CN112571197A

CN112571197A - Semiconductor ceramic protection equipment

Info

Publication number: CN112571197A
Application number: CN202011581286.9A
Authority: CN
Inventors: 刘雪珠
Original assignee: Guangzhou Yiyuanyuan Trading Co ltd
Current assignee: Li Sanyuan
Priority date: 2020-12-28
Filing date: 2020-12-28
Publication date: 2021-03-30

Abstract

The invention discloses a semiconductor ceramic protection device, which comprises a processing center, a controller, a driving box, an observation window, a powder discharge groove and an equipment box, wherein the upper end of the processing center is movably matched with the driving box, the upper end of the driving box is fixedly embedded with the controller, the observation window is fixed with the left end and the right end of the driving box through bolts, the lower end of the processing center is in clearance fit with the upper end of the equipment box, the powder discharge groove is nested and connected with the right end of the processing center, the powder discharge groove is welded and connected with the upper end of the equipment box, the processing center comprises a polisher, a protective cover, a rotary sleeve column, a construction bin and a fixed seat, the invention moves the powder discharge groove through the centrifugal force generated during rotation, a displacement rod of the powder discharge groove is upwards unfolded under the matching of a thrust block and a rolling wheel through the action of the centrifugal force, so that the internal hot air and ceramic dust are shunted through a shunting block, and meanwhile, the hot air in the grinding block is discharged, so that the problem that the grinding block adsorbs dust due to heating is avoided.

Description

Semiconductor ceramic protection equipment

Technical Field

The invention relates to the field of conductor ceramics, in particular to semiconductor ceramic protection equipment.

Background

The semiconductor ceramic is a functional ceramic material with wide application range, the electrical property of the material is very sensitive to external temperature, voltage and the like, and the material can accurately capture the change, so that the semiconductor ceramic is manufactured into various semiconductor components by modern people;

however, the prior art has the following defects: the current semiconductor ceramic protection equipment is the polishing equipment before semiconductor ceramic leaves the factory, in order to get rid of the unnecessary burr on semiconductor ceramic surface, make its ceramic surface smooth, make the protection to ceramic body, because the in-process of deburring polishing has ceramic powder to fall down, then the mill generates heat because of high-speed rotatory friction and produces static, adsorb the powder that falls on the mill surface easily, continue to polish semiconductor ceramic surface, thereby it is low to lead to the semiconductor ceramic surface smoothness that the processing came out, and then cause and descend semiconductor ceramic protection effect.

Disclosure of Invention

Aiming at the defects in the prior art, the invention aims to provide a semiconductor ceramic protection device, and solves the problem that in the prior art, the conventional semiconductor ceramic protection device is a polishing device before semiconductor ceramic leaves factory, in order to remove redundant burrs on the surface of the semiconductor ceramic and make the ceramic surface smooth and protect a ceramic body, ceramic powder falls off in the deburring and polishing process, a grinding disc generates heat due to high-speed rotating friction to generate static electricity, the falling powder is easily adsorbed on the surface of the grinding disc, and the surface of the semiconductor ceramic is continuously polished, so that the surface smoothness of the processed semiconductor ceramic is low, and the protection effect of the semiconductor ceramic is reduced.

In order to achieve the purpose, the invention is realized by the following technical scheme: a semiconductor ceramic protection device structurally comprises a processing center, a controller, a driving box, an observation window, a discharge groove and a device box, the upper end of the processing center is movably matched with the driving box, the upper end of the driving box is fixedly connected with the controller, the observation window is fixed with the left end and the right end of the driving box through bolts, the lower end of the machining center is in clearance fit with the upper end of the equipment box, the end discharge groove is connected with the right end of the machining center in a nested manner, the end discharge groove is connected with the upper end of the equipment box in a welded manner, the processing center comprises a polisher, a protective cover, a rotary sleeve column, a construction bin and a fixed seat, the polisher and the rotary sleeve column are integrally nested and matched, the bottom of the rotary sleeve column is movably matched with the upper end of the fixed seat, the two sides of the fixed seat are connected with the protective cover in a clamping way, the inside clearance fit with the construction storehouse of safety cover, the whole clearance fit of construction storehouse and burnishing machine.

