CN112584665A - Heat dissipation structure of electronic equipment and construction method thereof - Google Patents
Heat dissipation structure of electronic equipment and construction method thereof Download PDFInfo
- Publication number
- CN112584665A CN112584665A CN201910921721.9A CN201910921721A CN112584665A CN 112584665 A CN112584665 A CN 112584665A CN 201910921721 A CN201910921721 A CN 201910921721A CN 112584665 A CN112584665 A CN 112584665A
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- heat
- metal
- circuit board
- dissipation structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20518—Unevenly distributed heat load, e.g. different sectors at different temperatures, localised cooling, hot spots
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention provides a method of constructing a heat dissipation structure of an electronic apparatus including a case, a circuit board within the case, and a heat generating element provided on one side surface of the circuit board, the method comprising: carrying out quantitative thermal analysis on the electronic equipment to determine the heat dissipation direction of the heating element; and arranging a plurality of metal exposure areas on the side surface according to the heat dissipation direction, wherein the plurality of metal exposure areas surround the heating element to absorb heat, and the area and the position of each metal exposure area correspond to the heat dissipation direction.
Description
Technical Field
The invention relates to a heat dissipation structure of electronic equipment and a construction method thereof.
Background
Some components of many electronic devices generate heat seriously, and especially some compact products have high requirements on heat dissipation. How to solve the heat dissipation problem of the components needs to find a good solution.
Some electronic products on the market generally adopt a heat dissipation scheme that a heating device or a heating part is directly connected with a heat dissipation device through a heat conduction pad to play a role in heat dissipation. How to analyze the structure of the heat dissipation device and efficiency analysis are not well reflected. When the heat dissipation effect is not good, the method of enlarging the heat dissipation device and increasing the heat conductivity coefficient is generally adopted for improvement. But simply increasing the volume of the heat sink device is not applicable to the more and more compact products at present.
Disclosure of Invention
In order to solve the above technical problem, the present invention provides a method for constructing a heat dissipation structure of an electronic device including a case, a circuit board located in the case, and a heat generating element disposed on one side surface of the circuit board, comprising:
carrying out quantitative thermal analysis on the electronic equipment to determine the heat dissipation direction of the heating element;
and arranging a plurality of metal exposure areas on the side surface according to the heat dissipation direction, wherein the plurality of metal exposure areas surround the heating element to absorb heat, and the area and the position of each metal exposure area correspond to the heat dissipation direction.
Preferably, the temperature rise of each of said metal exposed areas is the same.
Preferably, after the providing the plurality of metal exposed regions, further comprising:
and arranging a heat conduction structure which is connected between two side surfaces of the circuit board so as to transfer the heat of the heating element from one side surface of the circuit board to the other side surface of the circuit board.
Preferably, after the heat conducting structure is arranged, the method further comprises the following steps:
and carrying out quantitative thermal analysis on the electronic equipment with the heat dissipation structure so as to determine the heat dissipation direction of the heating element.
Another embodiment of the present invention also provides a heat dissipation structure of an electronic apparatus including a case, a circuit board inside the case, and a heat generating element provided on one side surface of the circuit board, the heat dissipation structure being configured according to the above-described configuration method, the heat dissipation structure including:
a plurality of metal exposure regions located on the same side surface of the circuit board as the heat generating element, the plurality of metal exposure regions surrounding the heat generating element to absorb heat, an area and a position of each of the metal exposure regions corresponding to the heat dissipation direction.
Preferably, the temperature rise of each of said metal exposed areas is the same.
Preferably, further comprising:
a heat conductive structure connected between both side surfaces of the circuit board to transfer heat of the heat generating element from one side surface to the other side surface of the circuit board.
Preferably, the heat conductive structure includes:
the metal through holes penetrate through the circuit board from the thickness direction of the circuit board, and the metal through holes are uniformly distributed in the metal exposure area.
Preferably, the heat conductive structure includes:
a metal heat sink including a first metal plate attached to the one side surface, a second metal plate attached to the other side surface, and a connecting sheet connecting the first metal plate and the second metal plate together from an edge of the circuit board,
the first metal sheet covers the plurality of metal exposed regions.
Preferably, further comprising:
the heat conducting pad is positioned between the other side surface and the shell and is attached to the inner side surface of the shell.
