CN112625403A - High-heat-resistance resin and preparation method and application thereof - Google Patents
High-heat-resistance resin and preparation method and application thereof Download PDFInfo
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- CN112625403A CN112625403A CN202011484161.4A CN202011484161A CN112625403A CN 112625403 A CN112625403 A CN 112625403A CN 202011484161 A CN202011484161 A CN 202011484161A CN 112625403 A CN112625403 A CN 112625403A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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Abstract
The invention discloses a high heat-resistant resin and a preparation method and application thereof, wherein the high heat-resistant resin specifically comprises polycarbonate, polyether ether ketone, polyarylate, gamma-aminopropyl triethoxysilane, toluene, methyl methacrylate, polyethylene, diethyl phthalate and an initiator, wherein the mass parts of the components in the high heat-resistant rubber are as follows: polycarbonate (C): 80-100, polyetheretherketone: 60-80 parts of polyarylate 150-200 parts of gamma-aminopropyltriethoxysilane 6-8 parts of gamma-aminopropyltriethoxysilane 800 parts of toluene 600-30 parts of methyl methacrylate and 40-60 parts of polyethylene. The invention mixes a plurality of high heat-resistant resin matrixes and further manufactures the high heat-resistant resin matrixes in a polymerization mode, and in the preparation process, the gamma-aminopropyltriethoxysilane is added, so that the high heat-resistant resin matrixes are combined, the heat resistance of the resin is effectively improved, the flowing property of the resin is improved, the manufacturability is excellent, and the high heat-resistant resin matrix can be widely applied to the field of preparation of high-speed copper-clad plates or electronic sealing elements.
Description
Technical Field
The invention relates to the technical field of resin preparation, in particular to high-heat-resistance resin and a preparation method and application thereof.
Background
The resin is generally referred to as an organic polymer which has a softening or melting range after being heated, has a tendency to flow under an external force when softened, is solid, semi-solid or liquid at room temperature, and may be liquid at some time.
Chinese patent CN201711471735.2 discloses 'oil-resistant epoxy resin and a preparation method thereof', belonging to the technical field of resin preparation, wherein the oil-resistant epoxy resin comprises the following raw materials: the oil-resistant epoxy resin is prepared by the steps of preparing a base material, preparing a modifying material, mixing the base material, the modifying material and other materials, and the like. Although the epoxy resin prepared by the invention has excellent oil resistance, the heat resistance can not meet the requirement in practical use.
Disclosure of Invention
The present invention is directed to a high heat-resistant resin, a method for preparing the same, and applications thereof, which solve the problems set forth in the background art.
In order to achieve the purpose, the invention provides the following technical scheme: the high heat-resistant resin comprises polycarbonate, polyether-ether-ketone, polyarylate, gamma-aminopropyl triethoxysilane, toluene, methyl methacrylate, polyethylene, diethyl phthalate and an initiator, wherein the mass parts of the components in the high heat-resistant rubber are as follows:
polycarbonate 80-100
Polyether-ether-ketone 60-80
Polyarylate 150-
Gamma-aminopropyl triethoxy silane 6-8
Toluene 600-800-
20-30 parts of methyl methacrylate
Polyethylene 40-60
Diethyl phthalate 15-25
Initiator 1-2
And 4-6 of an antioxidant.
Preferably, the initiator specifically adopts benzyl peroxide, and the antioxidant specifically adopts dibutyl hydroxy toluene.
Preferably, the preparation method comprises the following steps:
s1, setting the temperature of the reaction kettle to be 80 ℃, adding toluene, methyl methacrylate and diethyl phthalate into the reaction kettle, setting the rotating speed to be 800-;
s2, uniformly mixing the polycarbonate, the polyether-ether-ketone and the polyarylate, setting the reaction temperature to be 90-95 ℃, setting the rotation speed to be 850-950r/min, continuously stirring for 10min, keeping the temperature for 30min, and adding the mixture into the reaction mixed base material obtained in the S1;
s3, adding gamma-aminopropyltriethoxysilane and an initiator into the mixed base material obtained in S1 and S2, setting the temperature of the reaction kettle to be 110-.
Preferably, the prepared high heat-resistant resin can be applied to the field of preparation of high-speed copper-clad plates or electronic sealing elements.
