CN112596556A - Temperature control method and electronic device - Google Patents
Temperature control method and electronic device Download PDFInfo
- Publication number
- CN112596556A CN112596556A CN202011496401.2A CN202011496401A CN112596556A CN 112596556 A CN112596556 A CN 112596556A CN 202011496401 A CN202011496401 A CN 202011496401A CN 112596556 A CN112596556 A CN 112596556A
- Authority
- CN
- China
- Prior art keywords
- temperature
- shell
- housing
- electronic device
- electronic equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Automation & Control Theory (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Control Of Temperature (AREA)
Abstract
The application provides a temperature control method and an electronic device. The temperature control method is applied to electronic equipment, and comprises the following steps: acquiring a first ambient temperature of the electronic equipment at a first position through a temperature sensor; acquiring a second ambient temperature of the electronic equipment at a second position through a temperature sensor; controlling, by a processor, a housing of the electronic device to warm up when a difference between the second ambient temperature and the first ambient temperature exceeds a first predetermined threshold. By the temperature control method, the shell of the electronic equipment can be controlled to be heated up when the temperature of the external environment where the electronic equipment is located suddenly changes, so that the phenomenon that water vapor is liquefied on the surface of the electronic equipment when the temperature of the external environment suddenly rises is prevented.
Description
Technical Field
The present application relates to the field of electronic device technologies, and in particular, to a temperature control method and an electronic device.
Background
Along with the gradual improvement of the life quality of people, the demand of people on electronic equipment is strong. At present, because the weather is sultry when summer, the air conditioner all can be opened in the room usually, indoor outer difference in temperature is great, when the user carries electronic equipment to walk out the room and arrive when outdoor, the external environment's that electronic equipment is located temperature risees suddenly, the vapor that is floating in the outdoor air, when meetting the lower electronic equipment of temperature, can take place liquefaction phenomenon on the surface of electronic equipment's casing, thereby can condense the small drop of water of one deck on the surface of casing, thereby cause its surface to appear greasy sensation, the experience of user when this electronic equipment of handheld is not good.
Thus, the related art of the existing electronic devices still needs to be improved.
Disclosure of Invention
In one aspect of the present application, a method of temperature control is provided. The temperature control method is applied to electronic equipment, and comprises the following steps: acquiring a first ambient temperature of the electronic equipment at a first position through a temperature sensor; acquiring a second ambient temperature of the electronic equipment at a second position through a temperature sensor; controlling, by a processor, a housing of the electronic device to warm up when a difference between the second ambient temperature and the first ambient temperature exceeds a first predetermined threshold. By the temperature control method, the shell of the electronic equipment can be controlled to be heated up when the temperature of the external environment where the electronic equipment is located changes suddenly, so that the phenomenon that water vapor is liquefied on the surface of the electronic equipment when the temperature of the external environment rises suddenly is prevented, the surface of the electronic equipment is greasy, and the experience of holding the electronic equipment by hand is poor.
In another aspect of the present application, an electronic device is provided. The electronic device includes: a housing; the first temperature detector is used for acquiring a first environment temperature and a second environment temperature of the shell; a position detector for acquiring position information of the housing; the processor is electrically connected with the first temperature detector, the position detector and the temperature regulator, and is used for controlling the temperature of the shell of the electronic equipment to rise according to the difference value of the first environment temperature and the second environment temperature. The temperature control device can control the electronic equipment shell to heat up when the temperature of the external environment where the electronic equipment shell is located changes suddenly, so that the phenomenon that water vapor is liquefied on the surface of the electronic equipment shell when the temperature of the external environment rises suddenly is prevented, the surface of the electronic equipment shell feels greasy, and the experience when the electronic equipment shell is held by hands is poor.
Drawings
Fig. 1 shows a schematic flow diagram of a temperature control method of the present application.
Fig. 2 shows a schematic flow diagram of another temperature control method of the present application.
Fig. 3 shows a schematic flow diagram of yet another temperature control method of the present application.