As can be seen from the above technical solutions, before the heat dissipation structure is provided for the electronic device, quantitative thermal analysis is first performed on the whole electronic device, and usually, the position of the main heating element, the direction of heat dissipation thereof, and the speed of heat dissipation are analyzed by using a thermodynamic diagram, which can be expressed as the position with the highest temperature, the speed of heat gradient change, and the like. As can be seen from quantitative thermal analysis, the heat dissipation direction of the heat generating element is generally not uniform to the surroundings, but has a certain directivity.
Therefore, the heat dissipation structure arranged for the electronic equipment is often required to cover the whole peripheral area of the heating element under the condition that quantitative thermal analysis is not carried out on the electronic equipment, so that the heat dissipation structure occupies a larger volume, and the heat dissipation effect is poor due to no pertinence. In the embodiment, the heat dissipation direction of the heating element is obtained by carrying out quantitative heat analysis on the electronic equipment, the heat dissipation structure can be set in the heat dissipation direction in a targeted manner, and the heat dissipation structures can be set in a small amount or even not set in other directions, so that the volume occupied by unnecessary heat dissipation structures can be reduced, and the heat dissipation effect is effectively improved due to the improvement of the pertinence of the heat dissipation structure.
Drawings
The following drawings are only schematic illustrations and explanations of the present invention, and do not limit the scope of the present invention.
Fig. 1 is an exploded view of a first embodiment of a heat dissipation structure of an electronic device of the present invention.
Fig. 2a and 2b are schematic exploded views of a second embodiment of a heat dissipation structure of an electronic device of the present invention.
Fig. 3 is a schematic view of one side surface of the circuit board in the present invention.
Fig. 4 is a schematic view of the other side surface of the circuit board in the present invention.
Fig. 5 is a partial schematic view of a second embodiment of the invention.
Fig. 6 is a thermodynamic diagram for heat dissipation direction analysis of an electronic device in the present invention.
Fig. 7 and 8 are thermodynamic diagrams of an electronic device having a heat dissipation structure in the present invention.
Detailed Description
In order to more clearly understand the technical features, objects, and effects of the present invention, embodiments of the present invention will now be described with reference to the accompanying drawings, in which like reference numerals refer to like parts throughout.
"exemplary" means "serving as an example, instance, or illustration" herein, and any illustration, embodiment, or steps described as "exemplary" herein should not be construed as a preferred or advantageous alternative.
For the sake of simplicity, the drawings are only schematic representations of the parts relevant to the invention, and do not represent the actual structure of the product. In addition, in order to make the drawings concise and understandable, components having the same structure or function in some of the drawings are only schematically illustrated or only labeled.
In this document, "upper", "lower", "front", "rear", "left", "right", and the like are used only to indicate relative positional relationships between relevant portions, and do not limit absolute positions of the relevant portions.
In this document, "first", "second", and the like are used only for distinguishing one from another, and do not indicate the degree and order of importance, the premise that each other exists, and the like.
In this context, "equal", "same", etc. are not strictly mathematical and/or geometric limitations, but also include tolerances as would be understood by a person skilled in the art and allowed for manufacturing or use, etc. Unless otherwise indicated, numerical ranges herein include not only the entire range within its two endpoints, but also several sub-ranges subsumed therein.
Example embodiments will now be described more fully with reference to the accompanying drawings.
In order to solve the problems in the prior art, the present invention provides a method for constructing a heat dissipation structure of an electronic device, wherein, as shown in fig. 1, the electronic device includes a housing, a circuit board 20 located in the housing, and a heat generating element 30 disposed on a side surface 21 of the circuit board 20, the housing includes a front shell 11 and a rear shell 12, and the circuit board 20 is located in a cavity formed by the front shell 11 and the rear shell 12.
The construction method comprises the following steps:
performing quantitative thermal analysis on the electronic device shown in fig. 1, wherein the thermodynamic diagram is shown in fig. 5, and a heat dissipation direction of the heating element 30 can be determined according to the thermodynamic diagram, wherein the heat dissipation direction mainly refers to a direction in which the heating element 30 causes the surrounding environment to heat up fastest and/or highest;
a plurality of metal exposed regions 41, 42 are provided on one side surface 21 according to a heat dissipation direction, the plurality of metal exposed regions 41, 42 surrounding the heat generating element 30 to absorb heat thereof, an area and a position of each metal exposed region 41, 42 corresponding to the heat dissipation direction.
