CN112666707A - Head-mounted electronic equipment and manufacturing method thereof - Google Patents
Head-mounted electronic equipment and manufacturing method thereof Download PDFInfo
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- CN112666707A CN112666707A CN202011429284.8A CN202011429284A CN112666707A CN 112666707 A CN112666707 A CN 112666707A CN 202011429284 A CN202011429284 A CN 202011429284A CN 112666707 A CN112666707 A CN 112666707A
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Abstract
The application discloses a head-mounted electronic device and a manufacturing method thereof. The head-mounted electronic device includes: the fixing part is provided with a cavity and is used for wearing the head-mounted electronic equipment on the head of a user; the heating element is arranged in the cavity; the heat conducting fins are arranged in the cavity and extend along the outline of the cavity, the heat conducting fins are connected with the heating element in a heat conducting manner, and at least part of the heat conducting fins are connected with the inner wall of the cavity in a heat conducting manner so as to conduct heat generated by the heating element to the fixing part. The fixing part in the head-mounted electronic equipment has relatively large volume and surface area, and the heat conducting sheet extends along the fixing part to enable the heat conducting sheet to have relatively large heat conducting area, so that heat generated by the heating element can be conducted out of the fixing part more quickly.
Description
Technical Field
The present disclosure relates to the field of electronic devices, and particularly, to a head-mounted electronic device and a method for manufacturing the same.
Background
With the development and progress of science and technology, the application of the head-mounted electronic equipment in various fields such as games, virtual reality, multimedia, entertainment, simulation, scientific research and the like is more and more extensive, and the requirements of users on the head-mounted electronic equipment are higher and higher.
In general, a head-mounted electronic device is provided with various electronic components such as a circuit board and a chip. When the head-mounted electronic equipment works, the heat productivity of the electronic element is often larger, so that the temperature of the equipment is higher, and the comfort degree of the equipment is influenced.
Disclosure of Invention
The embodiment of the application discloses a head-mounted electronic device and a manufacturing method thereof.
In a first aspect, embodiments of the present disclosure provide a head-mounted electronic device, including: the fixing part is provided with a cavity and is used for wearing the head-mounted electronic equipment on the head of a user; the heating element is arranged in the cavity; the heat conducting fins are arranged in the cavity and extend along the outline of the cavity, the heat conducting fins are connected with the heating element in a heat conducting manner, and at least part of the heat conducting fins are connected with the inner wall of the cavity of the fixing part in a heat conducting manner so as to conduct heat generated by the heating element to the outside of the fixing part.
In a second aspect, an embodiment of the present disclosure further provides a method for manufacturing a head-mounted electronic device, for manufacturing the head-mounted electronic device, where the method includes: arranging the heating element in a fixing part, wherein the fixing part is used for wearing the head-mounted electronic equipment on the head of a user; the heat conducting fin is fixed in the fixing part, so that the heat conducting fin is in heat conduction connection with the heating element, and at least part of the heat conducting fin is in heat conduction connection with the fixing part, wherein the heat conducting fin extends along the fixing part.
The beneficial effect of this application is as follows: the fixing part is used for wearing the head-mounted electronic equipment on the head of a user, and usually has relatively large volume and surface area, correspondingly, the heat conducting sheet extending along the cavity of the fixing part can also have relatively large heat dissipation area, at least part of the heat conducting sheet is connected with the inner wall of the cavity in a heat conducting manner, so that the heat conducting sheet can conduct heat to the fixing part quickly after absorbing heat generated by the heating element, the outer surface of the fixing part can dissipate heat quickly, and the heat dissipation effect of the head-mounted electronic equipment is improved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:
FIG. 1 shows a schematic structural diagram of one embodiment of a head mounted electronic device according to the present application;
FIG. 2 shows a schematic structural diagram of another embodiment of a head mounted electronic device according to the present application;
FIG. 3A shows a schematic structural diagram of yet another embodiment of a head mounted electronic device according to the present application;
fig. 3B shows a partial structural sectional view of the head-mounted electronic apparatus of the present embodiment;
FIG. 4 shows a schematic structural diagram of yet another embodiment of a head mounted electronic device according to the present application;
FIG. 5 shows a flow diagram of one embodiment of a method of fabricating a head mounted electronic device according to the present application.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be described in detail and completely with reference to the following specific embodiments of the present application and the accompanying drawings. It should be apparent that the described embodiments are only some of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Fig. 1 shows a schematic structural diagram of an embodiment of a head-mounted electronic device according to the present application. As shown in fig. 1, in the present embodiment, the head-mounted electronic apparatus 100 may include a fixing portion 101, a heat generating element 102, and a heat conductive sheet 103. In order to clearly show the fixing portion 101, the heat generating element 102 and the heat conducting sheet 103 of the head-mounted electronic device in the embodiment, only a partial structure of the head-mounted electronic device 100 is shown in fig. 1, which is not a limitation of the present application.
