CN112615118A - Load sheet and manufacturing method thereof - Google Patents
Load sheet and manufacturing method thereof Download PDFInfo
- Publication number
- CN112615118A CN112615118A CN202011511454.7A CN202011511454A CN112615118A CN 112615118 A CN112615118 A CN 112615118A CN 202011511454 A CN202011511454 A CN 202011511454A CN 112615118 A CN112615118 A CN 112615118A
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- fan
- substrate
- electrode
- ring structure
- load sheet
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/22—Attenuating devices
Abstract
The invention belongs to the technical field of microelectronics, and particularly relates to a load sheet and a manufacturing method thereof, wherein the load sheet comprises a substrate, a grounding electrode, an input electrode and a resistor; the substrate is of a fan-ring structure; the grounding electrode and the input electric plate are arranged on the same side of the substrate, and a sector annular interval area is formed between the grounding electrode and the input electrode; the resistor is arranged in the sector annular interval area and is respectively connected with the grounding electrode and the input electrode. According to the load sheet provided by the embodiment of the invention, the substrate is set to be in the fan-shaped structure, the grounding electrode, the input electrode and the resistor are manufactured on the substrate, the fan-shaped interval is formed between the grounding electrode and the input electrode, and the resistor is positioned in the fan-shaped interval area.
Description
Technical Field
The invention belongs to the technical field of microelectronics, and particularly relates to a load sheet and a manufacturing method thereof.
Background
The load sheet is a basic electronic element, which mainly comprises a substrate, and a grounding electrode, a signal input electrode and a resistor which are arranged on the substrate. The load sheet is widely applied to the communication and electronic fields.
In the prior art, two electrodes and a resistor are usually designed into a rectangular structure, and such design has many disadvantages including poor heat dissipation of a load sheet, poor high-frequency characteristics, difficult standing wave matching and the like.
The load chip provided by the prior art is difficult to meet the use requirement in a high-frequency circuit, and needs to be improved.
Disclosure of Invention
The embodiment of the invention aims to provide a load sheet, and aims to solve the problem that the load sheet provided by the prior art is difficult to meet the use requirement in a high-frequency circuit and needs to be improved.
The embodiment of the invention is realized by that the load sheet comprises a substrate, a grounding electrode, an input electrode and a resistor;
the substrate is of a fan-ring structure;
the grounding electrode and the input electric plate are arranged on the same side of the substrate, and a sector annular interval area is formed between the grounding electrode and the input electrode;
the resistor is arranged in the sector annular interval area and is respectively connected with the grounding electrode and the input electrode.
Another objective of an embodiment of the present invention is to provide a method for manufacturing a load sheet, where the method includes the following steps:
manufacturing a fan-shaped substrate;
manufacturing a metal layer on the substrate, and etching and processing a sector annular interval area to obtain two sector annular electrodes;
and manufacturing a plurality of fan-shaped resistors at intervals in the fan-shaped interval area, and hollowing out the substrate in the interval area between every two adjacent resistors.
According to the load sheet provided by the embodiment of the invention, the substrate is set to be in the fan-shaped structure, the grounding electrode, the input electrode and the resistor are manufactured on the substrate, the fan-shaped interval is formed between the grounding electrode and the input electrode, and the resistor is positioned in the fan-shaped interval area. The high-frequency standing wave suppression circuit can well realize high-order mode suppression when being applied to a high-frequency circuit, the standing wave is easy to match, and better high-frequency characteristics can be kept.
Drawings
Fig. 1 is a perspective view of a load sheet according to an embodiment of the present invention.
In the drawings: 1. a substrate; 2. a ground electrode; 3. an input electrode; 4. and (4) resistance.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Specific implementations of the present invention are described in detail below with reference to specific embodiments.
As shown in fig. 1, a structure diagram of a load chip provided in an embodiment of the present invention is shown, where the load chip includes a substrate 1, a ground electrode 2, an input electrode 3, and a resistor 4;
the substrate 1 is of a fan-ring structure;
the grounding electrode 2 and the input electrode plate are arranged on the same side of the substrate 1, and a sector annular interval area is formed between the grounding electrode 2 and the input electrode 3;
the resistor 4 is disposed in the sector-ring-shaped spacing region, and is connected to the ground electrode 2 and the input electrode 3, respectively.