The correspondence referred to herein means that a larger area and/or a larger number of metal exposed regions are provided in the heat dissipation direction.
In the present embodiment, before providing the heat dissipation structure for the electronic device, quantitative thermal analysis is first performed on the whole electronic device, and the position of the main heating element 30, the direction of heat dissipation thereof, and the speed of heat dissipation are generally analyzed by using a thermodynamic diagram as shown in fig. 6, which can be expressed as the position with the highest temperature, the speed of heat gradient change, and the like in the thermodynamic diagram. As can be seen from quantitative thermal analysis, the heat radiating direction of the heating element 30 is not generally uniform to the surroundings, but has a certain directivity. For example, as shown in fig. 6, the main heat dissipation direction of the heat generating element 30 is toward the upper side of the heat generating element 30, and the lower side thereof is less affected by the heat generating element 30.
Therefore, the heat dissipation structure arranged for the electronic equipment is often required to cover the whole peripheral area of the heating element under the condition that quantitative thermal analysis is not carried out on the electronic equipment, so that the heat dissipation structure occupies a larger volume, and the heat dissipation effect is poor due to no pertinence. In the embodiment, the heat dissipation direction of the heating element 30 is obtained by performing quantitative thermal analysis on the electronic device, the heat dissipation structure can be set in the heat dissipation direction in a targeted manner, and the heat dissipation structures can be set in a small amount or even not set in other directions, so that the volume occupied by unnecessary heat dissipation structures can be reduced, and the heat dissipation effect is effectively improved due to the improvement of the pertinence of the heat dissipation structure.
In the present embodiment, as shown in fig. 1, the heat dissipation structure may be implemented as a metal exposed region, such as a copper exposed region, of the circuit board 20. The heat dissipation direction can be divided into only the upper and lower parts of the heat generating element 30 as shown in fig. 1, and correspondingly, the heat dissipation structure can include only two metal exposed regions 41, 42 on one side surface 21, wherein in the present embodiment, the area of the metal exposed region 41 above the heat generating element 30 corresponding to the heat dissipation direction is larger than the area of the metal exposed region 42 below the heat generating element 30 not in the heat dissipation direction. In other embodiments, the number and area of the metal exposed regions corresponding to the heat dissipation direction may be set to be greater than the number and area of the metal exposed regions that are not in the heat dissipation direction.
It will be understood by those skilled in the art that, in order to improve the pertinence and accuracy of the heat dissipation structure, the heat dissipation direction may be further subdivided, for example, into the upper, lower, left and right sides of the heat generating element, or the area surrounding the heat generating element may be divided into eight or more areas, etc. The number of divisions of the heat radiation direction is increased, which is favorable for the miniaturization of the heat radiation structure and the improvement of the heat radiation efficiency.
Specifically, the areas of the plurality of metal exposed regions are different from each other, and the areas are arranged so that the temperature rise of each metal exposed region is the same. Through this, the plurality of metal exposed areas of the heat dissipation structure can be uniformly dissipated, so that the problems of uneven heat dissipation and low heat dissipation efficiency caused by overhigh local temperature rise and undersize temperature rises of other areas are avoided. Meanwhile, the overall stability of the electronic equipment can be improved due to the balanced heat dissipation effect, and damage to components and parts caused by overhigh local temperature is avoided.
Further, a plurality of metal exposed regions may be provided not only on the same one-side surface 21 as the heat generating element 30, as shown in fig. 4, but also on the other-side surface 22 of the circuit board 20, metal exposed regions 41 ', 42' corresponding to the one-side surface 21 may be provided. The metal exposed regions 41 ', 42' correspond in location and area to the metal exposed regions 41, 42.
In order to improve the heat dissipation effect, the method further comprises the following steps after the plurality of metal exposed regions are arranged:
a heat conductive structure is provided, which is connected between both side surfaces of the circuit board 20 to transfer heat of the heat generating element 30 from one side surface 21 to the other side surface 22 of the circuit board.
In the above-mentioned heat dissipation direction is the heat dissipation direction on the side surface 21 where the heat generating element 30 is located, and the side surface on which the heat generating element 30 is located also belongs to one of the heat dissipation directions, so for this aspect, the method of the embodiment further includes providing a heat conducting structure for transferring heat from the side surface 21 to the other side surface 22 of the circuit board, so as to further improve the heat dissipation effect.
