CN112672629A - Seamless microcrystal chip shielding cover - Google Patents
Seamless microcrystal chip shielding cover Download PDFInfo
- Publication number
- CN112672629A CN112672629A CN202011629072.4A CN202011629072A CN112672629A CN 112672629 A CN112672629 A CN 112672629A CN 202011629072 A CN202011629072 A CN 202011629072A CN 112672629 A CN112672629 A CN 112672629A
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- China
- Prior art keywords
- plate
- side wall
- bottom plate
- cover body
- supporting piece
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000013081 microcrystal Substances 0.000 title abstract description 3
- 239000002994 raw material Substances 0.000 claims abstract description 4
- 238000005452 bending Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention discloses a seamless microcrystal chip shielding case, which comprises a cover body and a supporting piece, wherein a side plate of the cover body is formed by stretching a raw material, and a concave part is formed inwards on the side plate; the supporting piece is formed by a plurality of split pieces which are connected end to form a ring; the split plate is a stamping formed part and comprises a horizontal bottom plate, an inner side wall, an outer side wall, a top plate and a vertical plate, wherein the top plate is parallel to the bottom plate, the inner side wall is vertically arranged on one side of the bottom plate, and the outer side wall is obliquely arranged on the other side of the bottom plate and is connected with the top plate; the riser sets up perpendicularly in one side of the relative lateral wall of roof. The arc structure is avoided in the supporting piece, the supporting piece can be directly manufactured by adopting a bending process, and the mold is stable, so that the productivity of the supporting piece is improved; the direct stretch forming of curb plate of the cover body has eliminated the gap that originally exists between the adjacent limit of bending, has promoted the shielding effectiveness of shield cover.
Description
Technical Field
The invention relates to the technical field of electromagnetic shielding, in particular to a shielding case.
Background
Chinese patent application No. 201680042778.6 discloses a shielding case, which comprises a cover body and a clamping support, wherein the cover body comprises a top wall and a side wall enclosed at the periphery of the top wall in a closed manner, the clamping support is fixed to a circuit board in a closed manner, the clamping support and the cover body are closed and continuously connected on a plane parallel to the top wall, and the clamping support accommodates and clamps an insertion end of the side wall far away from the top wall. The centre gripping support is including two centre gripping arms that the symmetry set up, and every centre gripping arm all includes the clamping section and from the linkage segment that the clamping section extends, and two clamping sections merge and form and press from both sides tight structure, and the terminal interconnect of keeping away from the clamping section of two linkage segments forms the V-arrangement structure between two linkage segments. Because the clamping support can be accommodated and clamps the insertion end of the side wall and is fixed to the circuit board in a closed manner, the clamping support is connected between the cover body and the circuit board in a closed manner and continuously, no gap exists between the cover body and the circuit board, and the shielding cover can completely cover the components to be shielded on the circuit board. But as the clamping support of the supporting cover body, two supporting plates of the clamping support are arc-shaped, so that the forming of the die is difficult, and the productivity cannot be improved.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: the shield cover is simple in structure and good in shielding effect.
In order to achieve the purpose, the technical scheme provided by the invention is as follows:
the seamless microcrystalline chip shielding case comprises a cover body and a supporting piece, wherein the cover body comprises a flat plate and side plates enclosed around the flat plate, the side plates of the cover body are formed by stretching raw materials, and concave parts are formed inwards on the side plates; the supporting piece is formed by a plurality of split pieces which are interconnected end to form a ring; the split plate is a stamped and formed part and comprises a horizontal bottom plate, an inner side wall, an outer side wall, a top plate and a vertical plate, the top plate is parallel to the bottom plate, the inner side wall is vertically arranged on one side of the bottom plate, the outer side wall is obliquely arranged on the other side of the bottom plate and is connected with the top plate, and an included angle formed between the outer side wall and the bottom plate is an obtuse angle; the vertical plate is vertically arranged on one side, opposite to the outer side wall, of the top plate, the vertical plate and the inner side wall are arranged in a staggered mode, and a slot is formed between the vertical plate and the inner side wall; the side plate of the cover body is inserted into the slot, the vertical plate seals the concave part to form a first shielding cavity, and a second shielding cavity is formed between the side plate of the cover body and the outer side wall.
Compared with the prior art, the invention has the beneficial effects that:
1. the arc structure is avoided in the supporting piece, the supporting piece can be directly manufactured by adopting a bending process, and the mold is stable, so that the productivity of the supporting piece is improved;
2. the design of the two shielding cavities improves the shielding capability of the shielding case;
3. the side plates of the shield body are directly stretched and formed, so that gaps existing between the original adjacent bent edges are eliminated, and the shielding capability of the shielding cover is improved;
4. the cover body is utilized to form one of the shielding cavities, so that the occupation of the internal space of the shielding cover is reduced, the size of the shielding cover can be reduced, and the shielding cover is suitable for being used in lighter and thinner electronic products.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below.
