CN220066259U

CN220066259U - Socket for DIP welding

Info

Publication number: CN220066259U
Application number: CN202321381632.8U
Authority: CN
Inventors: 商文霞
Original assignee: Hunan Yuanxin Sensor Technology Co ltd
Current assignee: Hunan Xingshuo Sensor Technology Co ltd
Priority date: 2023-06-01
Filing date: 2023-06-01
Publication date: 2023-11-21
Anticipated expiration: 2033-06-01

Abstract

The present utility model provides a socket for DIP soldering, comprising: the socket comprises a socket top, a socket main body and a socket bottom; the top of the socket is provided with a conical boss; the top of the conical boss is provided with two inlet holes, and the contact surface between the bottom and the top of the socket is provided with two pin holes; the inlet and the pin hole form an inlet pipeline from top to bottom; the socket main body is internally integrated with a plurality of contact pins based on an injection molding process; the top of each contact pin is provided with a track; the track is communicated with the inlet pipeline; part of needle tube of the contact pin and all contacts are exposed at the bottom of the contact pin; the socket bottom is equipped with two fixed columns, the fixed column inserts printed circuit board preset position to realize fixed connection. The socket provided by the utility model can realize automatic equipment welding, is convenient for frequent plug and replacement of TO packaging devices, and ensures reliability and firmness.

Description

Socket for DIP welding

Technical Field

The utility model relates to the technical field of component welding, in particular to a socket for DIP welding.

Background

Dual in-line package (DIP package) is also called DIP package or DIP package, abbreviated as DIP or DIL, and is a package form of an electronic component, which is commonly used for packaging components such as an integrated circuit chip, a resistor, a capacitor, a diode, and the like. The DIP packaged component has double rows of in-line pins that can be directly inserted into through holes on a PCB board, and therefore is also referred to as a through hole interposer, which is part of the PCBA (printed circuit board assembly) process.

The DIP welding processing mode mainly comprises three modes of DIP welding, wave soldering and reflow soldering, and the wave soldering processing mode is mainly studied. Wave soldering is to fix the connector on the printed circuit board, the mechanical pump continuously presses out liquid tin wave from the nozzle, when the printed circuit board passes through, the tin continuously overflows to the surface of the printed circuit board in the form of wave crest for soldering, and the wave soldering machine can finish the soldering of all welding spots on the printed circuit board at one time. The connector is usually composed of a socket and a pin, and the connector needs to be fixed at a preset position of a printed circuit board in advance and has certain high temperature resistance and fixing force.

The TO packaged device is a metal-encapsulated electronic component that typically includes one or more pins and a metal shell. Because the diameter of the pins of the TO packaging device is larger, and the distance between the pins is smaller, the problems of pin short circuit or poor contact and the like are easy TO occur during welding, and the problems can be effectively solved by using the connector. The DIP welding process of the current TO packaging form is widely applied TO the fields of automobiles, aerospace, electronics, household appliances and the like. However, the existing connectors cannot realize automatic equipment welding, such as wave soldering; the protruding height of the socket pins may have height difference, and different pins have different heights, so that the height difference may cause the problems of poor contact between the pins and the printed circuit board or bending of the pins; meanwhile, the existing plug connector is inconvenient for plugging and replacing TO packaging devices, and firmness after multiple plugging is not reliable.

Disclosure of Invention

In view of this, embodiments of the present utility model provide a socket for DIP soldering, which eliminates or improves one or more drawbacks of the prior art, and solves the problems that the existing connectors cannot realize automatic device soldering, have pin height differences, and are inconvenient for TO package device insertion and replacement.

The technical scheme of the utility model is as follows:

the utility model provides a socket for DIP welding, which is characterized by comprising the following components:

a socket top; the top of the socket is provided with a conical boss; the top of the conical boss is provided with two inlet holes, and the contact surface between the bottom of the conical boss and the top of the socket is provided with two pin holes; from top TO bottom, the inlet and the pin holes form an inlet pipeline for inserting TO pins;

a socket main body; the socket main body is internally integrated with a plurality of pins based on an injection molding process; the top of each contact pin is provided with a track; the track is communicated with the inlet pipeline;

a socket bottom; the bottom of the contact pin is exposed out of part of needle tubes and all contacts of the contact pin; the socket bottom is equipped with two fixed columns, the fixed column inserts printed circuit board and predetermines the position to realize fixed connection.