Fig. 4 shows a flow chart of a temperature control method according to a specific example of the present application.
Detailed Description
In one aspect of the present application, a method of temperature control is provided. With reference to fig. 1, it can be understood that the temperature control method may specifically include the following steps:
s100: the first ambient temperature when the electronic device is located at the first position is obtained by a temperature sensor (in the description of the present application, it is to be understood that the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of indicated technical features.
Specifically, it is understood that the first ambient temperature may refer to an ambient temperature of the electronic device housing at any position and under any condition, and at this time, the position, the external condition, and the environment of the electronic device housing are not particularly limited, and as long as the electronic device housing is in a certain external environment, the first ambient temperature may be obtained.
Specifically, it can be understood that the temperature sensor may adopt a conventional temperature sensor in the related art, and the specific type and the like thereof are not particularly limited as long as the first ambient temperature can be obtained, and are not described in detail herein.
S200: and acquiring a second ambient temperature of the electronic equipment at a second position through the temperature sensor.
Specifically, it can be understood that the obtaining of the second environment temperature may also be performed by the temperature sensor described above, that is, the same temperature sensor may be used for obtaining the first environment temperature and the second environment temperature, and as described above, the temperature sensor may be a conventional temperature sensor in the related art, and specific models and the like thereof are not particularly limited as long as the second environment temperature can be obtained, and are not described in detail herein.
S300: when the difference value between the second environment temperature and the first environment temperature exceeds a first preset threshold value, controlling the electronic device shell to be heated.
Specifically, it can be understood that, by the foregoing, the change of the external environment temperature of the electronic device has been acquired, after the above temperature change information is acquired, it is determined whether the difference between the second environment temperature and the first environment temperature exceeds a first predetermined threshold, and when the difference between the second environment temperature and the first environment temperature exceeds the first predetermined threshold, the temperature of the casing of the electronic device is controlled to be raised by the processor. Therefore, the temperature control method can control the shell of the electronic equipment to be heated up when the temperature of the external environment where the electronic equipment is located changes suddenly, so that the phenomenon that water vapor is liquefied on the surface of the electronic equipment when the temperature of the external environment rises suddenly is prevented, the surface of the electronic equipment is greasy, and the experience of holding the electronic equipment by hand is poor.
Specifically, it may be understood that a specific manner of determining whether the difference between the second ambient temperature and the first ambient temperature exceeds a first predetermined threshold may be performed by a processor, and it may be understood that, after the temperature change information is obtained, the temperature sensor may send the first ambient temperature and the second ambient temperature to the processor, and the processor determines whether the difference between the second ambient temperature and the first ambient temperature exceeds the first predetermined threshold.
Specifically, it is understood that the processor may be a processor of a type conventional in the related art, such as a CPU, and may be electrically connected to the temperature sensor, so that the temperature sensor transmits the first ambient temperature and the second ambient temperature to the processor; in addition, the processor is also electrically connected with the position detector, so that the position detector sends the position information of the first position and the second position to the processor.
Specifically, it can be understood that if the difference between the second ambient temperature and the first ambient temperature exceeds a first predetermined threshold, it is proved that the temperature of the external environment where the electronic device is located suddenly changes, and the temperature of the electronic device housing is controlled to rise, so as to prevent the above-mentioned disadvantages.
In particular, it is understood that the first predetermined threshold may be set according to practical situations, and in some examples of the present application, may be not less than 8 ℃. In some more specific examples of the present application, the first predetermined threshold may be set to 8 ℃, 9 ℃, or 10 ℃, or the like. Therefore, the first preset threshold is set properly, and when the difference between the first environment temperature and the second environment temperature is large enough, the electronic device shell is controlled to execute the operation, namely, the temperature of the electronic device shell is controlled to rise, so that misjudgment cannot occur, heating resources are wasted, and the environment-friendly effect is achieved.
