CN112665890A - Performance testing device and evaluation method for micron-sized metal microchannel heat exchanger - Google Patents
Performance testing device and evaluation method for micron-sized metal microchannel heat exchanger Download PDFInfo
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- CN112665890A CN112665890A CN202011625568.4A CN202011625568A CN112665890A CN 112665890 A CN112665890 A CN 112665890A CN 202011625568 A CN202011625568 A CN 202011625568A CN 112665890 A CN112665890 A CN 112665890A
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 61
- 239000002184 metal Substances 0.000 title claims abstract description 61
- 238000012360 testing method Methods 0.000 title claims abstract description 46
- 238000011156 evaluation Methods 0.000 title claims abstract description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 67
- 230000017525 heat dissipation Effects 0.000 claims abstract description 21
- 238000001816 cooling Methods 0.000 claims description 11
- 238000007789 sealing Methods 0.000 claims description 11
- 230000004907 flux Effects 0.000 claims description 9
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 238000009413 insulation Methods 0.000 claims description 5
- 239000000523 sample Substances 0.000 claims description 4
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 238000009530 blood pressure measurement Methods 0.000 claims description 3
- 239000012530 fluid Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 229910001256 stainless steel alloy Inorganic materials 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000002826 coolant Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000009529 body temperature measurement Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 230000002572 peristaltic effect Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
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- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention discloses a performance testing device of a micron-sized metal microchannel heat exchanger, which comprises a heat source chip, a metal microchannel heat exchanger, a testing box body, a circuit board, a pump, a pressure measuring system and a temperature collecting system, wherein the heat source chip is arranged on the heat source chip; the metal microchannel heat exchanger is arranged in the testing box body and communicated with a water inlet and a water outlet of the testing box body, the heat source chip is arranged on the metal microchannel heat exchanger, and the pressure measuring system and the temperature collecting system are respectively used for detecting flow resistance and temperature. The invention also provides a performance evaluation method based on the testing device. The invention can accurately obtain the heat dissipation capability, evaluate the heat dissipation contribution of each part and is convenient for the evaluation of the heat dissipation performance of the high-power chip.
Description
Technical Field
The invention relates to the field of microelectronic packaging, in particular to a device for testing performance of a micron-sized metal microchannel heat exchanger and an evaluation method.
Background
The metal microchannel has good heat-conducting property, good radio frequency grounding property and great application potential. At present, research, especially for the evaluation of the application heat dissipation performance of a high-power chip, lacks a test method for comprehensively reflecting the heat dissipation condition, and is unfavorable for promoting the application and development of metal microchannels.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provides a device and an evaluation method for testing the performance of a micron-sized metal microchannel heat exchanger.
In order to achieve the above purpose, the technical scheme of the invention is as follows:
the utility model provides a micron order metal microchannel heat exchanger capability test device, includes heat source chip, metal microchannel heat exchanger, test box body, circuit board, pump, pressure measurement system and temperature acquisition system, wherein: the test box body is formed by stacking a lower cover plate, a sealing gasket and an upper cover plate from bottom to top and is fixed by a fixing piece; the lower cover plate is provided with a flow channel, a first water inlet and a first water outlet, and the sealing gasket is provided with a second water inlet and a second water outlet which correspond to the first water inlet and the first water outlet one by one; the metal microchannel heat exchanger is arranged on the sealing gasket of the test box body and is communicated with the second water inlet and the second water outlet, the upper cover plate is arranged on the metal microchannel heat exchanger and is provided with an opening which is smaller than the upper surface of the metal microchannel heat exchanger corresponding to the metal microchannel heat exchanger, and the heat source chip is arranged on the metal microchannel heat exchanger in the opening; the circuit board is assembled on the upper cover plate and is electrically connected with the heat source chip; the pump, the test box body and the metal micro-channel heat exchanger form a fluid passage; the pressure measuring system is arranged at the first water inlet and the first water outlet to obtain flow resistance; the temperature acquisition system comprises a plurality of thermocouples, and the thermocouples are arranged on the surface of the heat source chip, the first water inlet and the first water outlet to acquire corresponding temperatures.
Optionally, the first water inlet is further communicated with a constant temperature water bath.
Optionally, the first water outlet is further connected with a heat exchanger.
Optionally, the first water inlet is further communicated with a filter and a degassing device.
Optionally, the upper cover plate and the lower cover plate are made of stainless steel or aluminum alloy.
