CN112578210A - Method for manufacturing instrument panel power interface circuit - Google Patents
Method for manufacturing instrument panel power interface circuit Download PDFInfo
- Publication number
- CN112578210A CN112578210A CN202011456787.4A CN202011456787A CN112578210A CN 112578210 A CN112578210 A CN 112578210A CN 202011456787 A CN202011456787 A CN 202011456787A CN 112578210 A CN112578210 A CN 112578210A
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- mode inductor
- common
- resistor
- instrument panel
- pcb
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 238000000034 method Methods 0.000 title claims abstract description 10
- 238000012360 testing method Methods 0.000 claims abstract description 22
- 238000002474 experimental method Methods 0.000 abstract description 7
- 230000003111 delayed effect Effects 0.000 abstract description 3
- 238000011161 development Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000001914 filtration Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 230000009191 jumping Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002407 reforming Methods 0.000 description 1
- 230000007847 structural defect Effects 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/001—Measuring interference from external sources to, or emission from, the device under test, e.g. EMC, EMI, EMP or ESD testing
- G01R31/002—Measuring interference from external sources to, or emission from, the device under test, e.g. EMC, EMI, EMP or ESD testing where the device under test is an electronic circuit
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
- G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
The invention relates to a method for manufacturing a power interface circuit of an instrument panel, which comprises the following steps: s1, providing a panel board PCB, wherein the PCB is provided with a first resistor, a second resistor and a second common-mode inductor mounting area, the first resistor is connected between a first pin pad and a fourth pin pad of the second common-mode inductor mounting area to short-circuit the first resistor and the fourth pin pad, and the second resistor is connected between the second pin pad and the third pin pad of the second common-mode inductor mounting area to short-circuit the second resistor and the third pin pad; s2, carrying out CE-EMC test on the PCB of the instrument panel; if the instrument panel PCB passes the CE-EMC test, the instrument panel PCB is shaped in S1 for mass production; if the CE-EMC test is not passed, performing step S3; s3, mounting a second common-mode inductor in a second common-mode inductor mounting area in a paster mode, disconnecting the first resistor and the second resistor, and carrying out CE-EMC test on the instrument panel PCB again; and if the CE-EMC test is passed, the instrument panel PCB is shaped and manufactured in mass production in S3. The advantages are that: therefore, the EMC experiment CE can be completed smoothly, quickly and efficiently, the development time is saved, and the project progress is not delayed.
Description
Technical Field
The invention relates to the technical field of automobile instrument desks, in particular to a method for manufacturing a power interface circuit of an instrument panel.
Background
In general, differential mode inductance filtering is designed at the power inlet of the instrument, but interference generated by a common mode is ignored. Therefore, CE can be invalid when EMC experiments are conducted, the operation is inconvenient to modify due to the fact that the position of the common-mode inductor is not reserved, the consumed time is long, the verification is conducted again after the PCB is modified, the time period is long, the investment of manpower and material resources is large, and the project schedule is delayed.
The existing power inlet design has the following disadvantages:
1. interference due to common mode is not considered in advance
2. The operation of rectifying and reforming the CE after the failure of the EMC experiment is difficult, the time is too long, and the cost is high
3. The method has the defects of long time and influence on project progress on the prior art when the PCB needs to be changed to verify the EMC experiment CE again after the rectification, and the method is provided.
Disclosure of Invention
The embodiment of the invention aims to provide a manufacturing method of an instrument panel power interface circuit aiming at the structural defects in the prior art, wherein a common mode inductor and a differential mode inductor are required to be designed at the front end for filtering simultaneously during design so as to achieve the best effect.