In the embodiment of the present invention, the substrate 1 may be made of ceramic or other non-conductive materials, which may be selected from the prior art according to actual needs, and the embodiment of the present invention is not limited thereto. In the embodiment of the present invention, the ground electrode 2 and the input electrode 3 are disposed on the same side of the substrate 1, and a fan-shaped interval is formed between the two electrodes. Preferably, the ground electrode 2, the input electrode 3 and the fan-ring-shaped space occupy the entire area of one side of the substrate 1; in addition, a resistor 4 is provided in the fan-shaped annular space, and both ends of the resistor 4 are connected to the ground electrode 2 and the input electrode 3, respectively.
In the embodiment of the invention, the grounding electrode 2 is connected with an external device, the input electrode 3 is connected with an external signal input end, and the resistor 4 is used for connecting the two electrodes and can attract reverse power. The specific materials used for the electrode and the resistor 4 are not particularly limited in the embodiment of the present invention, but the three should be made of conductive materials.
According to the load sheet provided by the embodiment of the invention, the substrate 1 is set to be in the fan-shaped structure, the grounding electrode 2, the input electrode 3 and the resistor 4 are manufactured on the substrate 1, so that a fan-shaped interval is formed between the grounding electrode 2 and the input electrode 3, and the resistor 4 is positioned in the fan-shaped interval area, so that the grounding resistor 4 and the input resistor 4 are equal in distance in the interval area, the uniformity of the two electrodes in the radial direction is good, the impedance is low, and the return loss and the conductor loss are reduced. The high-frequency standing wave suppression circuit can well realize high-order mode suppression when being applied to a high-frequency circuit, the standing wave is easy to match, and better high-frequency characteristics can be kept.
In an embodiment of the present invention, the ground electrode 2 has a fan-shaped ring structure, a center of the fan-shaped ring structure coincides with a center of the fan-shaped ring structure of the substrate 1, and two fan-shaped ring structures share a long arc edge.
In the embodiment of the present invention, the ground electrode 2 is configured in a fan-ring structure, the width of the ground electrode 2 is kept consistent along any radius of the fan-ring structure, and if the current flows mainly along the radius direction, good conduction uniformity can be obtained. And the area between the grounding electrode 2 and the input electrode 3 which are arranged in the fan-shaped annular structure is also arranged in the fan-shaped annular structure, at least three side surfaces of the grounding electrode 2 are arranged in the air, and the heat dissipation effect can be improved by utilizing the edge effect of heat transfer.
According to the load sheet provided by the embodiment of the invention, the grounding electrode 2 is arranged into a fan-shaped ring structure, so that the uniformity of the electrode in the current direction can be kept, the impedance is reduced, and the return loss and the conductor loss can be reduced.
In an embodiment of the present invention, the input electrode 3 is a fan-shaped ring structure, a center of the fan-shaped ring structure coincides with a center of the fan-shaped ring structure of the substrate 1, and two fan-shaped ring structures share a short arc edge.
In the embodiment of the present invention, the input electrode 3 is configured as a fan-ring structure, the width of the input electrode 3 is kept consistent along any radius of the fan-ring, and if the current mainly flows along the radius direction, good conductive uniformity can be obtained. And the area between the input electrode 3 and the grounding electrode 2 which are arranged in the fan-shaped structure is also arranged in the fan-shaped structure, at least three side surfaces of the input electrode 3 are arranged in the air, and the heat dissipation effect can be improved by utilizing the edge effect of heat transfer.
According to the load sheet provided by the embodiment of the invention, the input electrode 3 is arranged into the fan-shaped ring structure, so that the uniformity of the current direction electrode can be kept, the impedance is reduced, and the return loss and the conductor loss can be reduced. In addition, in cooperation with the sector-ring-shaped grounding electrode 2, current flows through the grounding electrode 2 and the input electrode mainly in the radial direction, and the respective widths of the grounding electrode 2 and the input electrode are completely consistent on any radius, so that extra consumption caused by the electrode structure is avoided, namely, the structure uniformity is good, and both the two electrodes can obtain better heat dissipation effects.
