CN112613265A - Electromagnetic film lamination alignment symbol design method - Google Patents
Electromagnetic film lamination alignment symbol design method Download PDFInfo
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- CN112613265A CN112613265A CN202011234483.3A CN202011234483A CN112613265A CN 112613265 A CN112613265 A CN 112613265A CN 202011234483 A CN202011234483 A CN 202011234483A CN 112613265 A CN112613265 A CN 112613265A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/392—Floor-planning or layout, e.g. partitioning or placement
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/394—Routing
Abstract
The invention discloses a method for designing an electromagnetic film lamination alignment symbol, which belongs to the technical field of FPC and RFPC product electromagnetic film lamination and comprises the following steps: s1, sleeving the set jointed board side net copper of the FPC and RFPC products by using the negative polarity PAD of the FPC and RFPC products; s2, placing positive PAD of FPC and RFPC products on negative PAD; s3, wiring is conducted on positive polarity PAD of FPC and RFPC products; s4, selecting pnl patches, and designing alignment symbols on the edges of the set jointed boards; and S5, adhering the alignment mark on the outer layer circuit of the FPC and RFPC product to the electromagnetic film adhering region required by the customer. According to the electromagnetic film attaching alignment symbol design method, set strips used in traditional attaching are changed into pnl strips, alignment symbols are designed on the edges of the set strips, production and inspection efficiency can be remarkably improved, whether attaching deviates or not can be accurately judged, equipment modification cannot be added, operation is simple, and cost is low.
Description
Technical Field
The invention belongs to the technical field of FPC and RFPC product electromagnetic film lamination, and particularly relates to a method for designing an electromagnetic film lamination alignment symbol.
Background
At present, with the continuous development of the electronic technology field, various electronic products appear, and the lives of people are enriched, and the electronic products almost need to use electromagnetic films.
In the prior art, most FPC and RFPC products in the industry at present use electromagnetic film laminating design, set strips are used in traditional laminating, labor cost is high, production and inspection efficiency is low, and mass production is not facilitated.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a design method of an electromagnetic film lamination alignment symbol, which aims to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme: a method for designing an electromagnetic film lamination alignment symbol comprises the following steps:
s1, sleeving the set jointed board side net copper of the FPC and RFPC products by using the negative polarity PAD of the FPC and RFPC products;
s2, placing positive PAD of FPC and RFPC products on negative PAD;
s3, wiring is conducted on positive polarity PAD of FPC and RFPC products;
s4, selecting pnl patches, and designing alignment symbols on the edges of the set jointed boards;
and S5, adhering the alignment mark on the outer layer circuit of the FPC and RFPC product to the electromagnetic film adhering region required by the customer.
Further optimizing the technical scheme, the negative polarity PAD and the positive polarity PAD are parts for mutually welding the FPC, the RFPC product and the pins of the component, and are composed of copper foils and holes, and the copper foils cannot be covered by the solder mask when exposed.
Further optimizing the technical scheme, in the step S1, manufacturers need to accurately calculate the production sizes of the single jointed boards according to the sizes required by customers for FPC and RFPC products, wherein the maximum size is pnl jointed boards, the middle size is set jointed boards, and the minimum size is pcs jointed boards.
Further optimizing the technical scheme, the model of the negative polarity PAD of the FPC and RFPC product is S1000, and the model of the positive polarity PAD of the FPC and RFPC product is S300.
Further optimizing the technical scheme, in S3, when the FPC or RFPC product is wired, the wiring operation is performed by using R150 × 600 lines, and the wiring is a straight line or a 45-degree broken line, so as to avoid generating electromagnetic radiation.
Further optimize this technical scheme, after the laminating of electromagnetic film, operating personnel can see that the counterpoint symbol shows that the laminating skew is in 0.15mm by eye.
Compared with the prior art, the invention provides a method for designing an electromagnetic film lamination alignment symbol, which has the following beneficial effects:
according to the electromagnetic film attaching alignment symbol design method, set strips used in traditional attaching are changed into pnl strips, alignment symbols are designed on the edges of the set strips, production and inspection efficiency can be remarkably improved, whether attaching deviates or not can be accurately judged, equipment modification cannot be added, operation is simple, and cost is low.
Drawings
FIG. 1 is a schematic diagram of a product structure of a method for designing an electromagnetic film lamination alignment mark according to the present invention;
fig. 2 is a schematic diagram of another product structure of the electromagnetic film lamination alignment mark design method according to the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The first embodiment is as follows:
a method for designing an electromagnetic film lamination alignment symbol comprises the following steps:
s1, sleeving the set jointed board side net copper of the FPC and RFPC products by using the negative polarity PAD of the FPC and RFPC products;
s2, placing positive PAD of FPC and RFPC products on negative PAD;
s3, wiring is conducted on positive polarity PAD of FPC and RFPC products;
s4, selecting pnl patches, designing alignment symbols on set jointed boards, wherein the alignment symbols are in the product structure diagrams of the figure 1 and the figure 2;
and S5, adhering the alignment mark on the outer layer circuit of the FPC and RFPC product to the electromagnetic film adhering region required by the customer.
