (AREA)
Abstract
The invention provides a ceramic insulating material processing die for electronic devices, which relates to the field of ceramic material processing and comprises a supporting mechanism and a die processing plate, wherein after the shape of a ceramic raw material is determined, an inserting mechanism is transversely inserted into an inner cavity of a transparent integral ceramic product, the ceramic raw material is transversely penetrated through in a hollow way and then transversely moved out of a mounting sleeve, an inner mounting cylinder is directly contacted with the inner cavity of the ceramic raw material, the formed ceramic raw material is extracted through a through hole, the inner cavity of a groove body raw material of the inner mounting cylinder forms an outer ring cylinder shape after water is extracted, the water content of the ceramic raw material closer to the mounting cylinder is lower, the inserting mechanism is transversely extracted at the moment to block the through holes at two ends of the mounting plate, the functional diversity of the device is increased, the fan of a fan blade generates wind power, the whole device is positioned in a high-temperature drying room and is a closed space, and the generated wind power generates air flow in, the drying process of the whole device is accelerated.
Description
Technical Field
The invention relates to the field of processing of ceramic insulating materials, in particular to a processing die for a ceramic insulating material of an electronic device.
Background
The ceramic material is an inorganic non-metallic material prepared by forming and high-temperature sintering natural or synthetic compounds. It has the advantages of high melting point, high hardness, high wear resistance, oxidation resistance, etc. The ceramic can be used as a structural material and a cutter material, and can also be used as a functional material because the ceramic also has certain special properties.
In the process of ceramic material processing, the processing mould is indispensable equipment, and the processing mould that exists on the existing market mostly has the device and can not adapt to the problem that the multiple concave shape appearance model, the variety of whole device is less, the extraction time of pottery water content is longer and the drying efficiency in the dry baking house inner chamber of high temperature is low.
To solve the above problems, we propose a ceramic insulating material processing mold for electronic devices.
Disclosure of Invention
The invention aims to provide a ceramic insulating material processing die for an electronic device, so as to solve the technical problem.
In order to solve the technical problems, the invention adopts the following technical scheme: the utility model provides a ceramic insulation material mold processing for electron device, includes supporting mechanism and mold processing board, and mold processing board is installed to supporting mechanism's upper end, supporting mechanism includes mounting plate and support column, the support column is installed to mounting plate's upper end, mold processing board is installed to the upper end of support column includes mounting substrate, incites the mechanism, adjustment mechanism and alternates the mechanism, incites the mechanism to be installed at mounting substrate's inner chamber both ends, adjustment mechanism has been seted up to mounting substrate's inner chamber, adjustment mechanism's inner chamber alternates and is provided with and alternates the mechanism.
Preferably, the mounting substrate includes mounting panel, installation vertical cylinder, interior fluting and well open double flute, the four corners of mounting panel is run through and is provided with the installation vertical cylinder, the interior fluting has been seted up to the inner chamber of mounting panel, well open double flute has been seted up to the upper end both sides of mounting panel, embedded fluting has been seted up to the inner chamber of mounting panel.
Preferably, incite the moving mechanism and include the mounting box, run through the cross axle, installation clamp ring and fanning piece, the inner chamber of mounting box runs through to be provided with and runs through the cross axle, run through the both ends of cross axle and install the installation clamp ring, fanning piece is installed to the upper end of mounting box.
Preferably, adjustment mechanism is installed to the embedded grooved inner chamber of mounting panel, adjustment mechanism includes erection column, installation diaphragm and guiding mechanism, the upper end embedding of erection column has the installation diaphragm, guiding mechanism is installed to the side bottom of erection column.
Preferably, the erection column includes cylinder, embedded recess, protruding lath, side joint block and horizontal processing strip, embedded recess has been seted up on the top of cylinder, protruding lath is installed to the side of cylinder, the side joint block is installed to the side bottom of protruding lath, horizontal processing strip is installed to the other end of side joint block.
Preferably, the adjusting mechanism comprises an installation assembling block, an elastic sheet and a lateral-side transverse cylinder, the elastic sheet is installed between the installation assembling blocks, and the lateral-side transverse cylinder is installed at the lateral end of the installation assembling block.
