CN112601353A - Electronic component pin and electronic component - Google Patents

Electronic component pin and electronic component Download PDF

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Publication number
CN112601353A
CN112601353A CN202011541898.5A CN202011541898A CN112601353A CN 112601353 A CN112601353 A CN 112601353A CN 202011541898 A CN202011541898 A CN 202011541898A CN 112601353 A CN112601353 A CN 112601353A
Authority
CN
China
Prior art keywords
pin
welding head
lower welding
upper rod
rod body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202011541898.5A
Other languages
Chinese (zh)
Inventor
姚磊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xinyi Chengxiang Electronics Co ltd
Original Assignee
Xinyi Chengxiang Electronics Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xinyi Chengxiang Electronics Co ltd filed Critical Xinyi Chengxiang Electronics Co ltd
Priority to CN202011541898.5A priority Critical patent/CN112601353A/en
Publication of CN112601353A publication Critical patent/CN112601353A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H01R4/029—Welded connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/1078—Leads having locally deformed portion, e.g. for retention

Abstract

The invention belongs to the technical field of electronic elements, and particularly relates to an electronic element pin and an electronic element, which comprise a pin body, wherein a tin coating is arranged on the outer wall of the pin body, the pin body comprises an upper rod body and a lower welding head, the upper rod body is coaxially connected to the upper end of the lower welding head, a transition step is arranged at the joint of the upper rod body and the lower welding head, and the lower surface of the lower welding head is arc-shaped. The electronic element consists of an electronic element pin and an electric body connected to the upper side of the electronic element pin; when the electronic element is used, the pins of the electronic element penetrate through the corresponding electric through holes on the PCB, and the transition steps are connected with the PCB in a soldering mode. Through the matching action of the lower welding head and the transition step, the resistance is larger after the pin body and the PCB are connected by tin welding, and the pin body is not easy to loosen; through the arc setting of soldered connection bottom down, when welding or assembly, be difficult to cause staff's hand to prick.

