CN112640097A - Chip on film module, display panel and display device - Google Patents
Chip on film module, display panel and display device Download PDFInfo
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- CN112640097A CN112640097A CN201880095924.0A CN201880095924A CN112640097A CN 112640097 A CN112640097 A CN 112640097A CN 201880095924 A CN201880095924 A CN 201880095924A CN 112640097 A CN112640097 A CN 112640097A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
Abstract
The utility model provides a chip on film structure (100), display panel (60) and display device (200), wherein chip on film structure (100) includes flexible base plate (10) and chip (20), flexible base plate (10) are including stress relieving structure (12), chip (20) are including connecting terminal (22), connecting terminal (22) are chip (20) fixed connection in flexible base plate (10), stress relieving structure (12) and connecting terminal (22) interval preset distance, so that when flexible base plate (10) are crooked, stress relieving structure (12) can reduce the stress that connecting terminal (22) received, can prevent chip (20) and desolder under the state of buckling, improve the reliability of chip on film structure (100) under the state of buckling.
Description
The embodiment of the application relates to the technical field of display, in particular to a chip on film module, a display panel and a display device.
In the current stage, mobile electronic products such as mobile phones and digital cameras are developed to be light, thin, small and small, which requires a new generation of packaging technology with high density and small volume capable of being freely installed to meet the above requirements. The technology is a packaging technology for fixing a chip on a flexible circuit board, the chip is jointed with a flexible substrate circuit by using a flexible circuit board as a packaging chip carrier, and the manufactured flexible display screen can realize display in various bending states.
However, when the flexible display screen is bent, the flip-chip film is bent, which causes the chip corners on the flip-chip film to bear a large tensile force, resulting in a risk of solder joint debonding.
Disclosure of Invention
The embodiment of the application aims to provide a chip on film module, a display panel and a display device, so as to solve the technical problem that a chip in a chip on film in the prior art is easy to be desoldered in a bending state.
The embodiment of the application solves the technical problem and provides the following technical scheme:
a chip on film module includes:
a flexible substrate including a stress relief structure; and
the chip, the chip includes connecting terminal, connecting terminal will chip fixed connection in on the flexible substrate, stress relieving structure with connecting terminal interval default distance, so that when the flexible substrate is crooked, stress relieving structure can reduce the stress that connecting terminal received.
Optionally, the stress relief structure comprises a groove arranged partially around the connection terminal.
Optionally, the groove arranged around the connection terminal penetrates through the flexible substrate at least partially.
Optionally, the stress relief structure includes a plurality of grooves arranged at intervals, and the grooves arranged at intervals are toothed.
Optionally, at least a portion of the plurality of grooves arranged at intervals penetrates through the flexible substrate.
Optionally, the number of the stress relief structures is at least two, and the at least two stress relief structures are respectively disposed on two opposite sides of the connection terminal.
Optionally, the chip is rectangular; the connecting terminals are arranged side by side along the edge of the chip; the at least two stress relief structures on opposite sides of the connection terminal are symmetrical with respect to a symmetry axis of the rectangle; each of the stress relief structures is symmetrical with respect to another axis of symmetry of the rectangle.
Optionally, each stress relief structure comprises a first straight line groove, and the first straight line groove is parallel to one side of the rectangle.
Optionally, each stress relief structure comprises a first linear groove and a second linear groove; the number of the first straight line grooves is one, and the first straight line grooves are parallel to one side of the rectangle; the number of the second linear grooves is two, the two second linear grooves extend from two ends of the first linear groove towards the same direction respectively, and an included angle is formed between each second linear groove and the corresponding first linear groove and faces the connecting terminal; the second linear grooves located on the two opposite sides of the connecting terminal extend in opposite directions.
Optionally, the included angle is an obtuse angle, a right angle, or an acute angle.
Optionally, each stress relief structure comprises a first linear groove and a second linear groove; the number of the first linear grooves and the number of the second linear grooves are both one; one end of the first linear groove is connected with one end of the second linear groove, and an included angle is formed at the joint of the first linear groove and the second linear groove; the included angle faces the connection terminal.