Preferably, the inserting mechanism comprises an installation sleeve, an inner installation barrel, an embedded cavity, through holes and an invagination shaft, the inner installation barrel is installed in the inner cavity of the installation sleeve, the embedded cavity is formed in the arrangement of the inner installation barrel, the through holes are annularly formed in the outer ring of the embedded cavity, and the invagination shaft is installed in the inner cavity of the inner installation barrel.
Preferably, the two ends of the inner cavity of the mounting bottom plate are provided with mounting sleeves in a penetrating manner.
Preferably, the elastic piece is a member made of an elastomer material.
Compared with the prior art, the invention has the following beneficial effects:
1. according to the ceramic insulating material processing die for the electronic device, ceramic raw materials to be processed are placed into the embedded slotted inner cavity of the adjusting mechanism, the mounting assembly blocks are pushed inwards, the placing positions of the mounting columns are adjusted, the convex strip plates and the transverse processing strips are pushed by the mounting assembly blocks to adjust the positions, and the ceramic insulating material processing die can be suitable for various concave-shaped appearance models of ceramic materials.
2. According to the ceramic insulating material processing die for the electronic device, after the shape of a ceramic raw material is determined, the penetrating mechanism is transversely penetrated through an inner cavity of a transparent integral ceramic product, the ceramic raw material is transversely penetrated in a hollow mode and then transversely moved out of the mounting sleeve, the inner mounting cylinder is directly contacted with the inner cavity of the ceramic raw material, the formed ceramic raw material is subjected to water extraction through the through holes, after water extraction, the inner cavity of the groove body raw material of the inner mounting cylinder is in an outer ring cylinder shape, the water content of the ceramic raw material closer to the mounting cylinder is lower, at the moment, the penetrating mechanism is transversely pulled out, the through holes at two ends of the mounting plate are blocked, and the functional diversity of the device is improved.
3. The invention provides a ceramic insulating material processing die for an electronic device, which is characterized in that after ceramic raw materials for pumping water in an inner cavity are kept stand for 20min, an integral device is placed in a high-temperature drying room, the ceramic raw materials are subjected to high-temperature forming at high temperature, an external motor drives a transverse shaft to spirally rotate during the high-temperature forming, and the external motor rotates 180 degrees anticlockwise to drive fan blades to rotate in the same direction and rotate in the reverse direction to drive the fan blades to rotate in the reverse direction clockwise, so that wind power is generated due to the fan motion of the fan blades at the moment, the integral device is in a closed space in the high-temperature drying room, and the generated wind power generates air flow in the closed space to accelerate the drying process of the integral device.
Drawings
FIG. 1 is a schematic structural view of a ceramic insulating material processing mold for electronic devices according to the present invention;
FIG. 2 is a schematic perspective view of a mounting substrate according to the present invention;
FIG. 3 is a schematic perspective view of the flaring mechanism of the present invention;
FIG. 4 is a schematic perspective view of an adjustment mechanism according to the present invention;
FIG. 5 is a schematic perspective view of the mounting post of the present invention;
FIG. 6 is a schematic perspective view of an adjusting mechanism according to the present invention;
fig. 7 is a schematic perspective view of the insertion mechanism of the present invention.
Reference numerals: 1. a support mechanism; 2. processing a plate by using a mold; 11. mounting a bottom plate; 12. a support pillar; 21. a mounting substrate; 211. mounting a plate; 212. installing a vertical cylinder; 213. an inner groove is formed; 214. opening a double groove; 22. an incitation mechanism; 221. mounting a box; 222. runs through the transverse shaft; 223. installing a clamping ring; 224. a fan blade; 23. an adjustment mechanism; 231. mounting a column; 2311. a cylinder; 2312. embedding a groove; 2313. a convex strip plate; 2314. a side connection block; 2315. transversely processing the strips; 232. installing a transverse plate; 233. an adjustment mechanism; 2331. mounting an assembling block; 2332. an elastic sheet; 2333. lateral connecting a transverse cylinder; 24. an inserting mechanism; 241. installing a sleeve; 242. an inner mounting cylinder; 243. an embedded cavity; 244. a through hole; 245. invaginating the shaft.