In order to achieve the above object, a method for manufacturing an instrument panel power interface circuit according to an embodiment of the present invention is implemented by the following technical solutions:
a manufacturing method of a power interface circuit of an instrument panel is characterized by comprising the following steps:
s1, providing a panel board PCB; the instrument panel PCB is provided with a first common-mode inductor, a first resistor and a second resistor, wherein the two resistors have zero impedance; the first pin and the second pin of the first common-mode inductor are used for being connected with the anode and the cathode of the storage battery respectively; a second common mode inductor mounting area used for mounting a second common mode inductor is reserved on the PCB, a first pin bonding pad of the second common mode inductor mounting area is connected with an ignition switch, a second pin bonding pad of the second common mode inductor mounting area is connected with the cathode of the storage battery, a third pin bonding pad of the second common mode inductor mounting area is connected with the shell, and a fourth pin bonding pad of the third common mode inductor mounting area is connected with the anode of the first diode, the anode of the second diode and the anode of the third diode; the first resistor is connected between a first pin bonding pad and a fourth pin bonding pad of the second common-mode inductor mounting area to enable the first pin bonding pad and the fourth pin bonding pad to be in short circuit, and the second resistor is connected between a second pin bonding pad and a third pin bonding pad of the second common-mode inductor mounting area to enable the second pin bonding pad and the third pin bonding pad to be in short circuit;
s2, carrying out CE-EMC test on the instrument panel PCB; if the instrument panel PCB passes the CE-EMC test, the instrument panel PCB is shaped in S1 for mass production; if the CE-EMC test is not passed, performing step S3;
s3, mounting a second common-mode inductor in a second common-mode inductor mounting area in a paster mode, disconnecting the first resistor and the second resistor, and carrying out CE-EMC test on the instrument panel PCB again; and if the CE-EMC test is passed, the instrument panel PCB is shaped and manufactured in mass production in S3.
A fourth pin of the third common mode inductor is connected with the shell, and the fourth pin of the third common mode inductor is connected with the anode of a fourth diode and the anode of a fifth diode; and the cathode of the second diode is connected with the cathode of the fifth diode.
Compared with the prior art, the invention has the beneficial effects that: the whole crystal oscillator module is connected with the system ground in a single-point ground mode, so that the crystal oscillator module is protected to have a cleaner ground, and a more stable clock is provided for the system. Compared with the prior scheme, the prior layout is more compact, and the interference shielding capability of the crystal oscillator module is stronger. Thereby improving the stability of the upper system.
Drawings
The above features and advantages of the present invention will become more apparent and readily appreciated from the following description of the exemplary embodiments thereof taken in conjunction with the accompanying drawings.
FIG. 1 is a schematic circuit diagram of an embodiment of the present invention;
FIG. 2 is a circuit diagram of the front side of a PCB board according to an embodiment of the present invention;
FIG. 3 is a circuit diagram of the back side of the PCB according to the embodiment of the invention.
Detailed Description
The invention is described in further detail below with reference to the attached drawing figures to facilitate understanding by those skilled in the art:
reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.
In the description of the present invention, it is to be understood that the terms "central", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "horizontal", "top", "bottom", "inner", "outer", "circumferential", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.
In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
As shown in fig. 1-3, the method for manufacturing a power interface circuit of a dashboard provided in this embodiment is mainly based on a PCB of the dashboard, and the PCB is provided with a first common mode inductor L60103. The first pin and the second pin of the first common mode inductor L60103 are used for being connected to the positive and negative electrodes BATT and BAT _ GND of the storage battery, respectively. A fourth pin of the third pin of the first common mode inductor L60103 is connected to the positive electrode of the fourth diode D60102 and the positive electrode of the fifth diode D60101.
A second common mode inductor mounting area for mounting a second common mode inductor L60102 is reserved on the PCB. The first pin pad of the second common mode inductor mounting area is connected with the ignition switch IGN, the second pin pad of the second common mode inductor mounting area is connected with the cathode BAT _ GND of the storage battery, the third pin pad of the second common mode inductor mounting area is connected with the shell, and the fourth pin pad of the second common mode inductor mounting area is connected with the anode of the first diode D60105, the anode of the second diode D60104 and the anode of the third diode D60109. The cathode of the first diode D60105 is connected with the cathode of the fourth diode D60102, and the cathode of the second diode D60104 is connected with the cathode of the fifth diode D60101.
In addition, the PCB is further provided with a first resistor R60111 and a second resistor R60112 with zero impedance. The first resistor R60111 is connected between the first pin pad and the fourth pin pad of the second common mode inductor mounting area to short the first pin pad and the fourth pin pad, and the second resistor R60112 is connected between the second pin pad and the third pin pad of the second common mode inductor mounting area to short the second pin pad and the third pin pad.
Through the structure, compared with a traditional power inlet circuit, two common-mode inductors, namely a first common-mode inductor L60103 and a second common-mode inductor L60102, are added for filtering. The GND loop is divided, the BAT _ GND is divided into GND after passing through the common-mode inductor, and the design has obvious effect on CE and ESD in EMC experimental items.
The second common mode inductor L60102, the first resistor R60111, and the second resistor R60112 are all designed to be reserved (when the second common mode inductor L60102 is used, the first resistor R60111 and the second resistor R60112 are not attached, and vice versa).
Based on the above PCB board structure, the manufacturing method of this embodiment includes the following steps:
s1, providing the instrument panel PCB, enabling the second common-mode inductor L60102 to be not attached, and jumping off the second common-mode inductor L60102 through a 0 ohm resistor by using a first resistor R60111 and a second resistor R60112;
s2, performing first experiment, and performing CE-EMC test on the PCB of the instrument panel; if the test result passes the CE-EMC test, the instrument panel PCB is shaped in S1 for mass production, namely the second common mode inductor L60102 for the subsequent mass production is not used for loading; if the CE-EMC test is not passed, performing step S3;
s3, mounting a second common mode inductor L60102 in a second common mode inductor mounting area in a paster mode, disconnecting the first resistor R60111 and the second resistor R60112, and carrying out CE-EMC test on the instrument panel PCB again; if the test result passes the CE-EMC test, the dashboard PCB is shaped in S3 for mass production, that is, the first resistor R60111 and the second resistor R60112 are not mounted, and the second common mode inductor L60102 is mounted.
Compared with the prior art, the invention has the beneficial effects that: and when a schematic diagram is drawn in the early stage, a proper common-mode inductor is selected. By designing the reserved circuit in advance, the possibility of changing the PCB during the EMC experiment CE is low, so that the EMC experiment CE can be completed smoothly, quickly and efficiently, the development time is saved, and the project schedule is not delayed.
It should be noted that the above-mentioned embodiments are provided for further detailed description of the present invention, and the present invention is not limited to the above-mentioned embodiments, and those skilled in the art can make various modifications and variations on the above-mentioned embodiments without departing from the scope of the present invention.
Claims (2)
1. A manufacturing method of a power interface circuit of an instrument panel is characterized by comprising the following steps:
s1, providing a panel board PCB; the instrument panel PCB is provided with a first common-mode inductor, a first resistor and a second resistor, wherein the two resistors have zero impedance; the first pin and the second pin of the first common-mode inductor are used for being connected with the anode and the cathode of the storage battery respectively; a second common mode inductor mounting area used for mounting a second common mode inductor is reserved on the PCB, a first pin bonding pad of the second common mode inductor mounting area is connected with an ignition switch, a second pin bonding pad of the second common mode inductor mounting area is connected with the cathode of the storage battery, a third pin bonding pad of the second common mode inductor mounting area is connected with the shell, and a fourth pin bonding pad of the third common mode inductor mounting area is connected with the anode of the first diode, the anode of the second diode and the anode of the third diode; the first resistor is connected between a first pin bonding pad and a fourth pin bonding pad of the second common-mode inductor mounting area to enable the first pin bonding pad and the fourth pin bonding pad to be in short circuit, and the second resistor is connected between a second pin bonding pad and a third pin bonding pad of the second common-mode inductor mounting area to enable the second pin bonding pad and the third pin bonding pad to be in short circuit;
s2, carrying out CE-EMC test on the instrument panel PCB; if the instrument panel PCB passes the CE-EMC test, the instrument panel PCB is shaped in S1 for mass production; if the CE-EMC test is not passed, performing step S3;
s3, mounting a second common-mode inductor in a second common-mode inductor mounting area in a paster mode, disconnecting the first resistor and the second resistor, and carrying out CE-EMC test on the instrument panel PCB again; and if the CE-EMC test is passed, the instrument panel PCB is shaped and manufactured in mass production in S3.