Optionally, the heat source chip is a simulated heat source chip, a GaN HEMT high-power radio frequency device or a high-power SiC power electronic device; the heat source chip is bonded or eutectic-welded to the upper surface of the metal microchannel heat exchanger by adopting conductive adhesive, solder or nano silver paste.
Optionally, the heat source chip is connected with the circuit board through a gold wire, an aluminum wire or a probe card.
Optionally, the sealing gasket is a heat insulating material; or a heat insulation pad is arranged between the sealing pad and the upper cover plate, and the heat insulation pad wraps the side face of the metal micro-channel heat exchanger.
Optionally, the temperature acquisition system further includes an infrared real-time thermal imager for acquiring a surface temperature of the heat source chip.
A performance evaluation method for a micron-sized metal microchannel heat exchanger adopts the performance test device for the micron-sized metal microchannel heat exchanger, a cooling working medium is introduced from a first water inlet to obtain input voltage, input current and the temperatures of the first water inlet, a first water outlet and the surface of the microchannel heat exchanger, wherein the product of the input voltage (Vn) and the input current (In) is input heat flux density (Wn) which is shown as the following formula,
Wn＝Vn In
the heating area of the heat source chip is A, a first heat flux density (Qn) is obtained, as shown in the following formula,
Qn＝Wn/A
adjusting the first heat flux density by adjusting the voltage, and taking the surface temperature of the heat source chip smaller than the maximum allowable temperature and the temperature of the cooling working medium smaller than the phase change temperature of the cooling working medium as a reference; and converting the temperature of the first water inlet and the first water outlet into a second heat flow density, wherein the difference value between the first heat flow density and the second heat flow density is the heat dissipation caused by other factors.
The invention has the beneficial effects that: the test box body uses upper and lower apron to combine sealed the pad, seals up with the mounting and can effectively strengthen the gas tightness, prevents that the coolant liquid from revealing, avoids pressure intensity too big, and the coolant liquid directly breaks metal microchannel, destroys the assembly. The heat dissipation capability can be accurately obtained, the heat dissipation contribution of each part can be evaluated, and the heat dissipation performance evaluation of the high-power chip can be conveniently applied.
Drawings
FIG. 1 is a schematic diagram of a performance testing device of a micro-scale metal micro-channel heat exchanger according to an embodiment;
fig. 2 is an assembly schematic of a test cartridge.
Detailed Description
The invention is further explained below with reference to the figures and the specific embodiments. The drawings are only schematic and can be easily understood, and the specific proportion can be adjusted according to design requirements.
A performance testing device for a micro-scale metal micro-channel heat exchanger is mainly composed of a heat source chip 501, a metal micro-channel heat exchanger 301, a testing box 000, a circuit board 700, a DC power supply, a pump 910, a pressure measuring system 920 and a temperature collecting system 930, as shown in FIG. 1 and FIG. 2, wherein: the test cartridge 000 is formed by stacking a lower cover plate 100, a gasket 200 and a gasket 400, a heat insulating pad 300, an elastic gasket 500, and an upper cover plate 600 from bottom to top, and fixed by a fixing member 800 (e.g., a screw or a bolt), the lower cover plate 100 having a flow channel 102 and a first water inlet 101A and a first water outlet 101B, and the gasket 200 having a second water inlet 201A and a second water outlet 201B corresponding to the first water inlet 101A and the first water outlet 101B of the lower cover plate 100. The metal microchannel heat exchanger 301 is installed on the sealing gasket 200 of the testing box body and is communicated with the second water inlet 201A and the second water outlet 201B. The upper cover plate 600 is disposed on the metal microchannel heat exchanger 301 and is provided with an opening 601 smaller than the upper surface of the metal microchannel heat exchanger 301, that is, the edge of the opening 601 of the upper cover plate 600 overlaps at least 2 sides of the outer periphery of the upper surface of the metal microchannel heat exchanger 301. The gasket 400 has the same opening. The heat source chip 501 is disposed on the metal microchannel heat exchanger 301 within the opening.
The cooling working medium flows in from the first water inlet 101A, enters the microchannel 302 of the metal microchannel heat exchanger 301 through the input side of the flow channel 102, the second water inlet 201A and the input port 302A of the metal microchannel heat exchanger 301, and then flows out from the first water outlet 101B through the output port 302B of the metal microchannel heat exchanger 301, the second water outlet 201B and the output side of the flow channel 102.