In some embodiments of the utility model, the pin opening has an inner diameter greater than the inner diameter of the inlet opening, facilitating TO pin insertion.

In some embodiments of the present utility model, the track inner diameter is smaller than the pin hole inner diameter, and the hole inlet pipeline and the track form a complete insertion pipeline, so as TO realize self-shaping of the TO pin.

In some embodiments of the utility model, the socket body is cylindrical in configuration to facilitate interface design and layout on the printed circuit board.

In some embodiments of the present utility model, a round hole is provided on one side of the top of the socket as a positioning edge to distinguish the polarity of the device.

In some embodiments of the utility model, the socket base is provided with a plurality of bumps to facilitate positioning on the printed circuit board.

In some embodiments of the utility model, the fixing posts are made of metal materials.

In some embodiments of the present utility model, the fixing post and the printed circuit board are fixedly connected by soldering.

In some embodiments of the utility model, the socket is entirely of plastic material.

In some embodiments of the utility model, the length of the fixing post is greater than the exposed portion of the pin at the bottom of the socket.

The utility model has the advantages that:

the present utility model provides a socket for DIP soldering, comprising: the socket comprises a socket top part, a socket main body and a socket bottom part. The top of the socket is provided with a conical boss, a manual operation position is reserved, and the TO pin can be conveniently plugged and pulled manually. The top of the conical boss is provided with two inlet holes, the contact surface between the bottom and the top of the socket is provided with two pin holes from top TO bottom, the inlet holes and the pin holes form an inlet pipeline, the inner diameter of the pin holes is larger, and the TO pins are convenient TO insert. A round hole is arranged on one side of the top of the socket and used as a positioning edge for distinguishing the polarity of the device and preventing the misplug direction. The socket body adopts a cylindrical structure, so that interface design and layout are convenient to carry out on a printed circuit board. The socket main body is internally integrated with a plurality of contact pins based on an injection molding process, the top of each contact pin is provided with a track, and the track is communicated with the inlet pipeline TO form an insertion pipeline with a funnel-shaped structure so as TO realize self-shaping of TO pins. The bottom of the contact pin is exposed out of partial needle tubes and all contacts of the contact pin, two fixing columns are arranged at the bottom of the socket, and the fixing columns are inserted into the preset positions of the printed circuit board so as TO realize reinforcement, and when a TO packaging device is frequently plugged or replaced, the reliability and the firmness can be ensured. The bottom of the contact pin is also provided with a plurality of protruding points, so that the contact pin can be conveniently positioned with the printed circuit board. The socket provided by the utility model can realize automatic equipment welding and is convenient for frequent plug and replacement of TO packaging devices.

Additional advantages, objects, and features of the utility model will be set forth in part in the description which follows and in part will become apparent to those having ordinary skill in the art upon examination of the following or may be learned from practice of the utility model. The objectives and other advantages of the utility model may be realized and attained by the structure particularly pointed out in the written description and drawings thereof.

It will be appreciated by those skilled in the art that the objects and advantages that can be achieved with the present utility model are not limited to the above-described specific ones, and that the above and other objects that can be achieved with the present utility model will be more clearly understood from the following detailed description.

Drawings

The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate and together with the description serve to explain the utility model. The components in the figures are not necessarily to scale, emphasis instead being placed upon illustrating the principles of the utility model. Corresponding parts in the drawings may be exaggerated, i.e. made larger relative to other parts in an exemplary device actually manufactured according to the present utility model, for convenience in showing and describing some parts of the present utility model. In the drawings:

fig. 1 is a front view of a socket for DIP soldering in accordance with an embodiment of the present utility model.

Fig. 2 is a cross-sectional view of a socket for DIP soldering in accordance with an embodiment of the present utility model.

