CN112601422A - Server heat abstractor and server - Google Patents
Server heat abstractor and server Download PDFInfo
- Publication number
- CN112601422A CN112601422A CN202011434884.3A CN202011434884A CN112601422A CN 112601422 A CN112601422 A CN 112601422A CN 202011434884 A CN202011434884 A CN 202011434884A CN 112601422 A CN112601422 A CN 112601422A
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- server
- cooling
- box body
- air
- liquid
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- 238000001816 cooling Methods 0.000 claims abstract description 68
- 230000017525 heat dissipation Effects 0.000 claims abstract description 61
- 239000007788 liquid Substances 0.000 claims abstract description 60
- 239000000110 cooling liquid Substances 0.000 claims abstract description 51
- 239000002826 coolant Substances 0.000 claims description 24
- 238000007789 sealing Methods 0.000 claims description 16
- 239000011148 porous material Substances 0.000 claims description 7
- 239000000428 dust Substances 0.000 abstract description 5
- 239000012535 impurity Substances 0.000 abstract description 5
- 238000010438 heat treatment Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 4
- 238000001125 extrusion Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20736—Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a server heat dissipation device.A cooling liquid is contained in a box body; a cooling pipeline is arranged in the box body and is immersed in the cooling liquid for heat exchange; the cooling pipeline is provided with an air driving device, the air driving device is used for driving air to flow in the cooling pipeline, the air driving device provides power to discharge cooled air in the cooling pipeline to the inside of the server, hot air in the server enters the box body and finally enters the cooling pipeline to realize circular flow, the hot air continuously enters the box body to be cooled, heat is transferred to cooling liquid, the box body is provided with a liquid inlet pipe and a liquid outlet pipe, the cooling liquid enters the box body from the liquid inlet pipe and is discharged from the liquid outlet pipe, and the cooling liquid is cooled outside the box body; the server heat dissipation device cools the air in the server through the cooling liquid, basically does not exchange heat with the outside air, and effectively avoids the influence caused by the impurities such as dust in the outside air entering the server.
Description
Technical Field
The invention relates to the technical field of servers, in particular to a server heat dissipation device. The invention also relates to a server.
Background
A plurality of server devices are arranged in the existing cabinet, a large amount of heat can be generated in the operation process of the server devices, and if the temperature cannot be effectively reduced in time, the accumulated heat easily causes the server devices to overheat and crash, so that the operation of a network system is abnormal.
The traditional cooling device for the server cabinet adopts an air-cooled heat dissipation mode, external air flow is introduced into the server, the heat dissipation rate is low, rapid heat dissipation cannot be achieved, heat accumulation enables the server to be overheated, operation of the server is seriously affected, and therefore the use efficiency is affected; and external dust enters the machine body, and the normal work of the machine body can be influenced after long-term use.
For those skilled in the art, how to improve the heat dissipation efficiency and reduce the influence of dust on the server is a technical problem to be solved at present.
Disclosure of Invention
The invention provides a server heat dissipation device, which is used for circularly cooling air in a server and reducing the influence of impurities carried by outside air on the server, and the specific scheme is as follows:
a server heat dissipation device comprises a box body arranged inside a server, wherein cooling liquid is contained in the box body; a liquid inlet pipe and a liquid outlet pipe are arranged on the box body, and cooling liquid enters the box body from the liquid inlet pipe and is discharged from the liquid outlet pipe;
a cooling pipeline is arranged in the box body and is immersed in cooling liquid for heat exchange; and an air driving device is arranged on the cooling pipeline, and can discharge cooled air in the cooling pipeline to the inside of the server and enable hot air in the server to enter the box body.
Optionally, a supporting transverse plate is arranged in the box body, a heat dissipation plate is fixedly mounted on the supporting transverse plate, and the end part of the heat dissipation plate can extend out of the box body and is directly contacted with a heating device in the server for heat conduction;
the box body is provided with an air inlet pipe, the air inlet pipe guides hot air in the server to the upper side of the supporting transverse plate, and the heat of the heat dissipation plate is conducted to the air.
Optionally, the heat dissipation plates are vertically arranged, through holes are arrayed on the heat dissipation plates, and the diameters of the through holes are smaller than the thickness of the heat dissipation plates; and a strip-shaped through groove is formed in the lower edge of the heat dissipation plate.
