CN112671367A - Novel FBAR filter and preparation method thereof - Google Patents
Novel FBAR filter and preparation method thereof Download PDFInfo
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- H—ELECTRICITY
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- H—ELECTRICITY
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Abstract
The invention discloses a novel FBAR filter and a preparation method thereof. The method comprises the following steps: etching a groove on a preparation substrate, preparing a piezoelectric material and a bottom electrode in the groove, firstly preparing a thin seed layer before preparing the bottom electrode, preparing an air cavity supporting layer, taking another supporting substrate, bonding the supporting substrate, the preparation substrate and the air cavity supporting layer together, removing the preparation substrate, exposing the piezoelectric material, preparing a top electrode on the piezoelectric material, and leading out the bottom electrode to obtain the filter formed by cascading a plurality of resonators. According to the invention, by firstly digging the groove on the preparation substrate and then growing the piezoelectric material, the problem of crack generation caused by overlarge stress due to the growth of the whole piezoelectric film is effectively avoided, the stress of the piezoelectric film is reduced, meanwhile, the problem of energy loss caused by transverse transmission of energy is effectively avoided due to the discontinuity of the piezoelectric film of each resonance unit, clutter can be effectively inhibited, and the preparation yield and performance of the filter are improved.
Description
Technical Field
The invention belongs to the technical field of radio frequency filtering, and particularly relates to a novel FBAR filter and a preparation method thereof.
Background
The multifunctional development of the wireless communication terminal puts high technical requirements on miniaturization, high frequency, high performance, low power consumption, low cost and the like on a radio frequency device. The traditional surface acoustic wave filter (SAW) has large insertion loss in a high frequency band above 2.4GHz, and the dielectric filter has good performance but large volume. The Film Bulk Acoustic Resonator (FBAR) technology is a new radio frequency device technology which has appeared in recent years along with the improvement of the technological level of processing and the rapid development of modern wireless communication technology, especially personal wireless communication technology. The surface acoustic wave resonator has the advantages of extremely high quality factor Q value (more than 1000) and being capable of being integrated on an IC chip, and is compatible with a Complementary Metal Oxide Semiconductor (CMOS) process, and meanwhile, the defect that the surface acoustic wave resonator and the dielectric resonator cannot be compatible with the CMOS process is effectively avoided.
However, the air-gap type FBAR filter is currently monopolized by foreign patents, and the technical route cannot be used, but the performance of the FBAR filter with the structure still has a room for improvement, as shown in fig. 1, which comprises a substrate, an air cavity on the substrate, and a bottom electrode, a piezoelectric layer and a top electrode sequentially manufactured on the substrate across the air cavity. The preparation process of the overseas agilent resonator is mentioned in the chem master paper of Zhejiang university "research and modeling of Film Bulk Acoustic Resonator (FBAR)", P47-48: etching a cavity on the upper surface of the Si sheet, then filling a sacrificial layer material PSG in the pit, sputtering and growing a layer of metal film on the surface of the sacrificial layer after CMP polishing, and etching a bottom electrode pattern at a position corresponding to the upper part of the sacrificial layer. Then a layer of piezoelectric film is deposited above the bottom electrode, after etching, the piezoelectric film covers the boundary of the pit on the substrate and exposes the leading-out end of the bottom electrode, and then a layer of metal film is deposited on the piezoelectric film, and the top electrode pattern is etched. A release window is then etched in the piezoelectric layer by dry etching to expose portions of the sacrificial layer. And finally, releasing the sacrificial layer from the carved release window, and manufacturing the FBAR on the substrate across the air cavity, wherein the sacrificial layer releasing method leaves a plurality of release channel holes on the piezoelectric layer, so that the piezoelectric film is greatly damaged, the cavity structure is easy to collapse, the Q value and the electromechanical coupling coefficient are low, the insertion loss is large, and the performance of the device is influenced.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention aims to provide a novel FBAR filter and a preparation method thereof. The novel FBAR filter provided by the invention is a film bulk acoustic wave filter.