Specifically, as shown in fig. 3, the heat conducting structure may include metal vias 31, the metal vias 31 penetrating the circuit board 20 from a thickness direction of the circuit board 20 so that the one side surface 21 and the other side surface 22 of the circuit board 20 communicate with each other through the heat conducting metal, the plurality of metal vias 31 being uniformly distributed in the metal exposed regions 41, 42.
The metal exposed areas 41, 42 serve as the primary heat dissipation structure of the heating element 30 for dissipating heat from the heating element 30. Since the heat generating element 30 is located on the one side surface 21 of the circuit board 20, heat can be efficiently transferred from the one side surface 21 to the other side surface 22 through the metal through-holes 31, and further, heat can be dissipated from the other side surface 22 and a case (e.g., the rear case 12) corresponding to the other side surface 22.
Alternatively, as shown in fig. 5, 2a and 2b, the heat conducting structure may further include a metal heat sink 50, the metal heat sink 50 including a first metal sheet 51 attached to the one side surface 21, a second metal sheet 52 attached to the other side surface 22, and a connecting piece 53 connecting the first metal sheet 51 and the second metal sheet 52 together from an edge of the circuit board 20. Wherein the first metal sheet 51 covers the plurality of metal exposed regions 41, 42 and correspondingly the second metal sheet 52 covers the plurality of metal exposed regions 41 ', 42'.
The metal heat sink 50 may be clamped to the circuit board 20 to make sufficient contact with the metal exposed areas on the circuit board 20. Similarly, the metal heat sink 50 also functions to transfer heat emitted from the heat generating element 30 from the one side surface 21 to the other side surface 22. And because the area is larger and the heat dissipation effect is more concentrated, the heat dissipation effect of the metal through hole is better than that of the metal through hole.
The method of the present invention can be used to construct one or more heat conducting structures in the heat dissipating structure of the electronic device according to the actual heat dissipation requirements, for example, the heat conducting structure may only include the metal through hole 31, only include the metal heat sink 50, or both.
In order to ensure the heat dissipation effect of the electronic device, after the heat dissipation structure is configured for the electronic device, the method may further include: quantitative thermal analysis is performed on the electronic equipment with the heat dissipation structure so as to determine the heat dissipation direction of the heating element.
As mentioned above, the heat dissipation direction mainly refers to the direction in which the heating element 30 causes the surrounding environment to heat up most quickly and/or the highest. When the heat dissipation structure constructed according to the construction method of the present invention is capable of satisfying, for example, the same temperature rise per metal exposure region, the heat dissipation directions should be evenly distributed around the heat generating element 30, i.e., without a specific fastest, and/or highest direction of temperature rise.
For example, as shown in fig. 6, the electronic device constructed according to the construction method of the present invention is subjected to a thermal analysis, and the electronic structure has a plurality of metal exposed regions 41, 42 corresponding to the heat dissipation direction, and the heat dissipation effect thereof is significantly more uniform than that of the electronic device without the heat dissipation structure shown in fig. 5.
Further, as shown in fig. 7, the electronic device constructed according to the construction method of the present invention is subjected to a thermal analysis, and the electronic structure has a plurality of metal exposed regions 41, 42 corresponding to the heat dissipation direction and a metal heat sink 50, and the heat dissipation effect thereof is significantly more uniform than that of the electronic device without the heat conductive structure shown in fig. 6.
In one embodiment of the present invention, there is provided a heat dissipation structure of an electronic apparatus constructed according to the above construction method, as shown in fig. 1, the electronic apparatus includes a housing, a circuit board 20 located in the housing, and a heat generating element 30 disposed on one side surface 21 of the circuit board 20, the housing includes a front case 11 and a rear case 12, and the circuit board 20 is located in a cavity formed by the front case 11 and the rear case 12. The heat dissipation structure is constructed according to the construction method described above, and the heat dissipation structure includes:
a plurality of metal exposed regions 41, 42 located on the same side surface 21 of the circuit board 20 as the heat generating element 30, the plurality of metal exposed regions 41, 42 surrounding the heat generating element 30 to absorb heat, an area and a position of each of the metal exposed regions 41, 42 corresponding to a heat dissipation direction.