Optionally, the cooling pipeline is arranged in a vertical serpentine shape, a sliding plate is sleeved outside the cooling pipeline and can slide vertically, the sliding plate is driven by a vertical driving rod to move downwards to extrude cooling liquid, and the cooling liquid below the sliding plate flows onto the heat dissipation plate along a return pipeline to perform heat exchange;
the cooling liquid falls through a transverse plate liquid return port arranged on the supporting transverse plate and falls through a sliding plate liquid return port arranged on the sliding plate.
Optionally, the upper surface of the sliding plate is an inclined surface, so that the cooling liquid flows to the liquid return port of the sliding plate.
Optionally, the top of cooling pipe extends to the inside top of box, the outside cover body that sets up in top of cooling pipe, the top of cooling pipe sets up two-layer orifice plate, and is two-layer press from both sides between the orifice plate and adorn the dupont membrane.
Optionally, one-way valves which are communicated in one way are respectively arranged in the liquid return port of the sliding plate, the return pipeline and the air inlet pipe;
and electromagnetic valves for controlling on-off are respectively arranged in the transverse plate liquid return port, the liquid inlet pipe and the liquid outlet pipe.
Optionally, the cooling duct discharges cooled air from a lower portion of the cabinet into the inside of the server; the air inlet pipe guides hot air into the interior of the box body from the upper portion of the box body.
Optionally, an annular groove is formed in the middle of the side wall of the through hole in the sliding plate, and a first sealing ring for sealing with the outer surface of the cooling pipeline is installed in the annular groove; and a second sealing ring is fixedly arranged on the lower surface of the sliding plate and is used for being matched and sealed with the outer surface of the cooling pipeline.
The invention also provides a server, which comprises the server heat dissipation device.
The invention provides a server heat dissipation device, which comprises a box body arranged in a server, wherein cooling liquid is contained in the box body; a cooling pipeline is arranged in the box body, the cooling pipeline is immersed in cooling liquid for heat exchange, when air in the cooling pipeline passes through the cooling liquid, heat exchange is carried out, and the temperature of the air is reduced; the cooling pipeline is provided with an air driving device, the air driving device is used for driving air to flow in the cooling pipeline, the air driving device provides power to discharge cooled air in the cooling pipeline to the inside of the server, hot air in the server enters the box body and finally enters the cooling pipeline to realize circular flow, the hot air continuously enters the box body to be cooled, heat is transferred to cooling liquid, the box body is provided with a liquid inlet pipe and a liquid outlet pipe, the cooling liquid enters the box body from the liquid inlet pipe and is discharged from the liquid outlet pipe, and the cooling liquid is cooled outside the box body; the server heat dissipation device cools the air in the server through the cooling liquid, and basically does not exchange heat with the outside air, so that the influence caused by the fact that impurities such as dust in the outside air enter the server can be effectively avoided.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1A is a schematic front view of a heat dissipation device for a server according to an embodiment of the present invention;
FIG. 1B is an enlarged view of a portion X of FIG. 1A;
FIG. 1C is an enlarged view of a portion Y of FIG. 1A;
FIG. 2 is a schematic side view of a heat sink of a server according to an embodiment of the present invention;
FIG. 3 is a schematic view of the coolant flowing over the support cross plate;
fig. 4 is a schematic view showing a structure in which the coolant falls onto the slide plate.
The figure includes:
the device comprises a box body 1, a liquid inlet pipe 11, a liquid outlet pipe 12, a cooling pipeline 2, a backflow pipeline 21, a cover body 22, a pore plate 23, a DuPont membrane 24, an air driving device 3, a supporting transverse plate 4, a heat dissipation plate 41, a through hole 411, a through groove 412, a transverse plate liquid return port 42, an air inlet pipe 5, a sliding plate 6, a vertical driving rod 61, a sliding plate liquid return port 62, a first sealing ring 63 and a second sealing ring 64.
Detailed Description
The core of the invention is to provide a server heat dissipation device which can cool the air in the server circularly and reduce the influence of impurities carried by the outside air on the server.
In order to make those skilled in the art better understand the technical solution of the present invention, the server heat sink of the present invention will be described in detail with reference to the accompanying drawings and specific embodiments.