The polishing device is further improved, the polishing device comprises a polishing barrel, a driving belt, a rotating machine, a fixed support and a rotating disc, the upper end of the polishing barrel is movably matched with the inside of the rotating disc, the upper end of the rotating disc is connected with the driving belt in a nested mode, the inner side of the driving belt is connected with the top end of a rotating machine in a meshed mode, the upper end of the rotating disc is connected with the fixed support in a spiral mode, and the two polishing barrels are driven to rotate through the rotating disc and are cylindrical integrally.

The polishing barrel is further improved, the polishing barrel comprises a polishing plate, a fixed disk, a movable sleeve ring and a powder scattering groove, the surface of the polishing plate is in clearance fit with the fixed disk, two sides of the polishing plate are connected with the powder scattering groove in a clamping manner, the powder scattering groove is in movable fit with the surface of the fixed disk, the movable sleeve ring is fixedly connected with the tail end of the powder scattering groove in an embedded manner, five polishing plates are arranged, the surface of each polishing plate is arc-shaped, and the tail end of each polishing plate is fixedly embedded in the inner wall of the movable sleeve ring.

The grinding plate is further improved, the grinding plate comprises grinding blocks, swing rods, springs, buffer blocks and limiting walls, the bottoms of the grinding blocks are connected with the upper ends of the swing rods in a welded mode, the centers of the swing rods are hinged to the buffer blocks, the upper ends of the buffer blocks are in clearance fit with the lower ends of the grinding blocks, the bottoms of the limiting walls are fixedly embedded in the springs, the bottoms of the swing rods are connected with the centers of the limiting walls in a welded mode, the buffer blocks are distributed in the centers of the two swing rods, and the bottoms of the grinding blocks are supported to buffer the grinding blocks.

The invention is further improved, the powder scattering groove comprises a drainage strip, a swing frame, a discharge groove, a flow distribution block and a clamping plate, the drainage strip is hinged with the surface of the discharge groove, the discharge groove is movably matched with two sides of the swing frame, the swing frame is in interference fit with the inner wall of the clamping plate, two sides of the flow distribution block are in clearance fit with the swing frame, the discharge groove is fixed on the inner side of the clamping plate and is movably matched with the clamping plate, the whole drainage strip is in a wave long strip shape, two groups of the drainage strips are arranged, one group of the drainage strips is three, and the drainage strips are distributed at the top end of the.

The invention is further improved, the swing frame comprises a movable bolt, a balance rope, a displacement rod, a rolling wheel and a thrust block, the movable bolt is hinged with the top end of the displacement rod, the balance rope is nested and connected with the surface of the movable bolt, the tail end of the displacement rod is in threaded connection with the thrust block, the rolling wheel is in sliding fit with the lower surface of the thrust block, the thrust block is provided with two blocks which are integrally in a crescent shape, and the upper end, the left end and the right end of the thrust block move through the fit of the displacement rod and the rolling wheel.

Advantageous effects

Compared with the prior art, the invention has the following beneficial effects;

1. according to the invention, the polishing barrel is used for removing burrs and polishing the surface of the semiconductor ceramic, the polishing barrel is used for integrally nesting the semiconductor ceramic for construction, and the grinding block can have an area change when contacting the grinding block, so that the inner swing rod is extruded to swing, the buffer block bears the grinding block, and the spring at the lower end is compressed, so that the buffer effect is achieved, the ceramic surface is ensured to be attached, and the polishing dead angle is effectively avoided in the polishing process.

2. The powder scattering groove is moved by centrifugal force generated during rotation, the displacement rod of the powder scattering groove is upwards unfolded under the action of the centrifugal force under the matching of the thrust block and the rolling wheel, so that hot air and ceramic dust in the powder scattering groove are shunted by the shunting block and are finally discharged from the discharge groove, the ceramic dust in the powder scattering groove is effectively discharged out of the construction cylinder, the hot air in the powder scattering groove is discharged, and the problem that the grinding block adsorbs the dust due to heating is avoided.

Drawings

FIG. 1 is a schematic structural diagram of a semiconductor ceramic protection device according to the present invention.

FIG. 2 is a schematic view of the internal structure of the machining center of the present invention.

Fig. 3 is a schematic view of the overall perspective structure of the polisher according to the present invention.

FIG. 4 is a schematic top view of a polishing cartridge according to the present invention.

Fig. 5 is a schematic view of the internal structure of the sanding plate of the present invention.