In this embodiment, the fixing portion 101 may be a component in the head-mounted electronic device 100, and the fixing portion may wear the head-mounted electronic device 100 on the head of the user. Further, a cavity is formed inside the fixing portion 101. The heating element 102 may be disposed in a cavity formed by the fixing portion 101. It is understood that the heat generating element 102 may be various electrical elements, such as a chip, a motherboard, etc., required for the head-mounted electronic device 100 to perform functions, and such electrical elements tend to generate heat during operation.
The heat conductive sheet 103 may be disposed in the cavity of the fixing portion 101. The heat conductive sheet 103 extends along the contour of the cavity. It can be seen that the shape of the heat-conducting sheet 103 can be adapted to the shape of the fixing portion 101. As an example, the shape of the heat conduction sheet 103 is adapted to the shape of the fixing portion 101, which can be understood as that the orthographic projection of the heat conduction sheet 103 to the ground is similar to the orthographic projection of the fixing portion 101 to the ground, and the area of the orthographic projection of the heat conduction sheet 103 to the ground is slightly smaller than that of the orthographic projection of the fixing portion 101 to the ground. The heat conductive sheet 103 is thermally connected to the heating element 102, and therefore, the heat conductive sheet 103 can absorb heat generated by the heating element 102. Meanwhile, at least a portion of the heat conductive sheet 103 may be thermally connected to the fixing portion 101, so that heat absorbed by the heat conductive sheet 103 may be conducted to the fixing portion 101, and thus heat may be dissipated to the outside from the outer surface of the fixing portion 101. As an example, the heat conducting sheet 103 may be in contact connection with the inner walls of the cavity of the heat generating element 102 and the fixing portion 101 to achieve a good heat conduction effect, or the heat conducting sheet 103 may be in indirect connection with the heat generating element 102 and the fixing portion 101. There is no unique limitation on the specific implementation of the thermally conductive connection.
Further, in the head mounted electronic apparatus 100, the cavity of the fixing part 101 for wearing the head mounted electronic apparatus on the head of the user has a large surface area. Therefore, the heat conductive sheet 103 disposed in the cavity of the fixing portion 101 and extending along the contour of the cavity can have a relatively large heat conductive area. The heat conducting sheet 103 is connected with the heating element 102 in a heat conducting manner, so that the heat conducting sheet 103 can absorb heat generated by the heating element 102 more quickly and conduct the heat to the inner wall of the cavity more quickly until the heat is dissipated out of the fixing part 101. The heat dissipation efficiency of the head-mounted electronic device 100 is improved.
In general, the head-mounted electronic device 100 may be wearable glasses (e.g., AR glasses) including temples, a ring-type display device without distinguishing the temples, and the like, without being limited thereto. If the head-mounted electronic device 100 is a pair of wearable glasses, the fixing portion 101 may be a temple of the pair of wearable glasses that can be supported by the ear of the user. If the head-mounted electronic device 100 is a ring-type display device (e.g., HoloLens), the fixing portion 101 may be a wearing member such as a headband in the ring-type display device.
It is understood that, in order that the heat conductive sheet 103 can quickly conduct heat to the fixing portion 101, the heat conductive sheet 103 may be made of metal having good heat conductive properties. Further, in order to reduce the weight of the head-mounted electronic apparatus, while ensuring that the heat-conducting sheet 103 has a large heat-conducting area, the thickness of the heat-conducting sheet 103 may be reduced, which enables heat to be conducted to the fixing portion 101 more quickly, and also enables the overall weight of the head-mounted electronic apparatus to be reduced, for example, the heat-conducting sheet 103 may be made of copper foil.
In some optional implementations of the present embodiment, the fixing portion 101 may be a one-piece structure with a hollow inside, and the fixing portion 101 may be formed with a cavity. Alternatively, the fixing portion 101 may be a split structure, as shown in fig. 1, different components of the split structure may be fixed by snapping, adhering, or the like to form the fixing portion 101, and there is no unique limitation on the fixing portion 101 here. Generally, the fixing portion 101 is made of a material having a certain thermal conductivity, so that heat generated by the heat generating element 102 can be quickly dissipated to the outside through the fixing portion 101.
With continued reference to fig. 2, a schematic structural diagram of another embodiment of a head-mounted electronic device according to the present application is shown. In the present embodiment, the head-mounted electronic apparatus 200 may include a fixing portion 201, a heat generating element 202, a heat conductive sheet 203, and a heat conductive block 204.