Based on this, the present invention aims to overcome the defects of the prior art, and provides a novel FBAR filter and a preparation method thereof. By adopting the preparation method, a sacrificial layer is not needed in the preparation process, the damage to the piezoelectric film is reduced, and the problem of adverse effect on the filter structure in the sacrificial layer removing process is solved.
The purpose of the invention is realized by at least one of the following technical solutions.
The novel FBAR filter provided by the invention is formed by cascading n resonators, wherein n is an integer and is more than or equal to 1; the resonator comprises a supporting substrate, an air cavity supporting layer, a bottom electrode, a seed layer, a piezoelectric film structure layer, a top electrode and a bottom electrode upward lead; the two air cavity supporting layers are respectively stacked on the supporting substrate, the bottom electrodes are respectively connected with the two air cavity supporting layers, and the bottom electrodes, the air cavity supporting layers and the supporting substrate enclose a cavity; the seed layer is laminated on the bottom electrode and the air cavity supporting layer; the piezoelectric film structure layer and the top electrode are sequentially stacked on the seed layer; the bottom electrode is connected with the upper lead of the bottom electrode.
The support substrate is one or more of a silicon substrate, a sapphire substrate, a silicon carbide substrate, a gallium nitride substrate, an aluminum nitride substrate, an AlxGa1-xN buffer layer substrate, a glass substrate, an organic polymer material flexible substrate, and the like.
Further, the material of the air cavity supporting layer is an insulating material, and the insulating material is SiO2、AlN，Si3N4One or more of (1); the thickness of the air cavity supporting layer is 0.3-3 μm.
Preferably, the material of the support layer is an insulating material; the supporting layer is made of materials with higher dielectric constants such as silicon dioxide, silicon nitride, aluminum nitride and gallium nitride.
Furthermore, the bottom electrode and the top electrode are made of more than one of Al, Mo, W, Pt, Cu, Ag, Au, ZrN and the like; the thickness of the bottom electrode and the thickness of the top electrode are both 20-500 nm.
Further, the seed layer is a sputtered polycrystalline piezoelectric material or a single crystal piezoelectric material; the seed layer is made of more than one of AlN, ZnO, lithium niobate, lithium tantalate and the like; the thickness of the seed layer is 5-100 nm.
Further, the piezoelectric thin film structure layer is more than one of a high-quality single crystal piezoelectric thin film grown by epitaxy, a high-C-axis oriented polycrystalline piezoelectric thin film grown by sputtering and a thin film with piezoelectric characteristics; the piezoelectric thin film structure layer is made of more than one of AlN, ZnO, PZT, lithium niobate, lithium tantalate and the like; the thickness of the piezoelectric film structure layer is 0.02-10 μm.
The novel FBAR filter provided by the invention has the filtering frequency of 10MHz-100 GHz.
The preparation method of the novel FBAR filter provided by the invention comprises the following steps: firstly, preparing grooves (the number of the grooves can be multiple) on a preparation substrate by an etching method, then preparing piezoelectric materials in the grooves, then preparing a bottom electrode, firstly preparing a thin seed layer before preparing the bottom electrode, preparing an air cavity supporting layer, taking another supporting substrate, bonding the supporting substrate, the preparation substrate and the structures of the grooves together, then removing the preparation substrate to expose the piezoelectric materials, preparing a top electrode above the piezoelectric materials, leading out the bottom electrode, and finally preparing a filter formed by cascading a plurality of basic resonators.