Optionally, the included angle is an obtuse angle, a right angle, or an acute angle.
Optionally, each stress relief structure comprises a linear slot and an arc-shaped slot; the number of the linear grooves is one, and the linear grooves are parallel to one side of the rectangle; the number of the arc-shaped grooves is two, and the two arc-shaped grooves extend from two ends of the linear groove respectively and are bent towards the connecting terminal.
Optionally, each stress relief structure comprises an arc-shaped slot, which is bent towards the connection terminal.
Optionally, the stress relief structure is a hollowed-out groove or a non-hollowed-out groove.
The embodiment of the application also provides the following technical scheme for solving the technical problems:
a display panel, comprising: the display unit and the chip on film module are in communication connection.
The embodiment of the application also provides the following technical scheme for solving the technical problems:
a display device, comprising:
a substrate;
a driving layer disposed on the substrate; and
the display panel is disposed on the driving layer, and the driving layer is used for driving the display panel.
Compared with the prior art, in the chip on film module that this application embodiment provided, at the distance set up the stress structure that disappears in the distance of predetermineeing of the connecting terminal of chip to when making the flexible substrate crooked, be used for reducing the stress that the connecting terminal of chip received can prevent that the chip from desoldering under the state of buckling, improves the reliability of chip on film module under the state of buckling.
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art that other drawings can be obtained according to the structures shown in the drawings without inventive labor.
Fig. 1 is a schematic structural diagram of a chip on film module according to an embodiment of the present disclosure;
fig. 2 to 15 are schematic structural diagrams of a chip on film module according to various embodiments;
fig. 16 is a schematic structural diagram of a display device according to another embodiment of the present application.
The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. If in the embodiments of the present application there is a description referring to "first", "second", etc., the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present application.
Referring to fig. 1, a chip on film module 100 provided in an embodiment of the present disclosure includes a flexible substrate 10 and a chip 20, where the flexible substrate 10 includes a stress relief structure 12, the chip 20 includes a connection terminal 22, the connection terminal 22 fixedly connects the chip 20 to the flexible substrate 10, and the stress relief structure 12 is spaced from the connection terminal 22 by a predetermined distance, so that when the flexible substrate 10 is bent, the stress relief structure 12 can reduce stress applied to the connection terminal 22.
The predetermined distance may be obtained through experiments, as long as the stress relief structure 12 can reduce the stress applied to the connection terminal 22 when the flexible substrate 10 is bent, and the predetermined distance is, for example, 0.5 to 2 cm.
In the embodiment of the present application, the stress relief structure 12 is disposed in the predetermined distance from the connection terminal 22 in the flip chip module 100, so that when the flexible substrate 10 is bent, the stress relief structure 12 reduces the stress applied to the connection terminal 22, thereby preventing the chip 20 from being detached from the chip in the bending state, and improving the reliability of the flip chip module 100 in the bending state. The flexible substrate 10 serves as a carrier for supporting the chip 20. In this embodiment, the flexible substrate 10 is a two-layer flexible copper clad laminate (abbreviated as "2L-FCCL") composed of a flexible insulating base film and a metal foil, the flexible insulating base film is a polyimide film formed by polycondensing pyromellitic dianhydride (PMDA) and diaminodiphenyl ether (DDE) in a strong polar solvent, casting the resulting product into a film, and imidizing the film, and the metal foil is a copper foil. The bending curvature radius of the two-layer flexible copper clad laminate is less than 3mm, and the two-layer flexible copper clad laminate has excellent flexibility; the thermal expansion coefficient of the two-layer flexible copper clad laminate is less than 7 multiplied by 10－6℃ －1It has good heat resistance stability; the Water Vapor Transmission Rate (WVTR) of the two-layer flexible copper-clad plate is less than 1 multiplied by 10－6g/(m 2D) and Oxygen Transmission Rate (OTR) of less than 1X 10－5g/(m 2D) it has good water and oxygen blocking capacity; the surface roughness of the two-layer flexible copper-clad plate is small by 1nm, the two-layer flexible copper-clad plate not only has the integrity of a multi-layer structure, but also is not easy to crack when a device is bent, and the service life of the device is long.