FIG. 6 is a schematic view of the internal structure of the powder scattering groove of the present invention.

FIG. 7 is a schematic view of the internal structure of the rocking arm of the present invention.

In the figure: machining center-1, controller-2, driving box-3, observation window-4, powder discharge groove-5, equipment box-6, polisher-11, protective cover-12, rotary sleeve column-13, construction bin-14, fixed seat-15, polishing cylinder-111, driving belt-112, rotating machine-113, fixed support-114, rotating disc-115, polishing plate-a 1, fixed disc-a 2, movable lantern ring-a 3, powder scattering groove-a 4, grinding block-a 11, swing rod-a 12, spring-a 13, buffer block-a 14, limit wall-a 15, drainage strip-b 1, swing frame-b 2, discharge groove-b 3, flow distribution block-b 4, clamping plate-b 5, movable bolt-c 1, balance rope-c 2, balance rope-b 2, and grinding plate-a-115, A displacement rod-c 3, a rolling wheel-c 4 and a thrust block-c 5.

Detailed Description

The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it is obvious that the described embodiments are some, not all embodiments of the present invention, and all other embodiments obtained by those skilled in the art without any inventive work based on the embodiments of the present invention belong to the protection scope of the present invention.

The invention is further described below with reference to the accompanying drawings:

example 1

As shown in figures 1 to 5:

the structure of the device comprises a processing center 1, a controller 2, a driving box 3, an observation window 4, a discharge groove 5 and an equipment box 6, wherein the upper end of the processing center 1 is movably matched with the driving box 3, the upper end of the driving box 3 is fixedly connected with the controller 2, the observation window 4 is fixed with the driving box 3 by bolts at the left end and the right end, the lower end of the processing center 1 is in clearance fit with the upper end of the equipment box 6, the discharge groove 5 is in nested connection with the right end of the processing center 1, the discharge groove 5 is in welded connection with the upper end of the equipment box 6, the processing center 1 comprises a polisher 11, a protective cover 12, a rotary sleeve column 13, a construction bin 14 and a fixed seat 15, the polisher 11 is in integral nested fit with the rotary sleeve column 13, the bottom of the rotary sleeve column is movably matched with the upper end of the fixed seat 15, the two sides of the fixed seat 15 are in clamped connection with, the construction bin 14 is in clearance fit with the polisher 11 as a whole.

The polisher 11 includes a polishing barrel 111, a driving belt 112, a rotating machine 113, a fixing support 114 and a rotating disc 115, the upper end of the polishing barrel 111 is movably matched with the inside of the rotating disc 115, the upper end of the rotating disc 115 is connected with the driving belt 112 in a nested manner, the inner side of the driving belt 112 is connected with the top end of the rotating machine 113 in a meshed manner, the upper end of the rotating disc 115 is connected with the fixing support 114 in a spiral manner, the two polishing barrels 111 are driven to rotate through the rotating disc 115 and are integrally cylindrical, and the polishing barrel 111 is beneficial to performing nested polishing on semiconductor ceramics needing burr removal polishing so as to enable surface polishing to be more comprehensive.

Wherein, polishing barrel 111 includes sanding board a1, fixed disk a2, activity lantern ring a3, scattered powder groove a4, sanding board a1 surface and fixed disk a2 clearance fit, sanding board a1 both sides are connected with scattered powder groove a4 block, scattered powder groove a4 and fixed disk a2 surface clearance fit, activity lantern ring a3 is connected with scattering the terminal embedment of powder groove a4, sanding board a1 is equipped with five altogether, and the surface is the arc, and the terminal embedment is at activity lantern ring a3 inner wall, wherein looses powder groove a4 and is favorable to carrying out the water conservancy diversion and inside heat dissipation to the ceramic powder under polishing, the polishing.

The grinding plate a1 comprises a grinding block a11, a swing rod a12, a spring a13, a buffer block a14 and a limiting wall a15, the bottom of the grinding block a11 is connected with the upper end of the swing rod a12 in a welding mode, the center of the swing rod a12 is connected with a buffer block a14 in a hinged mode, the upper end of the buffer block a14 is in clearance fit with the lower end of the grinding block a11, the bottom of the limiting wall a15 is connected with the spring a13 in an embedded mode, the bottom of the swing rod a12 is connected with the center of the limiting wall a15 in a welding mode, the buffer block a14 is distributed in the centers of the two swing rods a12, the bottom of the grinding block a11 is supported, the grinding block a11 of the grinding block a11 plays a buffering role, and the grinding block a11 is beneficial to wrapping semiconductor ceramics, so that the surface of the semiconductor ceramics is attached and polished under.