Description

Electronic component pin and electronic component
Technical Field
The invention relates to the technical field of electronic elements, in particular to an electronic element pin and an electronic element.
Background
Electronic components are basic elements in electronic circuits, typically individually packaged, and have two or more leads or metal contacts. The electronic components are interconnected to form an electronic circuit having a specific function, such as: amplifiers, radio receivers, oscillators, etc., one of the common ways to connect electronic components is soldering to a printed circuit board. The electronic components may be individual packages (resistors, capacitors, inductors, transistors, diodes, etc.) or groups of various complexities, such as: integrated circuits (operational amplifiers, exclusion, logic gates, etc.).
The existing electronic element is usually a copper wire or an iron wire with a smooth surface and the same diameter, so that the stability is not enough during welding, and loose condition is easy to occur after long-time use, which causes poor contact. For this reason, a corresponding technical scheme needs to be designed for solution.
Disclosure of Invention
The invention aims to provide an electronic element pin and an electronic element, and solves the technical problems that the conventional electronic element provided by the background art is usually a copper wire or an iron wire with a smooth surface and the same diameter, so that the stability is not enough during welding, and the loose condition is easy to occur after long-time use, thereby causing poor contact.
In order to achieve the purpose, the invention provides the following technical scheme: the pin comprises a pin body, wherein a tin coating is arranged on the outer wall of the pin body, the pin body comprises an upper rod body and a lower welding head, the upper rod body is coaxially connected to the upper end of the lower welding head, a transition step is arranged at the joint of the upper rod body and the lower welding head, and the lower surface of the lower welding head is arc-shaped.
Preferably, the upper rod body, the lower welding head and the transition step are integrally cast and molded.
Preferably, the length of the upper rod body is 2-10 mm.
Preferably, the cross sections of the upper rod body and the lower welding head are circular, the diameter of the cross section of the upper rod body is 0.5mm-1.5mm, and the diameter of the cross section of the lower welding head is 1.8mm-2.6 mm.
An electronic component using electronic component pins, the electronic component is composed of electronic component pins and an electric body connected to the upper sides of the electronic component pins;
when the device is used, the pins of the electronic element penetrate through the corresponding electric through holes in the PCB, the lower welding head extends to the other side of the PCB, the distance between the transition step and the PCB is 1mm-1.6mm, the upper rod body, the lower welding head and the corresponding electric through holes in the PCB are coaxially arranged, and the transition step and the PCB are connected in a soldering mode.
Compared with the prior art, the invention has the beneficial effects that:
(1) through the matching action of the lower welding head and the transition step, the resistance is larger after the pin body and the PCB are connected by tin welding, and the pin body is not easy to loosen;
(2) through the arc setting of soldered connection bottom down, when welding or assembly, be difficult to cause staff's hand to prick.
Drawings
FIG. 1 is a schematic cross-sectional view of an electronic device pin according to the present invention;
FIG. 2 is a schematic structural diagram of a lead body according to the present invention;
FIG. 3 is a schematic structural diagram of an electronic device according to the present invention;
FIG. 4 is a schematic view of the electronic component of the present invention inserted into a PCB;
FIG. 5 is a schematic structural view of the electronic component pin and the PCB after being soldered.
In the figure: 1 pin body, 11 upper rod body, 12 lower welding head, 13 transition step and 2 tin coating.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
Example (b):
referring to fig. 1-5, the present invention provides a technical solution: the utility model provides an electronic component pin, includes pin body 1, and pin body 1 adopts iron system or adopts copper, be provided with tin coating 2 on the outer wall of pin body 1, tin coating 2 on the outer wall of pin body 1 makes things convenient for subsequent soldering operation, pin body 1 includes the body of rod 11 and soldered connection 12 down, go up the upper end of body of rod 11 coaxial coupling at soldered connection 12 down, the junction of going up the body of rod 11 and soldered connection 12 down is provided with transition step 13, the lower surface of soldered connection 12 is the arc form down.
Furthermore, the upper rod body 11, the lower welding head 12 and the transition step 13 are integrally cast, the manufacturing process among the upper rod body 11, the lower welding head 12 and the transition step 13 is simple, and the plurality of pin bodies 1 can be manufactured at one time.
Further, the length of the upper rod body 11 is 2-10mm, the length of the upper rod body 11 is determined according to the use requirement, normal use is guaranteed, and waste is reduced.
Furthermore, the cross sections of the upper rod body 11 and the lower welding head 12 are circular, the diameter of the cross section of the upper rod body 11 is 0.5mm-1.5mm, the diameter of the cross section of the lower welding head 12 is 1.8mm-2.6mm, the diameter of the lower welding head 12 is larger than that of the upper rod body 11, and then the upper rod body 11 and the lower welding head 12 are welded at the joint through tin welding.
An electronic component using the electronic component pin, the electronic component is composed of the electronic component pin and an electric body connected to the upper side of the electronic component pin;
when the device is used, the pins of the electronic element penetrate through the corresponding electric through holes on the PCB, the lower welding head 12 extends to the other side of the PCB, the distance between the transition step 13 and the PCB is 1mm-1.6mm, the upper rod body 11 and the lower welding head 12 are coaxially arranged with the corresponding electric through holes on the PCB, and the transition step 13 is connected with the PCB in a soldering mode.
While there have been shown and described the fundamental principles and essential features of the invention and advantages thereof, it will be apparent to those skilled in the art that the invention is not limited to the details of the foregoing exemplary embodiments, but is capable of other specific forms without departing from the spirit or essential characteristics thereof; the present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein, and any reference signs in the claims are not intended to be construed as limiting the claim concerned.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (5)

1. An electronic component pin, comprising a pin body (1), characterized in that: the outer wall of the pin body (1) is provided with a tin coating (2), the pin body (1) comprises an upper rod body (11) and a lower welding head (12), the upper rod body (11) is coaxially connected to the upper end of the lower welding head (12), a transition step (13) is arranged at the joint of the upper rod body (11) and the lower welding head (12), and the lower surface of the lower welding head (12) is arc-shaped.
2. An electronic component pin according to claim 1, wherein: the upper rod body (11), the lower welding head (12) and the transition step (13) are integrally cast and molded.
3. An electronic component pin according to claim 1, wherein: the length of the upper rod body (11) is 2-10 mm.
4. An electronic component pin according to claim 1, wherein: the cross sections of the upper rod body (11) and the lower welding head (12) are circular, the diameter of the cross section of the upper rod body (11) is 0.5-1.5 mm, and the diameter of the cross section of the lower welding head (12) is 1.8-2.6 mm.
5. An electronic component using the electronic component pin according to any one of claims 1 to 4, characterized in that: the electronic element consists of an electronic element pin and an electric body connected to the upper side of the electronic element pin;
when the device is used, the pins of the electronic element penetrate through the corresponding electric through holes in the PCB, the lower welding head (12) extends to the other side of the PCB, the distance between the transition step (13) and the PCB is 1mm-1.6mm, the upper rod body (11), the lower welding head (12) and the corresponding electric through holes in the PCB are coaxially installed, and the transition step (13) and the PCB are connected in a soldering mode.
CN202011541898.5A 2020-12-23 2020-12-23 Electronic component pin and electronic component Pending CN112601353A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202011541898.5A CN112601353A (en) 2020-12-23 2020-12-23 Electronic component pin and electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202011541898.5A CN112601353A (en) 2020-12-23 2020-12-23 Electronic component pin and electronic component

Publications (1)

Publication Number Publication Date
CN112601353A true CN112601353A (en) 2021-04-02

Family

ID=75201001

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202011541898.5A Pending CN112601353A (en) 2020-12-23 2020-12-23 Electronic component pin and electronic component

Country Status (1)

Country Link
CN (1) CN112601353A (en)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4236776A (en) * 1978-08-24 1980-12-02 Augat Inc. Electrical contact with improved means for solder wicking and degassing
JPH0235763A (en) * 1988-07-26 1990-02-06 Matsushita Electric Works Ltd Substrate with terminal pin
DE4342149A1 (en) * 1993-12-10 1995-06-22 Ptr Mestechnik Gmbh & Co Kg Tapered terminal pin for connecting electronic components to PCBs
JPH09199660A (en) * 1997-03-04 1997-07-31 Ibiden Co Ltd Semiconductor mounting board
CN101019231A (en) * 2004-09-15 2007-08-15 揖斐电株式会社 Lead pin for mounting semiconductor and printed wiring board
KR101283508B1 (en) * 2013-03-25 2013-07-12 에스디(주) Coupling structure of printed circuit board and terminal pin
CN104485228A (en) * 2014-12-11 2015-04-01 铜陵市启动电子制造有限责任公司 Flat thin-film capacitor
CN106211628A (en) * 2016-08-31 2016-12-07 安徽赛福电子有限公司 Electronic component fast welding T-Ring
CN106332449A (en) * 2016-08-31 2017-01-11 安徽赛福电子有限公司 Electronic element pin

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4236776A (en) * 1978-08-24 1980-12-02 Augat Inc. Electrical contact with improved means for solder wicking and degassing
JPH0235763A (en) * 1988-07-26 1990-02-06 Matsushita Electric Works Ltd Substrate with terminal pin
DE4342149A1 (en) * 1993-12-10 1995-06-22 Ptr Mestechnik Gmbh & Co Kg Tapered terminal pin for connecting electronic components to PCBs
JPH09199660A (en) * 1997-03-04 1997-07-31 Ibiden Co Ltd Semiconductor mounting board
CN101019231A (en) * 2004-09-15 2007-08-15 揖斐电株式会社 Lead pin for mounting semiconductor and printed wiring board
KR101283508B1 (en) * 2013-03-25 2013-07-12 에스디(주) Coupling structure of printed circuit board and terminal pin
CN104485228A (en) * 2014-12-11 2015-04-01 铜陵市启动电子制造有限责任公司 Flat thin-film capacitor
CN106211628A (en) * 2016-08-31 2016-12-07 安徽赛福电子有限公司 Electronic component fast welding T-Ring
CN106332449A (en) * 2016-08-31 2017-01-11 安徽赛福电子有限公司 Electronic element pin

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PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20210402