Fig. 3 is a schematic diagram illustrating a use process of a socket for DIP soldering according to an embodiment of the present utility model.

Reference numerals illustrate:

100: a socket top; 200: a socket main body; 300: a socket bottom;

110: a conical boss; 111: an inlet orifice; 112: pin holes;

113: a hole inlet pipeline; 120: a round hole; 210: a contact pin;

211: a needle tube; 212: a contact; 220: a track;

230: injection molding the main body; 310: and fixing the column.

Detailed Description

The present utility model will be described in further detail with reference to the following embodiments and the accompanying drawings, in order to make the objects, technical solutions and advantages of the present utility model more apparent. The exemplary embodiments of the present utility model and the descriptions thereof are used herein to explain the present utility model, but are not intended to limit the utility model.

It should be noted here that, in order to avoid obscuring the present utility model due to unnecessary details, only structures and/or processing steps closely related to the solution according to the present utility model are shown in the drawings, while other details not greatly related to the present utility model are omitted.

It should be emphasized that the term "comprises/comprising" when used herein is taken to specify the presence of stated features, elements, steps or components, but does not preclude the presence or addition of one or more other features, elements, steps or components.

It is also noted herein that the term "coupled" may refer to not only a direct connection, but also an indirect connection in which an intermediate is present, unless otherwise specified.

Hereinafter, embodiments of the present utility model will be described with reference to the accompanying drawings. In the drawings, the same reference numerals represent the same or similar components, or the same or similar steps.

In order TO solve the problems that the existing connector cannot realize automatic equipment welding, has pin height difference and is inconvenient for inserting and replacing TO packaging devices, the utility model provides a socket for DIP welding, which is shown in fig. 1, and comprises a socket top 100, a socket main body 200 and a socket bottom 300, and particularly, as shown in fig. 2:

the socket top 100 is provided with a conical boss 110, the top of the conical boss 110 is provided with two inlet holes 111, the contact surface between the bottom and the socket top 100 is provided with two pin holes 112, and the inlet holes 111 and the pin holes 112 form an inlet pipeline 113 for inserting TO pins from top TO bottom.

The socket body 200 is integrated with a plurality of pins 210 based on an injection molding process inside, and a rail 220 is provided at the top of each pin, wherein the rail 220 communicates with the inlet pipe 113. In fig. 2, the rail 220 is provided inside, and thus cannot be directly observed.

Pin bottom 300 exposes a portion of needle tube 211 and all contacts 212 of pin 210, socket bottom 300 is further provided with two fixing posts 310, and fixing posts 310 are inserted into predetermined positions of the printed circuit board to achieve fixed connection.

The tapered boss 110 is provided at the socket top 100 TO leave enough place for manual operation, i.e., for manual insertion and extraction of the TO pins, and at the same time, TO reduce the contact area between the TO pins and the socket, thereby reducing contact resistance and improving electrical performance. The tapered bosses can also help better align the TO pins TO the jack, avoiding the TO pins from being skewed or not inserted in place.

In some embodiments, pin opening 112 has an inner diameter that is greater than the inner diameter of access opening 111, facilitating insertion of the TO pin. The TO (TransistorOutline) tube is a common high-power semiconductor device, the pins of which are metal columns, one end of which is connected with the chip, and the other end of which is connected into the circuit as pins, and the number of the pins of the TO is usually 2-4.

In some embodiments, the inlet conduit 113 communicates with the track 220 TO form an insertion conduit, providing an insertion path for the TO pin. When the inner diameter of pin hole 112 is larger than the inner diameter of inlet 111 and the inner diameter of track 220 is smaller than the inner diameter of pin hole 112, the entire inserted pipe has a funnel-shaped structure. From top TO bottom, the TO pins are inserted from the inlet 111 TO the pin holes 112 TO the tracks 220, and finally the pins 210 are inserted, so that a sufficient distance is reserved, and the automatic shaping of the TO pins, namely, when the TO pins are inserted from top TO bottom, the pins are gradually separated and inserted into the corresponding pins.

