CN112573894A - Low-temperature ceramic sintering powder process for chip packaging bonding - Google Patents
Low-temperature ceramic sintering powder process for chip packaging bonding Download PDFInfo
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Abstract
The invention discloses a low-temperature ceramic sintering powder process for chip packaging bonding, which comprises the following steps of S1: mixing solid materials required by the ceramic, adding water, and then grinding, wherein the step S2: standing the ground material, naturally drying the material into a powder cake, and then grinding the powder cake into powder by a grinder to obtain ceramic powder, wherein the step S3: mixing the ceramic powder obtained in the step S2 with a binder, and mixing to prepare a material, step S4: and (5) cold-pressing and molding the spare material into a blank through powder, and performing step S5: and then placing the molded sample into a multi-grade baking device for hot-pressing sintering, wherein the temperature in the furnace is 200-600 ℃, 600-1000 ℃ and 1000-1600 ℃ in sequence, and the step S6: after firing the shaping, cool off through natural forced air cooling mode, the encapsulation is accomplished, and through putting into the shaping sample and carrying out hot pressing sintering in the baking equipment of multilevel, along with rising step by step of temperature, the texture changes the back when can guaranteeing the blank to toast, and the level is clear, guarantees that blank shaping effect is better, guarantees ceramic powder quality.
Description
Technical Field
The invention relates to the technical field of chip packaging, in particular to a low-temperature ceramic sintering powder process for chip packaging bonding.
Background
The package for mounting semiconductor IC chip has the functions of holding, fixing, sealing, protecting chip and strengthening electrothermal performance, and is also the bridge for connecting the chip inside world and outer circuit, i.e. the connection points on the chip are connected to the pins of the package through wires on the printed circuit board, and these pins are connected to other devices. Therefore, the package plays an important role for both the CPU and other LSI integrated circuits;
since the low-temperature-sintered ceramic material can be co-fired with a low-melting-point metal material such as silver or copper having a low specific resistance, a multilayer ceramic substrate having excellent high-frequency characteristics can be formed, and is widely used as a substrate material for a high-frequency module in an information communication terminal, for example, and a so-called glass-ceramic composite system in which a B2O3 — SiO2 glass material is mixed into a ceramic material such as Al2O3 is generally used as the low-temperature-sintered ceramic material. In this system, since it is necessary to use a relatively expensive glass as a starting material and to contain a boron element which is easily volatilized at the time of firing, the composition of the obtained substrate is likely to be uneven;
in the existing sintering process, the sintering of ceramics can only be realized by a baking device with a single temperature, when the ceramic material is used, the blank molding temperature rapidly rises in a short time when a blank is molded, the blank molding effect is poor, and the product quality is influenced.
Disclosure of Invention
The invention aims to provide a process for bonding low-temperature ceramic sintering powder for chip packaging, which can ensure that the quality of a blank is well-arranged after the texture is changed during the blank baking along with the gradual rise of the temperature, ensure the better blank forming effect and ensure the quality of the ceramic powder.
The purpose of the invention can be realized by the following technical scheme:
a low-temperature ceramic sintering powder process for chip packaging bonding comprises the following steps;
step S1: mixing solid materials required by ceramics, adding water, and then crushing and grinding;
step S2: standing the ground material, naturally drying the material into powder cakes, grinding the powder cakes into powder by a grinder, and screening the powder cakes by using a screen until the particle fineness reaches 300-400 meshes to obtain ceramic powder;
step S3: mixing the ceramic powder obtained in the step S2 with a binder, and mixing to obtain a spare material;
step S4: cold pressing the spare material into blank;
step S5: and then placing the molded sample into a multi-grade baking device for hot-pressing sintering, wherein the temperature in the furnace is sequentially 200-600 ℃, 600-1000 ℃ and 1000-1600 ℃.
Step S6: and after firing and forming, cooling in a natural air cooling mode, and packaging.
As a further scheme of the invention: in the step S1, when the grinding is carried out in a three-roll grinder, the grinding time is 30-50 min.
As a further scheme of the invention: in the step S4, the filtering screen is 400 meshes, the stirring speed is 500 rpm, and the stirring time is 10 min.
As a further scheme of the invention: the multi-stage roasting apparatus in the step S5 includes: mount, rotating electrical machines, bake out furnace, rotary rod, sintering case, forced air cooling structure, drainage structure, carriage, chamber door, fretwork board, division board, mount, swing dish, swing motor, drive lever, passive pole, oscillating axle, air inlet fan, drainage fan, gas collecting channel, the bottom central point of mount puts and installs rotating electrical machines, install the rotary rod in rotating electrical machines's the pivot, the sintering case is installed in the cooperation in the pivot of rotary rod, the top side of mount is equal triangle position and installs three bake out furnace, there is the chamber door one side of sintering case through the hinge mounting, one side at the sintering case is installed to the carriage, forced air cooling structure and drainage structure are installed respectively to the both sides of carriage.