The specific working principle is as follows:

the invention lifts the protective cover 12 upwards through the controller 2, nests the semiconductor ceramic on the surface of the rotary sleeve column 13, puts down the protective cover 12, drives the drive belt 112 to rotate the rotary disc 115 under the rotation of the rotating machine 113 by the polisher 11, drives the polishing barrel 111 in a phase-changing manner, leads the polishing plate a1 in the polishing barrel 111 to remove burrs through the grinding block a11 and the semiconductor ceramic surface under the rotation drive, polishes the semiconductor ceramic surface, so as to extrude the internal displacement rod a12 and swing the internal displacement rod outwards and inwards as the contacted ceramic surface fluctuates, then is supported by the top end of the buffer block a14, ensures that the grinding block a11 can polish the ceramic end surfaces with different radians, the invention removes the burrs and polishes the semiconductor ceramic surface through the polishing barrel 111, the polishing barrel 111 is used for integral nesting construction, the grinding block a11 has area change when contacting with the semiconductor ceramic surface, therefore, the swing rod a12 in the polishing device is squeezed to swing, so that the buffer block a14 bears the grinding block a11 of the polishing device, and the spring a13 at the lower end is compressed, so that the buffering effect is achieved, the bonding with the ceramic surface is ensured, and the polishing dead angle is effectively avoided in the polishing process.

Example 2:

as shown in fig. 6 to 7:

the powder scattering groove a4 comprises a drainage strip b1, a swing frame b2, a discharge groove b3, a diversion block b4 and a clamping plate b5, the drainage strip b1 is hinged to the surface of the discharge groove b3, the discharge groove b3 is movably matched with two sides of a swing frame b2, the swing frame b2 is in interference fit with the inner wall of the clamping plate b5, two sides of the diversion block b4 are in clearance fit with the swing frame b2, the discharge groove b3 is fixed to the inner side of the clamping plate b5 and is movably matched with the clamping plate b, the drainage strip b1 is integrally in a wave-shaped long strip shape and is provided with two groups of three strips, the two groups of three strips are distributed at the top end of the discharge groove b3 in a swinging and hinged manner, wherein the swing frame b2 is favorable for swinging leftwards under the driving of centrifugal force so that the inside is sucked from the diversion block b4 and then guided to discharge.

The swing frame b2 comprises a movable bolt c1, a balance rope c2, a displacement rod c3, a rolling wheel c4 and a thrust block c5, the movable bolt c1 is hinged to the top end of the displacement rod c3, the balance rope c2 is nested and connected with the surface of a movable bolt c1, the tail end of the displacement rod c3 is in threaded connection with the thrust block c5, the rolling wheel c4 is in sliding fit with the lower surface of the thrust block c5, the thrust block c5 is provided with two blocks which are in a crescent shape integrally, the upper end and the left end and the right end of the movable bolt c3 are in movable fit with the rolling wheel c4, and the rolling wheel c4 facilitates the auxiliary thrust block c5 to smoothly cooperate with the swinging under the driving of centrifugal force to enable the movable bolt c1 to reach the unfolding state.

The specific working principle is as follows:

the invention triggers the powder scattering groove a4 by centrifugal force generated by the driving of rotation, so that the air in the powder scattering groove and ceramic powder are separated by the flow dividing block b4 under the driving of rotation, so that the movable bolt c1 is matched with the balance rope c2 to throw the left and right ends of the displacement rod c3 upwards under the driving of the centrifugal force, the thrust block c5 slides on the inner wall surface of the clamping plate b5 under the sliding of the rolling wheel c4, so that the swinging frame b2 is in an opening and closing state, and the matching of the rotating speed is added, so that air is discharged from the discharge groove b3 for flow guiding, so that the blowing drainage strip b1 swings left and right, the ceramic powder and the air discharged from the inside are scattered, the existence of the ceramic powder in the inside is reduced, the powder scattering groove a4 is moved by the centrifugal force generated during the rotation, the displacement rod c3 is matched with the rolling wheel c4 at the thrust block c5 under the action of the centrifugal force, upwards expand, make its inside hot-blast and ceramic dust shunt from reposition of redundant personnel piece b4, discharge from discharge tank b3 at last, inside the effectual inside ceramic dust discharge construction section of thick bamboo, also discharge inside hot-air simultaneously, avoided the abrasive brick because the problem of generating heat absorption dust.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein; any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. The utility model provides a semiconductor ceramic protection device, its structure includes machining center (1), controller (2), drive case (3), observation window (4), row end groove (5), equipment box (6), machining center (1) upper end and drive case (3) clearance fit, drive case (3) upper end is connected with controller (2) are built in, both ends bolt fastening about observation window (4) and drive case (3), machining center (1) lower extreme and equipment box (6) upper end clearance fit, arrange end groove (5) and machining center (1) right-hand member nested connection, arrange end groove (5) and equipment box (6) upper end welded connection, its characterized in that:

machining center (1) is including polisher (11), safety cover (12), rotatory cover post (13), construction storehouse (14), fixing base (15), polisher (11) and the whole nested cooperation of rotatory cover post (13), rotatory cover post (13) bottom and fixing base (15) upper end clearance fit, fixing base (15) both sides are connected with safety cover (12) block, inside and construction storehouse (14) clearance fit of safety cover (12), construction storehouse (14) and polisher (11) whole clearance fit.

2. A semiconductor ceramic protective apparatus according to claim 1, characterized in that: the polisher (11) comprises a polishing barrel (111), a driving belt (112), a rotating machine (113), a fixed support (114) and a rotating disc (115), the upper end of the polishing barrel (111) is movably matched with the inner portion of the rotating disc (115), the upper end of the rotating disc (115) is connected with the driving belt (112) in a nested mode, the inner side of the driving belt (112) is connected with the top end of the rotating machine (113) in a meshed mode, and the upper end of the rotating disc (115) is connected with the fixed support (114) in a spiral mode.

3. A semiconductive ceramic protective apparatus according to claim 2, wherein: polishing barrel (111) are including polishing board (a1), fixed disk (a2), activity lantern ring (a3), loose powder groove (a4), polish board (a1) surface and fixed disk (a2) clearance fit, polish board (a1) both sides and loose powder groove (a4) block and be connected, loose powder groove (a4) and fixed disk (a2) surface activity fit, activity lantern ring (a3) is connected with the terminal embedded solid of loosing powder groove (a 4).

4. A semiconductive ceramic protective apparatus according to claim 3, wherein: the grinding plate (a1) comprises a grinding block (a11), a swing rod (a12), a spring (a13), a buffering block (a14) and a limiting wall (a15), wherein the bottom of the grinding block (a11) is connected with the upper end of the swing rod (a12) in a welded mode, the center of the swing rod (a12) is hinged to the buffering block (a14), the upper end of the buffering block (a14) is in clearance fit with the lower end of the grinding block (a11), the bottom of the limiting wall (a15) is fixedly embedded in the spring (a13), and the bottom of the swing rod (a12) is connected with the center of the limiting wall (a15) in a welded mode.

5. A semiconductive ceramic protective apparatus according to claim 3, wherein: powder scattering groove (a4) includes drainage strip (b1), rocking frame (b2), discharge slot (b3), reposition of redundant personnel piece (b4), cardboard (b5), drainage strip (b1) and discharge slot (b3) surface hinge are connected, discharge slot (b3) and rocking frame (b2) both sides clearance fit, rocking frame (b2) and cardboard (b5) inner wall interference fit, reposition of redundant personnel piece (b4) both sides and rocking frame (b2) clearance fit, discharge slot (b3) are fixed at cardboard (b5) inboard rather than clearance fit.

6. The apparatus for protecting a semiconductive ceramic, according to claim 5, wherein: the rocking frame (b2) comprises a movable bolt (c1), a balance rope (c2), a displacement rod (c3), a rolling wheel (c4) and a thrust block (c5), wherein the movable bolt (c1) is hinged to the top end of the displacement rod (c3), the balance rope (c2) is connected with the movable bolt (c1) in a surface nesting mode, the tail end of the displacement rod (c3) is connected with the thrust block (c5) in a threaded mode, and the rolling wheel (c4) is in sliding fit with the lower surface of the thrust block (c 5).