The electronic device is subjected to quantitative thermal analysis, the thermodynamic diagram is shown in fig. 5, and the heat dissipation direction of the heating element 30 can be determined according to the thermodynamic diagram, wherein the heat dissipation direction mainly refers to the direction in which the heating element 30 causes the surrounding environment to heat up fastest and/or the highest;
a plurality of metal exposed regions 41, 42 are provided on one side surface 21 according to a heat dissipation direction, the plurality of metal exposed regions 41, 42 surrounding the heat generating element 30 to absorb heat thereof, an area and a position of each metal exposed region 41, 42 corresponding to the heat dissipation direction.
The correspondence referred to herein means that a larger area and/or a larger number of metal exposed regions are provided in the heat dissipation direction.
In the present embodiment, as shown in fig. 1, the heat dissipation structure may be implemented as a metal exposed region, such as a copper exposed region, of the circuit board 20. The heat dissipation direction can be divided into only the upper and lower parts of the heat generating element 30 as shown in fig. 1, and correspondingly, the heat dissipation structure can include only two metal exposed regions 41, 42 on one side surface 21, wherein in the present embodiment, the area of the metal exposed region 41 above the heat generating element 30 corresponding to the heat dissipation direction is larger than the area of the metal exposed region 42 below the heat generating element 30 not in the heat dissipation direction. In other embodiments, the number and area of the metal exposed regions corresponding to the heat dissipation direction may be set to be greater than the number and area of the metal exposed regions that are not in the heat dissipation direction.
It will be understood by those skilled in the art that, in order to improve the pertinence and accuracy of the heat dissipation structure, the heat dissipation direction may be further subdivided, for example, into the upper, lower, left and right sides of the heat generating element, or the area surrounding the heat generating element may be divided into eight or more areas, etc. The number of divisions of the heat radiation direction is increased, which is favorable for the miniaturization of the heat radiation structure and the improvement of the heat radiation efficiency.
Specifically, the areas of the plurality of metal exposed regions are different from each other, and the areas are arranged so that the temperature rise of each metal exposed region is the same. Through this, the plurality of metal exposed areas of the heat dissipation structure can be uniformly dissipated, so that the problems of uneven heat dissipation and low heat dissipation efficiency caused by overhigh local temperature rise and undersize temperature rises of other areas are avoided. Meanwhile, the overall stability of the electronic equipment can be improved due to the balanced heat dissipation effect, and damage to components and parts caused by overhigh local temperature is avoided.
Further, a plurality of metal exposed regions may be provided not only on the same one-side surface 21 as the heat generating element 30, as shown in fig. 4, but also on the other-side surface 22 of the circuit board 20, metal exposed regions 41 ', 42' corresponding to the one-side surface 21 may be provided. The metal exposed regions 41 ', 42' correspond in location and area to the metal exposed regions 41, 42.
The embodiment shown in fig. 1 further comprises: and a heat conductive structure connected between both side surfaces 21, 22 of the circuit board 20 to transfer heat of the heat generating element 30 from one side surface to the other side surface of the circuit board.
Wherein, in this embodiment, the heat conducting structure includes:
and metal through holes 31, wherein the metal through holes 31 penetrate through the circuit board 20 from the thickness direction of the circuit board 20 so that the one side surface 21 and the other side surface 22 of the circuit board 20 are communicated through the heat conductive metal, and the plurality of metal through holes 31 are uniformly distributed in the metal exposed regions 41 and 42.
The metal exposed areas 41, 42 serve as the primary heat dissipation structure of the heating element 30 for dissipating heat from the heating element 30. Since the heat generating element 30 is located on the one side surface 21 of the circuit board 20, heat can be efficiently transferred from the one side surface 21 to the other side surface 22 through the metal through-holes 31, and further, heat can be dissipated from the other side surface 22 and a case (e.g., the rear case 12) corresponding to the other side surface 22.
Preferably, the heat dissipation structure of the present embodiment further includes: and a thermal pad 60, the thermal pad 60 being located between the other side surface 22 and the rear case 12, one side of the thermal pad 60 being attached to the inner side surface of the rear case 12, and the other side being attached to the other side surface 22 or the metal exposed regions 41 ', 42' thereon, so as to transfer heat emitted from the heat generating component 30 from the one side surface 21 to the other side surface 22, and then to be emitted to the ambient environment through the rear case 12.
In the present embodiment, the heating element 30 is disposed on the side surface 21 of the circuit board 20 corresponding to the front case 11, and it can be understood by those skilled in the art that the side surface 21 may also correspond to the rear case 12, and accordingly, the heat of the heating element 30 can be transferred to the front case 11 through the heat conducting structure and dissipated to the surrounding environment.
