CN112596118A - Optical proximity sensor module - Google Patents
Optical proximity sensor module Download PDFInfo
- Publication number
- CN112596118A CN112596118A CN202011538976.6A CN202011538976A CN112596118A CN 112596118 A CN112596118 A CN 112596118A CN 202011538976 A CN202011538976 A CN 202011538976A CN 112596118 A CN112596118 A CN 112596118A
- Authority
- CN
- China
- Prior art keywords
- cavity
- chip
- proximity sensor
- collector
- optical proximity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 18
- 239000002390 adhesive tape Substances 0.000 claims abstract description 31
- 238000009434 installation Methods 0.000 claims abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 239000011889 copper foil Substances 0.000 claims description 10
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 8
- 241000218202 Coptis Species 0.000 claims description 4
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 4
- 230000005540 biological transmission Effects 0.000 claims 5
- 238000000034 method Methods 0.000 abstract description 9
- 239000003292 glue Substances 0.000 abstract description 8
- 230000006698 induction Effects 0.000 abstract description 3
- 230000004888 barrier function Effects 0.000 abstract 3
- 230000008054 signal transmission Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 description 8
- 239000000945 filler Substances 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000001746 injection moulding Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
- G01V8/00—Prospecting or detecting by optical means
- G01V8/10—Detecting, e.g. by using light barriers
- G01V8/12—Detecting, e.g. by using light barriers using one transmitter and one receiver
Landscapes
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Life Sciences & Earth Sciences (AREA)
- General Physics & Mathematics (AREA)
- Geophysics (AREA)
- Geophysics And Detection Of Objects (AREA)
Abstract
The invention discloses an optical proximity sensor module, which comprises a support plate, an adhesive tape and a single module, wherein the adhesive tape is installed at the upper end of the support plate, the single module is arranged on the outer wall of the support plate, a glue block is installed on the single module, a filling hole is formed in one side of the glue block, and sliding tangent lines are arranged at the lower ends of the glue block and the filling hole. This light proximity sensor module, glue the piece be an independent space all around, can put required LED chip in the inside, induction element and receiving device, installation emission chip in the first cavity, arouse infrared chip through loading current, emission signal is from the window signals of first cavity top, when not meetting the barrier, the signal can not refract back, when infrared signal meets the barrier, signal transmission arouses the receiving chip of first cavity, the realization meets the photoelectric sensing process of barrier, chip signals is just paused, when the device light source is sheltered from, the chip is just the signals.
Description
Technical Field
The invention relates to the technical field of optical proximity sensor modules, in particular to an optical proximity sensor module.
Background
In its broadest definition, a sensor is a device, module or subsystem whose purpose is to detect events or changes in the environment and to transmit information to other electronic devices, typically computer processors. Sensors are always used with other electronic devices, a sensor being a device or apparatus which can sense a predetermined measured object and convert it into a usable signal according to a certain rule, usually consisting of a sensing element and a converting element, and a measuring apparatus which converts the measured object into a certain physical quantity in a certain relation with a certain accuracy and which is convenient for application.
The existing optical proximity sensor has low precision, the signal emission is often abnormal, the signal is not refracted or the signal is abnormally refracted, and the user experience is greatly reduced.
Disclosure of Invention
The invention aims to provide an optical proximity sensor module, wherein an emitting chip is arranged in a first cavity, an infrared chip is excited by loading current, an emitting signal sends out a signal from a window above the first cavity, the signal cannot be refracted back when no obstacle is encountered, when the infrared signal encounters an obstacle, the signal is emitted to excite a receiving chip of the first cavity, the photoelectric sensing process of encountering the obstacle is realized, when a light source is received by a device, the signal sent by the chip is suspended, when the light source of the device is shielded, the chip sends out the signal, and the problems in the prior art can be solved.