The circuit board 700 is mounted on the upper cover plate 600 to provide electrical connection for the heat source chip 501 disposed on the test cartridge 000. The DC power supply can be selected from a DC power supply and used for supplying power to the heat source chip 501, the pump 910, the pressure measurement system 920 and the like. The pump 910 forms a fluid passage with the test box 000 and the micro-metal micro-channel heat exchanger 301, and a peristaltic pump or a gear pump and the like can be used for driving cooling working media to enter the test box 000 and collecting the working media after flowing through a test link. A pressure measuring system 920 (e.g., a pressure sensor) is disposed at both ends of the first water inlet 101A and the first water outlet 101B of the test cartridge 000 to obtain a flow resistance. The larger the flow rate, the better the heat dissipation effect, but the higher the required pumping power, which needs to be considered at the same time to reflect the best heat dissipation effect. The temperature acquisition system 930 mainly includes a thermocouple (thermometer) 931 and a data acquisition instrument assembly 932, where the thermocouple 931 is directly disposed on the surface of the heat source chip 501 and at least 1 of the first water inlet, the first water outlet, and the like to obtain corresponding temperatures. The temperature acquisition system 930 may further include an infrared real-time thermal imager 933 for acquiring the surface temperature of the entire heat source chip 501, and calibrating the temperature measurement result with the temperature measurement result of the thermocouple 931.
A constant temperature water bath 950 is added before the first inlet 101A of the test cartridge 000 to keep the temperature of the cooling liquid constant to a desired temperature, and the temperature of the inlet 000 of the test cartridge is constant. The heat exchanger 960 is added after the first water outlet 101B of the test cartridge 000 to cool the cooling medium, which has risen in temperature after passing through the heat source, to room temperature. A filter or degasser 940 may be added before the first inlet 101A of the test cassette 000 to remove impurities and prevent bubbles from being generated, thereby further improving the heat dissipation effect of the coolant.
The material of the upper and lower covers 600 and 100 of the test cartridge 000 may use stainless steel or aluminum alloy, etc. The heat insulation pad 300 wraps the side of the micro-metal micro-channel heat exchanger 301 so as to discharge the influence of the box body and the heat dissipation path on heat dissipation, and truly reflects the heat dissipation capability of the metal micro-channel. Further, the packing 200 and the packing 400 may be heat insulating materials, and the heat insulating mat 300 may be omitted.
The heat source chip 501 may be an analog heat source chip, or a high-power radio frequency device such as a GaN HEMT, or a high-power SiC power electronic device. The heat source chip 501 may be bonded or eutectic-bonded to the upper surface of the metal microchannel heat exchanger 301 by using conductive paste, solder, nano-silver paste, or the like, and the electrical connection between the heat source chip 501 and the circuit board 700 (e.g., PCB) may be made by using gold wire or aluminum wire, or may be connected by using a probe card. The probe card is used for electrically connecting the PCB and the heat source chip, so that the problems that a gold wire or an aluminum wire is easy to break and the requirement of lead span is limited can be effectively solved, the experimental operation is convenient, and the risk and the cost of routing again when the gold wire or the aluminum wire is broken are effectively avoided.
A performance evaluation method for a micron-sized metal microchannel heat exchanger comprises the following steps:
introducing a cooling working medium from the first water inlet to obtain input voltage, input current and the temperature of the first water inlet, the first water outlet and the surface of the micro-channel heat exchanger, wherein the product of the input voltage (Vn) and the input current (In) is input heat flow density (Wn) as shown In the following formula,
Wn＝Vn In
the heating area of the heat source chip is A, a first heat flux density (Qn) is obtained, as shown in the following formula,
Qn＝Wn/A
adjusting the first heat flux density by adjusting the voltage, and taking the surface temperature of the heat source chip smaller than the maximum allowable temperature (such as the maximum allowable temperature of GaN working is 200 ℃) and the temperature of the cooling working medium smaller than the phase change temperature of the cooling working medium as a reference; the heat dissipation effect of the metal microchannel heat exchanger is converted from the temperatures of the first water inlet and the first water outlet, namely the second heat flux density, and the difference value of the two is the heat dissipation caused by other factors. Therefore, the heat dissipation capability can be accurately acquired, the heat dissipation contribution of each part is evaluated, and the heat dissipation performance evaluation is facilitated.
The above embodiments are only used to further illustrate the performance testing apparatus and the evaluation method of the micro-scale metal micro-channel heat exchanger of the present invention, but the present invention is not limited to the embodiments, and any simple modification, equivalent change and modification made to the above embodiments according to the technical spirit of the present invention fall within the protection scope of the technical solution of the present invention.