In another embodiment of the present invention, there is provided a heat dissipation structure of an electronic apparatus constructed according to the above construction method, as shown in fig. 2a and 2b, the electronic apparatus includes a housing, a circuit board 20 located in the housing, and a heat generating element 30 disposed on one side surface 21 of the circuit board 20, the housing includes a front case 11 and a rear case 12, and the circuit board 20 is located in a cavity formed by the front case 11 and the rear case 12. The heat dissipation structure is constructed according to the construction method described above, and the heat dissipation structure includes:
a plurality of metal exposed regions 41, 42 located on the same side surface 21 of the circuit board 20 as the heat generating element 30, the plurality of metal exposed regions 41, 42 surrounding the heat generating element 30 to absorb heat, an area and a position of each of the metal exposed regions 41, 42 corresponding to a heat dissipation direction.
Further, a plurality of metal exposed regions may be provided not only on the same one-side surface 21 as the heat generating element 30, as shown in fig. 4, but also on the other-side surface 22 of the circuit board 20, metal exposed regions 41 ', 42' corresponding to the one-side surface 21 may be provided. The metal exposed regions 41 ', 42' correspond in location and area to the metal exposed regions 41, 42.
The embodiment shown in fig. 2a and 2b further comprises: and a heat conductive structure connected between both side surfaces 21, 22 of the circuit board 20 to transfer heat of the heat generating element 30 from one side surface to the other side surface of the circuit board.
Wherein, in this embodiment, the heat conducting structure includes:
and a metal heat sink 50, the metal heat sink 50 including a first metal sheet 51 attached to the one side surface 21, a second metal sheet 52 attached to the other side surface 22, and a connecting sheet 53 connecting the first metal sheet 51 and the second metal sheet 52 together from an edge of the circuit board 20. Wherein the first metal sheet 51 covers the plurality of metal exposed regions 41, 42 and correspondingly the second metal sheet 52 covers the plurality of metal exposed regions 41 ', 42'.
The metal heat sink 50 may be clamped to the circuit board 20 to make sufficient contact with the metal exposed areas on the circuit board 20. Similarly, the metal heat sink 50 also functions to transfer heat emitted from the heat generating element 30 from the one side surface 21 to the other side surface 22. And because the area is larger and the heat dissipation effect is more concentrated, the heat dissipation effect of the metal through hole is better than that of the metal through hole.
Preferably, the heat dissipation structure of the present embodiment further includes: and the heat conducting pad 60, the heat conducting pad 60 is located between the other side surface 22 and the rear shell 12, one side of the heat conducting pad 60 is attached to the inner side surface of the rear shell 12, and the other side is attached to the other side surface 22 or the second metal sheet 52 of the metal heat sink 50 thereon, so as to transfer the heat emitted by the heating element 30 from one side surface 21 to the other side surface 22, and then the heat is emitted to the ambient environment through the rear shell 12.
In the present embodiment, the heating element 30 is disposed on the side surface 21 of the circuit board 20 corresponding to the front case 11, and it can be understood by those skilled in the art that the side surface 21 may also correspond to the rear case 12, and accordingly, the heat of the heating element 30 can be transferred to the front case 11 through the heat conducting structure and dissipated to the surrounding environment.
As can be seen from the above technical solutions, before the heat dissipation structure is provided for the electronic device, quantitative thermal analysis is first performed on the whole electronic device, and usually, the position of the main heating element, the direction of heat dissipation thereof, and the speed of heat dissipation are analyzed by using a thermodynamic diagram, which can be expressed as the position with the highest temperature, the speed of heat gradient change, and the like. As can be seen from quantitative thermal analysis, the heat dissipation direction of the heat generating element is generally not uniform to the surroundings, but has a certain directivity.
Therefore, the heat dissipation structure arranged for the electronic equipment is often required to cover the whole peripheral area of the heating element under the condition that quantitative thermal analysis is not carried out on the electronic equipment, so that the heat dissipation structure occupies a larger volume, and the heat dissipation effect is poor due to no pertinence. In the embodiment, the heat dissipation direction of the heating element is obtained by carrying out quantitative heat analysis on the electronic equipment, the heat dissipation structure can be set in the heat dissipation direction in a targeted manner, and the heat dissipation structures can be set in a small amount or even not set in other directions, so that the volume occupied by unnecessary heat dissipation structures can be reduced, and the heat dissipation effect is effectively improved due to the improvement of the pertinence of the heat dissipation structure.