The preparation method of the novel FBAR filter provided by the invention comprises the following steps:
(1) etching n grooves (the number of the grooves can be multiple) on the preparation substrate, wherein n is an integer and is more than or equal to 1; then preparing a piezoelectric film structure layer (piezoelectric material) in the groove, preparing a seed layer (a thin bottom electrode seed layer) on the piezoelectric film structure layer by adopting an epitaxial or sputtering method, and then preparing a bottom electrode on the seed layer by a sputtering or electron beam evaporation method and patterning;
(2) preparing two air cavity supporting layers (depositing an insulating material and patterning the insulating material to form the air cavity supporting layers) on a bottom electrode and a seed layer, taking another supporting substrate (the substrate can be a silicon wafer, sapphire, silicon, sapphire, LiGaO2, GaN, SiC, glass, an organic high polymer material and the like), bonding the supporting substrate with the two air cavity supporting layers and the prepared substrate at the same time, enclosing a cavity by the bottom electrode, the air cavity supporting layers and the supporting substrate, and removing the prepared substrate after bonding, wherein the removing method is mechanical thinning combined with wet etching or dry etching commonly used in the industry;
(3) and after the preparation substrate is removed, the piezoelectric thin film structure layer is exposed, a top electrode is prepared on the piezoelectric thin film structure layer, and the bottom electrode is led out (the seed layer is etched by a bottom electrode lead-out through hole by wet etching or dry etching), and the lead-out on the bottom electrode can be realized by methods such as electroplating or evaporation sputtering, so that the novel FBAR filter (the filter formed by cascading a plurality of resonators) is obtained.
Further, the preparation substrates in the step (1) are a silicon substrate, a sapphire substrate, a silicon carbide substrate, a gallium nitride substrate and LiGaO2Substrate, aluminum nitride substrate, AlxGa1-xN buffer layer substrate, glass substrate, organic polymer materialMore than one of the flexible substrates.
Furthermore, a cavity is carved in the middle of one surface, bonded with the air cavity supporting layer, of the supporting substrate in the step (2), and the depth of the cavity is 0.5-3 microns.
The preparation method provided by the invention can prepare the FBAR filter with any frequency, including the FBAR filter in the frequency range from 10MHz to 10 GHz.
Compared with the prior art, the invention has the following advantages and beneficial effects:
the preparation method provided by the invention does not need to use a sacrificial layer in the preparation process, reduces the damage to the piezoelectric film, thereby overcoming the problem of adverse effect on the filter structure in the process of removing the sacrificial layer, and the method for preparing the piezoelectric film in the groove by etching the groove on the preparation substrate can effectively reduce the stress of the piezoelectric film, inhibit noise waves, reduce energy loss, well improve the quality of the piezoelectric film, reduce the insertion loss of the film bulk acoustic resonator, improve the Q value and the electromechanical coupling coefficient, and becomes a solution suitable for the radio frequency filter in future high-frequency and high-power occasions.
Drawings
FIG. 1 is a cross-sectional view of a prior art FBAR with an air gap;
FIG. 2 is a sectional view of a preparation substrate in the embodiment;
FIG. 3 is a schematic diagram illustrating a groove etched on a preparation substrate in an embodiment;
FIG. 4 is a schematic view showing the preparation of a piezoelectric film in a groove of a preparation substrate in the embodiment;
FIG. 5 is a schematic view showing the preparation of a seed layer and a bottom electrode in the example;
FIG. 6 is a schematic diagram of an embodiment in which an insulating dielectric support layer is deposited and patterned;
FIG. 7 is a schematic view of another embodiment of a support substrate bonded to a front wafer;
FIG. 8 is a schematic view showing the removal of the preparation substrate and the preparation of the top electrode in the example;
FIG. 9 is a schematic diagram of a novel FBAR filter obtained after fabricating a bottom electrode upper lead in the example;
FIG. 10 is a schematic diagram showing a ladder cascade configuration filter of resonators in an embodiment;
fig. 11 is a graph showing the effect of low insertion loss and wide pass band exhibited by the filter manufactured in the example.
Detailed Description
The following examples are presented to further illustrate the practice of the invention, but the practice and protection of the invention is not limited thereto. It is noted that the processes described below, if not specifically described in detail, are all realizable or understandable by those skilled in the art with reference to the prior art. The reagents or apparatus used are not indicated to the manufacturer, and are considered to be conventional products available by commercial purchase.