Detailed Description
In order to make the technical means, the original characteristics, the achieved purposes and the effects of the invention easily understood, the invention is further described below with reference to the specific embodiments and the attached drawings, but the following embodiments are only the preferred embodiments of the invention, and not all embodiments. Based on the embodiments in the implementation, other embodiments obtained by those skilled in the art without any creative efforts belong to the protection scope of the present invention.
Specific embodiments of the present invention are described below with reference to the accompanying drawings.
Example 1
As shown in fig. 1, 2, 4, 5 and 6, a ceramic insulating material processing mold for electronic devices comprises a supporting mechanism 1 and a mold processing plate 2, the mold processing plate 2 is installed on the upper end of the supporting mechanism 1, the supporting mechanism 1 comprises an installation bottom plate 11 and a supporting column 12, the supporting column 12 is installed on the upper end of the installation bottom plate 11, installation sleeves 241 are installed on both ends of the inner cavity of the installation bottom plate 11 in a penetrating way, the mold processing plate 2 installed on the upper end of the supporting column 12 comprises an installation base plate 21, an excitation mechanism 22, an adjusting mechanism 23 and an inserting mechanism 24, the excitation mechanism 22 is installed on both ends of the inner cavity of the installation base plate 21, the adjusting mechanism 23 is arranged on the inner cavity of the installation base plate 21, the inserting mechanism 24 is inserted in the inner cavity of the adjusting mechanism 23, the installation base plate 21 comprises an installation vertical tube 211, an installation vertical tube 212, an inner slot 213 and a middle open, the inner cavity of the mounting plate 211 is provided with an inner slot 213, both sides of the upper end of the mounting plate 211 are provided with middle-opened double slots 214, the inner cavity of the mounting plate 211 is provided with an embedded slot, the inner cavity of the embedded slot of the mounting plate 211 is provided with an adjusting mechanism 23, the adjusting mechanism 23 comprises a mounting column 231, a mounting transverse plate 232 and an adjusting mechanism 233, the upper end of the mounting column 231 is embedded with the mounting transverse plate 232, the bottom of the side end of the mounting column 231 is provided with the adjusting mechanism 233, the mounting column 231 comprises a cylinder body 2311, an embedded groove 2312, a convex strip 2313, a lateral processing strip 2315, the top end of the cylinder body 2311 is provided with an embedded groove 2312, the side end of the cylinder body 2311 is provided with a convex strip 2313, the bottom of the lateral end of the convex strip 2313 is provided with a lateral connecting block 2314, the other end of the lateral connecting block 2314 is provided with a lateral processing strip 2315, the adjusting mechanism, the elastic plate 2332 is a member made of a synthetic rubber material, a lateral-side horizontal tube 2333 is installed at a side end of the mounting block 2331, a ceramic raw material to be processed is placed into an embedded slotted cavity of the adjusting mechanism 23, the mounting block 2331 is pushed inward to adjust the placing position of the mounting column 231, and the convex strip 2313 and the lateral processing strip 2315 are pushed to adjust the positions so as to be suitable for various concave-shaped appearance models of ceramic materials.
Example 2
As shown in fig. 7, an inserting mechanism 24 includes a mounting sleeve 241, an inner mounting tube 242, an inner embedding cavity 243, a through hole 244 and an inner embedding shaft 245, the inner mounting tube 242 is mounted in an inner cavity of the mounting sleeve 241, the inner embedding cavities 243 are arranged in the inner mounting tube 242, a through hole 244 is annularly formed in an outer ring of the inner embedding cavity 243, the inner embedding shaft 245 is mounted in an inner cavity of the inner mounting tube 242, after the shape of a ceramic raw material is determined, the inserting mechanism 24 transversely penetrates through an inner cavity of a transparent integral ceramic product to transversely penetrate through the ceramic raw material, then the ceramic raw material is transversely moved out of the mounting sleeve 241, the inner mounting tube 242 is directly contacted with the inner cavity of the ceramic raw material, moisture is extracted from the formed ceramic raw material through the through hole 244, because the inner cavity of the groove body raw material of the inner mounting tube 242 after moisture extraction forms an outer ring cylinder shape, and the moisture content of the ceramic raw material closer to the, at this time, the penetrating mechanism 24 is transversely pulled away, through holes at two ends of the mounting plate 211 are blocked, and the functional diversity of the device is increased.