Specifically, it can be understood that, when the first predetermined threshold is less than or equal to 20 ℃, the electronic device casing is heated with the first heating power to control the temperature of the electronic device casing to increase, so as to prevent the surface of the electronic device from liquefying water vapor when the temperature of the external environment suddenly increases, thereby causing a greasy feeling on the surface of the electronic device.
Further, when the first predetermined threshold is less than or equal to 20 ℃ and the second ambient temperature is lower than-30 ℃, heating the electronic device shell by using second heating power to control the temperature of the electronic device shell to rise, wherein the second heating power is greater than the first heating power. Therefore, when the electronic equipment is carried by a user to go out of a room and reach the outside of the room, the temperature of the external environment where the electronic equipment is located suddenly drops, and cold air is conducted from the external environment to the inside of various electronic elements and batteries in the electronic equipment through the shell, so that the electronic elements and the batteries cannot normally work, the electronic equipment is halted or automatically shut down, the electronic equipment is heated by adopting the second heating power with larger heating power, the temperature of the shell of the electronic equipment is controlled to rise, and the electronic equipment can be prevented from being halted or the automatic shutdown is poor.
Specifically, it can be understood that the first heating power and the second heating power may be set according to actual needs, as long as the second heating power is greater than the first heating power, and specific numerical ranges thereof are not described herein in detail.
Specifically, it is understood that the specific manner of heating the electronic device housing by using the different first heating power and the different second heating power is not particularly limited, and in some examples of the present application, the above-mentioned heating of the electronic device housing by using the different first heating power and the different second heating power can be realized by changing the setting of the aforementioned temperature regulator.
Further, with reference to fig. 2, it can be understood that after the step of controlling the temperature rise of the casing of the electronic device, the method may further include the steps of:
s400: and acquiring the temperature of the shell in real time.
Specifically, it is understood that the temperature of the housing may refer to the temperature of the housing itself at a certain time, and at this time, the position, the external condition, and the environment of the housing are not particularly limited, and as long as the housing is an electronic device housing which actually exists, the temperature of the housing can be obtained.
Specifically, it can be understood that a manner of acquiring the temperature of the housing in real time is not particularly limited, and in some examples of the application, the manner of acquiring the temperature of the housing in real time may be performed by using a temperature sensor, and the temperature sensor may be a conventional temperature sensor in the related art, and a specific model and the like of the conventional temperature sensor are not particularly limited, as long as the real-time temperature of the housing of the electronic device can be acquired, and therefore, redundant description is not repeated here.
S500: and judging whether the difference value between the temperature of the shell and the second environment temperature is smaller than a second preset threshold value.
Specifically, it may be understood that the specific manner of determining whether the difference between the temperature of the housing and the second ambient temperature is smaller than the second predetermined threshold may be performed by a processor, and it may be understood that, after the difference between the real-time temperature and the second ambient temperature is obtained, the temperature sensor sends the difference to the processor, and the processor determines whether the difference between the temperature of the housing and the second ambient temperature is smaller than the second predetermined threshold.
In particular, it is understood that the processor may be the same processor as the aforementioned processor or a different processor, and the processor is electrically connected to the temperature sensor, so that the second temperature detector sends the difference between the temperature of the housing and the second ambient temperature to the processor.
S600: and when the difference value between the temperature of the shell and the second ambient temperature is smaller than the second preset threshold value, stopping controlling the shell to be heated.
Specifically, it is understood that if the difference between the temperature of the housing and the second ambient temperature is less than the second predetermined threshold, the difference between the temperature of the electronic device itself and the temperature of the external environment where the electronic device is located is not great, and the control of the temperature rise of the housing of the electronic device may be stopped, and at this time, the electronic device may perform normal heat exchange with the external environment through contact with the air of the external environment, heat radiation, and the like.