The heat dissipation structure of the electronic equipment further provides a heat conduction structure according to the heat dissipation direction of the heating element, and the heat conduction structure is used for transferring heat from one side surface of the circuit board to the other side surface of the circuit board and then transferring the heat to the surrounding environment through the shell, so that targeted heat dissipation is further realized, and the heat dissipation efficiency is improved. The heat conducting structure can be embedded into the circuit board or attached to the surface of the circuit board, the volume occupied by the heat radiating structure is not increased, and the heat radiating effect is effectively improved due to the fact that the pertinence of the heat radiating structure is improved and the position without the heating element is reasonably applied to radiating.
It should be understood that although the present description has been described in terms of various embodiments, not every embodiment includes only a single embodiment, and such description is for clarity purposes only, and those skilled in the art will recognize that the embodiments described herein can be combined as a whole to form other embodiments as would be understood by those skilled in the art.
The above-listed detailed description is only a specific description of a possible embodiment of the present invention and is not intended to limit the scope of the present invention, and equivalent embodiments or modifications such as combinations, divisions or repetitions of the features without departing from the technical spirit of the present invention are included in the scope of the present invention.
Claims (10)
1. A method of constructing a heat dissipation structure of an electronic apparatus including a case, a circuit board in the case, and a heat generating element provided on one side surface of the circuit board, comprising:
carrying out quantitative thermal analysis on the electronic equipment to determine the heat dissipation direction of the heating element;
and arranging a plurality of metal exposure areas on the side surface according to the heat dissipation direction, wherein the plurality of metal exposure areas surround the heating element to absorb heat, and the area and the position of each metal exposure area correspond to the heat dissipation direction.
2. The method of claim 1 wherein the temperature rise of each of said metal exposed regions is the same.
3. The method of claim 1, further comprising, after providing the plurality of metal exposed regions:
and arranging a heat conduction structure which is connected between two side surfaces of the circuit board so as to transfer the heat of the heating element from one side surface of the circuit board to the other side surface of the circuit board.
4. The method of claim 3, further comprising, after providing the thermally conductive structure:
and carrying out quantitative thermal analysis on the electronic equipment with the heat dissipation structure so as to determine the heat dissipation direction of the heating element.
5. A heat dissipation structure of an electronic apparatus, the electronic apparatus including a case, a circuit board within the case, and a heat generating element provided on one side surface of the circuit board, the heat dissipation structure being configured according to the construction method of any one of claims 1 to 4, the heat dissipation structure comprising:
a plurality of metal exposure regions located on the same side surface of the circuit board as the heat generating element, the plurality of metal exposure regions surrounding the heat generating element to absorb heat, an area and a position of each of the metal exposure regions corresponding to the heat dissipation direction.
6. The heat dissipation structure of claim 6, wherein the temperature rise of each of the metal exposed regions is the same.
7. The heat dissipation structure of claim 5, further comprising:
a heat conductive structure connected between both side surfaces of the circuit board to transfer heat of the heat generating element from one side surface to the other side surface of the circuit board.
8. The heat dissipation structure of claim 7, wherein the heat conduction structure comprises:
the metal through holes penetrate through the circuit board from the thickness direction of the circuit board, and the metal through holes are uniformly distributed in the metal exposure area.
9. The heat dissipation structure of claim 7, wherein the heat conduction structure comprises:
a metal heat sink including a first metal plate attached to the one side surface, a second metal plate attached to the other side surface, and a connecting sheet connecting the first metal plate and the second metal plate together from an edge of the circuit board,
the first metal sheet covers the plurality of metal exposed regions.