Specifically, the negative polarity PAD and the positive polarity PAD are parts for mutually welding the FPC, the RFPC product and the pins of the component, and are composed of copper foils and holes, and the copper foils cannot be covered by a solder mask when exposed.
Specifically, in S1, the FPC and RFPC products need to be accurately calculated by the manufacturer according to the size required by the customer to obtain the production size of a single jointed board, where the largest size is pnl jointed boards, the middle size is set jointed boards, and the smallest size is pcs jointed boards.
Specifically, the model of the negative polarity PAD of the FPC or RFPC product is S1000, and the model of the positive polarity PAD of the FPC or RFPC product is S300.
Specifically, in S3, when the FPC or RFPC product is wired, the wiring operation is performed by using a R150 × 600 wire, and the wiring is a straight line or a 45-degree broken line, so as to avoid generating electromagnetic radiation.
Specifically, after the electromagnetic film is attached, an operator can visually see that the alignment mark indicates that the attachment deviation is within +/-0.15 mm.
Example two:
a method for designing an electromagnetic film lamination alignment symbol comprises the following steps:
s1, sleeving the set jointed board side net copper of the FPC and RFPC products by using the negative polarity PAD of the FPC and RFPC products;
s2, placing positive PAD of FPC and RFPC products on negative PAD;
s3, wiring is conducted on positive polarity PAD of FPC and RFPC products;
s4, selecting pnl patches, designing alignment symbols on set jointed boards, wherein the alignment symbols are in the product structure diagrams of the figure 1 and the figure 2;
and S5, adhering the alignment mark on the outer layer circuit of the FPC and RFPC product to the electromagnetic film adhering region required by the customer.
Specifically, the negative polarity PAD and the positive polarity PAD are parts for mutually welding the FPC, the RFPC product and the pins of the component, and are composed of copper foils and holes, and the copper foils cannot be covered by a solder mask when exposed.
Specifically, in S1, the FPC and RFPC products need to be accurately calculated by the manufacturer according to the size required by the customer to obtain the production size of a single jointed board, where the largest size is pnl jointed boards, the middle size is set jointed boards, and the smallest size is pcs jointed boards.
Specifically, the model of the negative polarity PAD of the FPC or RFPC product is S1000, and the model of the positive polarity PAD of the FPC or RFPC product is S300.
Specifically, in S3, when the FPC or RFPC product is wired, the wiring operation is performed by using the R150 × 600 wire, and the wiring is a straight line to avoid electromagnetic radiation.
Specifically, after the electromagnetic film is attached, an operator can visually see that the alignment mark indicates that the attachment deviation is within +/-0.15 mm.
Example three:
a method for designing an electromagnetic film lamination alignment symbol comprises the following steps:
s1, sleeving the set jointed board side net copper of the FPC and RFPC products by using the negative polarity PAD of the FPC and RFPC products;
s2, placing positive PAD of FPC and RFPC products on negative PAD;
s3, wiring is conducted on positive polarity PAD of FPC and RFPC products;
s4, selecting pnl patches, designing alignment symbols on set jointed boards, wherein the alignment symbols are in the product structure diagrams of the figure 1 and the figure 2;
and S5, adhering the alignment mark on the outer layer circuit of the FPC and RFPC product to the electromagnetic film adhering region required by the customer.
Specifically, the negative polarity PAD and the positive polarity PAD are parts for mutually welding the FPC, the RFPC product and the pins of the component, and are composed of copper foils and holes, and the copper foils cannot be covered by a solder mask when exposed.
Specifically, in S1, the FPC and RFPC products need to be accurately calculated by the manufacturer according to the size required by the customer to obtain the production size of a single jointed board, where the largest size is pnl jointed boards, the middle size is set jointed boards, and the smallest size is pcs jointed boards.
Specifically, the model of the negative polarity PAD of the FPC or RFPC product is S1000, and the model of the positive polarity PAD of the FPC or RFPC product is S300.
Specifically, in S3, when the FPC or RFPC product is wired, the wiring operation is performed by using the R150 × 600 wire, and the wiring is a 45-degree broken line to avoid electromagnetic radiation.
Specifically, after the electromagnetic film is attached, an operator can visually see that the alignment mark indicates that the attachment deviation is within +/-0.15 mm.
Example three:
a method for designing an electromagnetic film lamination alignment symbol comprises the following steps:
s1, sleeving the set jointed board side net copper of the FPC and RFPC products by using the negative polarity PAD of the FPC and RFPC products;
s2, placing positive PAD of FPC and RFPC products on negative PAD;
s3, wiring is conducted on positive polarity PAD of FPC and RFPC products;
s4, selecting pnl patches, designing alignment symbols on set jointed boards, wherein the alignment symbols are in the product structure diagrams of the figure 1 and the figure 2;
and S5, adhering the alignment mark on the outer layer circuit of the FPC and RFPC product to the electromagnetic film adhering region required by the customer.