As shown in fig. 1A, a schematic front view of a heat dissipation device for a server according to an embodiment of the present invention; FIG. 2 is a schematic side view of one embodiment of a heat sink for a server according to the present invention, in which the single arrows indicate the air flow direction, the double arrows indicate the coolant flow direction, and A indicates the server; the server heat dissipation device comprises a box body 1 arranged in a server, wherein cooling liquid is contained in the box body 1; set up feed liquor pipe 11 and drain pipe 12 on the box 1, coolant liquid gets into box 1 from feed liquor pipe 11 to discharge from drain pipe 12, the heat is absorbed to the coolant liquid in box 1, takes the heat out behind the coolant liquid outflow box 1, and cools off outside box 1, and the coolant liquid after the cooling carries out box 1 through feed liquor pipe 11 again.
A cooling pipeline 2 is arranged in the box body 1, the cooling pipeline 2 is immersed in cooling liquid for heat exchange, as shown in fig. 1A, the lower part of the cooling pipeline 2 is in the cooling liquid, and the upper part of the cooling pipeline 2 is not immersed in the cooling liquid, that is, the cooling pipeline 2 is at least partially immersed in the cooling liquid; cooling tube 2 is snakelike the setting of coiling at box 1, also is the S-shaped and buckles repeatedly to the heat transfer area of increase air and coolant liquid improves heat exchange efficiency, improves the heat conduction efficiency of heat from air conduction to coolant liquid. An air driving device 3 is installed on the cooling pipeline 2, the air driving device 3 can adopt a blower, and the air driving device 3 provides power for air so that the air can flow.
Inside air drive arrangement 3 can arrange the server through refrigerated air in cooling tube 2, and make inside hot-air admission box 1 of server, hot-air admission box 1 back reentrant cooling tube 2, derive the heat when the position of air process coolant liquid, the temperature of air reduces, flow inside the server again, each components and parts during operation of server inside produces the heat, absorb the heat when the air flows through, take the heat of components and parts out of the server.
Because the heat dissipation device of the server only carries out circulating heat exchange on the air inside the server, the heat dissipation of the air outside the server is basically not needed, the influence caused by the impurities such as dust in the outside air entering the server can be reduced to the maximum extent, and the inside of the server can be kept clean for a long time. The invention adopts a liquid cooling mode to circularly cool the air, the heat conduction efficiency is higher, and the cooling liquid is only concentrated in the box body 1 and does not flow through the inside of the server through a pipeline, but the air in the server is introduced into the box body 1 to be cooled, thereby effectively avoiding the influence of the leakage of the cooling liquid on the normal work of the server.
On the basis of the scheme, the supporting transverse plate 4 is arranged in the box body 1, the supporting transverse plate 4 is fixed in the box body 1, and the supporting transverse plate 4 is transversely and horizontally arranged and plays a supporting role. The heat dissipation plate 41 is fixedly installed on the supporting transverse plate 4, the end part of the heat dissipation plate 41 can extend out of the box body 1 and is directly contacted with a heating device inside the server for heat conduction, and the heat dissipation plate 41 conducts heat in a solid heat conduction mode and conducts heat more quickly compared with an air heat conduction mode; the air entering the server from the cooling pipeline 2 contacts the heating element to absorb heat, the heat dissipation plate 41 directly contacts the heating element inside the server to absorb heat, and the heat is conducted to the inside of the box body 1 through two ways.
The box body 1 is provided with the air inlet pipe 5, the air inlet pipe 5 guides hot air inside the server to the upper side of the supporting transverse plate 4, preferably, the distance between the bottom end of the air inlet pipe 5 and the upper surface of the supporting transverse plate 4 is 2cm, the air flowing through the inside of the server enters the box body 1 through the air inlet pipe 5, the air is blown onto the supporting transverse plate 4 to be dispersed and then directly contacts with the heat dissipation plate 41, the air further absorbs heat conducted by the heat dissipation plate 41, the heat of the heat dissipation plate 41 is conducted into the air, and the air is further heated; since the area of the heat dissipation plate 41 is larger, the heat dissipation area is increased for the inside of the server with a small space, so that heat is better transferred to the air, and the air that has absorbed the heat of the heat dissipation plate 41 flows through the cooling duct 2, thereby cooling the air in the cooling duct 2.