In order to achieve the purpose, the invention provides the following technical scheme:
an optical proximity sensor module comprises a support plate, an adhesive tape and a single module, wherein the adhesive tape is installed at the upper end of the support plate, the single module is arranged on the outer wall of the support plate, a rubber block is installed on the single module, a filling hole is formed in one side of the rubber block, and sliding tangent lines are arranged at the lower ends of the rubber block and the filling hole;
the single module comprises a first cavity, a second cavity, a third cavity, a fourth cavity, a receiving chip, a copper foil, a collector, a transmitter, a first gold thread, a transmitting chip, a transmitting negative electrode, a transmitting positive electrode and a second gold thread, the single module is connected with the first cavity all around, the second cavity, the third cavity and one end of the fourth cavity, one side of the upper end of the single module is connected with one end of the collector, the other end of the collector is connected with one end of the copper foil, the other end of the copper foil is connected with the receiving chip, the transmitter is installed on the other side of the upper end of the single module, the transmitter is connected with the receiving chip through the first gold thread, one side of the lower end of the single module is connected with one end of the transmitting negative electrode, the other end of the transmitting negative electrode is connected with the transmitting chip, the transmitting positive electrode is installed on.
Preferably, the upper end of the carrier plate is provided with a plurality of groups of adhesive tapes, and the gap between each group of adhesive tapes is 0.5 mm.
Preferably, a plurality of groups of single modules are arranged on the carrier plate, and each group of single modules are separated by a sliding cutting line.
Preferably, the single die sets are separated by the sliding cut lines to form a cavity of 2.0 x 1.6 x 0.72.
Preferably, the collector and the emitter are located on the same horizontal line, the transverse distance between the collector and the emitter is 7mm, and the vertical span between the collector and the emitter is 0.55 mm.
Preferably, the type of the transmitting chip is 940.
Preferably, the distance between the collector and the emitting cathode is 2.1 mm.
Compared with the prior art, the invention has the following beneficial effects:
the optical proximity sensor module comprises a carrier plate, adhesive tapes arranged at the upper end of the carrier plate, wherein a plurality of groups of adhesive tapes are arranged, the gap between each group of adhesive tapes is 0.5mm, each adhesive tape is cut into an island shape by a blade with the width of 0.5mm, the carrier plate and the adhesive tapes are filled by a special compression mold in an injection molding way, fillers are special lightproof black materials, each adhesive tape is separated by the black filling materials and is independent of each other and not interfered by the black filling materials, an independent space is formed around the adhesive block, a required LED chip, a sensing device and a receiving device can be placed in the adhesive block, a transmitting chip is arranged in a first cavity, an infrared chip is excited by loading current, a transmitting signal sends out from a window above the first cavity, the signal can not be refracted back when the infrared signal meets an obstacle, the signal is emitted to excite the receiving chip of the first cavity when the infrared signal meets the obstacle, and the photoelectric sensing process, when the device receives the light source, the chip sends out signals and then pauses, and when the light source of the device is shielded, the chip sends out signals.
Drawings
FIG. 1 is a front elevational view of the overall construction of the present invention;
FIG. 2 is a side view of the overall structure of the present invention;
FIG. 3 is a left side view of the overall structure of the present invention;
FIG. 4 is a top view of the overall structure of the present invention;
FIG. 5 is an exploded view of a single module of the present invention.