Example 1
A novel FBAR filter is formed by cascading n resonators, wherein n is a positive integer and is more than or equal to 1; as shown in fig. 9, the resonator includes a support substrate 106, an air cavity support layer 105, a bottom electrode 104, a seed layer 103, a piezoelectric thin film structure layer 102, a top electrode 107, and a bottom electrode upper lead 108; two air cavity supporting layers 105 are respectively stacked on the supporting substrate 106, the bottom electrode 104 is respectively connected with the two air cavity supporting layers 105, and the bottom electrode 104, the air cavity supporting layers 105 and the supporting substrate 106 enclose a cavity; the seed layer is laminated on the bottom electrode 104 and the air cavity support layer 105; the piezoelectric thin film structure layer 102 and the top electrode 107 are sequentially stacked on the seed layer 103; the bottom electrode pull-up 108 is connected to the bottom electrode 104.
The support substrate 106 is one or more of a silicon substrate, a sapphire substrate, a silicon carbide substrate, a gallium nitride substrate, an aluminum nitride substrate, an AlxGa1-xN buffer layer substrate, a glass substrate, and an organic polymer material flexible substrate.
The material of the air cavity supporting layer 105 is an insulating material, and the insulating material is SiO2、AlN，Si3N4One or more of (1); the air cavity support layer 105 has a thickness of 0.3-3 μm.
The bottom electrode 104 and the top electrode 107 are made of more than one of Al, Mo, W, Pt, Cu, Ag, Au and ZrN; the thickness of the bottom electrode 104 and the top electrode 107 is 20-500 nm.
The seed layer 103 is a sputtered polycrystalline piezoelectric material or a single crystal piezoelectric material; the seed layer 103 is made of more than one of AlN, ZnO, lithium niobate and lithium tantalate; the thickness of the seed layer 103 is 5-100 nm.
The piezoelectric thin film structure layer 102 is more than one of a monocrystalline piezoelectric thin film grown by epitaxy, a polycrystalline piezoelectric thin film grown by sputtering and oriented to a high C axis, and a thin film with piezoelectric characteristics; the piezoelectric thin film structure layer 102 is made of more than one of AlN, ZnO, PZT, lithium niobate and lithium tantalate; the thickness of the piezoelectric film structure layer 102 is 0.02 μm to 10 μm.
Through the combination of different piezoelectric layer thicknesses and different electrode thicknesses, the resonant frequency of the resonator can be from 10MHz to 10GHz, and further, the passband of the filter can be from 10MHz to 10GHz through cascade formation. Fig. 10 is a schematic diagram showing a ladder cascade structure of resonators in the embodiment. As shown in fig. 10, the series resonators and the parallel resonators are ladder-cascade to form the most basic filter unit, and pass bands are formed by the correspondence of resonance frequencies; thus, the frequency of the resonator is affected by the thickness of the piezoelectric layer and the thickness of the electrodes (as shown in table 1 below), and filters with different frequency passbands can be formed. Table 1 is a table of data showing the combinations of different piezoelectric layer thicknesses and electrode thicknesses to form different resonance points in the examples.
TABLE 1
Example 2
A preparation method of a novel FBAR filter comprises the following specific steps:
(1) as shown in fig. 2, a preparation substrate 110 is taken, and the preparation substrate 110 may be a substrate material of silicon, silicon carbide, sapphire, glass, metal or organic polymer;
(2) as shown in fig. 3, a groove 101 is etched on a preparation substrate 110 by an etching method;
(3) as shown in fig. 4, a piezoelectric thin film structure layer 102 is prepared in a groove 101 by a chemical vapor deposition or sputtering method, the piezoelectric thin film structure layer 102 is a single crystal or polycrystalline aluminum nitride material, and may also be a material with piezoelectric properties such as ZnO and PZT, and the thickness of the piezoelectric thin film structure layer 102 is between 0.02 and 10 micrometers.
(4) As shown in fig. 5, a seed layer 103 and a bottom electrode 104 are prepared on a piezoelectric thin film structure layer 102 by a chemical vapor deposition or sputtering or electron beam evaporation method, and are subjected to patterning processing to obtain a desired electrode pattern, where the electrode material may be one or more of Al, Mo, W, Pt, Cu, Ag, Au, ZrN, or other materials with good electrical conductivity, such as non-metallic materials like graphene, and the electrode thickness is in a range from 0.1 nm to 500 nm.