As a further scheme of the invention: the sintering box is divided into six fan-shaped chamber cavities with equal areas through the matching of the partition plates, and hollow plates are embedded at the bottoms of the three fan-shaped chamber cavities arranged at intervals in the sintering box.
As a further scheme of the invention: the bottom side of the sintering box is tangent to the top side surface of the baking furnace, and the top side wall of the baking furnace is provided with a through hole.
As a further scheme of the invention: the air cooling structure comprises a fixing frame, a swing disc, a swing motor, a driving rod, a driven rod, a swing shaft and an air inlet fan, wherein the air inlet fan is erected in the fixing frame through the matching of the swing shaft, the swing motor is installed on the top side of the fixing frame through the matching of bolts, the swing disc is installed on a rotating shaft of the swing motor, one end of the driving rod is installed on the end face eccentric position of the swing disc through the matching of pins, one end of the driven rod is welded on one side of the top of the swing shaft, and the other end of the driven rod is connected in a matched and inserted mode inside the other end of the driving rod.
As a further scheme of the invention: the drainage structure comprises a drainage fan and a gas collecting hood, the drainage fan is installed at a port of the gas collecting hood, and the gas collecting hood is of a conical structure.
As a further scheme of the invention: the fixed frame and the gas collecting hood are welded on two sides of the top of the conveying frame in a butt welding mode.
The invention has the beneficial effects that:
the method comprises the steps that a formed sample is placed into a multi-level baking device for hot-pressing sintering, a hollow plate with materials is rotationally transferred to a first baking furnace, the room temperature of the first baking furnace is 400 ℃, blank preheating can be achieved, after preheating, a sintering box continuously rotates, the blank is transferred to a second baking furnace, the room temperature in the second baking furnace is 800 ℃, primary heating is achieved, after baking, the sintering box continuously rotates, the blank is transferred to a third baking furnace, the room temperature is 1400 ℃, along with gradual temperature rise, the blank is well-arranged after texture change during baking, the blank forming effect is better, and the quality of ceramic powder is guaranteed;
through setting up forced air cooling structure and drainage structure cooperation operation, it is rotatory that swing motor drives the swinging tray, under the cooperation rotation of drive lever, the one end of passive pole is twitched in the drive lever, twitch the in-process, passive pole along with the drive lever wrench movement, at the wrench movement in-process, drive the air intake fan swing through the oscillating axle, can realize the multi-angle cooling of airing exhaust, enlarge the cooling surface, improve the cooling effect, in the forced air cooling, drainage fan operation, with the steam drainage, the warm island effect is avoided appearing, improve the cooling effect.
Drawings
In order to facilitate understanding for those skilled in the art, the present invention will be further described with reference to the accompanying drawings.
FIG. 1 is a front perspective view of the multi-stage baking apparatus according to the present invention;
FIG. 2 is a top perspective view of the multi-stage baking apparatus according to the present invention;
FIG. 3 is a front perspective view of the multi-stage baking apparatus according to the present invention;
FIG. 4 is a view showing the overall internal structure of the multi-stage roasting apparatus of the present invention;
FIG. 5 is a structural view of the area A in the overall internal structure of the multi-stage roasting apparatus of the present invention;
in the figure: 1. a fixed mount; 2. a rotating electric machine; 3. a baking oven; 4. rotating the rod; 5. sintering box; 6. an air-cooled structure; 7. a drainage structure; 8. a carriage; 9. a box door; 51. a hollowed-out plate; 52. a separator plate; 61. a fixed mount; 62. a wobble plate; 63. a swing motor; 64. a driving lever; 65. a passive rod; 66. a swing shaft; 67. an air intake fan; 71. a drainage fan; 72. and a gas-collecting hood.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the following embodiments, and it should be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1 to 5, the present invention provides a technical solution:
example (b):
a low-temperature ceramic sintering powder process for chip packaging bonding comprises the following steps;
comprises the following steps;
step S1: mixing solid materials required by ceramics, adding water, and then crushing and grinding;
step S2: standing the ground material, naturally drying the material into powder cakes, grinding the powder cakes into powder by a grinder, and screening the powder cakes by using a screen until the particle fineness reaches 300-400 meshes to obtain ceramic powder;
step S3: mixing the ceramic powder obtained in the step S2 with a binder, and mixing to obtain a spare material;
step S4: cold pressing the spare material into blank;
step S5: and then placing the molded sample into a multi-grade baking device for hot-pressing sintering, wherein the temperature in the furnace is sequentially 200-600 ℃, 600-1000 ℃ and 1000-1600 ℃.
Step S6: and after firing and forming, cooling in a natural air cooling mode, and packaging.