In some embodiments, the socket as a whole, i.e., the socket body 200, has a cylindrical configuration that facilitates interface design and layout on a printed circuit board (PrintedCircuitBoard, PCB). Because the socket is a component for connecting the electronic element and the circuit board, the interface design and layout of the socket are very important for the connection quality and reliability of the circuit, and the socket adopting the cylindrical structure can more conveniently carry out the interface design on the PCB board, so that the connection is more stable and reliable.

In some embodiments, a circular aperture 120 is provided on one side of the receptacle top 100 as a locating edge to distinguish between device polarities. Considering that the TO packaged devices have polarity differentiation, if the polarity is reversed, the devices may be damaged or malfunction. Therefore, in the utility model, in order to avoid the occurrence of the situation, a round hole is designed on one side of the top of the socket, so that when the device is inserted, a user can determine the correct insertion direction according to the polarity of the device, thereby ensuring the normal operation of the device.

In some embodiments, the socket body 200 is integrated with a plurality of pins 210 based on an injection molding process inside, and as shown in fig. 2, the socket body 200 includes a plurality of pins 210 and an injection molded body 230. Wherein the injection molded body is represented by a diagonal line in fig. 2. The injection molding process is a manufacturing process of injecting molten plastic into a mold through high pressure, and forming a required product after cooling, has the advantages of low cost, high production efficiency, high product precision and the like, and is widely applied to manufacturing plastic products such as electronic product shells, automobile parts, household appliance accessories and the like. Thus, the socket is entirely of plastic material.

In some embodiments, a plurality of bumps are provided on the socket bottom 300 as anchor points to facilitate positional positioning on the printed circuit board to ensure that the socket is accurately aligned with the printed circuit board. The location and shape of the bumps need to be determined according to the specific socket and printed circuit board design requirements. In the design of a printed circuit board, a corresponding space needs to be reserved at the installation position of the socket to accommodate the convex points of the socket and ensure that the socket can be arranged in coordination with other components. When the socket is mounted, the bumps of the socket are aligned with the positioning holes on the printed circuit board, and the socket is lightly pressed to ensure good contact with the printed circuit board. Based on the design, the installation accuracy and stability of the socket can be effectively improved, so that the reliability and performance of the whole circuit are improved.

In some embodiments, two metal fixing posts 310 are provided at the socket bottom 300, and the fixing posts 310 are inserted into a predetermined position of the printed circuit board, and automatic soldering is performed based on wave soldering together with the pins. The socket is fixed by the fixing column 310, so that the welding strength can be increased while the normal transmission of electric signals is ensured, the socket is prevented from moving or shaking when being used or when a TO assembled device is required TO be plugged and pulled out for many times, and the reliable firmness is ensured.

In some embodiments, the length of the fixing posts 310 is greater than the exposed portions of the pins 210 at the receptacle bottom 300.

The socket of the present utility model will be further described with reference to the following embodiments:

the socket of the utility model integrates the traditional contact pin into the socket by injection molding. A conical boss is designed at the top of the socket, so that the TO pins can be conveniently plugged and pulled out manually. And designing an original hole on one side of the top of the socket TO serve as a positioning edge, and identifying the access direction of the TO assembly device. The TO pins are inserted into the pins in the socket from the conical boss from top TO bottom, and a longer insertion pipeline with a funnel-shaped structure is formed based on the injection molding main body, so that the self-shaping of the TO pins is realized. Two metal fixing columns are arranged at the bottom of the socket and welded with the printed circuit board at preset positions so as to strengthen connection.

As shown in fig. 3, the use process of the socket of the present utility model includes the following steps S101 to S104:

step S101: the socket is inserted into the corresponding position of the printed circuit board by adopting a special-shaped plug-in device or manually.

Step S102: a Printed Circuit Board (PCBA) with components mounted thereon is placed on a conveyor belt and fed into a wave soldering station where the components on the PCBA are contacted with molten solder in a solder bath. The PCBA continuously moves forwards through the conveyor belt, and the PCBA passes through a wave crest in the soldering tin pool to finish the soldering.