Specifically, it can be understood that the second predetermined threshold may be set according to an actual situation, and a specific value thereof may be flexibly selected by a person skilled in the art according to an actual need, which is not described herein in detail. Therefore, the second preset threshold which is more appropriate is selected, and when the difference between the temperature of the shell and the second ambient temperature is small enough, the shell of the electronic device is stopped to be controlled to be heated, so that misjudgment cannot occur, and the surface of the electronic device is greasy or the electronic device is halted or automatically shut down; meanwhile, when the difference value between the temperature of the shell and the second ambient temperature is smaller than the second preset threshold value, the shell is stopped to be controlled to be heated, resources can be saved, the shell cannot be heated all the time, the temperature of the electronic equipment is prevented from being too high, and therefore the defects caused by overheating of electrical elements in the electronic equipment are prevented.
Further, with reference to fig. 3, it can be understood that after the step of determining whether the difference between the temperature of the housing and the second ambient temperature is less than the second predetermined threshold, the method may further include the steps of:
s700: and adjusting and controlling the heating rate of the electronic equipment shell according to the difference between the temperature of the shell and the second ambient temperature.
In particular, it is understood that when the difference between the temperature of the housing and the second ambient temperature is small, the rate of controlling the temperature rise of the housing of the electronic device may be made higher, thereby making the difference between the temperature of the housing and the second ambient temperature smaller than the second predetermined threshold more quickly; when the temperature of casing with difference between the second ambient temperature is less, can be so that control the rate that electronic equipment's casing heaied up is lower, can make in short predetermined time the temperature of casing with difference between the second ambient temperature is less than the predetermined threshold value of second, and then stop control electronic equipment's casing heaies up.
Specifically, it can be understood that the predetermined time may be set according to actual conditions, and specific values thereof may be flexibly selected by those skilled in the art according to actual needs, and will not be described in detail herein.
Specifically, it is understood that the specific manner of adjusting the rate of controlling the temperature rise of the casing of the electronic device is not particularly limited, and will not be described in detail herein.
In another aspect of the present application, an electronic device is provided. The temperature control device includes: a housing; the first temperature detector is used for acquiring a first environment temperature and a second environment temperature of the shell; the position detector is used for acquiring position information of the electronic equipment shell; the processor is electrically connected with the first temperature detector, the position detector and the temperature regulator, and is used for controlling the temperature of the shell of the electronic equipment to rise according to the difference value of the first environment temperature and the second environment temperature. When the temperature of the external environment where the electronic equipment is located changes suddenly, the phenomenon that the temperature of the external environment rises suddenly can be prevented, the surface of the electronic equipment is liquefied by water vapor, the surface of the electronic equipment is greasy, and the experience when the electronic equipment is held by hands is poor.
Further, it is understood that the temperature control device may further include: and the second temperature detector is used for acquiring the temperature of the shell in real time, and the processor is also used for judging whether the difference value between the real-time temperature and the second ambient temperature is smaller than a second preset threshold value. The specific arrangement of the second temperature detector is the same as that of the temperature control method described above, and therefore, redundant description is omitted here.
Further, it can be understood that the first temperature detector and the second temperature detector may be temperature sensors used in the description of the temperature control method, and are not described in detail herein.
Specifically, it is understood that the position information of the electronic device housing may refer to the aforementioned first position and second position.
Specifically, it can be understood that a manner of obtaining the location information of the electronic device housing is not particularly limited, in some examples of the application, the manner of obtaining the location information of the electronic device housing may be performed by a location detector disposed on the electronic device housing, and the location detector may adopt a location detector that is conventional in the related art, such as a GPS positioning system, and specific settings thereof are not particularly limited as long as the location information of the electronic device housing can be obtained, and are not described in detail herein.
Further, it is understood that the shell may also contain at least one of lead oxide or barium oxide. From this, through above-mentioned mode of setting up, can be so that the specific heat capacity of casing self is less, thereby further make electronic equipment can realize and external environment between quick heat exchange, and then when further preventing external environment's temperature from rising suddenly, the liquefaction phenomenon of vapor appears in this electronic equipment's surface, causes the greasy sense on its surface, and the experience when handing this electronic equipment is not good.