Compared with the prior art, the invention has the following beneficial effects:
the invention mixes a plurality of high heat-resistant resin matrixes and further manufactures the high heat-resistant resin matrixes in a polymerization mode, and in the preparation process, the gamma-aminopropyltriethoxysilane is added, so that the high heat-resistant resin matrixes are combined, the heat resistance of the resin is effectively improved, the flowing property of the resin is improved, the manufacturability is excellent, and the high heat-resistant resin matrix can be widely applied to the field of preparation of high-speed copper-clad plates or electronic sealing elements.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The first embodiment is as follows:
the high heat-resistant resin comprises polycarbonate, polyether-ether-ketone, polyarylate, gamma-aminopropyl triethoxysilane, toluene, methyl methacrylate, polyethylene, diethyl phthalate and an initiator, wherein the mass parts of the components in the high heat-resistant rubber are as follows:
polycarbonate 80
Polyether ether ketone 60
Polyarylate 150
Gamma-aminopropyltriethoxysilane 6
Toluene 600
Methyl methacrylate 20
Polyethylene 40
Phthalic acid diethyl ester 15
Initiator 1
And (4) an antioxidant.
Specifically, the initiator specifically adopts benzyl peroxide, and the antioxidant specifically adopts dibutyl hydroxy toluene.
In this embodiment, the preparation method is specifically divided into the following steps:
s1, setting the temperature of the reaction kettle to be 80 ℃, adding toluene, methyl methacrylate and diethyl phthalate into the reaction kettle, setting the rotation speed to be 800-1000r/min, standing for 2-3h after reacting for 5min, increasing the temperature of the reaction kettle to 85 ℃, adding polyethylene into the reaction kettle, and continuously reacting for 30 min.
S2, mixing the polycarbonate, the polyether-ether-ketone and the polyarylate uniformly, setting the reaction temperature at 90-95 ℃, setting the rotation speed at 850-950r/min, stirring continuously for 10min, keeping the temperature for 30min, and adding the mixture into the reaction mixed base material obtained in the S1.
S3, adding gamma-aminopropyltriethoxysilane and an initiator into the mixed base material obtained in S1 and S2, setting the temperature of the reaction kettle to be 110-.
The prepared high heat-resistant resin can be applied to the field of preparation of high-speed copper-clad plates or electronic sealing elements.
In this example, the heat resistant resin obtained was examined to have a heat resistant temperature of 296 ℃.
Example two:
the high heat-resistant resin comprises polycarbonate, polyether-ether-ketone, polyarylate, gamma-aminopropyl triethoxysilane, toluene, methyl methacrylate, polyethylene, diethyl phthalate and an initiator, wherein the mass parts of the components in the high heat-resistant rubber are as follows:
polycarbonate 90
Polyether ether ketone 70
Polyarylate 175
Gamma-aminopropyltriethoxysilane 7
Toluene 700
Methyl methacrylate 25
Polyethylene 50
Phthalic acid diethyl ester 20
Initiator 1.5
And (5) an antioxidant.
Specifically, the initiator specifically adopts benzyl peroxide, and the antioxidant specifically adopts dibutyl hydroxy toluene.
In this embodiment, the preparation method is specifically divided into the following steps:
s1, setting the temperature of the reaction kettle to be 80 ℃, adding toluene, methyl methacrylate and diethyl phthalate into the reaction kettle, setting the rotation speed to be 800-1000r/min, standing for 2-3h after reacting for 5min, increasing the temperature of the reaction kettle to 85 ℃, adding polyethylene into the reaction kettle, and continuously reacting for 30 min.
S2, mixing the polycarbonate, the polyether-ether-ketone and the polyarylate uniformly, setting the reaction temperature at 90-95 ℃, setting the rotation speed at 850-950r/min, stirring continuously for 10min, keeping the temperature for 30min, and adding the mixture into the reaction mixed base material obtained in the S1.
S3, adding gamma-aminopropyltriethoxysilane and an initiator into the mixed base material obtained in S1 and S2, setting the temperature of the reaction kettle to be 110-.
The prepared high heat-resistant resin can be applied to the field of preparation of high-speed copper-clad plates or electronic sealing elements.
In this example, the heat resistant resin obtained was examined to have a heat resistant temperature of 305 ℃.