Preferably, the heat dissipation plates 41 in the present invention are vertically arranged, the heat dissipation plates 41 are parallel to each other, and the heat dissipation plates 41 are perpendicular to the supporting horizontal plate 4; as shown in fig. 2, the through holes 411 are arranged in the heat dissipation plate 41 in an array, the diameter of the through holes 411 is smaller than the thickness of the heat dissipation plate 41, and the through holes 411 are arranged to increase the contact area between the heat dissipation plate 41 and the air, thereby improving the heat exchange efficiency.
The lower edge of the heat dissipation plate 41 is provided with the strip-shaped through groove 412, the transverse width of the through groove 412 is large, when air is blown out from the air inlet pipe 5, the air is directly blown onto the supporting transverse plate 4 and is dispersed to the periphery, the air flows through the through groove 412 and can rapidly flow to other heat dissipation plates 41, the air can be more uniformly contacted with each heat dissipation plate 41, and the heat transfer is more sufficient.
As shown in fig. 1A, the cooling pipe 2 is in a vertical serpentine configuration, that is, the cooling pipe 2 has a vertically-arranged structure, and the sliding plate 6 is sleeved on the outside of the cooling pipe 2, and the sliding plate 6 can vertically slide, and is guided by the vertical section of the cooling pipe 2. The slide 6 realizes vertical reciprocating through vertical actuating lever 61, and vertical actuating lever 61 can adopt forms such as cylinder or electronic jar, and extrusion coolant liquid when vertical actuating lever 61 drives the downstream makes the coolant liquid of slide 6 below flow to the heating panel 41 along return line 21 and carries out the heat exchange, as shown in fig. 3, for the coolant liquid flows to the schematic diagram of supporting diaphragm 4 top.
The bottom end of the return pipe 21 is communicated with the cooling liquid below the box body 1, and the top end extends to the upper part of the supporting transverse plate 4. When needs promote the radiating efficiency, drive slide 6 through vertical actuating lever 61 and move extrusion coolant liquid down, the coolant liquid receives the extrusion and flows to support diaphragm 4 from return line 21 on to with heating panel 41 direct contact, the heat of direct absorption heating panel 41 accelerates heat transfer's speed.
The cooling liquid falls through a transverse plate liquid return port 42 arranged on the supporting transverse plate 4 and falls through a sliding plate liquid return port 62 arranged on the sliding plate 6, as shown in fig. 4, which is a structural schematic diagram that the cooling liquid falls on the sliding plate 6; after absorbing the heat of the heat dissipation plate 41, the coolant flows downward from the transverse plate liquid return port 42 and falls onto the sliding plate 6, and then flows into the coolant at the bottom of the box body 1 from the sliding plate liquid return port 62 of the sliding plate 6, so that the coolant circularly flows, and in the process that the coolant flows to the bottom of the box body 1 again, the vertical driving rod 61 drives the sliding plate 6 to flow upward to provide a space for the returned coolant.
Because the cooling liquid is directly contacted with the heat dissipation plate 41, the cooling and heat dissipation efficiency can be improved to a greater extent, and because the vertical driving rod 61 is adopted to extrude the cooling liquid, the cooling liquid is quieter compared with a mode of pumping the cooling liquid by adopting a pump body.
Preferably, the upper surface of the sliding plate 6 is an inclined surface, so that the cooling liquid flows to the sliding plate liquid return port 62, the flowing speed of the cooling liquid is accelerated, and the cooling liquid is prevented from accumulating above the sliding plate 6.
Specifically, the top end of the cooling duct 2 in the present invention extends to the top of the interior of the box 1, as shown in fig. 1B, which is a partial enlarged view of the portion X in fig. 1A, a cover 22 is disposed outside the top end of the cooling duct 2, a through hole is disposed on a side wall of the cover 22, and the top end of the cooling duct 2 faces upward, so as to prevent most of the cooling liquid from splashing to the top end of the cooling duct 2; furthermore, two layers of pore plates 23 are arranged at the top end of the cooling pipeline 2, the pore plates 23 are provided with array through holes, the two layers of pore plates 23 are of solid structures, a DuPont film 24 is clamped between the two layers of pore plates 23, and the DuPont film 24 has the functions of only air permeability and water impermeability, so that the cooling liquid is prevented from entering the cooling pipeline 2 more thoroughly, and the cooling liquid is prevented from entering the inside of the server fundamentally.