Specifically, the negative polarity PAD and the positive polarity PAD are parts for mutually welding the FPC, the RFPC product and the pins of the component, and are composed of copper foils and holes, and the copper foils cannot be covered by a solder mask when exposed.
Specifically, in S1, the FPC and RFPC products need to be accurately calculated by the manufacturer according to the size required by the customer to obtain the production size of a single jointed board, where the largest size is pnl jointed boards, the middle size is set jointed boards, and the smallest size is pcs jointed boards.
Specifically, the model of the negative polarity PAD of the FPC or RFPC product is S1000, and the model of the positive polarity PAD of the FPC or RFPC product is S300.
Specifically, in S3, when the FPC or RFPC product is wired, the wiring operation is performed by using a R150 × 600 wire, and the wiring is a straight line or a 45-degree broken line, so as to avoid generating electromagnetic radiation.
Specifically, after the electromagnetic film is attached, an operator can visually see the alignment mark to indicate that the attachment deviation is within +/-0.20 mm.
The test results of the three examples show that: according to the electromagnetic film attaching alignment symbol design method, set strips used in traditional attaching are changed into pnl strips, alignment symbols are designed on the edges of the set strips, production and inspection efficiency can be remarkably improved, whether attaching deviates or not can be accurately judged, equipment modification cannot be added, operation is simple, and cost is low. And through adopting this counterpoint symbol batch production, the skew does not take place after the laminating, and laminating efficiency is high, reaches fine laminating effect.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A method for designing an electromagnetic film lamination alignment symbol is characterized by comprising the following steps:
s1, sleeving the set jointed board side net copper of the FPC and RFPC products by using the negative polarity PAD of the FPC and RFPC products;
s2, placing positive PAD of FPC and RFPC products on negative PAD;
s3, wiring is conducted on positive polarity PAD of FPC and RFPC products;
s4, selecting pnl patches, and designing alignment symbols on the edges of the set jointed boards;
and S5, adhering the alignment mark on the outer layer circuit of the FPC and RFPC product to the electromagnetic film adhering region required by the customer.
2. The method as claimed in claim 1, wherein the negative polarity PAD and the positive polarity PAD are portions where the FPC, the RFPC product and the device pins are soldered to each other, and are composed of copper foils and holes, and the copper foils are exposed and cannot be covered by the solder resist film.
3. The method as claimed in claim 1, wherein in S1, the FPC or RFPC products require manufacturers to accurately calculate the production sizes of single panels according to the sizes required by customers, wherein the maximum size is pnl panels, the middle size is set panels, and the minimum size is pcs panels.
4. The method as claimed in claim 1, wherein the type of the negative polarity PAD of the FPC or RFPC product is S1000, and the type of the positive polarity PAD of the FPC or RFPC product is S300.
5. The method as claimed in claim 1, wherein in S3, R150 x 600 lines are selected for the FPC or RFPC product to be wired, and the wiring is straight or 45 ° broken lines to avoid electromagnetic radiation.
6. The method of claim 1, wherein the alignment mark is visible to an operator within ± 0.15mm of the bonding offset after the bonding of the electromagnetic film.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011234483.3A CN112613265A (en) | 2020-11-07 | 2020-11-07 | Electromagnetic film lamination alignment symbol design method |
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| CN202011234483.3A CN112613265A (en) | 2020-11-07 | 2020-11-07 | Electromagnetic film lamination alignment symbol design method |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105578719A (en) * | 2015-12-29 | 2016-05-11 | 广东欧珀移动通信有限公司 | Flexible circuit board and terminal |
| CN106385759A (en) * | 2016-10-25 | 2017-02-08 | 歌尔股份有限公司 | FPC and camera module circuit board with same |
| CN206506781U (en) * | 2017-03-01 | 2017-09-19 | 奥士康精密电路（惠州）有限公司 | Three-back-shaped typesetting circuit board in a kind of PNL |
| JP2018098448A (en) * | 2016-12-16 | 2018-06-21 | 三菱電機株式会社 | Manufacturing method of flexible print circuit board |
| CN110868792A (en) * | 2019-11-11 | 2020-03-06 | 武汉天马微电子有限公司 | Flexible circuit board and display device |
-
2020
- 2020-11-07 CN CN202011234483.3A patent/CN112613265A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105578719A (en) * | 2015-12-29 | 2016-05-11 | 广东欧珀移动通信有限公司 | Flexible circuit board and terminal |
| CN106385759A (en) * | 2016-10-25 | 2017-02-08 | 歌尔股份有限公司 | FPC and camera module circuit board with same |
| JP2018098448A (en) * | 2016-12-16 | 2018-06-21 | 三菱電機株式会社 | Manufacturing method of flexible print circuit board |
| CN206506781U (en) * | 2017-03-01 | 2017-09-19 | 奥士康精密电路（惠州）有限公司 | Three-back-shaped typesetting circuit board in a kind of PNL |
| CN110868792A (en) * | 2019-11-11 | 2020-03-06 | 武汉天马微电子有限公司 | Flexible circuit board and display device |
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