2. The method of claim 1, wherein the method further comprises: a fourth pin of the third common mode inductor is connected with the shell, and the fourth pin of the third common mode inductor is connected with the anode of a fourth diode and the anode of a fifth diode; and the cathode of the second diode is connected with the cathode of the fifth diode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011456787.4A CN112578210A (en) | 2020-12-11 | 2020-12-11 | Method for manufacturing instrument panel power interface circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011456787.4A CN112578210A (en) | 2020-12-11 | 2020-12-11 | Method for manufacturing instrument panel power interface circuit |
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| Publication Number | Publication Date |
|---|---|
| CN112578210A true CN112578210A (en) | 2021-03-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202011456787.4A Pending CN112578210A (en) | 2020-12-11 | 2020-12-11 | Method for manufacturing instrument panel power interface circuit |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070296374A1 (en) * | 2006-06-07 | 2007-12-27 | Schneider Toshiba Inverter Europe Sas | Emc filtering device in a variable speed drive |
| CN203218059U (en) * | 2013-04-09 | 2013-09-25 | 宁波锦浪新能源科技有限公司 | Electromagnetic compatibility (EMC) filter integrated with common mode choke and differential mode chokes |
| CN106787684A (en) * | 2017-01-20 | 2017-05-31 | 武汉科技大学 | A kind of automobile instrument power source circuit |
| CN209659152U (en) * | 2019-04-30 | 2019-11-19 | 谢伟辉 | A kind of EMC power circuit applied to electromagnetic oven frequency converter |
| CN210120484U (en) * | 2019-06-06 | 2020-02-28 | 珠海市保时源光电科技有限公司 | EMC filter circuit |
| CN212115157U (en) * | 2020-05-13 | 2020-12-08 | 郑州跃博汽车电器有限公司 | Anti-interference system that security performance is high |
| CN213485247U (en) * | 2020-12-11 | 2021-06-18 | 上海伟世通汽车电子系统有限公司 | Power interface circuit structure |
-
2020
- 2020-12-11 CN CN202011456787.4A patent/CN112578210A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070296374A1 (en) * | 2006-06-07 | 2007-12-27 | Schneider Toshiba Inverter Europe Sas | Emc filtering device in a variable speed drive |
| CN203218059U (en) * | 2013-04-09 | 2013-09-25 | 宁波锦浪新能源科技有限公司 | Electromagnetic compatibility (EMC) filter integrated with common mode choke and differential mode chokes |
| CN106787684A (en) * | 2017-01-20 | 2017-05-31 | 武汉科技大学 | A kind of automobile instrument power source circuit |
| CN209659152U (en) * | 2019-04-30 | 2019-11-19 | 谢伟辉 | A kind of EMC power circuit applied to electromagnetic oven frequency converter |
| CN210120484U (en) * | 2019-06-06 | 2020-02-28 | 珠海市保时源光电科技有限公司 | EMC filter circuit |
| CN212115157U (en) * | 2020-05-13 | 2020-12-08 | 郑州跃博汽车电器有限公司 | Anti-interference system that security performance is high |
| CN213485247U (en) * | 2020-12-11 | 2021-06-18 | 上海伟世通汽车电子系统有限公司 | Power interface circuit structure |
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