(5) As shown in fig. 6, an air cavity support layer (insulating layer) 105 is then deposited to a thickness in the range of 0.2-4 microns, and then polished flat by mechanical polishing and patterned etching to obtain the air cavity support layer 105 shown in fig. 6;
(5) as shown in fig. 7, another supporting substrate 106 is taken to bond with the wafer prepared previously, which is a schematic diagram after bonding;
(6) as shown in fig. 8, removing the preparation substrate 110 by mechanical thinning combined with wet etching or dry etching, and preparing the top electrode 107;
(7) as shown in fig. 9, the seed layer 103 is etched, and the bottom electrode is led out or interconnected with the next resonator unit by sputtering or electron beam evaporation to realize the preparation of the filter, so as to obtain the novel FBAR filter.
Fig. 11 is a graph showing the effect of low insertion loss and wide pass band exhibited by the filter manufactured in the example. As shown in fig. 11, the resonator with a high Q value and a large effective electromechanical coupling coefficient shows a small insertion loss in the performance of the filter formed by cascading, and can satisfy a large passband bandwidth.
The above-mentioned embodiment only represents one embodiment of the present invention, and can be used to prepare FBAR filters with different frequency ranges, and the description thereof is simplified herein, but not intended to limit the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (10)
1. A novel FBAR filter is characterized by being formed by cascading n resonators, wherein n is an integer and is more than or equal to 1; the resonator comprises a supporting substrate, an air cavity supporting layer, a bottom electrode, a seed layer, a piezoelectric film structure layer, a top electrode and a bottom electrode upward lead; the two air cavity supporting layers are respectively stacked on the supporting substrate, the bottom electrodes are respectively connected with the two air cavity supporting layers, and the bottom electrodes, the air cavity supporting layers and the supporting substrate enclose a cavity; the seed layer is laminated on the bottom electrode and the air cavity supporting layer; the piezoelectric film structure layer and the top electrode are sequentially stacked on the seed layer; the bottom electrode is connected with the upper lead of the bottom electrode.
2. The FBAR filter of claim 1 wherein the support substrate is one or more of a silicon substrate, a sapphire substrate, a silicon carbide substrate, a gallium nitride substrate, an aluminum nitride substrate, an AlxGa1-xN buffer layer substrate, a glass substrate, and an organic polymer material flexible substrate.
3. The novel FBAR filter of claim 1, wherein the material of the air cavity support layer is an insulating material, and the insulating material is SiO2、AlN，Si3N4One or more of (1); the thickness of the air cavity supporting layer is 0.3-3 μm.
4. The novel FBAR filter according to claim 1, wherein the bottom and top electrodes are made of one or more of Al, Mo, W, Pt, Cu, Ag, Au, ZrN; the thickness of the bottom electrode and the thickness of the top electrode are both 20-500 nm.
5. The novel FBAR filter of claim 1 wherein the seed layer is a sputtered polycrystalline piezoelectric material or a single crystal piezoelectric material; the seed layer is made of more than one of AlN, ZnO, lithium niobate and lithium tantalate; the thickness of the seed layer is 5-100 nm.
6. The novel FBAR filter according to claim 1, wherein said piezoelectric thin film structure layer is one or more of a single crystal piezoelectric thin film grown epitaxially, a polycrystalline piezoelectric thin film grown by sputtering with high C-axis orientation, and a thin film with piezoelectric properties; the piezoelectric thin film structure layer is made of more than one of AlN, ZnO, PZT, lithium niobate and lithium tantalate; the thickness of the piezoelectric film structure layer is 0.02-10 μm.