Specifically, the heat conduction block 204 may be disposed between the heat generating element 202 and the heat conduction sheet 203, and thermally connected to the heat generating element 202 and the heat conduction sheet 203, so that the heat conduction block 204 can rapidly conduct heat generated by the heat generating element 202 to the heat conduction sheet 203. Here, the heat conduction block 204 can improve heat conduction between the heat generating element 202 and the heat conductive sheet 203, and improve the heat dissipation performance of the heat conductive sheet 203. Alternatively, the heat conduction block 204 may be made of a metal having good thermal conductivity, and may more rapidly absorb heat generated by the heat generating component 202 and conduct the heat to the heat conduction sheet 203, for example, the heat conduction block 204 may be a copper sheet.
In some optional implementations of the present embodiment, the heat generating element 202, the heat conducting block 204 and the heat conducting sheet 203 may be sequentially arranged along a predetermined direction, as shown in fig. 2, where the predetermined direction may be shown by an arrow in fig. 2. Further, the heat conduction block 204 may be connected to the heat generating element 202 and the heat conduction sheet 203 in direct contact. When the heat conduction block 204 is in direct contact with the heat conduction sheet 203 and the heat generating element 202, the heat of the heat generating element 202 can be more quickly conducted to the heat conduction block 204, and the heat conduction block 204 can also more quickly conduct the heat to the heat conduction sheet 203. It can be understood that the space occupied by the direct contact connection of the heat generating element 202, the heat conducting block 204 and the heat conducting sheet 203 is also smaller, and when the heat generating element is applied to a head-mounted electronic device, the volume of the head-mounted electronic device can be smaller, which is beneficial to the miniaturization of the device.
In some optional implementations of the present embodiment, the size of the heat conducting block 204 may be adapted to the size of the heat generating element 202, and specifically, the size of the heat conducting block 204 may be smaller than the size of the heat conducting sheet 203, as shown in fig. 2. It is understood that the size of the heat generating element 202 in the head-mounted electronic device is often smaller, the size of the heat conducting block 204 may be slightly larger than the size of the heat generating element 202, and the orthographic projection of the heat generating element 202 towards the heat conducting sheet 203 may completely fall within the orthographic projection of the heat conducting block 204 towards the heat conducting sheet 203. Of course, the larger the size of the heat generating element 202, the larger the size of the heat conducting block 204 may be. In order to improve the heat dissipation effect, the heat conductive sheet 203 corresponding to the size of the fixing portion 201 is generally large in size. The size of the heat conduction block 204 is adapted to the size of the heating element 202, so that heat generated by the heating element 202 can be quickly conducted to the heat conduction block 204, and the waste of materials of the heat conduction block 204 and the increase of the weight of the head-mounted electronic device can be avoided while the heat conduction effect of the heat conduction block 204 is ensured.
Alternatively, the heat-conducting block 204 and the heat-conducting sheet 203 may be an integral structure. When the heat-conducting block 204 and the heat-conducting fin 203 are integrally formed, they can be integrally formed. The heat-conducting block 204 and the heat-conducting sheet 203 are integrated, so that the manufacturing method of the head-mounted electronic device 200 can be simplified, the internal structure of the fixing portion 201 is more compact, and the heat-conducting effect of the heat-conducting block 204 is improved. It is to be understood that, when the heat conduction block 204 and the heat conduction sheet 203 are separate structures, they may be connected by welding or gluing, and the like, which is not limited herein.
In some optional implementations of the present embodiment, in the case where the head-mounted electronic device 200 is worn, the fixing portion 201 may include a wall surface on a side away from the skin of the user and a wall surface on a side close to the skin of the user. Specifically, the heat conductive sheet 203 may be thermally connected to a wall surface of the fixing portion 201 on a side away from the skin of the user, so that the heat conductive sheet 203 may conduct heat generated by the heat generating element 202 to the side of the fixing portion 201 away from the skin of the user. Therefore, when the user wears the head-mounted electronic device 200, the fixing portion 201 can radiate heat of the heating element 202 from one side away from the skin of the user, so that the influence of the heat generated by the heating element 202 on the user is reduced, and the user experience is improved.
In some optional implementations of the present embodiment, the head-mounted electronic device 200 may further include at least one thermal insulation layer 205. As shown in fig. 2, the head-mounted electronic device 200 may include two thermal barriers 205. It will be understood by those skilled in the art that the specific number of the thermal insulation layers 205 can be set according to actual requirements. The insulating layer 205 can be correspondingly disposed on the wall surface of the cavity of the fixing portion 201 on the side close to the skin of the user, so as to separate the fixing portion 201 from the portion of the heat conducting sheet 203 in this area, and avoid the user from feeling discomfort due to the excessively high temperature in this area.