In an embodiment of the present invention, in S1, the ceramic material includes Mg2B2O5Powder, SiO2、TiO2And argil, wherein the mass ratio of the argil to the argil is 10: 2: 1: 15 mixing, grinding and adopting zirconium ball sanding.
In one embodiment of the present invention, the molding method in step S4 is a steel die cold press molding method.
As an embodiment of the present invention, the multi-stage roasting apparatus in step S2 includes: mount 1, rotating electrical machines 2, bake out furnace 3, rotary rod 4, sintering case 5, air-cooled structure 6, drainage structure 7, carriage 8, chamber door 9, fretwork board 51, division board 52, mount 61, swing dish 62, swing motor 63, active rod 64, passive pole 65, oscillating axle 66, air intake fan 67, drainage fan 71, gas collecting channel 72, rotating electrical machines 2 is installed to the bottom central point of mount 1, install rotary rod 4 in rotating electrical machines 2's the pivot, sintering case 5 is installed in the cooperation in the pivot of rotary rod 4, three bake out furnace 3 is installed to the triangle position such as the top side of mount 1, there is chamber door 9 one side of sintering case 5 through the hinged joint, carriage 8 installs one side at sintering case 5, air-cooled structure 6 and drainage structure 7 are installed respectively to the both sides of carriage 8, sintering case 5 divides into six fan-shaped chamber of equal area through division board 52 cooperation, hollow plates 51 are embedded at the bottoms of three sector chamber cavities arranged at intervals in the sintering box 5, the bottom side of the sintering box 5 is tangent with the top side surface of the baking furnace 3, the top side wall of the baking furnace 3 is provided with a through hole, when in work, the hollow plate 51 with the materials is rotationally transferred to the first baking oven 3, the room temperature of the first baking oven 3 is 400 ℃, the blank can be preheated, after preheating, the sintering box 5 continues to rotate, the blank is transferred to a second baking furnace 3, the room temperature in the second baking furnace 3 is 800 ℃, primary heating is realized, after baking, the sintering box 5 continues to rotate, the room temperature for transferring the blank to the third baking furnace 3 is 1400 ℃, the blank can be guaranteed to have distinct layers after the texture changes when being baked along with the gradual rise of the temperature, the blank forming effect is better, and the quality of the ceramic powder is guaranteed.
As an embodiment of the present invention, the air-cooling structure 6 includes a fixed frame 61, a swing disc 62, a swing motor 63, a driving rod 64, a driven rod 65, a swing shaft 66 and an air inlet fan 67, the swing motor 67 is mounted inside the fixed frame 61 through the swing shaft 66 in a matching manner, the swing motor 63 is mounted on the top side of the fixed frame 61 through a bolt in a matching manner, the swing disc 62 is mounted on a rotating shaft of the swing motor 63, one end of the driving rod 64 is mounted on an end face eccentric position of the swing disc 62 through a pin in a matching manner, one end of the driven rod 65 is welded on one side of the top of the swing shaft 66, the other end of the driven rod 65 is inserted into the other end of the driving rod 64 in a matching manner, the flow-guiding structure 7 includes a flow-guiding fan 71 and a gas-collecting hood 72, the flow-guiding fan 71 is mounted at a port, mount 61 and gas collecting hood 72 weld the dress relatively in the top both sides of carriage 8, in operation, swing motor 63 drives the rotation of swing dish 62, under the cooperation rotation of drive lever 64, the one end of driven lever 65 is twitched in drive lever 64, twitch the in-process, driven lever 65 twists with drive lever 64, at the wrench movement in-process, drive air intake fan 67 swing through oscillating shaft 66, can realize the multi-angle cooling of airing exhaust, enlarge the cooling surface, improve the cooling effect, in the forced air cooling, drainage fan 71 operation, with the steam drainage, the warm island effect is avoided appearing, improve the cooling effect.
When baking, the box door 9 is opened, the blank is placed on one of the hollow plates 51, then the rotating motor 2 rotates anticlockwise, the hollow plate 51 with the stored material is rotated and transferred onto the first baking furnace 3, the room temperature of the first baking furnace 3 is 400 ℃, preheating of the blank can be realized, after preheating, the sintering box 5 continues to rotate, the blank is transferred onto the second baking furnace 3, the room temperature in the second baking furnace 3 is 800 ℃, primary heating is realized, after baking, the sintering box 5 continues to rotate, the room temperature of the blank transferred onto the third baking furnace 3 is 1400 ℃, along with gradual rise of the temperature, the blank can be guaranteed to be well-graded after being baked, better blank forming effect is guaranteed, quality of ceramic powder is guaranteed, after sintering, the ceramic powder is placed on the conveying frame 8, when the ceramic powder slowly moves, swing motor 63, air inlet fan 67 and drainage fan 71 cooperation operation, swing motor 63 drives the rotation of swing dish 62, under the cooperation rotation of drive lever 64, the one end of driven lever 65 is twitched in drive lever 64, twitch the in-process, driven lever 65 is along with the drive lever 64 wrench movement, at the wrench movement in-process, drive air inlet fan 67 swing through oscillating shaft 66, can realize the cooling of airing exhaust of multi-angle, enlarge the cooling surface, improve the cooling effect, in the forced air cooling, drainage fan 71 operation, with the steam drainage, avoid appearing warm island effect, improve the cooling effect.