Example 3
As shown in FIG. 3, a ceramic insulating material processing mold for electronic devices, wherein a firing mechanism 22 comprises a mounting box 221, a through cross shaft 222, a mounting clamp ring 223 and a fan blade 224, the inner cavity of the mounting box 221 is provided with the through cross shaft 222 in a penetrating manner, the mounting clamp ring 223 is mounted at two ends of the through cross shaft 222, the upper end of the mounting box 221 is provided with the fan blade 224, the ceramic raw material for pumping the inner cavity is placed for 20min in a standing manner, the whole device is placed in a high-temperature drying oven, the ceramic raw material is subjected to high-temperature forming through high temperature, the through cross shaft 222 is driven by an external motor to perform spiral rotation during high-temperature forming, as the firing mechanism 22 is alternately placed in an opposite manner, the external motor rotates 180 degrees in a counterclockwise direction, the fan blades 224 are driven to perform the same-direction rotation, the external motor rotates in a reverse direction, the fan blades 224 are driven to perform the reverse-direction rotation clockwise, at the, the whole device is located in a high-temperature drying room which is a closed space, and the generated wind force generates air flow in the closed space, so that the drying process of the whole device is accelerated.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and the preferred embodiments of the present invention are described in the above embodiments and the description, and are not intended to limit the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (9)
1. The utility model provides a ceramic insulation material mold processing for electronic device, includes supporting mechanism (1) and mould processing board (2), its characterized in that are installed to the upper end of supporting mechanism (1): the supporting mechanism (1) comprises an installation bottom plate (11) and a supporting column (12), the supporting column (12) is installed at the upper end of the installation bottom plate (11), a mold processing plate (2) is installed at the upper end of the supporting column (12) and comprises an installation base plate (21), an excitation mechanism (22), an adjusting mechanism (23) and an insertion mechanism (24), the excitation mechanism (22) is installed at two ends of an inner cavity of the installation base plate (21), the adjusting mechanism (23) is installed in the inner cavity of the installation base plate (21), and the insertion mechanism (24) is arranged in the inner cavity of the adjusting mechanism (23) in an insertion mode.
2. The ceramic insulating material processing mold for electronic devices as claimed in claim 1, wherein: mounting substrate (21) include mounting panel (211), installation vertical cylinder (212), interior fluting (213) and well open double flute (214), the four corners of mounting panel (211) is run through and is provided with installation vertical cylinder (212), interior fluting (213) have been seted up to the inner chamber of mounting panel (211), well open double flute (214) have been seted up to the upper end both sides of mounting panel (211), embedded fluting has been seted up to the inner chamber of mounting panel (211).
3. The ceramic insulating material processing mold for electronic devices as claimed in claim 1, wherein: the flaring mechanism (22) comprises a mounting box (221), a through transverse shaft (222), mounting clamp rings (223) and fanning pieces (224), an inner cavity of the mounting box (221) is provided with the through transverse shaft (222), the mounting clamp rings (223) are mounted at two ends of the through transverse shaft (222), and the fanning pieces (224) are mounted at the upper end of the mounting box (221).
4. The ceramic insulating material processing mold for electronic devices as claimed in claim 1, wherein: adjustment mechanism (23) are installed to the embedded grooved inner chamber of mounting panel (211), adjustment mechanism (23) are including erection column (231), installation diaphragm (232) and guiding mechanism (233), the upper end embedding of erection column (231) has installation diaphragm (232), guiding mechanism (233) are installed to the side bottom of erection column (231).
5. The ceramic insulating material processing mold for electronic devices as claimed in claim 4, wherein: the mounting post (231) comprises a post body (2311), an embedded groove (2312), a raised strip plate (2313), a side connecting block (2314) and a transverse processing strip (2315), the top end of the post body (2311) is provided with the embedded groove (2312), the raised strip plate (2313) is mounted at the side end of the post body (2311), the side connecting block (2314) is mounted at the bottom of the side end of the raised strip plate (2313), and the transverse processing strip (2315) is mounted at the other end of the side connecting block (2314).