FIG. 1 is a cross-sectional view of a seamless microcrystalline chip shield can;
FIG. 2 is a cross-sectional view of the cover;
fig. 3 is a cross-sectional view of the support.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
Examples
Referring to fig. 1, the seamless microcrystalline chip shield includes a shield body 10 and a support member 20.
Referring to fig. 2, the cover body comprises a flat plate 11 and side plates 12 enclosed around the flat plate, the side plates of the cover body are formed by stretching raw materials, and concave parts 13 are formed inwards on the side plates.
The support member is formed by a plurality of separate members interconnected end to end in a ring shape.
Referring to fig. 3, the split plate is a stamping part and comprises a horizontal bottom plate 21, an inner side wall 22, an outer side wall 23, a top plate 24 and a vertical plate 25, wherein the top plate is parallel to the bottom plate, the inner side wall is vertically arranged on one side of the bottom plate, the outer side wall is obliquely arranged on the other side of the bottom plate and is connected with the top plate, and an included angle formed between the outer side wall and the bottom plate is an obtuse angle of 110-120 degrees. The riser sets up perpendicularly in the one side of the relative lateral wall of roof, and the setting of misplacing between riser and the inside wall forms the slot between riser and inside wall.
The side plate of the cover body is inserted into the slot, the vertical plate seals the concave part to form a first shielding cavity 30, and a second shielding cavity 40 is formed between the side plate and the outer side wall of the cover body.
When the shield case is mounted on the circuit board, the bottom plate of the support member is first soldered to the circuit board 50.
Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (3)
1. The seamless microcrystalline chip shielding case is characterized by comprising a cover body and a supporting piece, wherein the cover body comprises a flat plate and side plates enclosed around the flat plate, the side plates of the cover body are formed by stretching raw materials, and concave parts are formed inwards on the side plates; the supporting piece is formed by a plurality of split pieces which are interconnected end to form a ring; the split plate is a stamped and formed part and comprises a horizontal bottom plate, an inner side wall, an outer side wall, a top plate and a vertical plate, the top plate is parallel to the bottom plate, the inner side wall is vertically arranged on one side of the bottom plate, the outer side wall is obliquely arranged on the other side of the bottom plate and is connected with the top plate, and an included angle formed between the outer side wall and the bottom plate is an obtuse angle; the vertical plate is vertically arranged on one side, opposite to the outer side wall, of the top plate, the vertical plate and the inner side wall are arranged in a staggered mode, and a slot is formed between the vertical plate and the inner side wall; the side plate of the cover body is inserted into the slot, the vertical plate seals the concave part to form a first shielding cavity, and a second shielding cavity is formed between the side plate of the cover body and the outer side wall.
2. The seamless microcrystalline chip shield of claim 1 wherein the outer sidewall forms an angle of 120 ° with the bottom plate.
3. The seamless microcrystalline chip shield of claim 2 in which the bottom plate of the split plate is soldered to the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011629072.4A CN112672629A (en) | 2020-12-30 | 2020-12-30 | Seamless microcrystal chip shielding cover |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011629072.4A CN112672629A (en) | 2020-12-30 | 2020-12-30 | Seamless microcrystal chip shielding cover |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112672629A true CN112672629A (en) | 2021-04-16 |
Family
ID=75412748
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011629072.4A Pending CN112672629A (en) | 2020-12-30 | 2020-12-30 | Seamless microcrystal chip shielding cover |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112672629A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20130069183A (en) * | 2011-12-16 | 2013-06-26 | 주식회사 오킨스전자 | Shield can clip |
| KR20160032392A (en) * | 2014-09-15 | 2016-03-24 | 오-토스프라이스 주식회사 | Shield Clips fixing shield covers |
| CN108064469A (en) * | 2016-12-15 | 2018-05-22 | 深圳市柔宇科技有限公司 | Shielding case |
| CN110868843A (en) * | 2019-12-10 | 2020-03-06 | 上海创功通讯技术有限公司 | Shielding case, circuit board assembly and terminal |
-
2020
- 2020-12-30 CN CN202011629072.4A patent/CN112672629A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20130069183A (en) * | 2011-12-16 | 2013-06-26 | 주식회사 오킨스전자 | Shield can clip |
| KR20160032392A (en) * | 2014-09-15 | 2016-03-24 | 오-토스프라이스 주식회사 | Shield Clips fixing shield covers |
| CN108064469A (en) * | 2016-12-15 | 2018-05-22 | 深圳市柔宇科技有限公司 | Shielding case |
| CN110868843A (en) * | 2019-12-10 | 2020-03-06 | 上海创功通讯技术有限公司 | Shielding case, circuit board assembly and terminal |
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| PB01 | Publication | ||
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