The heat insulating layer 205 may be provided between the fixing portion 201 and the heat generating element 202. Generally, when the user wears the head-mounted electronic device 200, the fixing portion 201 has a contact area near or contacting the skin of the user, and the thermal insulation layer 205 may be disposed in contact with an inner wall corresponding to the contact area in the cavity of the fixing portion 201. Therefore, the heat insulation layer 205 can separate the inner wall of the fixing portion 201 from the heating element 202, so that heat generated by the heating element 202 is not directly transmitted to a contact area of the skin of the user in the fixing portion 201, and the problem that the wearing of the user is affected due to overhigh temperature of an area in which the heating element 202 is arranged in the fixing portion 201 is avoided.
Further, when the heat insulating layer 205 corresponding to the heat generating element 202 is provided, the shape and size of the heat insulating layer 205 may be adapted to the shape and size of the heat generating element 202, as shown in fig. 2. This embodiment can improve the heat insulating effect of the heat insulating layer 205 and reduce the weight of the head-mounted electronic device 200 as much as possible. It can be seen that the size of the heat conducting sheet 203 is much larger than that of the heat insulating layer 205, so that the heat insulating layer 205 does not affect the heat conducting connection between the heat conducting sheet 203 and the fixing portion 201 at the region other than the contact region, so that the heat conducting sheet 203 still has good heat conducting performance. Alternatively, the thermal insulation layer 205 may be an aerogel sheet. It will be understood by those skilled in the art that the thermal insulation layer 205 may be made of other materials with good thermal insulation effect, and is not limited herein.
In some optional implementations of the embodiment, in a case that the head-mounted electronic device 200 is worn, a thermal conductivity of a material of a wall surface of the fixing portion 201 close to the skin of the user may be smaller than a first preset thermal conductivity, and a thermal conductivity of a material of a wall surface of the fixing portion 201 away from the human body may be larger than a second preset thermal conductivity. In this implementation, the first predetermined thermal conductivity may be less than the second predetermined thermal conductivity. In general, the user may feel a stronger heat to the wall surface of the fixing portion 201 close to the skin of the user than to the wall surface of the fixing portion 201 far from the skin of the user. Therefore, in order to reduce the influence of the heat generated by the heat generating element 202 on the user, the fixing portion 201 formed of a material having low thermal conductivity on the side close to the skin of the user can make the heat less perceptible to the user, thereby improving the user experience. The high thermal conductivity of the material of the fixing portion 201 away from the skin of the user can make the heat more easily conducted to the side away from the human body, thereby improving the heat dissipation efficiency. Alternatively, the wall surface of the fixing portion 201 close to the skin of the user may be made of plastic, and the wall surface of the fixing portion 201 away from the skin of the user may be made of metal with good thermal conductivity, such as aluminum alloy or magnesium-aluminum alloy. Wherein the plastic has low thermal conductivity and skin-friendly property. Metal texture such as aluminum alloy or almag is hard and density is less, accords with the light and easily characteristics of wearing of wear-type electronic equipment, also has good heat conduction effect simultaneously, can give off the heat outside the fixed part fast.
Referring next to fig. 3A-3B, fig. 3A is a schematic structural diagram of a head-mounted electronic device according to another embodiment of the present application, and fig. 3B is a partial structural sectional view of the head-mounted electronic device according to the embodiment. In the present embodiment, the head-mounted electronic device 300 may include a fixing portion 301, a heat generating element 302, a heat conducting sheet 303, and a heat dissipating fan 306, as shown in fig. 3A.
In this embodiment, specific structures, arrangement manners, and the like of the fixing portion 301, the heating element 302, and the heat conducting sheet 303 may refer to the head-mounted electronic device shown in fig. 1 or fig. 2, and are not described herein again. One or more heat dissipation fans 306 may be included in the head-mounted electronic device 300, as shown in fig. 3A or 3B, and one heat dissipation fan 306 may be included in the head-mounted electronic device 300. It should be noted that, if the head-mounted electronic device 300 has a plurality of heat-generating components 302, a plurality of heat-dissipating fans 306 may be correspondingly disposed, so as to ensure that each heat-generating component 302 has at least one heat-dissipating fan 306 corresponding thereto, and to discharge heat generated by the heat-dissipating fan 306 to the outside of the fixing portion 301.
Further, the distance between the heat dissipation fan 306 and the heat generating element 302 may be smaller than a predetermined distance. Since the airflow has the coanda effect, the airflow blown by the heat dissipation fan 306 to the surface of the heat generating element 302 will travel along the inner wall of the fixing portion 301, and therefore, the heat generated by the heat generating element 302 can be discharged more quickly by disposing the heat dissipation fan 306 close to the heat generating element 302. A person skilled in the art can determine a specific value of the preset distance according to the size of the head-mounted electronic device and the position of the fixing portion 301, so that the heat dissipation fan 306 can be disposed close to the heating element 302, and the heat dissipation effect of the heat dissipation fan 306 is improved.