In the figure: 1. a carrier plate; 101. gluing blocks; 102. filling holes; 103. sliding a tangent line; 2. an adhesive tape; 3. a single die set; 301. a first cavity; 302. a second cavity; 303. a third cavity; 304. a fourth cavity; 305. a receiving chip; 306. copper foil; 307. a collector; 308. a transmitter; 309. a first gold wire; 310. a transmitting chip; 311. an emission cathode; 312. an emission anode; 313. and a second gold wire.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-5, an optical proximity sensor module comprises a carrier plate 1, adhesive tapes 2 and single modules 3, wherein the adhesive tapes 2 are mounted on the upper end of the carrier plate 1, the adhesive tapes 2 are provided with a plurality of groups, the gap between each group of adhesive tapes 2 is 0.5mm, the adhesive tapes 2 are cut into an island shape by a 0.5mm wide blade, the carrier plate 1 and the adhesive tapes 2 are injection-molded and filled by a special pressing mold, the filler is a special opaque black material, each adhesive tape 2 is separated by a black filler material, are independent from each other and are not interfered by the black filler material, the single modules 3 are arranged on the outer wall of the carrier plate 1, the carrier plate 1 is provided with a plurality of groups of single modules 3, each group of single modules 3 is separated by a sliding tangent line 103, a cavity of 2.0 x 1.6 x 0.72 is formed after the single modules 3 are separated by the sliding tangent line 103, the single modules 3 are provided with adhesive blocks 101, required LED chips, induction devices and receiving devices can be placed in the glue block 101, a filling hole 102 is formed in one side of the glue block 101, a sliding tangent line 103 is arranged at the lower ends of the glue block 101 and the filling hole 102, and the middle of the filling hole 102 is filled with ink, so that glue leakage to the back side can be prevented.
Wherein the single module 3 comprises a first cavity 301, a second cavity 302, a third cavity 303, a fourth cavity 304, a receiving chip 305, a copper foil 306, a collector 307, an emitter 308, a first gold wire 309, an emitting chip 310, an emitting cathode 311, an emitting anode 312 and a second gold wire 313, the periphery of the single module 3 is connected with one end of the first cavity 301, the second cavity 302, the third cavity 303 and the fourth cavity 304, the emitting chip 310 is arranged in the first cavity 301, the infrared chip is excited by loading current, the emitted signal emits a signal from a window above the first cavity 301, when the signal does not encounter an obstacle, the signal can not be refracted back, when the infrared signal encounters the obstacle, the signal is emitted to excite the receiving chip of the first cavity 301, so as to realize the photoelectric induction process of encountering the obstacle, one side of the upper end of the single module 305 is connected with one end of the collector 307, the other end of the collector 307 is connected with one end of the copper foil 306, the other end of the copper foil 306 is connected with the receiving chip 305, the other side of the upper end of the single module 3 is provided with the emitter 308, the collector 307 and the emitter 308 are positioned on the same horizontal line, the distance between the collector 307 and the emitting negative electrode 311 is 2.1mm, the transverse distance between the collector 307 and the emitter 308 is 1.7mm, the vertical span between the collector 307 and the emitter 308 is 0.55mm, the emitter 308 is connected with the receiving chip 305 through a first gold wire 309, one side of the lower end of the single module 3 is connected with one end of the emitting negative electrode 311, the other end of the emitting negative electrode 311 is connected with the emitting chip 310, the emitting chip 310 is 940 in model, the other end of the lower end of the single module 3 is provided with an emitting positive electrode 312, and the emitting positive electrode 312 is connected with the.
