CN112563433A - Stretchable array substrate, display panel, display device and manufacturing method - Google Patents
Stretchable array substrate, display panel, display device and manufacturing method Download PDFInfo
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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Abstract
The invention discloses a stretchable array substrate, a display panel, a display device and a manufacturing method. The stretchable array substrate includes: including a backplate, the backplate includes a plurality of islands, a hole region disposed between adjacent islands, and a bridge region connecting adjacent islands, the islands including: the display area comprises a substrate, a driving circuit layer and a light-emitting device layer which are arranged on the substrate, and a protective layer covering the light-emitting device layer, wherein the protective layer is used for protecting the light-emitting device layer, an isolation area is arranged between the display area and the hole area, and the display area comprises a substrate, an isolation column arranged on the substrate, and a packaging layer covering the island area. According to the stretchable array substrate provided by the invention, the display area is protected by the protective layer, so that the normal display of the display area is not influenced when the laser is used for removing the luminescent material layer and the cathode material layer existing in the isolation area and the hole area due to the manufacturing process, and the packaging effect of the stretchable array substrate is effectively improved.
Description
Technical Field
The invention relates to the technical field of display, in particular to a stretchable array substrate, a display panel, a display device and a manufacturing method.
Background
With the rapid development of display technologies, flexible stretchable products are receiving much attention. In the main process of manufacturing the stretchable display device, a glass substrate is used as a hardness substrate of the stretchable array substrate, film layer manufacturing of the stretchable array substrate is performed on the glass substrate layer by layer, then a packaging process is performed to form the stretchable array substrate, and the stretchable array substrate is separated from the glass substrate by using a laser lift-off technology to form the stretchable array substrate. However, the peeled stretchable display device is vulnerable to a failure of the package.
Disclosure of Invention
In order to solve at least one of the above problems, a first embodiment of the present invention provides a stretchable array substrate comprising a backplane including a plurality of island regions, a hole region disposed between adjacent island regions, and a bridge region connecting adjacent island regions, the island regions comprising:
a display region including a substrate, a driving circuit layer and a light emitting device layer disposed on the substrate, a protective layer covering the light emitting device layer, the protective layer for protecting the light emitting device layer,
an isolation region between the display region and the hole region, including a substrate and an isolation pillar disposed on the substrate, an
An encapsulation layer covering the island region.
Further, the protective layer is made of a laser absorption material.
Further, the isolation region further includes a sidewall facing the hole region.
Further, the isolation region further comprises an inorganic film layer covering the isolation column.
Further, the display area is composed of the substrate, a driving circuit layer, a light emitting device layer and a protective layer covering the light emitting device layer.
The second embodiment of the invention provides a display panel comprising the stretchable array substrate.
A third embodiment of the present invention provides a display device including the display panel as described above.
A fourth embodiment of the present invention provides a method for manufacturing the stretchable array substrate, including:
forming a back plate, wherein the back plate comprises a plurality of island regions, hole regions arranged between the adjacent island regions and bridge regions connecting the adjacent island regions, the island regions comprise a display region and an isolation region, the display region comprises a substrate, and an anode of a driving circuit layer and an anode of a light-emitting device layer which are formed on the substrate, and the isolation region comprises a substrate and an isolation column arranged on the substrate;
forming a light emitting material layer of a light emitting device layer covering the island region, the hole region and the bridge region;
forming a cathode material layer of a light emitting device layer covering the light emitting material layer;
forming a protective layer covering the display region;
irradiating the island region, the bridge region and the hole region by using laser;
an encapsulation layer is formed overlying the island region.
Further, the protective layer is a laser absorbing material, and the irradiating the island region, the bridge region and the hole region with laser further comprises:
irradiating the display area of the island area with laser, wherein the protective layer absorbs the laser;
irradiating the isolation region of the island region with laser to remove the light-emitting material layer and the cathode material layer;
and irradiating the bridge region and the hole region by using laser to remove the light-emitting material layer and the cathode material layer.
Further, the isolation region further includes an inorganic film layer covering the isolation pillar and a sidewall facing the hole region, and the forming of the encapsulation layer covering the island region further includes:
and forming an encapsulation layer covering the island region, wherein the encapsulation layer covers the display region, the inorganic film layer of the isolation region and the side wall of the isolation region.
Further, after the irradiating the island region, the bridge region and the hole region with the laser, before the forming an encapsulation layer covering the island region, the method further includes: the island, bridge and hole regions are treated using oxygen ashing.
The invention has the following beneficial effects:
aiming at the existing problems, the invention provides the stretchable array substrate, on one hand, the light-emitting material layer and the cathode material layer of the display area are protected from laser through the protective layer, so that the normal display function can be realized, and the problem of film layer stripping in the laser stripping process is solved; on the other hand, the laser is used for removing the light-emitting material layer and the cathode material layer of the isolation area, so that the isolation column is directly contacted with and packaged by the packaging layer, the packaging effect of the stretchable array substrate can be effectively improved, meanwhile, the laser is used for removing the light-emitting material layer and the cathode material layer in the hole area, so that the packaging layer is not formed in the hole area, and the stretching performance of the stretchable array substrate is effectively improved on the basis of further improving the packaging performance of the stretchable array substrate. The stretchable array substrate has a good packaging effect and good tensile property, so that the problems in the prior art are solved, and the stretchable array substrate has a wide application prospect.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic view illustrating a layer structure of a stretchable array substrate according to an embodiment of the present invention;
fig. 2-5 are schematic diagrams illustrating layer structures corresponding to main steps in a manufacturing process of a stretchable array substrate according to an embodiment of the present invention;
fig. 6 shows a flow chart of a process for manufacturing the stretchable array substrate according to an embodiment of the present invention.
Detailed Description
In order to more clearly illustrate the invention, the invention is further described below with reference to preferred embodiments and the accompanying drawings. Similar parts in the figures are denoted by the same reference numerals. It is to be understood by persons skilled in the art that the following detailed description is illustrative and not restrictive, and is not to be taken as limiting the scope of the invention.
It is noted that references herein to "on … …", "formed on … …" and "disposed on … …" can mean that one layer is formed or disposed directly on another layer or that one layer is formed or disposed indirectly on another layer, i.e., there is another layer between the two layers. As used herein, unless otherwise specified, the term "on the same layer" means that two layers, components, members, elements or portions can be formed by the same patterning process, and the two layers, components, members, elements or portions are generally formed of the same material. Herein, unless otherwise specified, the expression "patterning process" generally includes the steps of coating of photoresist, exposure, development, etching, stripping of photoresist, and the like. The expression "one-time patterning process" means a process of forming a patterned layer, member, or the like using one mask plate.
In the prior art, a plurality of islands for emitting light, hole regions for providing tensile deformation for the stretchable array substrate, and bridge regions for routing are formed by forming holes on the stretchable array substrate. The island region comprises a display region where the light-emitting device is located and an isolation region for isolating water and oxygen erosion.
In addition, in the manufacturing process of the stretchable array substrate, after a substrate, a driving circuit layer and an anode are sequentially formed on a glass substrate, a whole surface of a light emitting material layer and a whole surface of a cathode are sequentially formed on the anode in an evaporation mode, then a packaging process is performed to form the stretchable array substrate, and the stretchable array substrate is separated from the glass substrate by using a laser lift-off technology. However, the stretchable array substrate obtained by the laser lift-off technology is very prone to package failure.
In this regard, the inventors have found through extensive studies and experiments that the cause of the problem is: in the prior art, the light-emitting material layer and the cathode cannot be formed on the anode in a patterning and pre-deposition mode, so that the light-emitting material layer and the cathode material layer are also present in the hole region and the isolation region of the stretchable array substrate when the whole-surface-covered light-emitting material layer and the cathode are formed by using an evaporation process. In the subsequent hole surrounding packaging process, the light emitting material layer and the cathode material layer of the hole region and the light emitting material layer and the cathode material layer of the isolation region are in direct contact with the packaging layer to form packaging, so that continuous packaging layers are formed in the hole region and the isolation region, and the stretchable array substrate has the problem of packaging failure.
In addition, the stretchable array substrate in the prior art is also prone to a film peeling (peeling) problem after being separated from the glass substrate by a laser peeling process, and for this reason, after a great deal of research and experiments, the inventors also found that the reason for the problem is that: when the laser stripping process is carried out, the luminescent material layer and the cathode of the luminescent device layer in the display area are irradiated by laser, and the phenomenon of gasification of the luminescent material layer and the cathode in the display area occurs, so that the problem of film stripping between the luminescent device layer and the packaging layer occurs.
In order to solve the above problems, the inventors propose a stretchable array substrate, a display panel, a display device and a manufacturing method.
As shown in fig. 1, one embodiment of the present invention provides a stretchable array substrate comprising a backplane comprising a plurality of islands, an aperture region disposed between adjacent islands, and a bridge region connecting adjacent islands, the islands comprising:
a display area AA including a substrate 10, a driving circuit layer 20 and a light emitting device layer 30 disposed on the substrate 10, a protective layer 50 covering the light emitting device layer 30, the protective layer 50 for protecting the light emitting device layer 30,
an isolation region BB between the display region AA and the hole region CC, including a substrate 10 and an isolation pillar 60 disposed on the substrate 10, an
An encapsulation layer 40 covering the island region.
According to the stretchable array substrate provided by the embodiment of the invention, on one hand, the light-emitting material layer and the cathode material layer of the display area are protected from laser through the protective layer, so that not only can a normal display function be realized, but also the problem of film layer peeling in a laser peeling process is solved; on the other hand, the laser is used for removing the light-emitting material layer and the cathode material layer of the isolation area, so that the isolation column is directly contacted with and packaged by the packaging layer, the packaging effect of the stretchable array substrate can be effectively improved, meanwhile, the laser is used for removing the light-emitting material layer and the cathode material layer in the hole area, so that the packaging layer is not formed in the hole area, and the stretching performance of the stretchable array substrate is effectively improved on the basis of further improving the packaging performance of the stretchable array substrate. In an alternative embodiment, the protective layer 50 is a laser-absorbing material. The laser energy in the laser etching process and the laser peeling process can be effectively absorbed through the laser absorption material, so that the light-emitting device layer 30 is effectively protected through the protective layer 50, and a normal display function is realized. Meanwhile, because the protective layer is not formed in the isolation region and the hole region, the luminescent material layer and the cathode material layer in the isolation region and the hole region are removed under the irradiation of laser, so that the packaging effect of the subsequent packaging process is further improved, and the tensile property of the formed stretchable array substrate is improved. In a specific example, the Laser in the Laser etching process is Low-energy Laser (Low Level Laser), the wavelength range of the Laser is 500-1100 nm, and the energy density of the Laser is (1-4) J/cm 2. The protective layer material absorbing the low-energy laser is a material with high laser absorption, such as one or a combination of at least two of polysulfone, polyamide, polyamic acid, polyimide, maleimide, polyetherimide, polybenzimidazole, polyacrylonitrile, polyether ether ketone, polyphenylene ether sulfone, polybenzoxazole, polyphenylene sulfide or polyether ketone, and one or a combination of at least two of inorganic substances such as molybdenum oxide, tantalum oxide, MnTaOx and the like.
Considering that the above-mentioned embodiment further includes a Polarizer (POL) disposed at the light emitting side of the array substrate, and the polarizer has the problems of non-patternability and non-stretchability, and affects the stretching performance of the array substrate when it is applied to the stretchable array substrate, in an alternative embodiment, the display area AA is composed of the substrate, the driving circuit layer, the light emitting device layer 30, and the protective layer 50 covering the light emitting device layer 30.
In the embodiment, the protection layer can not only absorb the laser, but also have high transmittance to visible light, so that the reflection reducing function of the display panel can be realized by replacing the polarizer, thereby simplifying the process and reducing the production cost. The embodiment can realize the reflection reduction of the stretchable array substrate through the protective layer arranged in the display area, and can effectively improve the stretching performance of the stretchable array substrate.
In an alternative embodiment, as shown in fig. 1, the isolation region BB further includes a sidewall facing the hole region CC. In this embodiment, during the packaging process, on the basis of forming the packaging layer on the isolation pillar of the isolation region, the sidewall of the isolation region facing the hole region is further packaged to form a continuous packaging layer, which can further protect the island region from being eroded by water and oxygen, and improve the packaging effect of the stretchable array substrate.
Compared with the packaging layer formed by packaging the hole region in the prior art, the packaging layer of the embodiment does not package in the hole region, but packages the side wall of the isolation region facing the hole region to form the packaging layer, and the packaging layer is not formed in the hole region, so that the stretching capability of the hole region is effectively improved on the basis of ensuring the packaging performance of the stretchable array substrate, and the stretching performance of the stretchable array substrate is effectively improved.
In an alternative embodiment, as shown in fig. 1, the isolation region BB further includes an inorganic film layer 61 covering the isolation pillar 60.
In the embodiment, on the basis that the isolation region is not provided with the organic light emitting material, the inorganic film layer 61 covering the isolation pillar 60 is in direct contact with the encapsulation layer 40, so that the encapsulation effect is further improved, and the encapsulation layers formed in the display region and the isolation region are of a continuous structure, so that the encapsulation distance of the encapsulation layer is increased compared with the prior art, and the encapsulation performance is better.
The manufacturing process of the stretchable array substrate shown in fig. 1 will now be described with a specific example:
and S1, forming a back plate.
In a specific example, the step S1 further includes:
s11, the flexible substrate 10, the driver circuit layer 20, and the anode of the light-emitting device layer 30 are sequentially stacked on the glass substrate 2, thereby forming the structure shown in fig. 2.
In one specific example, the driving circuit layer 20 includes: the structure comprises a buffer layer 21 formed on a substrate 10, an active layer 22 formed on the buffer layer 21, a dielectric layer 23 covering the active layer 22, a gate electrode 24 formed on the dielectric layer 23, a gate insulating layer 25 covering the gate electrode 24, a first insulating layer 26 formed on the gate insulating layer 25, a source-drain metal layer 27 formed on the first insulating layer 26, and a planarization layer 28 covering the first insulating layer 26, wherein the planarization layer 28 exposes a part of an anode 31, and the source-drain metal layer 27 is connected with the active layer 22 through a via hole.
S2, forming a light emitting material layer 32 of the light emitting device layer 30 covering the island region, the hole region CC and the bridge region, forming a cathode material layer of the light emitting device layer 30 covering the light emitting material layer 32, and forming a protective layer 50 covering the display region AA, forming the structure shown in fig. 3.
In a specific example, the light emitting material layer 32 and the cathode 33 may be integrally formed on the light emitting device layer 30 of the island region, the hole region CC, and the bridge region through an evaporation process.
In one specific example, the protective layer is a laser absorbing material.
It is worth mentioning that, before this step, an aperture region CC penetrating through the substrate 10 is formed, and an isolation region BB is formed between the aperture region CC and the display region AA. In a specific example, the hole region CC sequentially penetrates the planarization layer 28, the first insulating layer 26, the gate insulating layer 25, the dielectric layer 23, the buffer layer 21, and the substrate 10 to the glass substrate 22. In another specific example, the isolation region BB is formed on the first insulating layer 26.
S3, irradiating the island region, the bridge region and the hole region by using laser to form the structure shown in FIG. 4;
in one particular example, the laser is a low energy laser that absorbs energy efficiently absorbed by the laser material.
In an alternative embodiment, the step S3 further includes:
s31, irradiating the display area AA of the island area with laser light, and the protective layer 50 absorbs the laser light.
By utilizing the characteristic of the protective layer 50 of absorbing high absorption rate of the laser material to the laser light, when the laser light irradiates the display area AA, the protective layer 50 absorbs the laser light to protect the luminescent material layer 32 and the cathode 33 in the display area AA.
S32, irradiating the isolation regions BB of the island region with laser to remove the light emitting material layer 32 and the cathode material layer.
When the laser is irradiated on the isolation region BB, the light-emitting material layer 32 and the cathode material layer of the isolation region BB are vaporized and removed after irradiation, so as to form the structure of the isolation region BB without the light-emitting material layer 32 and without the cathode material layer as shown in fig. 4.
S33, irradiating the bridge and hole regions with laser to remove the luminescent material layer 32 and the cathode material layer.
When the laser is irradiated on the hole region CC, the luminescent material layer 32 and the cathode material layer in the hole region CC are vaporized and removed after irradiation, so as to form the structure of the hole region CC without luminescent material layer and without cathode material layer as shown in fig. 4. Therefore, the influence of the luminescent material layer and the cathode material layer remained in the hole region on the packaging when the side wall of the isolation region is packaged is further avoided.
S4, forming an encapsulation layer 40 covering the island region, forming the structure shown in fig. 5.
In a specific example, the isolation region BB further includes an inorganic film layer 61 covering the isolation pillar 60, and step S4 further includes:
s41, forming an encapsulation layer 40 covering the display area AA, the inorganic film layer 61 of the isolation area BB and the side wall of the isolation area BB.
The inorganic film 61 is in direct contact with the encapsulation layer 40 to form an encapsulation layer with good encapsulation effect.
The packaging layer 40 formed on the display area AA, the packaging layer 40 formed on the isolation column 60 and the inorganic film 61 formed on the side wall of the isolation area are continuous packaging structures, and because the light emitting layer material and the cathode layer material of the isolation area are removed in the previous steps, the packaging distance is effectively increased, the capability of resisting water and oxygen erosion is improved, and the packaging performance is further improved.
As shown in fig. 5, the light emitting layer material and the cathode layer material in the hole region have been removed in the previous step, and the encapsulation layer does not encapsulate the hole region, so that the tensile property provided by the hole region is effectively ensured.
It should be noted that, in an alternative embodiment, between step S3 and step S4, the method further includes: the island, bridge and hole regions are treated using oxygen ashing.
In this embodiment, through an oxygen Ashing treatment (O2 Ashing) process, on the basis of removing the light-emitting layer material and the cathode material layer in the isolation region and the hole region by using laser, the light-emitting layer material and the cathode material layer in the two regions are further removed, so as to ensure the removal effect of the light-emitting layer material and the cathode material layer in the two regions, thereby increasing the distance between the encapsulating layers and avoiding the occurrence of a continuous encapsulating layer in the hole region, so as to achieve a better encapsulating effect and achieve better tensile properties.
S5, peeling the stretchable array substrate and the glass substrate 2 by using a laser to form the structure shown in fig. 1.
In this step, when the laser beam irradiates the display area AA, the protective layer 50 of the display area AA can effectively protect the luminescent material layer 32 and the cathode 33, and the problem of film peeling caused by vaporization of the materials of the luminescent material layer and the cathode 33 due to the influence of the laser beam is avoided.
According to the stretchable array substrate provided by the embodiment of the invention, on one hand, the light-emitting material layer and the cathode material layer of the display area are protected from laser through the protective layer, so that not only can a normal display function be realized, but also the problem of film layer peeling in a laser peeling process is solved; on the other hand, the laser is used for removing the light-emitting material layer and the cathode material layer in the isolation area, so that the isolation column is directly contacted with and packaged by the packaging layer, the packaging effect of the stretchable array substrate is effectively improved, meanwhile, the laser is used for removing the light-emitting material layer and the cathode material layer in the hole area, so that the packaging layer is not formed in the hole area, the effective stretching of the stretchable array substrate is realized, and the stretching performance of the stretchable array substrate is effectively improved. The stretchable array substrate of the embodiment has both a good packaging effect and a good stretching property.
In correspondence with the stretchable array substrate provided in the above embodiments, as shown in fig. 6, an embodiment of the present application further provides a method for manufacturing the stretchable array substrate, the method including:
forming a backplane including a plurality of island regions including a display region AA and an isolation region BB, the display region AA including a substrate 10, an anode 31 of a driving circuit layer 20 and a light emitting device layer 30 formed on the substrate 10, a hole region CC disposed between adjacent island regions, and a bridge region connecting adjacent island regions, the isolation region BB including a substrate 10 and an isolation pillar 60 disposed on the substrate 10;
forming a light emitting material layer of the light emitting device layer 30 covering the island region, the hole region and the bridge region;
forming a cathode material layer of the light emitting device layer 30 covering the light emitting material layer;
forming a protective layer 50 covering the display area AA;
irradiating the island region, the bridge region and the hole region by using laser;
an encapsulation layer 40 is formed overlying the island region.
According to the stretchable array substrate manufactured by the method, on one hand, the light-emitting material layer and the cathode material layer of the display area are protected from laser by the protective layer, so that not only can a normal display function be realized, but also the problem of film layer peeling in a laser peeling process is solved; on the other hand, the laser is used for removing the light-emitting material layer and the cathode material layer of the isolation area, so that the isolation column is directly contacted with and packaged by the packaging layer, the packaging effect of the stretchable array substrate can be ensured, meanwhile, the laser is used for removing the light-emitting material layer and the cathode material layer in the hole area, so that the packaging layer is not formed in the hole area, the effective stretching of the stretchable array substrate is realized, and the stretching performance of the stretchable array substrate is effectively improved.
In an alternative embodiment, the protective layer is a laser light absorbing material, and the irradiating the island region, the bridge region, and the hole region with a laser light further comprises:
irradiating the display area AA of the island area by laser, wherein the protective layer 50 absorbs the laser;
irradiating the isolation region BB of the island region by using laser to remove the light-emitting material layer and the cathode material layer;
and irradiating the bridge region and the hole region CC by using laser to remove the light-emitting material layer and the cathode material layer.
In an alternative embodiment, the isolation region BB further includes an inorganic film layer 61 covering the isolation pillar 60 and a sidewall facing the hole region CC, and the forming of the encapsulation layer 40 covering the island region further includes:
forming an encapsulation layer 40 covering the island region, wherein the encapsulation layer 40 covers the display region AA, the inorganic film layer 61 of the isolation region BB, and the sidewall of the isolation region BB.
In an alternative embodiment, after said irradiating said island, bridge and hole regions with a laser, said method further comprises, prior to said forming an encapsulation layer 40 covering said island region: the island, bridge and hole regions are treated using oxygen ashing.
Since the manufacturing method of the stretchable array substrate provided in the embodiments of the present application corresponds to the stretchable array substrate provided in the above-mentioned several embodiments, the previous embodiments are also applicable to the method for testing the liquid crystal panel provided in this embodiment, and detailed description is not provided in this embodiment.
It should be noted that the stretchable array substrate provided in the embodiments of the present invention is not limited to the specific structure formed by the manufacturing method of the above embodiments of the present invention, and other processing processes may be adopted by those skilled in the art to form the specific structure of the stretchable array substrate under the concept of the present invention.
Accordingly, another embodiment of the present invention further provides a display panel including a display panel formed using the stretchable array substrate of the foregoing embodiment. The foregoing embodiments are also applicable to the display panel provided in this embodiment, and will not be described in detail in this embodiment. The foregoing embodiments and the advantages thereof are also applicable to the present embodiment, and therefore, the description of the same parts is omitted.
The display panel according to the above embodiment of the present invention is suitable for a flexible substrate that may have a stretching requirement, and therefore another embodiment of the present invention further provides a display device including the display panel. The display device can be any product or component with a stretchable function, such as a mobile phone, a tablet personal computer, a television, a display, a notebook computer, a digital photo frame or a navigator and the like.
It should be understood that the above-mentioned embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention, and it will be obvious to those skilled in the art that other variations or modifications may be made on the basis of the above description, and all embodiments may not be exhaustive, and all obvious variations or modifications may be included within the scope of the present invention.
Claims (11)
1. A stretchable array substrate comprising a backplane comprising a plurality of islands, an aperture region disposed between adjacent islands, and a bridge region connecting adjacent islands, wherein the islands comprise:
a display region including a substrate, a driving circuit layer and a light emitting device layer disposed on the substrate, a protective layer covering the light emitting device layer, the protective layer for protecting the light emitting device layer,
an isolation region between the display region and the hole region, including a substrate and an isolation pillar disposed on the substrate, an
An encapsulation layer covering the island region.
2. The stretchable array substrate of claim 1, wherein the protective layer is a laser absorbing material.
3. A stretchable array substrate according to claim 2, wherein the isolation regions further comprise sidewalls facing the aperture regions.
4. The stretchable array substrate of claim 1, wherein the isolation regions further comprise an inorganic film layer covering the isolation pillars.
5. A stretchable array substrate according to claim 1, wherein the display area is composed of the substrate, a driving circuit layer, a light emitting device layer, and a protective layer covering the light emitting device layer.
6. A display panel comprising the stretchable array substrate according to any one of claims 1 to 5.
7. A display device characterized by comprising the display panel according to claim 6.
8. A method of making a stretchable array substrate according to any of claims 1-5, comprising:
forming a back plate, wherein the back plate comprises a plurality of island regions, hole regions arranged between the adjacent island regions and bridge regions connecting the adjacent island regions, the island regions comprise a display region and an isolation region, the display region comprises a substrate, and an anode of a driving circuit layer and an anode of a light-emitting device layer which are formed on the substrate, and the isolation region comprises a substrate and an isolation column arranged on the substrate;
forming a light emitting material layer of a light emitting device layer covering the island region, the hole region and the bridge region;
forming a cathode material layer of a light emitting device layer covering the light emitting material layer;
forming a protective layer covering the display region;
irradiating the island region, the bridge region and the hole region by using laser;
an encapsulation layer is formed overlying the island region.
9. The method of claim 8 wherein the protective layer is a laser-absorbing material, and wherein irradiating the island, bridge, and hole regions with a laser further comprises:
irradiating the display area of the island area with laser, wherein the protective layer absorbs the laser;
irradiating the isolation region of the island region with laser to remove the light-emitting material layer and the cathode material layer;
and irradiating the bridge region and the hole region by using laser to remove the light-emitting material layer and the cathode material layer.
10. The method of claim 9, wherein the isolation region further comprises an inorganic film layer covering the isolation pillar and a sidewall facing the hole region, and wherein forming an encapsulation layer covering the island region further comprises:
and forming an encapsulation layer covering the island region, wherein the encapsulation layer covers the display region, the inorganic film layer of the isolation region and the side wall of the isolation region.
11. The method of any of claims 8-10, wherein after said irradiating said island, bridge and hole regions with a laser, prior to said forming an encapsulation layer covering said island region, said method further comprises: the island, bridge and hole regions are treated using oxygen ashing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011432586.0A CN112563433B (en) | 2020-12-10 | 2020-12-10 | Stretchable array substrate, display panel, display device and manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN114927060A (en) * | 2022-01-06 | 2022-08-19 | 友达光电股份有限公司 | Stretchable display panel |
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| CN110265474A (en) * | 2019-07-22 | 2019-09-20 | 京东方科技集团股份有限公司 | OLED display substrate, preparation method thereof and display device |
| CN110289292A (en) * | 2019-06-27 | 2019-09-27 | 京东方科技集团股份有限公司 | A kind of production method of display base plate, display device and display base plate |
| CN110416282A (en) * | 2019-08-28 | 2019-11-05 | 云谷（固安）科技有限公司 | Display device and its display base plate |
| CN111106266A (en) * | 2019-12-06 | 2020-05-05 | 武汉华星光电半导体显示技术有限公司 | Preparation method and preparation system of display device |
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| CN110265474A (en) * | 2019-07-22 | 2019-09-20 | 京东方科技集团股份有限公司 | OLED display substrate, preparation method thereof and display device |
| CN110416282A (en) * | 2019-08-28 | 2019-11-05 | 云谷（固安）科技有限公司 | Display device and its display base plate |
| CN111106266A (en) * | 2019-12-06 | 2020-05-05 | 武汉华星光电半导体显示技术有限公司 | Preparation method and preparation system of display device |
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| CN114927060A (en) * | 2022-01-06 | 2022-08-19 | 友达光电股份有限公司 | Stretchable display panel |
| CN114927060B (en) * | 2022-01-06 | 2023-11-10 | 友达光电股份有限公司 | Stretchable display panel |
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