Specifically, the fixing portion 301 may be provided with at least one air inlet a disposed corresponding to an air inlet direction of the heat dissipation fan 306, as shown in fig. 3A or 3B. The wall of the fixing portion 301 may further have at least one air outlet B disposed corresponding to the air outlet direction of the heat dissipation fan 306, as shown in fig. 3A or 3B, and the air outlet direction of the heat dissipation fan 306 faces the heat generating element 302. In this embodiment, the air inlet a formed in the wall of the fixing portion 301 enables the heat dissipation fan 306 to draw external normal temperature air into the cavity of the fixing portion 301, and then blow the normal temperature air toward the heating element 302, the normal temperature air takes away heat generated by the heating element 302 and discharges the heat from the air outlet B, and an air inlet direction and an air outlet direction of the heat dissipation fan 306 may be shown by dashed arrows in fig. 3B.
In some optional implementations of this embodiment, the head-mounted electronic device 300 may further include a thermal conductive block 304 and a thermal insulating layer 305, as shown in fig. 3A or 3B. The arrangement, structure, etc. of the heat conducting block 304 and the thermal insulation layer 305 may be as shown in the head-mounted electronic device in fig. 2, and are not described herein again.
In some optional implementations of the present embodiment, a plurality of heat dissipation holes 3011 are disposed on the surface of the fixing portion 301, and each heat dissipation hole 3011 may be disposed corresponding to the heat conducting sheet 303, as shown in fig. 3A. The heat in the fixing portion 301 can be more rapidly discharged from the heat dissipation holes 3011, thereby improving the heat dissipation efficiency. Meanwhile, the number and specific arrangement of the heat dissipation holes 3011 may be set according to actual heat dissipation needs, and there is no specific limitation here.
Compared with the head-mounted electronic device shown in fig. 1, the heat dissipation fan 306 is added to the head-mounted electronic device 300 provided in the above embodiment of the present application, and the heat generated by the heating element 302 can be also taken away by the rotation of the heat dissipation fan 306 outside the heat conducting fin 303 conducting the heat generated by the heating element 302 to the fixing portion 301, so that the heat dissipation effect of the head-mounted electronic device is further improved.
With further reference to fig. 4, a schematic structural diagram of yet another embodiment of a wearable electronic device according to the present application is shown. In this embodiment, the head-mounted electronic device may be wearable glasses 400, and as shown in fig. 4, the fixed part included in the head-mounted electronic device may be a temple housing 401 of the wearable glasses 400, and the wearable glasses further include a frame connected to the temple housing 401. The wearable glasses 400 may further include a heat generating element and a heat conductive sheet.
In the present embodiment, the size and shape of the above-described heat-conducting sheet may be adapted to the size and shape of the temple case 401. The arrangement and structure of the heating element, the heat conducting sheet and the temple shell 401 can be as shown in fig. 1, fig. 2 or fig. 3A, for example, the heating element can be arranged in the temple shell 401 corresponding to the virtual coil shown in fig. 4, that is, the temple shell 401 is far away from one side of the frame, so that the ear of the user can support a heavy area in the temple shell 401, thereby the fixing effect of the wearable glasses 400 is better, and the wearable glasses can be prevented from pressing the bridge of the nose of the user.
In some optional implementations of the present embodiment, the temple housing 401 may be a split structure, and the temple housing 401 may include an inner shell and an outer shell. Wherein, the inner casing and the outer casing constitute the above-mentioned temple casing 401, and refer to fig. 1 or fig. 2 or fig. 3A. Here, the inner case is close to the user in the wearable eyeglasses 400 worn state, and the outer case is far from the user in the wearable eyeglasses 400 worn state. In this implementation, the wearable glasses 400 described above may also include a thermally conductive block. Here, the inner shell, the heating element, the heat conducting block, and the heat conducting fin may be arranged in a predetermined direction, and the arrangement, structure, and the like of the inner shell, the heating element, the heat conducting block, the heat conducting fin, and the outer shell may be as shown in fig. 2 or fig. 3A, and are not described herein again. It will be appreciated that the separation of the temple housing 401 into an inner and outer shell facilitates the arrangement of various components of the wearable eyeglasses 400. As an example, the inner shell and the outer shell are detachable, specifically, a detachable adhesive or a snap connection, which is easy to implement.
In some optional implementations of this embodiment, the wearable glasses 400 may further include at least one thermal insulation layer. Wherein the thermal insulation layer may be provided on the wall surface inside the temple case 401 close to the skin of the user. Of course, an insulating layer may also be provided between the temple housing 401 and the heating element. As an example, the wearable glasses 400 include two insulative layers that may be disposed adjacent to the inner and outer shells of the temple housing 401, respectively, as shown in fig. 2 or 3A, and each insulative layer may be in contact with the inner and outer shells of the temple housing 401, respectively. This arrangement may allow both sides of the temple housing 401 in contact with the user's ear to be thermally insulated, thereby improving user experience. Alternatively, the wearable eyeglasses 400 may also include only one insulative layer, which may be disposed adjacent to the inner or outer shells of the temple housings 401.