One-way valves which are communicated in one way are respectively arranged in the liquid return port 62 of the sliding plate, the return pipeline 21 and the air inlet pipe 5; as shown in fig. 1C, which is a partial enlarged view of the portion Y in fig. 1A; the check valve only allows one-way flow of fluid and cannot flow in the reverse direction. The one-way valve in the air inlet duct 5 only allows the air flow from the server to the inside of the cabinet 1; the one-way valve arranged in the sliding plate liquid return port 62 prevents the cooling liquid from reversely flowing to the upper side in the process of pressing the sliding plate 6; the one-way valve in the return line 21 only allows the coolant to flow from the bottom up, avoiding the coolant to flow backwards.
Electromagnetic valves for controlling on-off are respectively arranged in the transverse plate liquid return port 42, the liquid inlet pipe 11 and the liquid outlet pipe 12, and the electromagnetic valves in the liquid inlet pipe 11 and the liquid outlet pipe 12 are closed when the cooling liquid is extruded through the sliding plate 6; and the electromagnetic valve in the transverse plate liquid return port 42 is closed when the cooling liquid reaches the supporting transverse plate 4, and after a period of time, the heat exchange of the cooling liquid is finished, and then the electromagnetic valve is opened to discharge the cooling liquid.
Specifically, the cooling duct 2 in the present invention discharges cooled air into the inside of the server from the lower portion of the cabinet 1, and cool air flows through the inside of the server from the bottom to the top. The air inlet pipe 5 guides the hot air into the interior of the cabinet 1 from the upper portion of the cabinet 1, thereby completing the circulation flow of the air.
Preferably, the invention sets up the annular groove in the sidewall middle part of the through hole on the slide 6, this through hole is used for cooperating and inserting the cooling pipe 2, mount the first seal ring 63 used for sealing with the external surface of the cooling pipe 2 in the annular groove, avoid the coolant liquid to flow to the top of the slide 6 upwards; the lower surface of the sliding plate 6 is fixedly provided with a second sealing ring 64, the second sealing ring 64 is used for being matched and sealed with the outer surface of the cooling pipeline 2, and the sealing efficiency can be furthest achieved through double sealing of the first sealing ring 63 and the second sealing ring 64.
The invention also provides a server, which comprises the server heat dissipation device, the server can achieve the same technical effect, and the other parts of the server are structured with reference to the prior art, which is not repeated herein.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. The server heat dissipation device is characterized by comprising a box body (1) arranged inside a server, wherein cooling liquid is contained in the box body (1); a liquid inlet pipe (11) and a liquid outlet pipe (12) are arranged on the box body (1), and cooling liquid enters the box body (1) from the liquid inlet pipe (11) and is discharged from the liquid outlet pipe (12);
a cooling pipeline (2) is arranged in the box body (1), and the cooling pipeline (2) is immersed in cooling liquid for heat exchange; an air driving device (3) is installed on the cooling pipeline (2), and the air driving device (3) can discharge cooled air in the cooling pipeline (2) to the interior of the server and enable hot air in the interior of the server to enter the box body (1).
2. The server heat dissipation device according to claim 1, wherein a supporting transverse plate (4) is arranged in the box body (1), a heat dissipation plate (41) is fixedly mounted on the supporting transverse plate (4), and the end part of the heat dissipation plate (41) can extend out of the box body (1) and is directly contacted with a heat generating device inside the server for heat conduction;
the air inlet pipe (5) is arranged on the box body (1), hot air in the server is guided to the upper portion of the supporting transverse plate (4) through the air inlet pipe (5), and heat of the heat dissipation plate (41) is conducted to the air.
3. The heat sink for the server according to claim 2, wherein the heat dissipation plates (41) are arranged in a vertical arrangement, through holes (411) are arranged on the heat dissipation plates (41) in an array, and the diameter of the through holes (411) is smaller than the thickness of the heat dissipation plates (41); a long through groove (412) is arranged at the lower edge of the heat dissipation plate (41).