Step S103: and obtaining the cooled PCBA.

Step S104: and inserting the TO packaged device into a socket TO perform function debugging.

In summary, the present utility model provides a socket for DIP soldering, comprising: the socket comprises a socket top part, a socket main body and a socket bottom part. The top of the socket is provided with a conical boss, a manual operation position is reserved, and the TO pin can be conveniently plugged and pulled manually. The top of the conical boss is provided with two inlet holes, the contact surface between the bottom and the top of the socket is provided with two pin holes from top TO bottom, the inlet holes and the pin holes form an inlet pipeline, the inner diameter of the pin holes is larger, and the TO pins are convenient TO insert. A round hole is arranged on one side of the top of the socket and used as a positioning edge for distinguishing the polarity of the device and preventing the misplug direction. The socket body adopts a cylindrical structure, so that interface design and layout are convenient to carry out on a printed circuit board. The socket main body is internally integrated with a plurality of contact pins based on an injection molding process, the top of each contact pin is provided with a track, and the track is communicated with the inlet pipeline TO form an insertion pipeline with a funnel-shaped structure so as TO realize self-shaping of TO pins. The bottom of the contact pin is exposed out of partial needle tubes and all contacts of the contact pin, two fixing columns are arranged at the bottom of the socket, and the fixing columns are inserted into the preset positions of the printed circuit board so as TO realize reinforcement, and when a TO packaging device is frequently plugged or replaced, the reliability and the firmness can be ensured. The bottom of the contact pin is also provided with a plurality of protruding points, so that the contact pin can be conveniently positioned with the printed circuit board. The socket provided by the utility model can realize automatic equipment welding and is convenient for frequent plug and replacement of TO packaging devices.

These are merely examples that are intended to be explicitly recited in this description, and all possible combinations of values recited between the lowest value and the highest value are believed to be explicitly stated in the description in a similar manner.

The term "consisting essentially of …" describing a combination shall include the identified element, ingredient, component or step as well as other elements, ingredients, components or steps that do not substantially affect the essential novel features of the combination. The use of the terms "comprises" or "comprising" to describe combinations of elements, components, or steps herein also contemplates embodiments consisting essentially of such elements, components, or steps. By using the term "may" herein, it is intended that any attribute described as "may" be included is optional.

Multiple elements, components, parts or steps can be provided by a single integrated element, component, part or step. Alternatively, a single integrated element, component, part or step may be divided into separate plural elements, components, parts or steps. The disclosure of "a" or "an" to describe an element, component, feature or step is not to be taken as excluding other elements, components, features or steps.

The above description is only of the preferred embodiments of the present utility model and is not intended to limit the present utility model, and various modifications and variations can be made to the embodiments of the present utility model by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.

Claims

1. A socket for DIP soldering, comprising:

2. The socket for DIP soldering of claim 1, wherein said pin opening has an inner diameter greater than an inner diameter of said inlet opening TO facilitate insertion of a TO pin.

3. The socket for DIP soldering of claim 2, wherein said track has an inner diameter smaller than an inner diameter of said pin opening, said inlet tube and said track forming a complete insertion tube for self-shaping of the TO pin.

4. The socket for DIP soldering of claim 1, wherein said socket body is of cylindrical configuration for facilitating interface design and layout on said printed circuit board.

5. The socket for DIP soldering as claimed in claim 1, wherein a circular hole is provided at a top side of the socket as a positioning edge to distinguish polarities of devices.

6. The socket for DIP soldering of claim 1, wherein said socket base is provided with a plurality of bumps for facilitating positioning on said printed circuit board.

7. The socket for DIP soldering of claim 1, wherein the fixing posts are of a metallic material.

8. The socket for DIP soldering as defined in claim 1, wherein the fixing posts are fixedly connected to the printed circuit board by soldering.

9. The socket for DIP soldering of claim 1, wherein the socket is integrally formed of a plastic material.

10. The socket for DIP soldering of claim 1, wherein at the bottom of the socket, the fixing posts have a length greater than an exposed portion of the pins.