In the related art, the electric components of the wearable glasses are usually disposed in the frame carrying the lens, which causes the frame to often generate heat locally. The wearable glasses disclosed in the embodiment have the heating element arranged in the glasses leg shells, the inner wall of the cavity formed by the glasses leg shells has a larger surface area, and the heat conducting fins are in the size and shape suitable for the glasses leg shells, so that the heat radiating area of the heat conducting fins is larger, and the heat radiating effect of the wearable glasses is improved.
In some optional implementation manners of this embodiment, the wearable glasses may further include at least one heat dissipation fan (please refer to fig. 3A or fig. 3B), a distance between the heat dissipation fan and the heating element may be smaller than a preset distance, the temple shell is provided with at least one air inlet disposed corresponding to an air inlet direction of the heat dissipation fan, an air outlet direction of the heat dissipation fan faces the heating element, and the temple shell is further provided with at least one air outlet disposed corresponding to the air outlet direction of the heat dissipation fan. Alternatively, an air outlet may be provided in a region between the wall surface of the temple housing close to the user and the wall surface of the temple housing far from the user (the specific position of the air outlet may refer to fig. 3A or 3B), and the air outlet may be provided close to the heating element. Therefore, when the user wears the wearable glasses in this embodiment, the heat discharged from the air outlet does not directly blow to the skin of the user, so that discomfort caused by the discharged heat to the human body can be avoided.
Referring next to fig. 5, shown is a flow chart 500 of one embodiment of a method of fabricating a head mounted electronic device according to the present application. The method 500 for manufacturing a head-mounted electronic device in this embodiment may be used to manufacture the head-mounted electronic device, and the method in this embodiment includes the following steps:
In this embodiment, the fixing portion may be configured to wear the head-mounted electronic device on the head of the user, and the heat generating element may be disposed in the cavity of the fixing portion. Here, the heat generating element may be disposed in the fixing portion by means of, for example, adhesion or the like.
In this embodiment, the heat-conducting fin is fixed in the cavity of the fixing portion, so that the heat-conducting fin can be connected with the heating element in a heat-conducting manner, and at least part of the heat-conducting fin can be connected with the inner wall of the cavity of the fixing portion in a heat-conducting manner. As an example, the heat-conducting sheet may be directly contact-type heat-conducting connected with the heating element and the fixing portion, and specifically, the heat-conducting sheet may be contact-type connected with the inner wall of the fixing portion after the heating element is contact-type connected with the heat-conducting sheet. It should be noted that the heat conducting sheet may extend along the cavity of the fixing portion, and it can be seen that the size and shape of the heat conducting sheet may be adapted to the size and shape of the fixing portion, so that the heat conducting sheet has a larger heat dissipation area, and the head-mounted electronic device manufactured by the method of this embodiment has a good heat dissipation effect.
In some optional implementations of this embodiment, the head-mounted electronic device may be wearable glasses, and the fixing part may be a temple shell of the wearable glasses. Here, the temple case may be a split type structure, and the temple case may include an inner case that the user is close to the user in the wearable glasses wearing state and an outer case that is far from the user. Further, the head-mounted electronic device may further include a thermal conductive block and a thermal insulation layer. The heat conducting block can be used for conducting heat generated by the heating element to the heat conducting sheet, and the heat insulating layer can be used for isolating the heat of the heating element for the glasses leg shell.
In this case, the method for manufacturing wearable glasses may include: firstly, respectively fixing a heat insulation layer on the inner wall of an inner shell and the inner wall of an outer shell; then, the heating element can be fixed on the heat insulation layer of the inner shell, so that the heat insulation layer can be positioned between the heating element and the inner shell; then, the heat conducting block can be connected with the heating element in a heat conducting manner so as to conduct the heat generated by the heating element to the heat conducting block; then, the heat conducting sheet is connected with the heat conducting block in a heat conducting manner, so that the heat conducting block can conduct heat generated by the heating element to the heat conducting sheet; finally, the heat conducting fins may be thermally conductively connected to the inner wall of the housing.
In some optional implementations of this embodiment, a heat dissipation fan may be further included in the head-mounted electronic device. When the cooling fan needs to be installed, the specific installation position of the cooling fan can be determined in the area close to the heating element, then the corresponding air inlet and air outlet are formed in the fixing portion, and finally the cooling fan is fixed at the determined position. It should be noted that the air outlet direction of the heat dissipation fan may face the heating element, so that when the heat dissipation fan works, air can be blown to the heating element to further reduce the temperature of the head-mounted electronic device.