In summary, in the optical proximity sensor module, the adhesive tape 2 is mounted on the upper end of the carrier board 1, the adhesive tape 2 is provided with a plurality of groups, the gap between each group of adhesive tapes 2 is 0.5mm, the adhesive tapes 2 are cut into an island shape by a blade with a width of 0.5mm, the carrier board 1 and the adhesive tapes 2 are filled by injection molding of a special pressing mold, the filler is a special opaque black material, each adhesive tape 2 is separated by the black filler material and is independent from each other without interference, the periphery of the adhesive block 101 is an independent space in which required LED chips, sensing devices and receiving devices can be placed, a transmitting chip 310 is mounted in the first cavity 301, an infrared chip is excited by loading current, a transmitting signal is emitted from a window above the first cavity 301, when the infrared signal does not encounter an obstacle, the signal is not refracted back, when the infrared signal encounters the obstacle, the signal is emitted to excite the receiving chip 305 of the first cavity 301, the photoelectric sensing process of meeting the obstacle is realized.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides an optical proximity sensor module, includes support plate (1), adhesive tape (2) and single module (3), its characterized in that: the upper end of the carrier plate (1) is provided with an adhesive tape (2), the outer wall of the carrier plate (1) is provided with a single module (3), a rubber block (101) is arranged on the single module (3), one side of the rubber block (101) is provided with a filling hole (102), and the lower ends of the rubber block (101) and the filling hole (102) are provided with a sliding tangent line (103);
the single module (3) comprises a first cavity (301), a second cavity (302), a third cavity (303), a fourth cavity (304), a receiving chip (305), a copper foil (306), a collector (307), an emitter (308), a first gold wire (309), an emitting chip (310), an emitting cathode (311), an emitting anode (312) and a second gold wire (313), the periphery of the single module (3) is connected with one end of the first cavity (301), the second cavity (302), the third cavity (303) and one end of the fourth cavity (304), one side of the upper end of the single module (3) is connected with one end of the collector (307), the other end of the collector (307) is connected with one end of the copper foil (306), the other end of the copper foil (306) is connected with the receiving chip (305), the emitter (308) is installed on the other side of the upper end of the single module (3), and the receiving chip (305) are connected through the first gold wire (309), single module (3) lower extreme one side links to each other with transmission negative pole (311) one end, and transmission negative pole (311) other end links to each other with transmission chip (310), and anodal (312) are launched in single module (3) lower extreme other end installation, and transmission anodal (312) link to each other through second gold thread (313) with transmission chip (310).
2. The optical proximity sensor module as recited in claim 1, wherein: the upper end of the carrier plate (1) is provided with adhesive tapes (2), the adhesive tapes (2) are provided with a plurality of groups, and the gap between each group of adhesive tapes (2) is 0.5 mm.
3. The optical proximity sensor module as recited in claim 1, wherein: the carrier plate (1) is provided with a plurality of groups of single modules (3), and each group of single modules (3) are separated by a sliding tangent line (103).
4. The optical proximity sensor module as recited in claim 3, wherein: the single die sets (3) are separated by a sliding tangent (103) to form a cavity of 2.0 x 1.6 x 0.72.
5. The optical proximity sensor module as recited in claim 1, wherein: the collector (307) and the emitter (308) are located on the same horizontal line, the transverse distance between the collector (307) and the emitter (308) is 1.7mm, and the vertical span between the collector (307) and the emitter (308) is 0.55 mm.
6. The optical proximity sensor module as recited in claim 1, wherein: the type of the transmitting chip (310) is 940.
7. The optical proximity sensor module as recited in claim 1, wherein: the distance between the collector (307) and the emitting cathode (311) is 2.1 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011538976.6A CN112596118B (en) | 2020-12-23 | 2020-12-23 | Optical proximity sensor module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011538976.6A CN112596118B (en) | 2020-12-23 | 2020-12-23 | Optical proximity sensor module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112596118A true CN112596118A (en) | 2021-04-02 |