7. The novel FBAR filter of claim 1 wherein the frequency of filtering is 10MHz-100 GHz.
8. A method of preparing the novel FBAR filter of any of claims 1 to 7, comprising the steps of:
(1) etching n grooves on a preparation substrate, wherein n is an integer and is not less than 1, then respectively preparing a piezoelectric thin film structure layer in each groove, preparing a seed layer on the piezoelectric thin film structure layer, and then preparing a bottom electrode on the seed layer;
(2) preparing two air cavity supporting layers on the bottom electrode and the seed layer, taking another supporting substrate, bonding the supporting substrate with the two air cavity supporting layers at the same time, and enclosing a cavity by the bottom electrode, the air cavity supporting layers and the supporting substrate;
(3) and removing the preparation substrate to expose the piezoelectric film structure layer, preparing a top electrode on the piezoelectric film structure layer, and leading out the bottom electrode to obtain the novel FBAR filter.
9. The method for preparing a novel FBAR filter according to claim 8, wherein the preparation substrate in step (1) is one or more of a silicon substrate, a sapphire substrate, a silicon carbide substrate, a gallium nitride substrate, an aluminum nitride substrate, an AlxGa1-xN buffer layer substrate, a glass substrate, and an organic polymer material flexible substrate.
10. The method of claim 8, wherein a cavity is formed in the middle of the bonding surface of the supporting substrate and the air cavity supporting layer in step (2), and the depth of the cavity is 0.5-3 μm.
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| CN202011572935.9A CN112671367A (en) | 2020-12-24 | 2020-12-24 | Novel FBAR filter and preparation method thereof |
| PCT/CN2021/127793 WO2022134860A1 (en) | 2020-12-24 | 2021-10-31 | Novel fbar filter and preparation method therefor |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022134860A1 (en) * | 2020-12-24 | 2022-06-30 | 华南理工大学 | Novel fbar filter and preparation method therefor |
| WO2022188777A1 (en) * | 2021-03-08 | 2022-09-15 | 诺思(天津)微系统有限责任公司 | Bulk acoustic wave resonator and manufacturing method therefor, filter, and electronic device |
| CN117294277A (en) * | 2023-11-24 | 2023-12-26 | 广州市艾佛光通科技有限公司 | Bulk acoustic wave resonator with high power and high electromechanical coupling coefficient and preparation method thereof |
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| CN117579026A (en) * | 2023-12-06 | 2024-02-20 | 武汉敏声新技术有限公司 | Film bulk acoustic resonator and preparation method thereof |
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| TWI493868B (en) * | 2013-01-02 | 2015-07-21 | Ind Tech Res Inst | Microelectromechanicalsystem-based resonator device |
| CN107947750A (en) * | 2017-11-22 | 2018-04-20 | 周燕红 | The preparation method and piezo-electric resonator of a kind of piezo-electric resonator |
| KR101965171B1 (en) * | 2018-08-24 | 2019-08-13 | (주)비티비엘 | Method of manufacturing ultrasonic sensor |
| CN109309483B (en) * | 2018-10-10 | 2022-03-25 | 华南理工大学 | Preparation method of support type film bulk acoustic resonator |
| CN110474616A (en) * | 2019-08-29 | 2019-11-19 | 华南理工大学 | A kind of air-gap type thin film bulk acoustic wave resonator and preparation method thereof |
| CN112671367A (en) * | 2020-12-24 | 2021-04-16 | 华南理工大学 | Novel FBAR filter and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2022134860A1 (en) * | 2020-12-24 | 2022-06-30 | 华南理工大学 | Novel fbar filter and preparation method therefor |
| WO2022188777A1 (en) * | 2021-03-08 | 2022-09-15 | 诺思(天津)微系统有限责任公司 | Bulk acoustic wave resonator and manufacturing method therefor, filter, and electronic device |
| CN117294277A (en) * | 2023-11-24 | 2023-12-26 | 广州市艾佛光通科技有限公司 | Bulk acoustic wave resonator with high power and high electromechanical coupling coefficient and preparation method thereof |
| CN117294277B (en) * | 2023-11-24 | 2024-03-26 | 广州市艾佛光通科技有限公司 | Bulk acoustic wave resonator with high power and high electromechanical coupling coefficient and preparation method thereof |
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