4. The server heat sink according to claim 2, wherein the cooling pipe (2) is arranged in a vertical serpentine shape, a sliding plate (6) is sleeved on the outside of the cooling pipe (2), the sliding plate (6) can slide vertically, the sliding plate (6) is driven by a vertical driving rod (61) to move downwards to squeeze the cooling liquid, so that the cooling liquid below the sliding plate (6) flows along a return pipe (21) to the heat dissipation plate (41) for heat exchange;
the cooling liquid falls through a transverse plate liquid return port (42) arranged on the supporting transverse plate (4) and falls through a sliding plate liquid return port (62) arranged on the sliding plate (6).
5. The server heat sink according to claim 4, wherein the top surface of the sliding plate (6) is sloped to allow the coolant to flow toward the sliding plate return port (62).
6. The server heat dissipation device according to claim 4, wherein a top end of the cooling pipe (2) extends to an uppermost portion inside the box body (1), a cover body (22) is arranged outside the top end of the cooling pipe (2), two layers of pore plates (23) are arranged at the top end of the cooling pipe (2), and a DuPont film (24) is sandwiched between the two layers of pore plates (23).
7. The server heat sink according to claim 4, wherein one-way valves are respectively disposed in the liquid return port (62), the return duct (21) and the air inlet duct (5);
and electromagnetic valves for controlling on-off are respectively arranged in the transverse plate liquid return port (42), the liquid inlet pipe (11) and the liquid outlet pipe (12).
8. The server heat sink according to claim 4, wherein the cooling duct (2) discharges cooled air from a lower portion of the case (1) into the inside of the server; the air inlet pipe (5) guides hot air into the box body (1) from the upper part of the box body (1).
9. The server heat sink according to claim 4, wherein an annular groove is formed in the middle of the side wall of the through hole in the sliding plate (6), and a first sealing ring (63) for sealing with the outer surface of the cooling pipeline (2) is mounted in the annular groove; and a second sealing ring (64) is fixedly arranged on the lower surface of the sliding plate (6), and the second sealing ring (64) is used for being matched and sealed with the outer surface of the cooling pipeline (2).
10. A server, comprising the server heat sink of any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011434884.3A CN112601422B (en) | 2020-12-10 | 2020-12-10 | Server heat abstractor and server |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011434884.3A CN112601422B (en) | 2020-12-10 | 2020-12-10 | Server heat abstractor and server |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112601422A true CN112601422A (en) | 2021-04-02 |
| CN112601422B CN112601422B (en) | 2022-06-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011434884.3A Active CN112601422B (en) | 2020-12-10 | 2020-12-10 | Server heat abstractor and server |
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| Country | Link |
|---|---|
| CN (1) | CN112601422B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016078295A1 (en) * | 2014-11-20 | 2016-05-26 | 中兴通讯股份有限公司 | Heat dissipation device |
| CN108882658A (en) * | 2018-09-07 | 2018-11-23 | 中南大学 | The server cabinet cooling system that immersion liquid cooling and circulating air cooling combine |
| CN109383321A (en) * | 2018-11-13 | 2019-02-26 | 武汉银桥南海光电有限公司 | A kind of charging pile with internal-circulation type radiator structure |
| CN111787769A (en) * | 2020-07-17 | 2020-10-16 | 济南浪潮数据技术有限公司 | Server cooling cabinet |
-
2020
- 2020-12-10 CN CN202011434884.3A patent/CN112601422B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016078295A1 (en) * | 2014-11-20 | 2016-05-26 | 中兴通讯股份有限公司 | Heat dissipation device |
| CN108882658A (en) * | 2018-09-07 | 2018-11-23 | 中南大学 | The server cabinet cooling system that immersion liquid cooling and circulating air cooling combine |
| CN109383321A (en) * | 2018-11-13 | 2019-02-26 | 武汉银桥南海光电有限公司 | A kind of charging pile with internal-circulation type radiator structure |
| CN111787769A (en) * | 2020-07-17 | 2020-10-16 | 济南浪潮数据技术有限公司 | Server cooling cabinet |
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| Publication number | Publication date |
|---|---|
| CN112601422B (en) | 2022-06-17 |
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