Example three:
the high heat-resistant resin comprises polycarbonate, polyether-ether-ketone, polyarylate, gamma-aminopropyl triethoxysilane, toluene, methyl methacrylate, polyethylene, diethyl phthalate and an initiator, wherein the mass parts of the components in the high heat-resistant rubber are as follows:
polycarbonate 100
Polyether ether ketone 80
Polyarylate 200
Gamma-aminopropyltriethoxysilane 8
Toluene 800
Methyl methacrylate 30
Polyethylene 60
Phthalic acid diethyl ester 25
Initiator 2
And 6, an antioxidant.
Specifically, the initiator specifically adopts benzyl peroxide, and the antioxidant specifically adopts dibutyl hydroxy toluene.
In this embodiment, the preparation method is specifically divided into the following steps:
s1, setting the temperature of the reaction kettle to be 80 ℃, adding toluene, methyl methacrylate and diethyl phthalate into the reaction kettle, setting the rotation speed to be 800-1000r/min, standing for 2-3h after reacting for 5min, increasing the temperature of the reaction kettle to 85 ℃, adding polyethylene into the reaction kettle, and continuously reacting for 30 min.
S2, mixing the polycarbonate, the polyether-ether-ketone and the polyarylate uniformly, setting the reaction temperature at 90-95 ℃, setting the rotation speed at 850-950r/min, stirring continuously for 10min, keeping the temperature for 30min, and adding the mixture into the reaction mixed base material obtained in the S1.
S3, adding gamma-aminopropyltriethoxysilane and an initiator into the mixed base material obtained in S1 and S2, setting the temperature of the reaction kettle to be 110-.
The prepared high heat-resistant resin can be applied to the field of preparation of high-speed copper-clad plates or electronic sealing elements.
In this example, the heat resistant resin obtained was examined to have a heat resistant temperature of 288 ℃.
Therefore, in summary, the resin prepared by using the mass ratio of the two raw materials in the example has the highest heat resistance.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (4)
1. A high heat-resistant resin characterized by: the high heat-resistant resin component specifically comprises polycarbonate, polyether ether ketone, polyarylate, gamma-aminopropyl triethoxysilane, toluene, methyl methacrylate, polyethylene, diethyl phthalate and an initiator, wherein the mass parts of the components in the high heat-resistant rubber are as follows:
polycarbonate 80-100
Polyether-ether-ketone 60-80
Polyarylate 150-
Gamma-aminopropyl triethoxy silane 6-8
Toluene 600-800-
20-30 parts of methyl methacrylate
Polyethylene 40-60
Diethyl phthalate 15-25
Initiator 1-2
And 4-6 of an antioxidant.
2. A high heat-resistant resin according to claim 1, characterized in that: the initiator specifically adopts benzyl peroxide, and the antioxidant specifically adopts dibutyl hydroxy toluene.
3. The high heat-resistant resin and the method for preparing the same according to claim 2, wherein: the preparation method comprises the following steps:
s1, setting the temperature of the reaction kettle to be 80 ℃, adding toluene, methyl methacrylate and diethyl phthalate into the reaction kettle, setting the rotating speed to be 800-;
s2, uniformly mixing the polycarbonate, the polyether-ether-ketone and the polyarylate, setting the reaction temperature to be 90-95 ℃, setting the rotation speed to be 850-950r/min, continuously stirring for 10min, keeping the temperature for 30min, and adding the mixture into the reaction mixed base material obtained in the S1;
s3, adding gamma-aminopropyltriethoxysilane and an initiator into the mixed base material obtained in S1 and S2, setting the temperature of the reaction kettle to be 110-.
4. The high heat-resistant resin as claimed in claim 3, and the preparation method and application thereof, wherein: the prepared high heat-resistant resin can be applied to the field of preparation of high-speed copper-clad plates or electronic sealing elements.
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| CN202011484161.4A CN112625403A (en) | 2020-12-16 | 2020-12-16 | High-heat-resistance resin and preparation method and application thereof |
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| CN202011484161.4A CN112625403A (en) | 2020-12-16 | 2020-12-16 | High-heat-resistance resin and preparation method and application thereof |
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| CN104403108A (en) * | 2014-12-19 | 2015-03-11 | 上海锦湖日丽塑料有限公司 | Heat-resistant polycarbonate (PC) copolymer and preparation method thereof |
| CN108164953A (en) * | 2016-12-07 | 2018-06-15 | 上海杰事杰新材料(集团)股份有限公司 | Low dielectric polycarbonate composite material of a kind of high heat conduction and preparation method thereof |
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Application publication date: 20210409 |