In an embodiment of the present invention, the resistor 4 is a fan-shaped ring structure, and a center of the fan-shaped ring structure coincides with a center of the fan-shaped ring structure of the substrate 1.
In the embodiment of the present invention, the resistor 4 is configured as a fan-shaped ring structure, and the center of the fan-shaped ring structure coincides with the center of the fan-shaped ring structure of the substrate 1, then the long arc side of the resistor 4 is connected to the grounding electrode 2, and the short arc side is connected to the input electrode 3, preferably, the long arc side coincides with the short arc side of the grounding electrode 2, and the short arc side coincides with the long arc side of the input resistor 4. With this arrangement, the connection width between the resistor 4 and the ground plate is larger than that between the resistor 4 and the input resistor, so that the resistor 4 is not easily broken down, standing wave matching is easy, high-frequency characteristics can be maintained, and the high-frequency circuit is more stable.
In one embodiment of the present invention, the resistors 4 are provided in number, and a space is provided between two adjacent resistors 4.
In the embodiment of the invention, the plurality of resistors 4 are arranged, and the interval is arranged between two adjacent resistors 4, so that the heat dissipation of the resistors 4 is facilitated. Preferably, the resistors 4 are arranged in two, and the intermediate resistor 4 is not present, so that the edge effect can be fully utilized to improve the heat dissipation effect of the resistor 4. In addition, the coupling matching can be realized by utilizing the interval between the two resistors 4, thereby increasing the ground inductance and improving the high-frequency characteristic of the load sheet.
In one embodiment of the present invention, the substrate 1 is hollowed out at the intervals between the resistors 4.
In the embodiment of the present invention, the substrate 1 is hollowed out, that is, the substrate 1 is provided with through holes at positions corresponding to the intervals between the resistors 4, and the shapes of the through holes are the same as the intervals. This arrangement may facilitate heat dissipation from adjacent resistors 4 on adjacent sides.
In an embodiment of the present invention, the substrate 1 is provided with a through hole, the through hole is aligned with the ground electrode 2 and/or the input electric plate, the ground electrode 2 and/or the input electric plate extends to the other side of the substrate 1 through the through hole, and the ground electrode 2 and/or the input electric plate forms a connection head on the other side of the substrate 1.
In the embodiment of the invention, the substrate 1 is provided with the through hole, and the electrode is connected with the external part after passing through the through hole and winding to the other side of the substrate 1.
In an embodiment of the present invention, the ground electrode 2, the input electrode 3, and the resistor 4 are symmetrically disposed on two sides of the substrate 1.
In the embodiment of the invention, the electrodes and the resistors 4 are symmetrically arranged on two sides, so that on one hand, the heat dissipation can be balanced, and on the other hand, the power of the load sheet can be increased.
In one embodiment of the present invention, the ground electrode 2 and the input electrode 3 are provided with connectors, and the connectors connect the ground electrode 2 or the input electrode 3 on both sides of the substrate 1 into a whole and connect with an external device.
One embodiment of the present invention further provides a method for manufacturing a load sheet, including the steps of:
manufacturing a fan-shaped substrate 1;
manufacturing a metal layer on the substrate 1, and etching and processing a sector annular interval area to obtain two sector annular electrodes;
and manufacturing a plurality of fan-shaped resistors 4 which are spaced apart from each other in the fan-shaped spacing area, and hollowing out the substrate 1 in the spacing area between every two adjacent resistors 4.
In the embodiment of the present invention, the fan-ring substrate 1 may be processed by cutting or using a mold. The material may be selected from ceramic or other non-conductive materials. The resistor 4 and the electrode may be manufactured by heating and solidifying corresponding slurry, or by deposition etching, and the specific processing manner is not particularly limited in the embodiments of the present invention. It should be noted that, for the structural differences of the load sheet in different embodiments, the method should include corresponding manufacturing steps.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. A load sheet is characterized in that the load sheet comprises a substrate, a grounding electrode, an input electrode and a resistor;
the substrate is of a fan-ring structure;
the grounding electrode and the input electric plate are arranged on the same side of the substrate, and a sector annular interval area is formed between the grounding electrode and the input electrode;
the resistor is arranged in the sector annular interval area and is respectively connected with the grounding electrode and the input electrode.