In one specific example of the present application, with reference to fig. 4, it can be appreciated that a first temperature detector obtains a first ambient temperature when the electronic device is in a first position; and a second ambient temperature when the electronic device is located at the second location; then the first temperature detector sends the first environmental temperature and the second environmental temperature which are obtained by the first temperature detector to the processor, the position detector also sends the position information of the first position and the second position which are obtained by the position detector to the processor, the processor judges whether the difference value between the second environmental temperature and the first environmental temperature exceeds a first preset threshold value, and when the difference value between the second environmental temperature and the first environmental temperature exceeds the first preset threshold value, the temperature of the shell of the electronic equipment is controlled to rise through the processor. And after that, the second temperature detector acquires the temperature of the shell in real time and sends the temperature of the shell to the processor, the processor judges whether the difference value between the temperature of the shell and the second ambient temperature is smaller than a second preset threshold value, and when the difference value between the temperature of the shell and the second ambient temperature is smaller than the second preset threshold value, the temperature of the shell is stopped to be controlled to rise.
It is understood that the electronic device may include other necessary structures and components besides the aforementioned structures, and those skilled in the art can supplement and design the electronic device according to the specific kind and use requirement of the electronic device, and will not be described in detail herein.
Although embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present application, and that variations, modifications, substitutions and alterations may be made to the above embodiments by those of ordinary skill in the art within the scope of the present application.
Claims (10)
1. A temperature control method is applied to electronic equipment and is characterized by comprising the following steps:
acquiring a first ambient temperature of the electronic equipment at a first position through a temperature sensor;
acquiring a second ambient temperature of the electronic equipment at a second position through a temperature sensor;
controlling, by a processor, a housing of the electronic device to warm up when a difference between the second ambient temperature and the first ambient temperature exceeds a first predetermined threshold.
2. The method according to claim 1, further comprising, after the step of controlling the temperature rise of the casing of the electronic device:
acquiring the temperature of the shell in real time;
determining whether a difference between the temperature of the housing and the second ambient temperature is less than a second predetermined threshold;
and when the difference value between the temperature of the shell and the second ambient temperature is smaller than the second preset threshold value, stopping controlling the shell to be heated.
3. The temperature control method of claim 2, further comprising, after the step of determining whether the difference between the temperature of the housing and the second ambient temperature is less than a second predetermined threshold:
and adjusting and controlling the heating rate of the shell according to the difference between the temperature of the shell and the second ambient temperature.
4. The method of claim 3, wherein the rate of heating the housing is adjusted and controlled based on a difference between the temperature of the housing and the second ambient temperature such that the difference between the real-time temperature and the second ambient temperature is less than the first predetermined threshold for a predetermined time.
5. The temperature control method according to claim 1, wherein the first predetermined threshold is not less than 8 ℃.
6. The temperature control method according to claim 5, wherein when the first predetermined threshold is less than or equal to 20 ℃, the case is heated with a first heating power to control the case to be warmed up.
7. The method according to claim 6, wherein when the first predetermined threshold is greater than 20 ℃ and the second ambient temperature is less than-30 ℃, the housing is heated with a second heating power to control the housing to warm up, wherein the second heating power is greater than the first heating power.
8. An electronic device, comprising:
a housing;
the first temperature detector is used for acquiring a first environment temperature and a second environment temperature of the shell;
a position detector for acquiring position information of the housing;
the processor is electrically connected with the first temperature detector, the position detector and the temperature regulator, and is used for controlling the temperature of the shell of the electronic equipment to rise according to the difference value of the first environment temperature and the second environment temperature.
9. The electronic device of claim 8, further comprising:
and the second temperature detector is used for acquiring the temperature of the shell in real time, and the processor is also used for judging whether the difference value between the temperature of the shell and the second ambient temperature is smaller than a second preset threshold value.
10. The electronic device of claim 8, wherein the housing contains at least one of lead oxide or barium oxide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011496401.2A CN112596556A (en) | 2020-12-17 | 2020-12-17 | Temperature control method and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011496401.2A CN112596556A (en) | 2020-12-17 | 2020-12-17 | Temperature control method and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112596556A true CN112596556A (en) | 2021-04-02 |
Family
ID=75196681
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011496401.2A Pending CN112596556A (en) | 2020-12-17 | 2020-12-17 | Temperature control method and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112596556A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070109441A1 (en) * | 2005-11-15 | 2007-05-17 | Yi-Jen Cheng | Defogging device for a surveillance camera |
| CN205193381U (en) * | 2015-11-26 | 2016-04-27 | 浙江大学 | Automatic defogging glasses based on heating of heating wire intelligence |
| CN105554928A (en) * | 2015-12-04 | 2016-05-04 | 上海斐讯数据通信技术有限公司 | Screen defogging method, system and device for mobile terminal |
| CN110715415A (en) * | 2019-10-23 | 2020-01-21 | 广东美的制冷设备有限公司 | Control method and device of air conditioning equipment and air conditioning equipment |
| CN111562803A (en) * | 2020-06-12 | 2020-08-21 | 西安易朴通讯技术有限公司 | Electronic device, temperature controller, temperature control method, device, and storage medium |
-
2020
- 2020-12-17 CN CN202011496401.2A patent/CN112596556A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070109441A1 (en) * | 2005-11-15 | 2007-05-17 | Yi-Jen Cheng | Defogging device for a surveillance camera |
| CN205193381U (en) * | 2015-11-26 | 2016-04-27 | 浙江大学 | Automatic defogging glasses based on heating of heating wire intelligence |
| CN105554928A (en) * | 2015-12-04 | 2016-05-04 | 上海斐讯数据通信技术有限公司 | Screen defogging method, system and device for mobile terminal |
| CN110715415A (en) * | 2019-10-23 | 2020-01-21 | 广东美的制冷设备有限公司 | Control method and device of air conditioning equipment and air conditioning equipment |
| CN111562803A (en) * | 2020-06-12 | 2020-08-21 | 西安易朴通讯技术有限公司 | Electronic device, temperature controller, temperature control method, device, and storage medium |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8042352B2 (en) | Control method and device for an air conditioning economizer system | |
| US20120248207A1 (en) | Wireless control of a heating or cooling unit | |
| WO2019223301A1 (en) | Air conditioner control method and control device and air conditioner using the method | |
| US20100065245A1 (en) | Air conditioning system | |
| US10353369B2 (en) | HVAC system detecting user discomfort | |
| CN110553347B (en) | Control method and system for delaying frosting, storage medium and air conditioner | |
| CN107676938B (en) | Air conditioner control method and device, electronic equipment and computer readable storage medium | |
| JP2010175229A (en) | Air conditioning controller | |
| CN108644968B (en) | Control method for air conditioning system | |
| CN108036471B (en) | Dehumidification control method for air conditioner | |
| CN110145837B (en) | Air conditioner and control method thereof | |
| CN107975915B (en) | Control method and device of air conditioner and computer readable storage medium | |
| JP2017032156A (en) | Air conditioner and control method | |
| JP2018054206A (en) | Indoor environment adjustment system | |
| JP2023181510A (en) | air conditioning system | |
| CN108592353B (en) | Control method for air conditioning system | |
| CN108826599B (en) | Control method for air conditioning system | |
| CN113357770A (en) | Control method and control device for air conditioner and air conditioner | |
| CN111002783A (en) | Control method for vehicle air conditioner, vehicle air conditioner and vehicle | |
| CN112596556A (en) | Temperature control method and electronic device | |
| CN111023523A (en) | Air conditioner control method and device, air conditioner and storage medium | |
| US20230375211A1 (en) | Air conditioner | |
| CN110864402B (en) | Air conditioner, air conditioner control method based on cold and heat feeling detection and storage medium | |
| CN110296497A (en) | The system and method for connecting the HVAC health monitoring of family | |
| CN111947225A (en) | Multifunctional heater control method and device, multifunctional heater and storage medium |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210402 |
|
| RJ01 | Rejection of invention patent application after publication |