Claims (10)
1. The utility model provides a micron order metal microchannel heat exchanger capability test device which characterized in that: including heat source chip, metal microchannel heat exchanger, test box body, circuit board, pump, pressure measurement system and temperature acquisition system, wherein:
the test box body is formed by stacking a lower cover plate, a sealing gasket and an upper cover plate from bottom to top and is fixed by a fixing piece; the lower cover plate is provided with a flow channel, a first water inlet and a first water outlet, and the sealing gasket is provided with a second water inlet and a second water outlet which correspond to the first water inlet and the first water outlet one by one; the metal microchannel heat exchanger is arranged on the sealing gasket of the test box body and is communicated with the second water inlet and the second water outlet, the upper cover plate is arranged on the metal microchannel heat exchanger and is provided with an opening which is smaller than the upper surface of the metal microchannel heat exchanger corresponding to the metal microchannel heat exchanger, and the heat source chip is arranged on the metal microchannel heat exchanger in the opening;
the circuit board is assembled on the upper cover plate and is electrically connected with the heat source chip;
the pump, the test box body and the metal micro-channel heat exchanger form a fluid passage;
the pressure measuring system is arranged at the first water inlet and the first water outlet to obtain flow resistance;
the temperature acquisition system comprises a plurality of thermocouples, and the thermocouples are arranged on the surface of the heat source chip, the first water inlet and the first water outlet to acquire corresponding temperatures.
2. The performance testing device for the micro-scale metal micro-channel heat exchanger according to claim 1, characterized in that: the first water inlet is also communicated with a constant-temperature water bath.
3. The performance testing device for the micro-scale metal micro-channel heat exchanger according to claim 1, characterized in that: the first water outlet is also connected with a heat exchanger.
4. The performance testing device for the micro-scale metal micro-channel heat exchanger according to claim 1, characterized in that: the first water inlet is also communicated with a filter and a degasser.
5. The performance testing device for the micro-scale metal micro-channel heat exchanger according to claim 1, characterized in that: the upper cover plate and the lower cover plate are made of stainless steel or aluminum alloy.
6. The performance testing device for the micro-scale metal micro-channel heat exchanger according to claim 1, characterized in that: the heat source chip is a simulated heat source chip, a GaN HEMT high-power radio frequency device or a high-power SiC power electronic device; the heat source chip is bonded or eutectic-welded to the upper surface of the metal microchannel heat exchanger by adopting conductive adhesive, solder or nano silver paste.
7. The performance testing device for the micro-scale metal micro-channel heat exchanger according to claim 1, characterized in that: the heat source chip is connected with the circuit board through a gold wire, an aluminum wire or a probe card.
8. The performance testing device for the micro-scale metal micro-channel heat exchanger according to claim 1, characterized in that: the sealing gasket is made of heat insulating materials; or a heat insulation pad is arranged between the sealing pad and the upper cover plate, and the heat insulation pad wraps the side face of the metal micro-channel heat exchanger.
9. The performance testing device for the micro-scale metal micro-channel heat exchanger according to claim 1, characterized in that: the temperature acquisition system further comprises an infrared real-time thermal imager for acquiring the surface temperature of the heat source chip.
10. A performance evaluation method for a micron-sized metal microchannel heat exchanger is characterized by comprising the following steps:
the performance testing device for the micron-sized metal microchannel heat exchanger, according to any one of claims 1 to 9, is adopted to introduce a cooling working medium from the first water inlet, and obtain an input voltage, an input current and temperatures of the first water inlet, the first water outlet and the surface of the microchannel heat exchanger, wherein the product of the input voltage (Vn) and the input current (In) is an input heat flux density (Wn) as shown In the following formula,
Wn＝Vn In
the heating area of the heat source chip is A, a first heat flux density (Qn) is obtained, as shown in the following formula,
Qn＝Wn/A
adjusting the first heat flux density by adjusting the voltage, and taking the surface temperature of the heat source chip smaller than the maximum allowable temperature and the temperature of the cooling working medium smaller than the phase change temperature of the cooling working medium as a reference; and converting the temperature of the first water inlet and the first water outlet into a second heat flow density, wherein the difference value between the first heat flow density and the second heat flow density is the heat dissipation caused by other factors.
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| CN202011625568.4A CN112665890A (en) | 2020-12-31 | 2020-12-31 | Performance testing device and evaluation method for micron-sized metal microchannel heat exchanger |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114280443A (en) * | 2021-11-03 | 2022-04-05 | 浙江大学杭州国际科创中心 | Power chip manifold type micro-channel heat exchanger testing device |
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2020
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