2. The load sheet of claim 1, wherein the ground electrode has a fan-ring structure, and the center of the fan-ring structure coincides with the center of the base plate fan-ring structure, and the two fan-ring structures share a long arc edge.
3. The load sheet of claim 1, wherein the input electrode is a fan-ring structure, and the center of the fan-ring structure coincides with the center of the base plate fan-ring structure, and the two fan-ring structures share a short arc edge.
4. The load sheet of claim 1, wherein the resistor is a fan-ring structure, and the center of the fan-ring structure coincides with the center of the base plate fan-ring structure.
5. The load sheet of claim 4, wherein the plurality of resistors are arranged with a space between two adjacent resistors.
6. The load sheet of claim 5, wherein the substrate is openly disposed at the spaces between the resistors.
7. The load sheet of claim 1, wherein the substrate defines a through-hole aligned with the ground electrode and/or the input electrical plate, the ground electrode and/or the input electrical plate extending through the through-hole to the other side of the substrate, the ground electrode and/or the input electrical plate forming a connection joint on the other side of the substrate.
8. The load sheet of any of claims 1-6, wherein the ground electrode, the input electrode, and the resistor are symmetrically disposed on opposite sides of the substrate.
9. The load sheet of claim 8, wherein the ground electrode and the input electrode are provided with connectors, and the connectors connect the ground electrode or the input electrode on both sides of the substrate into a whole and connect with an external device.
10. A method for manufacturing a load sheet is characterized by comprising the following steps:
manufacturing a fan-shaped substrate;
manufacturing a metal layer on the substrate, and etching and processing a sector annular interval area to obtain two sector annular electrodes;
and manufacturing a plurality of fan-shaped resistors at intervals in the fan-shaped interval area, and hollowing out the substrate in the interval area between every two adjacent resistors.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011511454.7A CN112615118B (en) | 2020-12-18 | 2020-12-18 | Load sheet and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011511454.7A CN112615118B (en) | 2020-12-18 | 2020-12-18 | Load sheet and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112615118A true CN112615118A (en) | 2021-04-06 |
| CN112615118B CN112615118B (en) | 2021-09-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011511454.7A Active CN112615118B (en) | 2020-12-18 | 2020-12-18 | Load sheet and manufacturing method thereof |
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| Country | Link |
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| CN (1) | CN112615118B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017046579A1 (en) * | 2015-09-14 | 2017-03-23 | Drayson Technologies (Europe) Limited | Rf-to-dc converter |
| CN207282681U (en) * | 2017-10-21 | 2018-04-27 | 苏州市新诚氏通讯电子股份有限公司 | Carrier sheet of the high power with pin |
| US20180254714A1 (en) * | 2015-09-14 | 2018-09-06 | Drayson Technologies (Europe) Limited | Rf-to-dc converter |
| US10523269B1 (en) * | 2018-11-14 | 2019-12-31 | At&T Intellectual Property I, L.P. | Device with configurable reflector for transmitting or receiving electromagnetic waves |
| CN210272623U (en) * | 2019-09-30 | 2020-04-07 | 深圳市禹龙通电子有限公司 | 200W sheet type load sheet |
-
2020
- 2020-12-18 CN CN202011511454.7A patent/CN112615118B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017046579A1 (en) * | 2015-09-14 | 2017-03-23 | Drayson Technologies (Europe) Limited | Rf-to-dc converter |
| US20180254714A1 (en) * | 2015-09-14 | 2018-09-06 | Drayson Technologies (Europe) Limited | Rf-to-dc converter |
| CN207282681U (en) * | 2017-10-21 | 2018-04-27 | 苏州市新诚氏通讯电子股份有限公司 | Carrier sheet of the high power with pin |
| US10523269B1 (en) * | 2018-11-14 | 2019-12-31 | At&T Intellectual Property I, L.P. | Device with configurable reflector for transmitting or receiving electromagnetic waves |
| CN210272623U (en) * | 2019-09-30 | 2020-04-07 | 深圳市禹龙通电子有限公司 | 200W sheet type load sheet |
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| Publication number | Publication date |
|---|---|
| CN112615118B (en) | 2021-09-03 |
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