The above description is only an example of the present application and is not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.
Claims (17)
1. A head-mounted electronic device, comprising:
the fixing part is provided with a cavity and used for wearing the head-mounted electronic equipment on the head of a user;
a heating element disposed within the cavity;
the heat conducting sheet is arranged in the cavity and extends along the outline of the cavity, the heat conducting sheet is connected with the heating element in a heat conducting manner, and at least part of the heat conducting sheet is connected with the inner wall of the cavity in a heat conducting manner so as to conduct heat generated by the heating element to the fixing part.
2. The head-mounted electronic apparatus according to claim 1, wherein the fixing portion has a wall surface on a side away from the skin of the user, and the heat-conducting sheet is thermally connected to an inner side of the wall surface.
3. The head mounted electronic device of claim 1, wherein the head mounted electronic device further comprises: at least one heat-conducting block;
the heat conducting block is connected with the heating element and the heat conducting sheet in a heat conducting manner so as to conduct heat generated by the heating element to the heat conducting sheet.
4. The head-mounted electronic apparatus according to claim 3, wherein the heat generating element, the heat conductive block, and the heat conductive sheet are arranged in this order in a predetermined direction, and the heat conductive block is connected in contact with the heat generating element and the heat conductive sheet.
5. The head-mounted electronic device according to claim 4, wherein the thermal conductive block has a size corresponding to a size of the heat generating element, and the thermal conductive block has a size smaller than the thermal conductive sheet.
6. The head-mounted electronic device of claim 5, wherein the thermal mass and the thermal sheet are a unitary structure.
7. The head mounted electronic device of claim 1, wherein the head mounted electronic device further comprises: at least one heat dissipation fan, wherein the distance between the heat dissipation fan and the heating element is less than a preset distance;
the fixing portion is provided with at least one air inlet corresponding to the air inlet direction of the heat dissipation fan, the air outlet direction of the heat dissipation fan faces the heating element, and the fixing portion is further provided with at least one air outlet corresponding to the air outlet direction of the heat dissipation fan.
8. The head mounted electronic device of claim 1, wherein the head mounted electronic device further comprises: the fixing part is provided with a contact area contacted with the skin of a user, and the heat insulation layer is arranged corresponding to the contact area so as to ensure that part of the heat conduction sheet is in heat conduction type connection with the inner wall of the cavity.
9. The head-mounted electronic device according to claim 8, wherein a plurality of heat dissipation holes are distributed on the surface of the fixing portion, the heat dissipation holes corresponding to the heat-conducting sheet.
10. The head-mounted electronic device of claim 8, wherein the thermal insulation layer is an aerogel sheet.
11. The head-mounted electronic device of claim 2, wherein the thermal conductivity of the material of the outer wall of the fixing part close to the skin of the user is less than a first preset thermal conductivity, and the thermal conductivity of the material of the wall surface of the fixing part far from the skin of the user is greater than a second preset thermal conductivity.
12. The head-mounted electronic device of claim 11, wherein the material of the outer wall of the fixing portion close to the skin of the user comprises plastic, and the material of the outer wall of the fixing portion far from the skin of the user comprises metal.
13. The head-mounted electronic device according to any one of claims 1-12, wherein the head-mounted electronic device is a wearable eyeglass, the fixing portion comprises a temple housing of the wearable eyeglass, and the thermal conductive sheet extends along a cavity of the temple housing.
14. The head mounted electronic device of claim 13, wherein the head mounted electronic device further comprises: a heat conducting block;
the temple shell comprises an inner shell and an outer shell which are used for forming the cavity, wherein the inner shell is close to a human body in the wearable glasses wearing state, and the outer shell is far away from the human body in the wearable glasses wearing state;
the inner shell, the heating element, the heat conduction block, the heat conduction sheet and the outer shell are sequentially arranged along a preset direction.
15. The head mounted electronic device of claim 14, wherein the head mounted electronic device further comprises: at least one thermal insulation layer is arranged between the heat conducting fins and the inner wall of the cavity, and the thermal insulation layer and the contact area of the glasses leg shell and the skin of the user are correspondingly arranged, so that part of the heat conducting fins are in heat conducting connection with the inner wall of the cavity.
16. A method of manufacturing a head-mounted electronic device, for manufacturing a head-mounted electronic device according to any one of claims 1-15, the method comprising:
arranging a heating element in a cavity of a fixing part, wherein the fixing part is used for wearing the head-mounted electronic equipment on the head of a user;
fixing a heat conducting fin in the cavity so as to enable the heat conducting fin to be in heat-conducting connection with the heating element and enable at least part of the heat conducting fin to be in heat-conducting connection with the inner wall of the cavity, wherein the heat conducting fin extends along the outline of the cavity.