10. The heat dissipation structure according to claim 8 or 9, characterized by further comprising:
the heat conducting pad is positioned between the other side surface and the shell and is attached to the inner side surface of the shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910921721.9A CN112584665B (en) | 2019-09-27 | 2019-09-27 | Heat dissipation structure of electronic equipment and construction method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910921721.9A CN112584665B (en) | 2019-09-27 | 2019-09-27 | Heat dissipation structure of electronic equipment and construction method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112584665A true CN112584665A (en) | 2021-03-30 |
| CN112584665B CN112584665B (en) | 2022-02-15 |
Family
ID=75109696
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910921721.9A Active CN112584665B (en) | 2019-09-27 | 2019-09-27 | Heat dissipation structure of electronic equipment and construction method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112584665B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113258228A (en) * | 2021-06-29 | 2021-08-13 | 成都市克莱微波科技有限公司 | Multichannel amplitude-phase consistent microwave assembly |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060011336A1 (en) * | 2004-04-07 | 2006-01-19 | Viktor Frul | Thermal management system and computer arrangement |
| CN1751388A (en) * | 2003-12-15 | 2006-03-22 | 索尼计算机娱乐公司 | Electronic device cooler, electronic device cooling method, and electronic device cooling control program |
| CN102252773A (en) * | 2010-05-20 | 2011-11-23 | 海信（山东）空调有限公司 | Radiator surface temperature field testing tool and method thereof |
| CN105138728A (en) * | 2015-07-23 | 2015-12-09 | 华南理工大学 | Electronic element heat transfer optimization arrangement method based on greedy algorithm |
| CN106971022A (en) * | 2017-02-24 | 2017-07-21 | 上海理工大学 | Structure heat dissipation channel layout optimization design method based on bionic principle |
| US20170309543A1 (en) * | 2014-10-21 | 2017-10-26 | Shin-Etsu Chemical Co., Ltd. | Heat dissipation sheet |
-
2019
- 2019-09-27 CN CN201910921721.9A patent/CN112584665B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1751388A (en) * | 2003-12-15 | 2006-03-22 | 索尼计算机娱乐公司 | Electronic device cooler, electronic device cooling method, and electronic device cooling control program |
| US20060011336A1 (en) * | 2004-04-07 | 2006-01-19 | Viktor Frul | Thermal management system and computer arrangement |
| CN102252773A (en) * | 2010-05-20 | 2011-11-23 | 海信（山东）空调有限公司 | Radiator surface temperature field testing tool and method thereof |
| US20170309543A1 (en) * | 2014-10-21 | 2017-10-26 | Shin-Etsu Chemical Co., Ltd. | Heat dissipation sheet |
| CN105138728A (en) * | 2015-07-23 | 2015-12-09 | 华南理工大学 | Electronic element heat transfer optimization arrangement method based on greedy algorithm |
| CN106971022A (en) * | 2017-02-24 | 2017-07-21 | 上海理工大学 | Structure heat dissipation channel layout optimization design method based on bionic principle |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113258228A (en) * | 2021-06-29 | 2021-08-13 | 成都市克莱微波科技有限公司 | Multichannel amplitude-phase consistent microwave assembly |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112584665B (en) | 2022-02-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7629683B1 (en) | Thermal management of electronic devices | |
| CN101013337B (en) | Heat-dissipating wireless communication system and manufacture method thereof | |
| US9318410B2 (en) | Cooling assembly using heatspreader | |
| US20060203451A1 (en) | Heat dissipation apparatus with second degree curve shape heat pipe | |
| CN112584665B (en) | Heat dissipation structure of electronic equipment and construction method thereof | |
| CN108990365B (en) | Heat radiation structure, shell and electronic equipment | |
| TW201218931A (en) | Mainboard and electronic device employ the sam | |
| EP3300471B1 (en) | Single plate heat radiation device and method | |
| JP6311222B2 (en) | Electronic device and heat dissipation method | |
| JP2009223881A (en) | Radio communication apparatus | |
| CN210671094U (en) | Electronic device | |
| CN210381763U (en) | Heat dissipation device, radio remote unit, baseband processing unit and base station | |
| CN111596514B (en) | Laser light source and laser projection equipment | |
| CN209201392U (en) | A kind of small-sized stacked circuit plate radiator structure | |
| CN108633213B (en) | Electronic device | |
| CN107318236B (en) | portable electronic product and heat dissipation type shell structure for same | |
| JP3153018U (en) | Heat dissipation device for communication device housing | |
| JP2002261223A (en) | Structure and method for connection of cold plate | |
| CN113268127A (en) | Electronic device | |
| JP2018142055A (en) | Heat sink, circuit board and radio communication apparatus | |
| CN109561641B (en) | Shielding cover, printed circuit board and electronic equipment | |
| JP2007201351A (en) | Electronic appliance | |
| US10672683B2 (en) | Heat transfer adapter plate | |
| CN218450324U (en) | Camera with a camera module | |
| CN211744599U (en) | Infrared module and electronic product |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |