CN112567523A - Display device and method for manufacturing the same - Google Patents

Display device and method for manufacturing the same Download PDF

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Publication number
CN112567523A
CN112567523A CN201980054133.8A CN201980054133A CN112567523A CN 112567523 A CN112567523 A CN 112567523A CN 201980054133 A CN201980054133 A CN 201980054133A CN 112567523 A CN112567523 A CN 112567523A
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CN
China
Prior art keywords
light emitting
substrate
inorganic light
display device
encapsulation layer
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CN201980054133.8A
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Chinese (zh)
Inventor
朴元淳
李泽模
尹正勋
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Samsung Electronics Co Ltd
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Samsung Electronics Co Ltd
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Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Priority claimed from PCT/KR2019/010405 external-priority patent/WO2020040483A1/en
Publication of CN112567523A publication Critical patent/CN112567523A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

A display device, comprising: a plurality of unit modules; and a cover configured to support the plurality of unit modules. Each of the plurality of unit modules includes: a substrate; a plurality of inorganic light emitting diodes disposed on the mounting surface of the substrate; and an encapsulation layer formed on the mounting surface of the substrate to cover the plurality of inorganic light emitting diodes and the mounting surface of the substrate. The encapsulation layer includes a viscoelastic material having a viscoelastic property that varies based on a temperature applied to the viscoelastic material.

Description

Display device and method for manufacturing the same
Technical Field
The present disclosure relates to a display device capable of directly displaying an image by coupling a plurality of modules to each other, each of which includes self-luminous inorganic light emitting diodes, is mounted on a substrate, and a method of manufacturing the same.
Background
A display apparatus is a type of output device that visually displays information such as characters, graphics, and images. There is an increasing demand for high-brightness, high-resolution, large-sized, high-efficiency, and low-power display devices. Accordingly, Organic Light Emitting Diode (OLED) panels have become increasingly popular as new display devices replacing Liquid Crystal Displays (LCDs). However, the OLED panel has some limitations, such as high price due to low production yield, low reliability of a large-sized panel, and durability against external environments such as water.
In view of the known limitations of LCD panels and OLED panels, and supplementing them, research has been conducted to develop new techniques for manufacturing panels by directly mounting inorganic light emitting diodes emitting red (R), green (G), and blue (B) light on a substrate.
Inorganic light emitting display technology has its own challenges in transferring very small size inorganic light emitting diodes (having dimensions of a few microns to hundreds of microns) from a wafer to a substrate. In addition, even after the inorganic light emitting diodes are mounted, challenges still exist in physically protecting the inorganic light emitting diodes from affecting the display with optical distortion and optical loss. Even further, there is a need for a technique that can improve image quality in addition to simply protecting the image.
Disclosure of Invention
[ problem ] to provide a method for producing a semiconductor device
An aspect of the present disclosure is to provide a packaging technique capable of physically protecting an inorganic light emitting diode having a size of several micrometers to several hundred micrometers after transferring the inorganic light emitting diode from a wafer to a substrate and improving image quality, a method of manufacturing a display device including the packaging technique, and a display device according to the packaging technique.
Another aspect of the present disclosure is to provide a packaging technology capable of preventing a view of a seam between unit modules adjacent to each other when a large screen is implemented by arranging the unit modules in a matrix, a method of manufacturing a display device including the packaging technology, and a display device according to the packaging technology.
Another aspect of the present disclosure is to provide a packaging technique capable of easily repairing a defective inorganic light emitting diode even after packaging a plurality of inorganic light emitting diodes, and a display device including the same.
Additional aspects of the disclosure will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the disclosure.
[ technical solution ] A
According to an aspect of the present disclosure, a method of manufacturing a display device includes: mounting a plurality of inorganic light emitting diodes on a mounting surface of a substrate; forming an encapsulation layer including a viscoelastic material on the mounting surface of the substrate to cover the plurality of inorganic light emitting diodes and the mounting surface of the substrate; assembling a plurality of unit modules including a first unit module and a second unit module adjacent to each other, each of the plurality of unit modules including a substrate, a plurality of inorganic light emitting diodes, and an encapsulation layer, the first unit module and the second unit module having a gap disposed between the first unit module and the second unit module; and changing viscoelasticity of the first encapsulation layer of the first unit module and the second encapsulation layer of the second unit module to visually conceal the seam. Mounting the plurality of inorganic light emitting diodes may include: separating the plurality of inorganic light emitting diodes from the wafer; and transferring the plurality of inorganic light emitting diodes separated from the wafer onto a substrate.
The shorter side of each of the plurality of inorganic light emitting diodes may have a size of 100 μm or less.
The viscoelastic material may include at least one of a vinyl polymer, an acetate polymer, an ethylene-vinyl acetate polymer, an olefin polymer, or an acrylic polymer.
Upon heating the viscoelastic material and reaching a predetermined temperature, the viscoelasticity of the viscoelastic material can be reduced, and the viscoelastic material can acquire fluidity.
Forming the encapsulation layer may include: forming a viscoelastic material in a film or sheet; and laminating the film or sheet on the substrate.
Forming the encapsulation layer may include laminating the viscoelastic material on the substrate while applying heat and pressure in a vacuum state. Forming the encapsulation layer may include placing a compensation layer on the encapsulation layer to planarize the encapsulation layer.
The method may further include removing the compensation layer after the encapsulation layer is cured.
The substrate may include: a glass substrate; and a Thin Film Transistor (TFT) layer formed on the glass substrate and configured to drive the plurality of inorganic light emitting diodes.
Assembling the plurality of unit modules may include arranging the plurality of unit modules in a matrix.
According to another aspect of the present disclosure, a display device includes a plurality of unit modules; and a cover configured to support the plurality of unit modules. Each of the plurality of unit modules may include: a substrate; a plurality of inorganic light emitting diodes disposed on the mounting surface of the substrate; and an encapsulation layer formed on the mounting surface of the substrate to cover the plurality of inorganic light emitting diodes and the mounting surface of the substrate. The encapsulation layer may include a viscoelastic material having a viscoelastic property that varies based on a temperature applied to the viscoelastic material.
Upon heating the viscoelastic material and reaching a predetermined temperature, the viscoelasticity of the viscoelastic material can be reduced, and the viscoelastic material can acquire fluidity.
The viscoelastic material may include at least one of a vinyl polymer, an acetate polymer, an ethylene-vinyl acetate polymer, an olefin polymer, or an acrylic polymer.
The substrate may include: a glass substrate; and a Thin Film Transistor (TFT) layer formed on the glass substrate and configured to drive the plurality of inorganic light emitting diodes.
A plurality of unit modules may be arranged in a matrix.
By applying heat to the encapsulation layers of the plurality of unit modules, the seams between the plurality of unit modules adjacent to each other may be visually hidden.
The display device may further include a compensation layer formed on the encapsulation layer to improve the flatness of the encapsulation layer.
The display device may further include a frame disposed between the plurality of unit modules and the cover and coupled to the plurality of unit modules.
According to another aspect of the present disclosure, a display device includes a plurality of unit modules; and a cover configured to support the plurality of unit modules. Each of the plurality of unit modules may include: a substrate; at least one inorganic light emitting diode package mounted on a mounting surface of a substrate, the at least one inorganic light emitting diode package comprising: an inorganic light emitting diode; and a molding resin configured to surround the inorganic light emitting diodes, respectively; and an encapsulation layer formed on the mounting surface of the substrate to cover the at least one inorganic light emitting diode package and the mounting surface of the substrate. The encapsulation layer may include a viscoelastic material having a viscoelastic property that varies based on a temperature applied to the viscoelastic material.
According to another aspect of the present disclosure, a display device includes a first unit module including: a first substrate; a plurality of first inorganic light emitting diodes disposed on the first mounting surface of the first substrate; and a first encapsulation layer formed on the first mounting surface of the first substrate to cover the plurality of first inorganic light emitting diodes and the first mounting surface of the first substrate; a second unit module, the first unit module and the second unit module being adjacent to each other with a gap therebetween, the second unit module including: a second substrate; a plurality of second inorganic light emitting diodes disposed on the second mounting surface of the second substrate; and a second encapsulation layer formed on the second mounting surface of the second substrate to cover the plurality of second inorganic light emitting diodes and the second mounting surface of the second substrate; a cover configured to support the first unit module and the second unit module. By changing the viscoelasticity of each of the first and second encapsulation layers, the joint between the first and second unit modules is visually hidden.
The viscoelasticity of each of the first encapsulation layer and the second encapsulation layer may be reduced and the viscoelasticity material of each of the first encapsulation layer and the second encapsulation layer may obtain fluidity based on heating the viscoelasticity material of each of the first encapsulation layer and the second encapsulation layer and reaching a predetermined temperature.
The viscoelastic material of each of the first and second encapsulation layers may include at least one of a vinyl polymer, an acetate polymer, an ethylene vinyl acetate polymer, an olefin polymer, or an acrylic polymer.
The display device may further include a compensation layer formed on the first and second encapsulation layers to improve flatness of the first and second encapsulation layers.
[ PROBLEMS ] the present invention
A large number of unit modules can be smoothly assembled and thus a large screen size satisfying consumer demands can be provided.
Although the packaging process on the inorganic light emitting diode is completed, it is possible to find a defective inorganic light emitting diode and easily replace the defective inorganic light emitting diode, thereby improving durability and reliability of the display device.
Drawings
Fig. 1 is a perspective view of a display device according to an embodiment;
fig. 2 is an exploded view of components of a display device according to an embodiment;
fig. 3 is a front view showing a state in which a plurality of unit modules are arranged in a matrix (encapsulation layer is omitted) according to the embodiment;
FIG. 4 is a front view of a single unit module (with encapsulation layers omitted) according to an embodiment;
fig. 5 is a sectional view of a single unit module according to an embodiment of the present disclosure, the sectional view being taken along line I-I in fig. 4 (with an encapsulation layer omitted);
fig. 6 is a sectional view of a unit module on which an encapsulation layer is formed according to an embodiment;
fig. 7 is a view of a mounting structure of an inorganic light emitting diode according to an embodiment;
FIG. 8 is a view of a unit module on which a compensation layer is formed to improve flatness of an encapsulation layer after the encapsulation layer is formed according to an embodiment;
fig. 9 is a view of a plurality of unit modules adjacent to each other according to an embodiment;
fig. 10 is a view of a display apparatus in which a seam between a plurality of unit modules is visually removed by applying heat to an encapsulation layer according to an embodiment;
fig. 11 is a view illustrating an operation of removing a partial region of the encapsulation layer on the upper surface of the defective inorganic light emitting diode according to the embodiment;
fig. 12 is a view illustrating a state where a partial region of the encapsulation layer on the upper surface of the defective inorganic light emitting diode is removed according to the embodiment;
fig. 13 is a view illustrating a state in which a defective inorganic light emitting diode is replaced with a repaired inorganic light emitting diode according to an embodiment;
fig. 14 is a flowchart illustrating a method of manufacturing a display device according to an embodiment;
fig. 15 is a flowchart illustrating a repair method of a display apparatus according to an embodiment; and
fig. 16 is a sectional view of a unit module of a display device according to another exemplary embodiment.
Detailed Description
The embodiments described in the present disclosure and the configurations shown in the drawings are merely examples of the present disclosure, and may be modified in various different ways to replace the embodiments and drawings of the present disclosure at the time of filing the present application.
The singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. The shapes and dimensions of elements in the figures may be exaggerated for clarity.
In the present disclosure, the terms "comprises," "comprising," "has," "having," and the like, are used to specify the presence of stated features, integers, steps, operations, elements, components, or groups thereof, but do not preclude the presence or addition of one or more other features, elements, steps, operations, elements, components, or groups thereof.
The present disclosure will now be described more fully hereinafter with reference to the accompanying drawings.
Fig. 1 is a perspective view of a display device 1 according to an embodiment of the present disclosure. Fig. 2 is an exploded view of the components of the display device 1 according to an embodiment of the present disclosure.
Referring to fig. 1 and 2, a display apparatus 1 is an output device for displaying information and data in the form of characters, features, graphics, and images. For example, the display apparatus may be implemented as a Television (TV), a Personal Computer (PC), a mobile device, and a digital signage. The display device may be mounted on the ground through a bracket (not shown) or may be mounted on a wall.
According to an embodiment, as shown in fig. 2, the display device 1 may include: a plurality of unit modules 30A to 30L for displaying images; a frame 21 supporting the plurality of unit modules 30A to 30L; and a rear cover 10 covering a rear surface of the frame 21. The rear cover 10 may form a rear surface of the display device 1.
The plurality of unit modules 30A to 30L may be arranged in an M × N matrix in the up, down, left, and right directions so as to be adjacent to each other. According to the embodiment, twelve (12) unit modules 30A to 30L are mounted on the frame 21 in the form of a 4 × 3 matrix, but the number and type of the plurality of unit module arrangements are not limited thereto. Accordingly, the number and type of the plurality of unit module arrangements may be modified based on design intent.
The plurality of unit modules 30A to 30L may be mounted on the frame 21 by various known methods (e.g., magnetic force using magnets or mechanical assembly structure).
The display device 1 may further include: a control board 25 for driving the plurality of unit modules 30A to 30L; and a power supply device (not shown) for supplying power to the plurality of unit modules 30A to 30L.
The plurality of unit modules 30A to 30L may be planar or curved. Further, the curvature thereof may vary according to design intent.
A cover glass 2 configured to protect and support the plurality of unit modules 30A to 30L may be attached to a front surface of each of the plurality of unit modules 30A to 30L. An optical film (not shown) configured to improve optical performance may be disposed between the cover glass 2 and the plurality of unit modules 30A to 30L. For example, a circular polarizing film, a linear polarizing film, a phase difference film (retardation film), an AG/LR/AR/HC film, and a Neutral Density (ND) film for improving image quality may be used alone as the optical film, or alternatively, two or more of them may be laminated and used as the optical film.
Fig. 3 is a front view illustrating a state in which a plurality of unit modules 30A to 30L are arranged in a matrix according to an embodiment of the present disclosure. Fig. 4 is a front view of a unit module 30A among a plurality of unit modules 30A to 30L according to an embodiment of the present disclosure. Fig. 5 is a sectional view of a single unit module according to an embodiment of the present disclosure, the sectional view being taken along line I-I in fig. 4. In fig. 3-5, the encapsulation layer is omitted. Fig. 7 is a view illustrating a mounting structure of an inorganic light emitting diode according to an embodiment of the present disclosure.
Referring to fig. 3 to 5 and 7, each of the plurality of unit modules 30A to 30L may include a substrate 40 and a plurality of inorganic light emitting diodes 50 mounted on a mounting surface 41 of the substrate 40.
The substrate 40 may be formed of materials such as Polyimide (PI), FR4, and glass. On the mounting surface 41 of the substrate 40, substrate electrodes 44 and 45 electrically connected to the plurality of inorganic light emitting diodes 50 may be formed.
The substrate 40 may include a base substrate 42 and a Thin Film Transistor (TFT) layer 43 formed on the base substrate 42 to drive the inorganic light emitting diode 50 among the plurality of inorganic light emitting diodes 50. The base substrate 42 may include a glass substrate. That is, the substrate 40 may include a Chip On Glass (COG) type substrate.
The inorganic light emitting diode 50 may be formed of an inorganic material. Accordingly, the inorganic light emitting diode 50 may have increased durability and a longer life span as compared to an Organic Light Emitting Diode (OLED) based on an organic material, and the inorganic light emitting diode 50 may have power efficiency several times greater than that of the OLED.
The plurality of inorganic light emitting diodes 50 may include red inorganic light emitting diodes 51, green inorganic light emitting diodes 52, and blue inorganic light emitting diodes 53. For example, as shown in fig. 5, a plurality of inorganic light emitting diodes 50 may be formed by mounting a series of red inorganic light emitting diodes 51, green inorganic light emitting diodes 52, and blue inorganic light emitting diodes 53 as a unit on a substrate 40. The red inorganic light emitting diode 51, the green inorganic light emitting diode 52, and the blue inorganic light emitting diode 53 may together form a single pixel.
As shown, the red, green, and blue inorganic light emitting diodes 51, 52, and 53 may be arranged in a row at predetermined intervals, but may be arranged in a different arrangement.
A plurality of inorganic light emitting diodes 50 may be picked up from a source wafer and transferred onto a substrate 40. The plurality of inorganic light emitting diodes 50 may be picked up and transferred by an electrostatic method using an electrostatic head, a stamp bonding (stamp bonding) method using an elastic polymer such as Polydimethylsiloxane (PDMS) or silicon (Si) as a head, or laser ablation transfer. The width, length, and height of each of the plurality of inorganic light emitting diodes 50 may have a size of several micrometers to several hundred micrometers, and the size of the shorter side (in a plan view) of the width and length of the micro inorganic light emitting diode may be 100 μm or less.
The plurality of inorganic light emitting diodes 50 may include first and second diode electrodes 57a and 57b, and be formed in a flip chip form, wherein the first and second diode electrodes 57a and 57b are disposed at a side opposite to a light emitting direction of the plurality of inorganic light emitting diodes 50. That is, the first and second diode electrodes 57a and 57b may be formed on the bottom surface 56 of the inorganic light emitting diode 50. The first diode electrode 57a and the second diode electrode 57b of each of the plurality of inorganic light emitting diodes 50 may be connected to the substrate electrodes 44 and 45 of the substrate 40 by soldering 46. Alternatively, the first and second diode electrodes 57a and 57b of the inorganic light emitting diode 50 may be connected to the substrate electrodes 44 and 45 of the substrate 40 through an anisotropic conductive film including fine conductive particles.
In addition, the inorganic light emitting diode 50 may be a lateral type or a vertical type, and may be connected to the substrate electrodes 44 and 45 through a wire.
Fig. 6 is a sectional view of a unit module 30A (of a plurality of unit modules 30A to 30L) on which an encapsulation layer is formed according to an embodiment of the present disclosure.
Referring to fig. 6 and 7, after the plurality of inorganic light emitting diodes 50 are mounted on the substrate 40, an encapsulation layer 60 may be formed on the substrate 40 to physically protect the plurality of inorganic light emitting diodes 50 from optical distortion.
The related art encapsulation layer is formed of a transparent molding material such as epoxy or silicon, or an adhesion promoter or adhesive such as Optically Clear Adhesive (OCA) or Optically Clear Resin (OCR).
According to an embodiment, as shown in fig. 6, the encapsulation layer 60 includes a viscoelastic material having viscoelasticity and a curing degree that vary according to a change in temperature or pressure, so as to physically sufficiently protect the inorganic light emitting diode 50 and improve image quality.
The viscoelastic material in the encapsulating layer 60 may include at least one of a vinyl polymer, an acetate polymer, an ethylene vinyl acetate polymer, an olefin polymer, or an acrylic polymer.
When the viscoelastic material of the encapsulation layer 60 is heated and reaches a predetermined temperature, the viscoelasticity thereof may be reduced, and the viscoelastic material may have fluidity. The application of heat to the viscoelastic material may be performed by using ultraviolet light or infrared light. The temperature at which the viscoelastic material has fluidity may be about 80 ℃ to about 120 ℃, but is not limited thereto. When the temperature of the viscoelastic material exceeds 120 ℃, the viscoelasticity may increase again, and the viscoelastic material may be cured. In addition to applying heat to the viscoelastic material, the viscoelastic material may also be cured by adding a hardener thereto.
Viscoelastic materials may have a refractive index between 0.5 and 1.8, and the refractive index may be controlled by using polymer particles such as fillers and beads.
The viscoelastic material may include, for example, a material that exhibits color by a pigment or dye. In particular, the viscoelastic material may comprise a black material. By adjusting the black color, the transmittance can be controlled and the luminance and the reflectance can be controlled according to the transmittance.
For example, the viscoelastic material may include black organic materials, black inorganic materials, and black metals, for example, carbon black, polyolefin-based pigments, azo-based pigments, azomethine-based pigments, diammonium-based pigments, phthalocyanine-based pigments, quinone-based pigments, indigo-based pigments, thioindigo-based pigments, dioxin-based pigments, quinacridone-based pigments, isoindolinone-based pigments, metal oxides, metal complexes, and aromatic hydrocarbons.
The encapsulation layer 60 may be formed by laminating a viscoelastic material on the substrate 40 through a lamination process.
That is, the encapsulation layer 60 may be formed by forming a viscoelastic material in the form of a film or sheet having a uniform thickness and laminating the viscoelastic material on the substrate 40. In a vacuum state, heat and pressure may be applied while the viscoelastic material adheres to the substrate 40. The lamination process may make the thickness of the encapsulation layer uniform and may prevent the generation of bubbles in the encapsulation layer 60, thereby improving the image quality of the display device.
The encapsulation layer 60 may be formed to surround the outer surface including the upper surface 54 and the side surfaces 55 of each of the plurality of inorganic light emitting diodes 50. The encapsulation layer 60 may be formed to cover the entire area of the mounting surface 41 of the substrate 40 so as to cover all of the inorganic light emitting diodes 50 mounted on the substrate 40. That is, the encapsulation layer 60 may be formed in the entire area of the mounting surface 41 of the substrate 40 so as to have a size corresponding to that of the substrate 40. In addition, as will be described later, it is appropriate that the encapsulation layer 60 have a size corresponding to that of the substrate 40, so that seams between a plurality of adjacent unit modules are visually and effectively removed.
Fig. 8 is a view of a unit module 30A (of a plurality of unit modules 30A-30L) on which a compensation layer 70 is formed to improve the flatness of an encapsulation layer 60 after the encapsulation layer 60 is formed, according to an embodiment of the present disclosure.
Referring to fig. 8, forming the encapsulation layer 60 may include placing a compensation layer 70 on the encapsulation layer 60 including the viscoelastic material such that the encapsulation layer 60 is more evenly formed. That is, after the compensation layer 70 is placed on the encapsulation layer 60 comprising the viscoelastic material, the encapsulation layer 60 and the compensation layer 70 may be stacked on top of each other, which will flatten the encapsulation layer 60. The compensation layer 70 may include a film or glass. Accordingly, the encapsulation layer 60 may be formed to have a uniform thickness as a whole.
A release agent may be disposed between the compensation layer 70 and the encapsulation layer 60, and thus the compensation layer 70 may be removed after the encapsulation layer 60 is cured.
When the film or glass is left, the film may include an optical film used in a related art display device, for example, cellulose Triacetate (TAC), polyethylene terephthalate (PET), and Cyclic Olefin Polymer (COP). These films can improve polarization, phase, transmission, reflection, and haze. The thickness of the film may be in the range of 3 μm to 500 μm. The thickness of the glass may be in the range of 1 μm to 7000 μm. The thicknesses of the film and the glass may be selected to adjust the boundaries between the plurality of unit modules 30A to 30L.
Fig. 9 is a view of a plurality of unit modules 30A to 30L adjacent to each other according to an embodiment of the present disclosure. Fig. 10 is a view of the display device 1 that visually hides the joints between the plurality of unit modules 30A to 30L by applying heat to the encapsulation layer according to an embodiment of the present disclosure. The seam is visually recognized through physical gaps between the plurality of unit modules.
As shown in fig. 9, a fine interval may be formed between the plurality of unit modules 30A to 30L adjacent to each other. For example, a gap may be formed between the adjacent unit modules 30A and 30B. Therefore, the seam can be visually recognized through the gap.
In order to improve the image quality, the seam G needs to be visually removed. According to the embodiment of the present disclosure, after assembling the adjacent unit modules 30A and 30B adjacent to each other together, heat may be applied to the encapsulation layer 60 of the adjacent unit modules 30A and 30B, and thus the seam G between the adjacent unit modules 30A and 30B adjacent to each other may be hidden.
When heat is applied to the surface joints of the adjacent unit modules 30A and 30B, viscoelasticity of the viscoelastic material contained in the encapsulation layer 60 is reduced and fluidity is obtained, and then the viscoelastic material sticks together while flowing, thereby visually removing the joints G. That is, the seam G may be hidden. After visually removing seam G, the viscoelastic material may be further heated or a hardener may be added, thereby curing encapsulation layer 60 again.
Fig. 14 is a flowchart illustrating a method of manufacturing the display device 1 according to an embodiment of the present disclosure.
Referring to fig. 14, a method of manufacturing a display device according to an embodiment of the present disclosure will be described below.
First, a plurality of inorganic light emitting diodes 50 are mounted on the substrate 40 (S110).
Next, an encapsulation layer 60 including a viscoelastic material is formed on the substrate 40 so as to cover the plurality of inorganic light emitting diodes 50 (S120).
Next, a plurality of unit modules each including the substrate 40, the plurality of inorganic light emitting diodes 50, and the encapsulation layer 60 are prepared and assembled to be adjacent to each other (S130).
The seams between the plurality of unit modules adjacent to each other are visually hidden by applying heat to the surface boundaries of the plurality of unit modules adjacent to each other (S140).
Fig. 11 is a view illustrating an operation of removing a partial region 61 of the encapsulation layer 60 on the upper surface of the defective inorganic light emitting diode 58 according to an embodiment of the present disclosure. Fig. 12 is a view illustrating a state where a partial region 61 of the encapsulation layer 60 on the upper surface of the defective inorganic light emitting diode 58 is removed according to an embodiment of the present disclosure. Fig. 13 is a view illustrating a state in which a defective inorganic light emitting diode 58 is replaced with a substitute inorganic light emitting diode 59 according to an embodiment of the present disclosure. Fig. 15 is a flowchart illustrating a method of repairing the display device 1 according to an embodiment of the present disclosure.
Hereinafter, description will be provided with reference to fig. 11 to 13 and 15. Because the encapsulation layer 60 includes a viscoelastic material, the display device 1 according to the embodiment of the present disclosure may easily replace the defective inorganic light emitting diode 58 even after the encapsulation layer 60 is formed on the plurality of inorganic light emitting diodes 50.
That is, after the lighting test is performed on the plurality of inorganic light emitting diodes 50 (S210), when a defective inorganic light emitting diode 58 that cannot be turned on is detected, the partial region 61 of the encapsulation layer 60 placed on the upper surface of the defective inorganic light emitting diode 58 is removed (S220).
Removing the partial region 61 of the encapsulation layer 60 may include irradiating a laser beam 91 on the partial region 61 of the encapsulation layer 60. Specifically, referring to fig. 11, the laser oscillator 90 may be moved to a region above the partial region 61 of the encapsulation layer 60 to irradiate the laser beam 91.
When the partial region 61 of the encapsulation layer 60 located above the defective inorganic light emitting diode 58 is removed, the defective inorganic light emitting diode 58 is removed from the substrate 40, and a new replacement inorganic light emitting element 59 is mounted at the position (S230).
Alternatively, a new replacement inorganic light emitting diode 59 may be installed in the adjacent area without removing the defective inorganic light emitting diode 58.
Next, heat is applied to the encapsulation layer 60 to remove defects in the encapsulation layer 60 (S240). When heat is applied to the encapsulation layer 60, the viscoelasticity of the viscoelastic material of the encapsulation layer 60 decreases and acquires fluidity. The viscoelastic material then flows, removing defects from the encapsulation layer 60. After the defect is removed, the viscoelastic material may be further heated or a hardener may be added, thereby curing the encapsulation layer 60 again.
Fig. 16 is a sectional view of a unit module 30A of the display device 1 according to another embodiment of the present disclosure.
A unit module 30A of the display device 1 according to another embodiment of the present disclosure will be described with reference to fig. 16. The same reference numerals are assigned to the same components as those of the above-described embodiment, and the description thereof will be omitted.
Unlike the above-described embodiment, each of the unit modules 30A to 30L may include a substrate 40 and a plurality of inorganic light emitting diode packages 250 mounted on the mounting surface 41 of the substrate 40.
That is, according to the previous embodiment in fig. 5 to 7, a plurality of inorganic light emitting diodes 50 are mounted on the substrate 40 without separate molding. According to another embodiment shown in fig. 16, at least one inorganic light emitting diode 254 may be separately molded to form an inorganic light emitting diode package 250, and then the inorganic light emitting diode package 250 may be mounted on the substrate 40.
The inorganic light emitting diode package 250 may include an inorganic light emitting diode 254 and a molding resin 255 configured to individually surround the inorganic light emitting diode 254. The molding resin 255 may be formed of a transparent material. The inorganic light emitting diode package 250 may include a red inorganic light emitting diode package 251, a green inorganic light emitting diode package 252, and a blue inorganic light emitting diode package 253.
On the substrate 40, an encapsulation layer 60 is formed to physically protect the inorganic light emitting diode package 250 without causing optical distortion. The encapsulation layer 60 may include a viscoelastic material having viscoelastic properties, and the degree of curing of the encapsulation layer 60 may vary according to a change in applied temperature or pressure.
As apparent from the above description, it is possible to physically and safely protect a plurality of inorganic light emitting diodes mounted on a substrate and improve optical performance, thereby improving image quality of a display device.
When a plurality of inorganic light emitting diodes are packaged, the viscoelastic material is formed in the form of a film or sheet and laminated on the substrate. Therefore, the packaging process can be simplified. The seams between the adjacent unit modules of the display apparatus may be visually hidden, and thus, the display quality may be improved.
Accordingly, a large number of unit modules can be smoothly assembled, and thus a large screen size satisfying consumer demands can be provided.
Although the packaging process on the inorganic light emitting diode is completed, it is possible to find a defective inorganic light emitting diode and easily replace the defective inorganic light emitting diode, thereby improving durability and reliability of the display device.
Although a few embodiments of the present disclosure have been shown and described, it would be appreciated by those skilled in the art that changes may be made in these embodiments without departing from the principles and spirit of the disclosure, the scope of which is defined in the claims and their equivalents.

Claims (10)

1. A display device, comprising:
a plurality of unit modules; and
a cover configured to support the plurality of unit modules,
wherein each of the plurality of unit modules includes:
a substrate;
a plurality of inorganic light emitting diodes disposed on the mounting surface of the substrate; and
an encapsulation layer formed on the mounting surface of the substrate to cover the plurality of inorganic light emitting diodes and the mounting surface of the substrate, and
wherein the encapsulation layer comprises a viscoelastic material having a viscoelasticity that varies based on a temperature applied to the viscoelastic material.
2. The display device according to claim 1, wherein viscoelasticity of the viscoelastic material is reduced based on heating the viscoelastic material and reaching a predetermined temperature, and the viscoelastic material obtains fluidity.
3. The display device of claim 1, wherein the viscoelastic material comprises at least one of a vinyl polymer, a acetate polymer, an ethylene vinyl acetate polymer, an olefin polymer, or an acrylic polymer.
4. The display device of claim 1, wherein the substrate comprises:
a glass substrate; and
a Thin Film Transistor (TFT) layer formed on the glass substrate and configured to drive the plurality of inorganic light emitting diodes.
5. The display device according to claim 1, wherein the plurality of unit modules are arranged in a matrix.
6. The display device according to claim 1, wherein a seam between the plurality of unit modules adjacent to each other is visually hidden by applying heat to the encapsulation layers of the plurality of unit modules.
7. The display device according to claim 1, further comprising a compensation layer formed on the encapsulation layer to improve flatness of the encapsulation layer.
8. The display device according to claim 1, further comprising a frame disposed between and coupled to the plurality of unit modules and the cover.
9. The display device according to claim 1, wherein the viscoelastic material is formed into a film or a sheet, and the film or the sheet is laminated on the substrate.
10. The display device according to claim 9, wherein the viscoelastic material is laminated on the substrate while applying heat and pressure in a vacuum state.
CN201980054133.8A 2018-08-20 2019-08-16 Display device and method for manufacturing the same Pending CN112567523A (en)

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KR1020190089452A KR20200021399A (en) 2018-08-20 2019-07-24 Display appartus and manufacuring mehtod thereof
PCT/KR2019/010405 WO2020040483A1 (en) 2018-08-20 2019-08-16 Display apparatus and manufacturing method thereof

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