In some embodiments, the flexible insulating base film may be made of other kinds of flexible materials, such as polyester, polynaphthalene, and the like, and the metal foil may be made of other kinds of metal materials, such as aluminum foil, composite metal foil, and the like, as needed.
In some embodiments, the flexible substrate 10 may be a flexible copper clad laminate made of three different materials, namely copper foil, film and adhesive, and is called a three-layer flexible copper clad laminate (3L-FCCL).
In some embodiments, the flexible substrate 10 may also be made of other flexible materials, such as: thermoplastic semi-crystalline polymers, such as PET, PEN and PEEK, have good transparency, low coefficient of thermal expansion, good water and oxygen barrier properties, and are relatively inexpensive; the non-crystalline thermoplastic polymer, such as PC and PES, is formed by solvent injection molding or melt injection molding, has better optical transparency and higher glass transition temperature, and when the thickness of a PC film or PES film reaches 0.1mm, the transmittance in a visible light range can reach more than 85%.
The chip 20 may be any chip applied in the display field, such as a driving chip or a control chip.
In this embodiment, the chip 20 and the flexible substrate 10 are packaged by using a non-conductive adhesive (NCA) technology, and the interconnection of the circuit is realized by directly contacting the metal bumps of the chip 20 and the metal lines of the flexible substrate 10. The non-conductive adhesive is a material without conductive particles, and may be of two types, namely, a non-conductive adhesive (NCP) and a non-conductive film (NCF), and in this embodiment, the non-conductive adhesive is a non-conductive film, the non-conductive film is attached between the chip 20 and the flexible substrate 10, and the pressure is applied to make the bumps of the chip 20 penetrate through the non-conductive film directly below the chip to directly contact with the corresponding lines of the flexible substrate 10, thereby achieving electrical connection. The non-conductive film is cured by heat and its shrinkage fixes the direct contact between the bumps of chip 20 and the printed lines. The curing shrinkage of the non-conductive film at a certain temperature not only ensures stable electrical connection between the chip 20 and the flexible substrate 10, but also provides a certain mechanical connection, thereby ensuring good bonding performance of the package body in both aspects.
The chip 20 is rectangular, and the chip 20 includes a silicon substrate, a fixed seal ring, a ground ring, at least one guard ring, at least one circuit, and a plurality of the connection terminals 22. The circuit is arranged on the silicon substrate and is provided with at least one output/input pad. The fixed seal ring is arranged on the silicon substrate and surrounds the circuit and the output/input pad. The grounding ring is arranged between the silicon substrate and the output/input pad and is electrically connected with the fixed sealing ring. The protective ring is arranged on the silicon substrate, arranged around the output/input pad and electrically connected with the fixed seal ring.
The connection terminals 22 are arranged side by side along the edge of the chip 20.
In the present embodiment, each of the connection terminals 22 is arranged side by side along a rectangle at equal intervals for fixedly connecting the chip 20 to the flexible substrate 10. The connecting terminals 22 may be any type and shape of connecting terminals 22, such as plug-in terminals, barrier terminals, spring terminals, wall terminals, etc.
The stress relief structure 12 is disposed on the flexible substrate 10, a preset distance is provided between the stress relief structure 12 and the connection terminal 22 of the chip 20, and the stress relief structure 12 is disposed along the extending direction of the bending portion of the flexible substrate 10, so that when the flexible substrate 10 is bent, the stress relief structure is used for reducing the stress applied to the connection terminal 22.
The stress relief structure 12 may be a hollow groove, a non-hollow groove or a groove partially penetrating through the flexible substrate 10, and the stress relief structure 12 is partially disposed around the connection terminal. The hollow-out grooves are slots penetrating through the flexible substrate 10, and the non-hollow-out grooves are slots or depressions not penetrating through the flexible substrate 10.
Referring to fig. 2, in the present embodiment, the number of the stress relief structures 12 is two, and the two stress relief structures 12 are respectively disposed on two opposite sides of the connection terminal 22, and the two stress relief structures 12 located on two opposite sides of the connection terminal 22 are symmetrical with respect to the first symmetry axis O1 of the rectangle; each stress relief structure 12 is symmetrical with respect to a second symmetry axis O2 of the rectangle, the first symmetry axis O1 being perpendicular to the second symmetry axis O2.
In the present embodiment, the stress relief structure 12 includes a first linear slot 122 and a second linear slot 124; the number of the first straight line grooves 122 is one, and the first straight line grooves 122 are parallel to one side of the rectangle, and the shortest distance between the first straight line grooves 122 and the connecting terminal 22 is 0.5 cm; the number of the second linear grooves 124 is two, the two second linear grooves 124 respectively extend from two ends of the first linear groove 122 towards the same direction, and the shortest distance between each second linear groove 124 and the connection terminal 22 is 0.5 cm; each of the second linear grooves 124 forms an included angle with the first linear groove 122, and the included angle formed by each of the second linear grooves 124 with the first linear groove 122 is a right angle, and the right angle faces the connection terminal 22. The two second linear grooves 124 extend toward each other.
Under the same test condition, the test results of finite element simulation show that the maximum stress of the chip surrounding region without the stress relief structure is 33MPa, and the maximum stress of the chip surrounding region with the stress relief structure is 17MPa, so that the stress relief structure 12 can greatly reduce the stress applied to the connection terminal 22.
It is understood that the shape of the stress relief structure 12 can be changed according to actual requirements, as long as the stress relief structure 12 can reduce the stress applied to the connection terminal 22 when the flexible substrate 10 is bent.
Referring to fig. 3, a chip on film module 100a according to some embodiments of the present invention is substantially the same as the chip on film module 100 shown in fig. 1 and 2, except that the stress relief structure 12a of the chip on film module 100a includes a first linear groove 122a and a second linear groove 124 a; the first straight line groove 122a is one in number and parallel to one of the sides of the rectangle; the number of the second linear grooves 124a is two, and the two second linear grooves 124a extend from both ends of the first linear groove 122a in the same direction; each of the second linear grooves 124a forms an included angle with the first linear groove 122a, and the included angle formed by each of the second linear grooves 124a and the first linear groove 122a is an obtuse angle, and the obtuse angle faces the connection terminal 22. It is understood that, in some other embodiments, the included angle formed by each of the second linear grooves 124a and the first linear groove 122a may also be an acute angle, and the acute angle is towards the connection terminal 22.
The shortest distance between the first linear groove 122a and the connection terminal 22 is 0.5 cm, and the shortest distance between each of the second linear grooves 124a and the connection terminal 22 is 0.8 cm.
Referring to fig. 4, a chip on film module 100b according to some embodiments of the present disclosure is substantially the same as the chip on film module 100 shown in fig. 1 and 2, except that the stress relief structure 12b of the chip on film module 100b is substantially triangular, the stress relief structure 12b includes a first linear slot 122b and a second linear slot 124b, and the number of the first linear slot 122b and the second linear slot 124b is one; one end of the first linear groove 122b is connected to one end of the second linear groove 124 b; the included angle between the first linear groove 122b and the second linear groove 124b is an obtuse angle, and the obtuse angle faces the connection terminal 22.
The shortest distance between the first linear groove 122b and the connection terminal 22 is 0.6 cm, and the shortest distance between the second linear groove 124b and the connection terminal 22 is also 0.6 cm.
It is understood that, in alternative embodiments, the included angle between the first linear groove 122b and the second linear groove 124b may also be a right angle or an acute angle, and the right angle or the acute angle is toward the connection terminal 22.
Referring to fig. 5, a flip-chip module 100c according to some embodiments of the present invention is substantially the same as the flip-chip module 100 shown in fig. 1 and 2, except that the stress relief structure 12c of the flip-chip module 100c is linear, and the stress relief structure 12c includes a first linear groove parallel to one side of the rectangle. The shortest distance between the first straight line groove and the connection terminal 22 is 0.5 cm.
Referring to fig. 6, a flip-chip module 100d according to some embodiments of the present invention is substantially the same as the flip-chip module 100 shown in fig. 1 and 2, except that the stress relief structure 12d of the flip-chip module 100b is in the shape of a circular arc, and the stress relief structure 12d includes an arc-shaped groove which is curved toward the connection terminal 22. The shortest distance between the arc-shaped groove and the connection terminal 22 is 0.5 cm.
Referring to fig. 7, a flip-chip module 100e according to some embodiments of the present disclosure is substantially the same as the flip-chip module 100 shown in fig. 1 and 2, except that the stress relief structure 12e of the flip-chip module 100e includes a linear slot 122e and an arc-shaped slot 124 e; the number of the linear grooves 122e is one, and is parallel to one of the sides of the rectangle; the number of the arc-shaped slots 124e is two, and two arc-shaped slots 124e extend from both ends of the linear slot 122e and are bent toward the connection terminal 22.
The shortest distance between the first straight line groove 122e and the connection terminal 22 is 0.5 cm, and the shortest distance between the arc-shaped groove 124e and the connection terminal 22 is also 0.8 cm.
It is understood that in alternative embodiments, the stress relief structures 12e may be configured as other strip shapes having circular arcs, and the strip shapes of the circular arcs may be regular shapes or irregular shapes.
In some embodiments, the stress relief structure 12 may be configured as other strip shapes with folded corners, such as: pentagons, hexagons, stars, etc.
In some embodiments, the stress relief structure 12 may also be an irregular shape with break angles, such as: trapezoids, irregular straight lines, irregular triangles, and the like.
Referring to fig. 8, a flip-chip module 100f according to some embodiments of the present invention is substantially the same as the flip-chip module 100c shown in fig. 4, except that the stress relief structure 12f of the flip-chip module 100f includes saw-toothed grooves, and the saw-toothed grooves are substantially arranged along a straight line. The serrated grooves provide strength while absorbing stress.
It will be appreciated that the stress relief structure 12, 12a, 12b, 12c, 12d or 12e of any of the above embodiments may be serrated at its edges, which provides strength while absorbing stress.
Referring to fig. 9 and 10 together, a flip-chip module 100g provided in some embodiments of the present application is substantially the same as the flip-chip module 100 shown in fig. 1 and 2, except that the stress relief structure 12g of the flip-chip module 100g includes a plurality of grooves 122g, the plurality of grooves 122g are spaced apart from the flexible substrate 10, the plurality of grooves 122g spaced apart from each other form a tooth-shaped structure, and the grooves may be configured as quadrilateral grooves, arc-shaped grooves, and the like as required. The stress relief structure 12g can not only absorb the stress applied to the connection terminal 22, but also maintain the flexible substrate 10 with a better bending strength because the bottom of the flexible substrate 10 is not penetrated.
Referring to fig. 11 and 12, a flip-chip module 100h according to some embodiments of the present disclosure is substantially the same as the flip-chip module 100 shown in fig. 1 and 2, except that the stress relief structure 12h of the flip-chip module 100h includes at least one hollow-out groove 122h penetrating through the flexible substrate 10 and at least one non-hollow-out groove 124h not penetrating through the flexible substrate 10, and the hollow-out groove 122h and the non-hollow-out groove 124h are spaced apart from each other and disposed on the flexible substrate 10. The stress relief structure 12h can not only absorb the stress applied to the connection terminal 22, but also improve the strength.
It is understood that in some embodiments, the stress relief structure 12g or the stress relief structure 12h may be the same shape as the stress relief structure 12, 12a, 12b, 12c, 12d, 12e, or 12f in any of the embodiments described above.
It is understood that in some embodiments, the hollowed-out grooves and the non-hollowed-out grooves may be disposed at any position of the stress relief structure 12, 12a, 12b, 12c, 12d, 12e or 12f in any of the above embodiments, for example, the first linear groove 122b of the stress relief structure 12b is disposed as the hollowed-out groove, and the second linear groove 124b is disposed as the non-hollowed-out groove; the linear slot 122e of the stress relief structure 12e is configured as a hollowed-out slot, and the arc-shaped slot 124e is configured as a non-hollowed-out slot. The grooves partially penetrating the flexible substrate 10 can not only absorb the stress to which the connection terminals 22 are subjected, but also improve the strength.
It is understood that the number of the stress relief structures may be changed according to actual requirements, as long as the stress relief structures can reduce the stress applied to the connection terminal when the flexible substrate is bent. Therefore, in some embodiments, the number of the stress relief structures may be one, and the stress relief structures are disposed on one side of the connection terminal; or the stress relief structures are multiple in number and are arranged on one side of the connecting terminal; or the stress relief structures are multiple in number and are respectively arranged on two opposite sides of the connecting terminal.
Referring to fig. 13, a chip on film module 100i according to some embodiments of the present disclosure is substantially the same as the chip on film module 100 shown in fig. 1 and 2, except that the chip on film module 100i includes four stress relief structures 12, two stress relief structures 12 are disposed on one side of the chip 20, and the other two stress relief structures 12 are disposed on the other side of the chip 20. The four stress relief structures 12 have the same shape, and two stress relief structures 12 located on the same side of the chip 20 are separately disposed, wherein one of the stress relief structures is larger, and the larger stress relief structure 12 partially surrounds the smaller stress relief structure 12.
Referring to fig. 14, a chip on film module 100j according to some embodiments of the present disclosure is substantially the same as the chip on film module 100a shown in fig. 3, except that the chip on film module 100j includes four stress relief structures 12a, two stress relief structures 12a are disposed on one side of the chip 20, and the other two stress relief structures 12a are disposed on the other side of the chip 20. The four stress relief structures 12a have the same shape, and two stress relief structures 12a located on the same side of the chip 20 are separately disposed, wherein one of the stress relief structures is larger, and the larger stress relief structure 12a partially surrounds the smaller stress relief structure 12 a.
It is understood that, in some embodiments, the chip on film module includes a plurality of the stress relief structures in the above embodiments, the stress relief structures in each of the above embodiments may be combined at will, and the stress relief structures in each of the above embodiments are arranged in parallel with a predetermined distance therebetween, and the stress relief structures in each of the above embodiments are arranged toward the connection terminals.
For example, referring to fig. 15, a chip on film module 100k provided in some embodiments of the present disclosure is substantially the same as the chip on film module 100i shown in fig. 13, except that the chip on film module 100k includes two stress relief structures 12 and two stress relief structures 12f, one stress relief structure 12 and one stress relief structure 12f are disposed on one side of the chip 20, the other stress relief structure 12 and the other stress relief structure 12f are disposed on the other side of the chip 20, and the stress relief structure 12 located on the same side of the chip 20 partially surrounds the stress relief structure 12 f.
Referring to fig. 16, another embodiment of the present disclosure further provides a display device 200 including a substrate 40, a driving layer 50, a display panel 60 and a protection layer 70. Wherein the driving layer 50 is used for driving the display panel 60.
The base 40 may use a flexible substrate such as a material including thin glass, a metal foil, or a plastic base having a flexible structure including a resin such as Polyimide (PI), Polycarbonate (PC), polyethylene glycol terephthalate (PET), Polyethersulfone (PES), polyethylene film (PEN), Fiber Reinforced Plastic (FRP), or the like coated on both sides of a base film, for example.
The driving layer 50 includes a scan circuit and a switch circuit, the scan circuit is connected to the switch circuit, and the switch circuit is connected to the organic light emitting diode device in the display panel 60.
The scanning circuit scans and selects the corresponding pixel unit through the switching circuit, and applies a driving voltage to the pixel unit to make the pixel unit emit light, thereby displaying an image.
The driving layer 50 may drive the display panel 60 in different driving manners, including a Passive Matrix (PMOLED) driving manner and an Active Matrix (AMOLED) driving manner. When the driving layer 50 adopts a PMOLED mode, the switching circuit may select a Thin-film transistor (TFT) as a switching tube, and static driving or dynamic driving is realized through the action of the scanning circuit. When the driving layer 50 is an AMOLED, the switching circuit may select a Low Temperature polysilicon Thin Film Transistor (LTP-Si TFT), an amorphous silicon TFT, a polysilicon TFT, an oxide semiconductor TFT, or an organic TFT as a switching tube.
The display panel 60 includes a display unit and the flip-chip on film module 100, 100a, 100b, 100c, 100d, 100e, 100f, 100g, 100h, 100i, 100j or 100k in any of the above embodiments, wherein the display unit is in communication connection with the chip 20 to perform light emitting display.
The protective layer 70 is used to protect the display panel 60, wherein the protective layer 70 may include, for example, ZrO, CeO2、ThO 2And the like. The protective layer 70 may form a transparent film to cover the entire surface of the display panel 60.
As described above, the display device 200 provided by the embodiment of the present application is flexible by being made of a flexible material, and becomes bendable. In some embodiments, the display device 200 is not only bendable but also transparent, for example, the material of which the display device 200 is made is a flexible transparent element, the substrate 40 is made of a polymer substance such as transparent plastic, the driving layer 50 uses transparent transistors, and the organic light emitting diode devices in the display panel 60 are made of a transparent material, so that the display device 200 can be flexible and transparent.
The transparent transistor is a TFT transistor manufactured from opaque silicon by replacing the related art TFT transistor manufactured from transparent silicon with a TFT transistor manufactured from a transparent substance such as zinc oxide or titanium dioxide. In addition, the transparent electrode may be composed of a material such as Indium Tin Oxide (ITO) or graphene. Graphene has a honeycomb lattice plane structure composed of carbon atoms, and has transparency. In addition, the transparent organic light emitting layer may be implemented using various substances.
By virtue of the flexible property, the display device 200 can implement various application functions by setting a bending parameter such as a bending sensor and using the bending parameter detected by the bending sensor, thereby greatly improving the experience of the user.
Compared with the prior art, the display panel 60 of the display device 200 provides a chip on film module 100, 100a, 100b, 100c, 100d, 100e, 100f, 100g, 100h, 100i, 100j or 100k, and the stress relief structure is arranged in the preset distance of the connecting terminal, so that the flexible substrate is bent, the stress relief structure reduces the stress received by the connecting terminal, and the chip can be prevented from being detached and welded under the bending state, and the reliability of the chip on film module under the bending state is improved.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; within the context of the present application, where technical features in the above embodiments or in different embodiments can also be combined, the steps can be implemented in any order and there are many other variations of the different aspects of the present application as described above, which are not provided in detail for the sake of brevity; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.
Claims (17)
- A chip on film module, comprising:a flexible substrate including a stress relief structure; andthe chip, the chip includes connecting terminal, connecting terminal will chip fixed connection in on the flexible substrate, stress relieving structure with connecting terminal interval default distance, so that when the flexible substrate is crooked, stress relieving structure can reduce the stress that connecting terminal received.
- The COF module of claim 1, wherein the stress relief structure comprises a groove disposed partially around the connection terminal.
- The COF module as claimed in claim 2, wherein the grooves surrounding the connection terminals extend at least partially through the flexible substrate.
- The COF module as claimed in claim 1, wherein the stress relief structure comprises a plurality of spaced apart grooves, the spaced apart grooves being in the shape of teeth.
- The COF module of claim 4, wherein at least a portion of the plurality of spaced apart grooves extends through the flexible substrate.
- The COF module as claimed in claim 1, wherein the number of the stress relief structures is at least two, and the at least two stress relief structures are respectively disposed on two opposite sides of the connection terminal.
- The COF module as claimed in claim 6,the chip is rectangular;the connecting terminals are arranged side by side along the edge of the chip;the at least two stress relief structures on opposite sides of the connection terminal are symmetrical with respect to a symmetry axis of the rectangle;each of the stress relief structures is symmetrical with respect to another axis of symmetry of the rectangle.
- The COF module of claim 7, wherein each of said stress relief structures comprises a first linear groove, said first linear groove being parallel to one of the sides of said rectangle.
- The COF module of claim 7, wherein each of the stress relief structures comprises a first linear groove and a second linear groove;the number of the first straight line grooves is one, and the first straight line grooves are parallel to one side of the rectangle;the number of the second linear grooves is two, the two second linear grooves extend from two ends of the first linear groove towards the same direction respectively, and an included angle is formed between each second linear groove and the corresponding first linear groove and faces the connecting terminal;the second linear grooves located on the two opposite sides of the connecting terminal extend in opposite directions.
- The COF module as claimed in claim 9,the included angle is an obtuse angle, a right angle or an acute angle.
- The COF module of claim 7, wherein each of the stress relief structures comprises a first linear groove and a second linear groove;the number of the first linear grooves and the number of the second linear grooves are both one;one end of the first linear groove is connected with one end of the second linear groove, and an included angle is formed at the joint of the first linear groove and the second linear groove;the included angle faces the connection terminal.
- The COF module as claimed in claim 11,the included angle is an obtuse angle, a right angle or an acute angle.
- The COF module of claim 7, wherein each stress relief structure comprises a linear slot and an arc slot;the number of the linear grooves is one, and the linear grooves are parallel to one side of the rectangle;the number of the arc-shaped grooves is two, and the two arc-shaped grooves extend from two ends of the linear groove respectively and are bent towards the connecting terminal.
- The COF module of claim 7, wherein each of said stress relief structures comprises an arcuate slot, said arcuate slot curving toward said connection terminal.
- The COF module as claimed in any one of claims 6 to 14, wherein the stress relief structure is a hollowed-out groove or a non-hollowed-out groove.
- A display panel comprising a display unit and the COF module of any one of claims 1 to 15; wherein the display unit is in communication connection with the chip.
- A display device, comprising:a substrate;a driving layer disposed on the substrate; andthe display panel of claim 16, the display panel disposed on the driving layer, the driving layer for driving the display panel.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2018/118540 WO2020107399A1 (en) | 2018-11-30 | 2018-11-30 | Chip-on-film module, display panel and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112640097A true CN112640097A (en) | 2021-04-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880095924.0A Pending CN112640097A (en) | 2018-11-30 | 2018-11-30 | Chip on film module, display panel and display device |
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| Country | Link |
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| CN (1) | CN112640097A (en) |
| WO (1) | WO2020107399A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111524464B (en) * | 2020-06-11 | 2022-10-28 | 厦门通富微电子有限公司 | Display device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105826353A (en) * | 2016-03-25 | 2016-08-03 | 京东方科技集团股份有限公司 | Chip on film and display device |
| CN106158817A (en) * | 2015-05-13 | 2016-11-23 | 南茂科技股份有限公司 | Thin film flip chip packaging structure and packaging module |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103269563B (en) * | 2013-04-27 | 2016-03-16 | 合肥京东方光电科技有限公司 | Cover brilliant thin film flexible circuit board and display unit |
| KR102205030B1 (en) * | 2013-12-17 | 2021-01-20 | 삼성디스플레이 주식회사 | Display device |
| CN207022277U (en) * | 2017-06-20 | 2018-02-16 | 深圳市九顶光电科技有限公司 | Flexible PCB and projecting apparatus |
| CN108039120A (en) * | 2017-11-30 | 2018-05-15 | 武汉华星光电半导体显示技术有限公司 | Flexible display panels and flexible display |
| CN207854263U (en) * | 2017-12-30 | 2018-09-11 | 颀中科技（苏州）有限公司 | Flexible circuit board and composite packing structure |
-
2018
- 2018-11-30 CN CN201880095924.0A patent/CN112640097A/en active Pending
- 2018-11-30 WO PCT/CN2018/118540 patent/WO2020107399A1/en active Application Filing
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106158817A (en) * | 2015-05-13 | 2016-11-23 | 南茂科技股份有限公司 | Thin film flip chip packaging structure and packaging module |
| CN105826353A (en) * | 2016-03-25 | 2016-08-03 | 京东方科技集团股份有限公司 | Chip on film and display device |
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| Publication number | Publication date |
|---|---|
| WO2020107399A1 (en) | 2020-06-04 |
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Application publication date: 20210409 |