17. The method for manufacturing a head-mounted electronic device according to claim 16, wherein the head-mounted electronic device is a pair of wearable glasses, the fixing part includes a temple housing of the pair of wearable glasses, and the temple housing includes an inner housing close to a human body and an outer housing far from the human body in a wearing state of the pair of wearable glasses;
the wearable glasses further comprise a heat conduction block, a heat insulation layer and a glasses frame connected with the glasses leg shells;
the method comprises the following steps:
fixing the heat insulation layer on the inner wall of the inner shell and the inner wall of the outer shell respectively, wherein the heat insulation layer is arranged at one end of the glasses leg shell, which is far away from the glasses frame;
fixing the heating element on a heat insulation layer of the inner shell so that the heat insulation layer is positioned between the heating element and the inner shell;
connecting the heat conducting block with the heating element in a heat conducting manner so as to conduct heat generated by the heating element to the heat conducting block;
connecting the heat conducting sheet and the heat conducting block in a heat conducting manner, so that the heat conducting block conducts heat generated by the heating element to the heat conducting sheet;
and connecting the heat conducting fins with the inner wall of the shell in a heat conducting manner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011429284.8A CN112666707A (en) | 2020-12-09 | 2020-12-09 | Head-mounted electronic equipment and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011429284.8A CN112666707A (en) | 2020-12-09 | 2020-12-09 | Head-mounted electronic equipment and manufacturing method thereof |
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| CN112666707A true CN112666707A (en) | 2021-04-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202011429284.8A Pending CN112666707A (en) | 2020-12-09 | 2020-12-09 | Head-mounted electronic equipment and manufacturing method thereof |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113126321A (en) * | 2021-04-19 | 2021-07-16 | 闪耀现实(无锡)科技有限公司 | Glasses |
| CN114280819A (en) * | 2021-12-29 | 2022-04-05 | 歌尔光学科技有限公司 | Intelligence glasses cooling structure |
| WO2023013180A1 (en) * | 2021-08-05 | 2023-02-09 | 住友電気工業株式会社 | Spectacle-type head-mounted display |
| WO2024039405A1 (en) * | 2022-08-19 | 2024-02-22 | Google Llc | Thermal management for head mounted wearable device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20160209659A1 (en) * | 2015-01-20 | 2016-07-21 | Michael Nikkhoo | Convective optical mount structure |
| CN207440398U (en) * | 2017-10-27 | 2018-06-01 | 潍坊歌尔电子有限公司 | Wear display device |
| CN209590415U (en) * | 2019-04-15 | 2019-11-05 | 潍坊歌尔电子有限公司 | A kind of helmet |
| CN210323591U (en) * | 2019-09-18 | 2020-04-14 | 杭州柏瑜机电有限公司 | VR glasses |
| CN210605214U (en) * | 2019-11-06 | 2020-05-22 | 优奈柯恩(北京)科技有限公司 | Intelligent glasses |
| CN214041883U (en) * | 2020-12-09 | 2021-08-24 | 闪耀现实(无锡)科技有限公司 | Head-mounted electronic equipment |
-
2020
- 2020-12-09 CN CN202011429284.8A patent/CN112666707A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20160209659A1 (en) * | 2015-01-20 | 2016-07-21 | Michael Nikkhoo | Convective optical mount structure |
| CN207440398U (en) * | 2017-10-27 | 2018-06-01 | 潍坊歌尔电子有限公司 | Wear display device |
| CN209590415U (en) * | 2019-04-15 | 2019-11-05 | 潍坊歌尔电子有限公司 | A kind of helmet |
| CN210323591U (en) * | 2019-09-18 | 2020-04-14 | 杭州柏瑜机电有限公司 | VR glasses |
| CN210605214U (en) * | 2019-11-06 | 2020-05-22 | 优奈柯恩(北京)科技有限公司 | Intelligent glasses |
| CN214041883U (en) * | 2020-12-09 | 2021-08-24 | 闪耀现实(无锡)科技有限公司 | Head-mounted electronic equipment |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113126321A (en) * | 2021-04-19 | 2021-07-16 | 闪耀现实(无锡)科技有限公司 | Glasses |
| WO2023013180A1 (en) * | 2021-08-05 | 2023-02-09 | 住友電気工業株式会社 | Spectacle-type head-mounted display |
| CN114280819A (en) * | 2021-12-29 | 2022-04-05 | 歌尔光学科技有限公司 | Intelligence glasses cooling structure |
| WO2024039405A1 (en) * | 2022-08-19 | 2024-02-22 | Google Llc | Thermal management for head mounted wearable device |
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Application publication date: 20210416 |