6. The ceramic insulating material processing mold for electronic devices as claimed in claim 4, wherein: the adjusting mechanism (233) comprises mounting and assembling blocks (2331), elastic pieces (2332) and lateral transverse cylinders (2333), the elastic pieces (2332) are mounted between the mounting and assembling blocks (2331), and the lateral ends of the mounting and assembling blocks (2331) are provided with the lateral transverse cylinders (2333).
7. The ceramic insulating material processing mold for electronic devices as claimed in claim 1, wherein: the penetrating mechanism (24) comprises an installation sleeve (241), an inner installation barrel (242), an embedded cavity (243), through holes (244) and an invagination shaft (245), the inner installation barrel (242) is installed in the inner cavity of the installation sleeve (241), the embedded cavity (243) is arranged in the inner installation barrel (242), the through holes (244) are annularly formed in the outer ring of the embedded cavity (243), and the invagination shaft (245) is installed in the inner cavity of the inner installation barrel (242).
8. The ceramic insulating material processing mold for electronic devices as claimed in claim 1, wherein: and the two ends of the inner cavity of the mounting bottom plate (11) are provided with mounting sleeves (241) in a penetrating way.
9. The ceramic insulating material processing mold for electronic devices as claimed in claim 6, wherein: the elastic piece (2332) is a member made of an elastomer material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011443024.6A CN112692970A (en) | 2020-12-08 | 2020-12-08 | Ceramic insulating material processing die for electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011443024.6A CN112692970A (en) | 2020-12-08 | 2020-12-08 | Ceramic insulating material processing die for electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112692970A true CN112692970A (en) | 2021-04-23 |
Family
ID=75507917
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011443024.6A Withdrawn CN112692970A (en) | 2020-12-08 | 2020-12-08 | Ceramic insulating material processing die for electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112692970A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114030866A (en) * | 2021-11-24 | 2022-02-11 | 新美鑫智能装备(东台)有限公司 | Efficient flexible conveying nonstandard automation device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02274503A (en) * | 1989-04-17 | 1990-11-08 | Ngk Insulators Ltd | Drying method of ceramic cast molding |
| CN201143718Y (en) * | 2007-11-13 | 2008-11-05 | 黄群欢 | Injection molding equipment of insulating ceramics |
| CN208215626U (en) * | 2018-04-24 | 2018-12-11 | 甘肃上河商贸集团有限责任公司 | A kind of Production of Ceramics drying device |
| CN109955357A (en) * | 2019-03-18 | 2019-07-02 | 美艺陶(福建)高新建材有限公司 | A kind of big specification floor and its production method |
| CN210969336U (en) * | 2019-11-22 | 2020-07-10 | 高安市金福生态石材有限公司 | Hot drying device for producing dielectric ceramic material |
-
2020
- 2020-12-08 CN CN202011443024.6A patent/CN112692970A/en not_active Withdrawn
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02274503A (en) * | 1989-04-17 | 1990-11-08 | Ngk Insulators Ltd | Drying method of ceramic cast molding |
| CN201143718Y (en) * | 2007-11-13 | 2008-11-05 | 黄群欢 | Injection molding equipment of insulating ceramics |
| CN208215626U (en) * | 2018-04-24 | 2018-12-11 | 甘肃上河商贸集团有限责任公司 | A kind of Production of Ceramics drying device |
| CN109955357A (en) * | 2019-03-18 | 2019-07-02 | 美艺陶(福建)高新建材有限公司 | A kind of big specification floor and its production method |
| CN210969336U (en) * | 2019-11-22 | 2020-07-10 | 高安市金福生态石材有限公司 | Hot drying device for producing dielectric ceramic material |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114030866A (en) * | 2021-11-24 | 2022-02-11 | 新美鑫智能装备(东台)有限公司 | Efficient flexible conveying nonstandard automation device |
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Application publication date: 20210423 |
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