The preferred embodiments of the invention disclosed above are intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention. The invention is limited only by the claims and their full scope and equivalents.
Claims (9)
1. A low-temperature ceramic sintering powder process for chip packaging bonding is characterized by comprising the following steps;
step S1: mixing solid materials required by ceramics, adding water, and then crushing and grinding;
step S2: standing the ground material, naturally drying the material into powder cakes, grinding the powder cakes into powder by a grinder, and screening the powder cakes by using a screen until the particle fineness reaches 300-400 meshes to obtain ceramic powder;
step S3: mixing the ceramic powder obtained in the step S2 with a binder, and mixing to obtain a spare material;
step S4: cold pressing the spare material into blank;
step S5: and then placing the molded sample into a multi-grade baking device for hot-pressing sintering, wherein the temperature in the furnace is sequentially 200-600 ℃, 600-1000 ℃ and 1000-1600 ℃.
Step S6: and after firing and forming, cooling in a natural air cooling mode, and packaging.
2. The process of claim 1, wherein in S1, the ceramic material comprises Mg2B2O5Powder, SiO2、TiO2And argil, wherein the mass ratio of the argil to the argil is 10: 2: 1: 15 mixing, grinding and adopting zirconium ball sanding.
3. The low-temperature ceramic sintered powder process for chip packaging and bonding as claimed in claim 2, wherein the forming manner in step S4 is steel die cold press forming manner.
4. The process of claim 2, wherein the multi-stage baking device in step S2 comprises: mount (1), rotating electrical machines (2), bake out furnace (3), rotary rod (4), sintering box (5), forced air cooling structure (6) and drainage structure (7), rotating electrical machines (2) are installed to the bottom central point of mount (1), install rotary rod (4) in the pivot of rotating electrical machines (2), sintering box (5) are installed in the cooperation in the pivot of rotary rod (4), the top side of mount (1) is equal triangle position and installs three bake out furnace (3), there is chamber door (9) one side of sintering box (5) through the hinge mounting, one side in sintering box (5) is installed in carriage (8), forced air cooling structure (6) and drainage structure (7) are installed respectively to the both sides of carriage (8).
5. The process for chip packaging bonding low-temperature ceramic sintered powder according to claim 4, wherein the sintering box (5) is divided into six fan-shaped chamber cavities with equal area by matching with a partition plate (52), and hollow plates (51) are embedded at the bottoms of three fan-shaped chamber cavities arranged at intervals in the sintering box (5).
6. The process for chip packaging bonding low-temperature ceramic sintered powder according to claim 4, wherein the bottom side of the sintering box (5) is tangent to the top side of the baking oven (3), and the top side wall of the baking oven (3) is provided with a through hole.
7. The process for chip packaging bonding low-temperature ceramic sintered powder according to claim 4, wherein the air cooling structure (6) comprises a fixed frame (61), an air inlet fan (67) is erected inside the fixed frame (61) in a matching manner through a swing shaft (66), a swing motor (63) is installed on the top side of the fixed frame (61) in a matching manner through a bolt, a swing disc (62) is installed on a rotating shaft of the swing motor (63), one end of a driving rod (64) is installed on an end face eccentric position of the swing disc (62) in a matching manner through a pin, one end of a driven rod (65) is welded on one side of the top of the swing shaft (66), and the other end of the driven rod (65) is inserted inside the other end of the driving rod (64) in a matching manner.
8. The process for chip packaging bonding low-temperature ceramic sintered powder according to claim 4, wherein the flow guiding structure (7) comprises a flow guiding fan (71) and a gas collecting hood (72), the flow guiding fan (71) is installed at a port of the gas collecting hood (72), and the gas collecting hood (72) is of a conical structure.
9. The process for chip packaging and bonding low-temperature ceramic sintered powder according to claim 7, wherein the fixing frame (61) and the gas collecting hood (72) are oppositely welded on two sides of the top of the conveying frame (8).
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4165226A (en) * | 1977-03-29 | 1979-08-21 | Narumi China Corporation | Process for preparing an element of a dual-in-line ceramic package provided with a layer of sealing glass |
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| US4165226A (en) * | 1977-03-29 | 1979-08-21 | Narumi China Corporation | Process for preparing an element of a dual-in-line ceramic package provided with a layer of sealing glass |
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