| CN112596118B CN112596118B (en) | 2024-05-10 |
Family
ID=75200404
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011538976.6A Active CN112596118B (en) | 2020-12-23 | 2020-12-23 | Optical proximity sensor module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112596118B (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1387186A1 (en) * | 2002-07-29 | 2004-02-04 | Siemens Aktiengesellschaft | Optoelectronic device for optical detection of an object |
| CN202150845U (en) * | 2011-05-25 | 2012-02-22 | 上海第二工业大学 | Low-cost optoelectronic switch |
| CN108020846A (en) * | 2018-01-15 | 2018-05-11 | 上海兰宝传感科技股份有限公司 | A kind of the sensor obstacle avoidance system and method in detectable barrier orientation |
| CN109743419A (en) * | 2018-12-27 | 2019-05-10 | 维沃移动通信有限公司 | Infrared sensor structure, display screen structure and terminal |
| CN209280949U (en) * | 2019-02-20 | 2019-08-20 | 深圳市烁讯电子有限公司 | Sensor module based on infrared proximity photoinduction |
| CN110753140A (en) * | 2019-09-30 | 2020-02-04 | 华为技术有限公司 | Terminal, lamp shade and ambient light approach module |
| CN110888178A (en) * | 2019-11-29 | 2020-03-17 | 北京小米移动软件有限公司 | Proximity detection circuit and terminal device |
| CN111158138A (en) * | 2020-02-26 | 2020-05-15 | 京东方科技集团股份有限公司 | Display module and display device |
| CN214704039U (en) * | 2020-12-23 | 2021-11-12 | 东莞市亿晶源光电科技有限公司 | Optical proximity sensor module |
-
2020
- 2020-12-23 CN CN202011538976.6A patent/CN112596118B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1387186A1 (en) * | 2002-07-29 | 2004-02-04 | Siemens Aktiengesellschaft | Optoelectronic device for optical detection of an object |
| CN202150845U (en) * | 2011-05-25 | 2012-02-22 | 上海第二工业大学 | Low-cost optoelectronic switch |
| CN108020846A (en) * | 2018-01-15 | 2018-05-11 | 上海兰宝传感科技股份有限公司 | A kind of the sensor obstacle avoidance system and method in detectable barrier orientation |
| CN109743419A (en) * | 2018-12-27 | 2019-05-10 | 维沃移动通信有限公司 | Infrared sensor structure, display screen structure and terminal |
| CN209280949U (en) * | 2019-02-20 | 2019-08-20 | 深圳市烁讯电子有限公司 | Sensor module based on infrared proximity photoinduction |
| CN110753140A (en) * | 2019-09-30 | 2020-02-04 | 华为技术有限公司 | Terminal, lamp shade and ambient light approach module |
| CN110888178A (en) * | 2019-11-29 | 2020-03-17 | 北京小米移动软件有限公司 | Proximity detection circuit and terminal device |
| CN111158138A (en) * | 2020-02-26 | 2020-05-15 | 京东方科技集团股份有限公司 | Display module and display device |
| CN214704039U (en) * | 2020-12-23 | 2021-11-12 | 东莞市亿晶源光电科技有限公司 | Optical proximity sensor module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112596118B (en) | 2024-05-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN214704039U (en) | Optical proximity sensor module | |
| CN208013385U (en) | A kind of photoelectric detection system of lithium battery bulge | |
| CN104661590A (en) | Biosensor and method for manufacturing biosensor | |
| US20150028357A1 (en) | Package structure of an optical module | |
| CN112310126B (en) | Optical distance sensing module, processing method thereof and electronic equipment | |
| CN106772699B (en) | Rainfall detection system and rainfall state detection method and device | |
| TWI738145B (en) | Optical sensor for distance measurement and manufacturing method thereof | |
| CN112596118A (en) | Optical proximity sensor module | |
| CN108932024A (en) | A kind of mobile terminal | |
| JP2015026799A (en) | Optical module and manufacturing method of the same | |
| CN213309700U (en) | Wearable intelligent device | |
| CN209134380U (en) | A kind of Photoelectric infrared switch being convenient for installation | |
| CN211786101U (en) | Infrared range sensor | |
| CN113238238A (en) | Laser detection module and preparation method thereof | |
| CN202994184U (en) | Support plate packaging structure having induction device | |
| CN216450652U (en) | Photoelectric packaging structure and photoelectric switch | |
| CN219046135U (en) | Ultrathin diffuse reflection photoelectric sensor | |
| KR20200131380A (en) | Reflective sensor with integrated connector and method of manufacturing the same | |
| CN221803127U (en) | Photoelectric sensor | |
| CN213813936U (en) | Infrared sensor optical lens assembly | |
| CN220509130U (en) | Reflective laser photoelectric sensor | |
| KR20220049918A (en) | Sensor device for detecting liquid level and manufacturing method thereof | |
| CN209657435U (en) | Optical intelligent material cabinet | |
| CN217957055U (en) | Photoelectric switch with indication function | |
| CN218386185U (en) | dToF sensor packaging structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |