KR20180010292A - Method for manufacturing display apparatus and display apparatus - Google Patents

Abstract

The present invention provides a display apparatus manufacturing method, which can reduce a fault rate in a manufacturing process while saving manufacturing costs, and a display apparatus. According to an aspect of the present invention, the display apparatus manufacturing method comprises: a step of forming a plurality of display parts on a base substrate; a step of attaching a temporary protective film to a lower surface of the base substrate; a step of cutting the base substrate and the temporary protective film along the periphery of each of the plurality of display parts to obtain a plurality of display panels each having a first area, a second area and a bending area between the first area and the second area; a step of removing the temporary protective film from the plurality of display panels; and a step of attaching a lower protective film to a lower surface of each of the plurality of display panels to correspond to the first area of each of the plurality of display panels.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a display apparatus,

Embodiments of the present invention relate to a display device manufacturing method and a display device, and more particularly, to a display device manufacturing method and a display device capable of reducing a production failure rate while reducing manufacturing costs.

Generally, a display device has a display portion disposed on a substrate. By bending at least a part of such a display device, it is possible to improve the visibility at various angles or reduce the area of the non-display area.

However, in the case of the conventional method of manufacturing a display device, defects occur in the process of manufacturing such a bended display device, and the life of the display device is reduced.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a method of manufacturing a display device and a display device capable of reducing a manufacturing defect while reducing the manufacturing cost, solving various problems including the above problems. However, these problems are exemplary and do not limit the scope of the present invention.

According to one aspect of the present invention, there is provided a method of manufacturing a display device, comprising the steps of: forming a plurality of display portions on a mother substrate; attaching a temporary protective film to a lower surface of the mother substrate; Cutting the film to obtain a plurality of display panels each having a first area and a second area and a bending area located between the first area and the second area; and removing the temporary protective film from the plurality of display panels And attaching a lower protective film to the lower surface of each of the plurality of display panels so as to correspond to the first area of each of the plurality of display panels.

The step of attaching the lower protective film may include attaching a lower protective film to the lower surface of each of the plurality of display panels so that a part of the lower protective film having an area wider than the area of the first area is exposed to the outside of the display panel . At this time, it may further include removing the exposed portion of the lower protective film outside the display panel. Specifically, the method may further include irradiating the lower protective film with a laser beam to remove portions of the lower protective film exposed outside the display panel.

The method may further include bending the display panel in the bending area such that the display panel is bent around a bending axis intersecting a virtual straight line connecting the center of the first area and the center of the second area.

The first region of each of the plurality of display panels may include a display portion.

The step of forming the display portions may include forming a plurality of display portions on the mother substrate on the carrier substrate, and separating the mother substrate from the carrier substrate, And attaching a temporary protective film to the lower surface of the carrier substrate of the mother substrate.

The step of removing the temporary protective film may further include attaching the printed circuit board or the electronic chip to the second area of each of the plurality of display panels. At this time, the length of the second region in the direction intersecting the imaginary straight line connecting the center of the first region and the center of the second region and the length in the direction intersecting the imaginary straight line of the printed circuit board or electronic chip Can be the same.

According to another aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: preparing a substrate having a bending region located between a first region and a second region; A step of removing the temporary protective film, and a step of attaching a lower protective film to the lower surface of the substrate so as to correspond to the first region.

The step of attaching the lower protective film may include the step of attaching the lower protective film to the lower surface of the substrate such that a part of the lower protective film having an area wider than the area of the first region is exposed to the outside of the substrate. Further, it may further include removing the exposed portion of the lower protective film from the substrate. Specifically, the method may further include irradiating the lower protective film with a laser beam to remove a portion of the lower protective film exposed outside the substrate.

The method may further include bending the substrate to bend about the bending axis in the bending region.

And forming a display portion on the first region of the substrate.

The step of removing the temporary protective film may further include the step of attaching the printed circuit board or the electronic chip to the second region of the substrate. At this time, the length of the second region in the direction intersecting the imaginary straight line connecting the center of the first region and the center of the second region and the length in the direction intersecting the imaginary straight line of the printed circuit board or electronic chip Can be the same.

According to another aspect of the present invention, there is provided a bending apparatus having a bending region located between a first region and a second region so that a part of a lower surface of the first region and a lower surface of the second region face each other, A lower protective film positioned on a lower surface of the substrate to correspond to at least a portion of the first region, and a lower protective film disposed on the upper surface of the substrate, And a support layer interposed between the film and the lower surface of the substrate in the second region.

The support layer may be adhered to a lower surface of the lower protective film and the second region of the substrate.

Wherein a distance between a first lower surface of a portion of the substrate on which the support layer is located and a second surface of the substrate on which the support layer is located, May be shorter than a maximum distance between mutually facing portions between the first and second lower surfaces.

Specifically, the distance between the first upper surface of the upper surface of the substrate in which the supporting layer is located and the upper surface of the substrate in the second area, A portion of the upper surface of the substrate may protrude in a direction opposite to the direction of the display portion with respect to a virtual first plane including the upper surface of the substrate in the second region at a portion corresponding to the support layer. Further, another portion of the upper surface of the substrate between the first upper surface and the second upper surface may protrude toward the display portion from a second virtual plane including the upper surface of the substrate at the portion where the display portion is disposed .

The area of the surface of the support layer in the direction of the lower protective film may be different from the area of the surface of the substrate in the direction of the second area of the support layer. Specifically, the surface area of the support layer in the direction of the lower protective film may be wider than the area of the substrate in the direction of the second area of the support layer.

On the other hand, an electronic device located on a second upper surface in a portion of the upper surface of the substrate where the supporting layer is located, and a reinforcing film located on the second upper surface so as to be positioned adjacent to the electronic device can do. At this time, the reinforcing film may cover all portions of the second upper surface exposed to the outside of the electronic device.

Other aspects, features and advantages of the present invention will become apparent from the following detailed description, claims, and drawings.

According to one embodiment of the present invention as described above, it is possible to realize a display device manufacturing method and a display device capable of reducing a manufacturing defect while reducing the manufacturing cost. Of course, the scope of the present invention is not limited by these effects.

FIGS. 1 to 8 are plan views, cross-sectional views, or perspective views schematically showing processes of a method of manufacturing a display device according to an embodiment of the present invention.
9 and 10 are plan views schematically showing processes of a method of manufacturing a display device according to another embodiment of the present invention.
11 is a plan view schematically showing a process of a method of manufacturing a display device according to another embodiment of the present invention.
12 and 13 are cross-sectional views schematically showing processes of a method of manufacturing a display device according to another embodiment of the present invention.
14 is a cross-sectional view schematically showing a part of a display device according to an embodiment of the present invention.
15 is a cross-sectional view schematically showing a part of a display device according to another embodiment of the present invention.
16 is a cross-sectional view schematically showing a part of another display device according to still another embodiment of the present invention.
17 is a cross-sectional view schematically showing a part of another display device according to another embodiment of the present invention.
18 is a cross-sectional view schematically showing a part of another display device according to still another embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The present invention is capable of various modifications and various embodiments, and specific embodiments are illustrated in the drawings and described in detail in the detailed description. The effects and features of the present invention and methods of achieving them will be apparent with reference to the embodiments described in detail below with reference to the drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings, wherein like reference numerals refer to like or corresponding components throughout the drawings, and a duplicate description thereof will be omitted .

In the following embodiments, when various components such as layers, films, regions, plates, and the like are referred to as being " on " other components, . Also, for convenience of explanation, the components may be exaggerated or reduced in size. For example, the size and thickness of each component shown in the drawings are arbitrarily shown for convenience of explanation, and thus the present invention is not necessarily limited to those shown in the drawings.

In the following embodiments, the x-axis, the y-axis, and the z-axis are not limited to three axes on the orthogonal coordinate system, and can be interpreted in a broad sense including the three axes. For example, the x-axis, y-axis, and z-axis may be orthogonal to each other, but may refer to different directions that are not orthogonal to each other.

FIGS. 1 to 8 are plan views, cross-sectional views, or perspective views schematically showing processes of a method of manufacturing a display device according to an embodiment of the present invention.

First, a plurality of display units DU are formed on the mother substrate 100 as shown in FIG. Of course, other processes may be performed prior to forming the plurality of display portions DU. For example, the buffer layer may be formed on the entire surface of the mother substrate 100. In addition, when a plurality of display units DU are formed, electronic devices such as a thin film transistor, which are electrically connected to the display devices in addition to the display devices, may be formed. In the peripheral area outside the display area, Electronic devices can be formed. When forming the plurality of display portions DU, an encapsulating layer for protecting the display elements may also be formed. The detailed configuration of the display unit DU will be described later.

The mother board 100 on which the plurality of display units DU are formed may include various materials having flexible or ben-double characteristics, such as polyethersulphone (PES), polyacrylate (PAR) ), Polyetherimide (PEI), polyethylenenaphthalate (PEN), polyethyeleneterephthalate (PET), polyphenylene sulfide (PPS), polyallylate, poly Polymeric resins such as polyimide (PI), polycarbonate (PC), or cellulose acetate propionate (CAP).

2, when a plurality of display units DU are formed as shown in FIG. 1, a plurality of display units DU can be formed on the mother substrate 100 on the carrier substrate 10 have. The carrier substrate 10 may, for example, comprise glass of sufficient thickness. Such a carrier substrate 10 has sufficient hardness so that the mother substrate 100 containing a material having a flexible or ben-double characteristic is prevented from being warped or deformed during the manufacturing process. For example, a mother substrate 100 may be formed on the carrier substrate 10 having such a sufficient hardness, and a plurality of display units DU may be formed on the mother substrate 100.

After the display units DU are thus formed, the mother substrate 100 is separated from the carrier substrate 10. Then, the temporary protective film 20 is attached to the lower surface of the carrier substrate 10 of the mother substrate 100 (-z direction) as shown in FIG. The temporary protective film 20 prevents the lower surface of the mother substrate 100 from being damaged in the manufacturing process. Since the temporary protective film 20 is removed in the manufacturing process as described later, it is preferable that the adhesive force between the temporary protective film 20 and the mother substrate 100 is not strong. To this end, it is necessary to prevent the adhesive strength between the temporary protective film 20 and the mother substrate 100 from being strong. This will be described later.

After attaching the temporary protective film 20 to the lower surface of the mother substrate 100, the mother substrate 100 and the temporary protective film 20 are simultaneously cut. Specifically, the mother substrate 100 and the temporary protective film 20 are cut along the periphery of each of the plurality of display units DU to obtain a plurality of display panels as shown in FIG. Cutting of the mother substrate 100 and the temporary protective film 20 may be accomplished in various ways, for example by irradiating a laser beam and cutting the cutting wheel to the mother substrate 100 and / or the temporary protective film 20, So that the cutting can be performed.

5 is a cross-sectional view schematically showing a part of one of a plurality of display panels obtained through such steps. 5, each of the plurality of display panels includes a first area 1A, a second area 2A, and a bending area located between the first area 1A and the second area 2A. (BA). Hereinafter, the substrate of each of the plurality of display panels will be described with reference to the mother substrate.

The first area 1A includes a display area DA. Of course, the first area 1A includes a part of the non-display area outside the display area DA in addition to the display area DA as shown in Fig. The second area 2A also includes a non-display area.

In addition to the display device 300, the display area DA of the display panel may include a thin film transistor 210 to which the display device 300 is electrically connected as described above. In FIG. 5, an organic light emitting device is disposed as a display device 300 in a display area DA. The fact that the organic light emitting diode is electrically connected to the thin film transistor 210 can be understood as the pixel electrode 310 is electrically connected to the thin film transistor 210. Of course, a thin film transistor (not shown) may be disposed in a peripheral region outside the display region DA of the substrate 100 as needed. The thin film transistor located in this peripheral region may be part of a circuit portion for controlling an electrical signal applied in, for example, the display region DA.

The thin film transistor 210 may include a semiconductor layer 211 including an amorphous silicon, a polycrystalline silicon, or an organic semiconductor material, a gate electrode 213, a source electrode 215a, and a drain electrode 215b. A gate insulating film 120 including an inorganic material such as silicon oxide, silicon nitride and / or silicon oxynitride is formed on the semiconductor layer 211 and the gate electrode 213 in order to ensure the insulating property between the semiconductor layer 211 and the gate electrode 213. [ The gate electrode 213 may be interposed. An interlayer insulating layer 130 including an inorganic material such as silicon oxide, silicon nitride, and / or silicon oxynitride may be disposed on the gate electrode 213. A source electrode 215a and a drain electrode 215b may be formed on the gate electrode 213, May be disposed on such an interlayer insulating film 130. [ The insulating film containing an inorganic material may be formed through CVD or ALD (atomic layer deposition). This also applies to the following embodiments and modifications thereof.

A buffer layer 110 may be interposed between the thin film transistor 210 and the substrate 100, as described above. The buffer layer 110 may comprise an inorganic material such as silicon oxide, silicon nitride and / or silicon oxynitride. The buffer layer 110 may serve to increase the smoothness of the upper surface of the substrate 100 or to prevent or minimize impurities from the substrate 100 from penetrating into the semiconductor layer 211 of the thin film transistor 210 .

A planarization layer 140 may be disposed on the thin film transistor 210. For example, as shown in FIG. 5, when the organic light emitting diode is disposed on the thin film transistor 210, the planarization layer 140 may substantially flatten the upper portion of the passivation layer covering the thin film transistor 210. The planarization layer 140 may be formed of an organic material such as acrylic, BCB (benzocyclobutene), or HMDSO (hexamethyldisiloxane). Although the planarization layer 140 is shown as a single layer in FIG. 5, the planarization layer 140 may be multilayered and various modifications are possible. 5, the planarization layer 140 has an opening outside the display area DA, and a portion of the planarization layer 140 of the display area DA and a planarization layer 140 of the second area 2A May be physically separated. This is to prevent impurities or the like penetrating from the outside through the inside of the planarization layer 140 to reach inside the display area DA.

An organic light emitting element having a pixel electrode 310, a counter electrode 330 and an intermediate layer 320 interposed therebetween and including a light emitting layer may be disposed on the planarization layer 140 in the display region DA . The pixel electrode 310 is electrically connected to the thin film transistor 210 in contact with one of the source electrode 215a and the drain electrode 215b through an opening formed in the planarization layer 140 or the like as shown in FIG. .

The pixel defining layer 150 may be disposed on the planarization layer 140. The pixel defining layer 150 serves to define a pixel by having an opening corresponding to each of the sub-pixels, that is, at least a central portion of the pixel electrode 310 is exposed. 5, the pixel defining layer 150 is formed by increasing the distance between the edge of the pixel electrode 310 and the counter electrode 330 on the pixel electrode 310, And prevents the occurrence of an arc or the like at the edge of the substrate. The pixel defining layer 150 may be formed of an organic material such as polyimide or hexamethyldisiloxane (HMDSO).

The intermediate layer 320 of the organic light emitting device may include a low molecular weight or a high molecular weight material. (HIL), a hole transport layer (HTL), an emission layer (EML), an electron transport layer (ETL), and an electron injection layer (EIL) : Electron Injection Layer) may be laminated in a single or a composite structure, and may have a structure of copper phthalocyanine (CuPc), N, N-di (naphthalen-1-yl) -N, N-diphenyl-benzidine (NPB), tris-8-hydroxyquinoline aluminum (Alq3), and the like, As well as various organic materials. These layers may be formed by a method of vacuum deposition.

When the intermediate layer 320 includes a polymer material, it may have a structure including a hole transport layer (HTL) and a light emitting layer (EML). In this case, the hole transport layer may include PEDOT, and the light emitting layer may include a polymer material such as poly-phenylenevinylene (PPV) and polyfluorene. The intermediate layer 320 may be formed by a screen printing method, an inkjet printing method, a laser induced thermal imaging (LITI) method, or the like.

Of course, the intermediate layer 320 is not necessarily limited to this, and may have various structures. The intermediate layer 320 may include a layer that is integrated over the plurality of pixel electrodes 310 and may include a patterned layer corresponding to each of the plurality of pixel electrodes 310.

The counter electrode 330 is disposed on the display area DA, and may be disposed to cover the display area DA as shown in FIG. That is, the counter electrode 330 may be integrally formed with a plurality of organic light emitting elements to correspond to the plurality of pixel electrodes 310.

Since the organic light emitting device can be easily damaged by moisture or oxygen from the outside, the sealing layer 400 covers and protects the organic light emitting device. The sealing layer 400 may cover the display area DA and extend to the outside of the display area DA. The sealing layer 400 may include a first inorganic sealing layer 410, an organic sealing layer 420, and a second inorganic sealing layer 430 as shown in FIG.

The first inorganic sealing layer 410 covers the counter electrode 330 and may include silicon oxide, silicon nitride, and / or silicon oxynitride. Of course, other layers such as a capping layer may be interposed between the first inorganic encapsulating layer 410 and the counter electrode 330 as necessary. Since the first inorganic encapsulating layer 410 is formed along the underlying structure, the top surface of the first inorganic encapsulating layer 410 is not flat as shown in FIG. The organic sealing layer 420 covers the first inorganic sealing layer 410. Unlike the first inorganic sealing layer 410, the organic sealing layer 420 may have a substantially flat upper surface. Specifically, the top surface of the organic sealing layer 420 may be substantially flat at a portion corresponding to the display area DA. The organic sealing layer 420 may include one or more materials selected from the group consisting of polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyimide, polyethylene sulfonate, polyoxymethylene, polyarylate, and hexamethyldisiloxane. have. The second inorganic encapsulation layer 430 covers the organic encapsulation layer 420 and may include silicon oxide, silicon nitride, and / or silicon oxynitride. The second inorganic encapsulation layer 430 contacts the first inorganic encapsulation layer 410 at a position of the second encapsulation layer 410 located outside the display area DA to prevent the organic encapsulation layer 420 from being exposed to the outside.

The sealing layer 400 includes a first inorganic encapsulating layer 410, an organic encapsulating layer 420 and a second inorganic encapsulating layer 430. The encapsulating layer 400 may be cracked It is possible to prevent such a crack from being connected between the first inorganic encapsulation layer 410 and the organic encapsulation layer 420 or between the organic encapsulation layer 420 and the second inorganic encapsulation layer 430. [ Accordingly, it is possible to prevent or minimize the formation of a path through which moisture, oxygen, etc. from the outside penetrates into the display area DA.

After acquiring a plurality of display panels having such a structure, necessary components can be formed in each of the plurality of display panels. For example, the polarizing plate 520 may be attached to the sealing layer 400 by an optically clear adhesive (OCA) 510. The polarizer 520 may reduce the reflection of external light. For example, when external light passes through the polarizing plate 520 and then passes through the polarizing plate 520 after being reflected from the upper surface of the counter electrode 330, the phase of the external light can be changed as it passes through the polarizing plate 520 twice. As a result, the phase of the reflected light is made different from the phase of the external light entering the polarizing plate 520, so that extinction interference is generated. As a result, visibility can be improved by reducing external light reflection. The translucent adhesive 510 and the polarizing plate 520 may be positioned to cover the opening of the planarization layer 140, for example, as shown in Fig.

Of course, in the method of manufacturing a display device according to the present embodiment, the step of forming the polarizing plate 520 is not always required, and other configurations other than the polarizing plate 520 may be used as needed. For example, the black matrix and the color filter may be formed without attaching the polarizer 520, thereby reducing the external light reflection in the completed display device.

Thereafter, the temporary protective film 20 is removed from the plurality of display panels as shown in FIG. 7, the lower protective film 170 is attached to the lower surface (-z direction) of each of the plurality of display panels so as to correspond to the first area 1A of each of the plurality of display panels.

The lower protective film 170 covers most of the first area 1A of the display panel, as shown in Fig. The lower protective film 170 does not cover the bending area BA and the second area 2A of the display panel. 7, the end of the lower protective film 170 in the direction of the second area 2A is located in the first area 1A and not only does not overlap with the bending area BA, BA). At this time, even if the end of the lower protective film 170 in the direction of the second region 2A is located in the first region 1A, as shown in FIG. 7, the portion of the lower protective film 170, which is formed with the uneven surface 160a of the organic material layer 160 Can be slightly overlapped. This is because the lower protective film 170 covers as much of the lower surface of the display panel as possible, thereby protecting a large portion of the display panel. The lower protective film 170 protects the lower surface of the display panel, that is, the lower surface (-z direction) of the substrate 100, and can have sufficient strength for this purpose. For example, the lower protective film 170 may comprise polyethylene terephthalate (PET).

Since the lower protective film 170 protects the lower surface of the substrate 100, it is necessary to prevent the lower protective film 170 from being easily removed in a subsequent handling process. Therefore, it is preferable that the adhesive strength between the lower protective film 170 and the mother substrate 100 is maintained sufficiently strong. To this end, it is necessary to make the adhesive force between the lower protective film 170 and the mother substrate 100 strong enough. On the other hand, as described above, it is desirable that the adhesive force between the temporary protective film 20 and the mother substrate 100 is not strong. As a result, the adhesion between the lower protective film 170 and the substrate 100 can be greater than the adhesion between the temporary protective film 20 and the mother substrate 100.

When attaching a certain film to a substrate using a pressure-sensitive adhesive, a UV-curing pressure-sensitive adhesive may be used. In this case, UV light is applied to the pressure-sensitive adhesive in order to control the adhesive force of the pressure-sensitive adhesive. At this time, the ultimate adhesive force of the pressure-sensitive adhesive can be controlled by adjusting the exposure time and the intensity of the UV light which are continuously irradiated with the UV light. Therefore, the exposure time at which the UV light is continuously applied to the adhesive between the temporary protective film 20 and the mother substrate 100 is shorter than the exposure time at which the UV light is continuously applied to the adhesive between the lower protective film 170 and the substrate 100 The adhesion between the lower protective film 170 and the substrate 100 can be made greater than the adhesion between the temporary protective film 20 and the mother substrate 100. [ Or the intensity of the UV light irradiated to the adhesive between the temporary protective film 20 and the mother substrate 100 is higher than the intensity of the UV light irradiated to the adhesive between the lower protective film 170 and the substrate 100, The adhesion between the film 170 and the substrate 100 can be made greater than the adhesion between the temporary protective film 20 and the mother substrate 100. [

The value obtained by dividing the area of the pressure sensitive adhesive interposed between the lower protective film 170 and the substrate 100 by the area of the substrate 100 corresponds to the area of the pressure sensitive adhesive interposed between the temporary protective film 20 and the mother substrate 100 The total adhesion force between the lower protective film 170 and the substrate 100 is larger than the total adhesion force between the temporary protective film 20 and the mother substrate 100. [ . In this case, it is assumed that the adhesive applied between the temporary protective film 20 and the mother substrate 100 is not applied to the entire area of the mother substrate 100 or the temporary protective film 20.

After attaching the lower protective film 170, the display panel is bent to be bent as shown in FIG. In FIG. 8, only the substrate 100 is shown for the sake of convenience. The bent portion of the substrate 100 is a bending region BA and a bending region BA intersecting a virtual straight line IL connecting the center of the first region 1A and the center of the second region 2A The substrate 100 is bent around the axis BAX.

At this time, as described above, since the lower protective film 170 has a shape corresponding to the first area 1A and does not exist in the bending area BA, defects due to the lower protective film do not occur at the time of bending the display panel . The lower protective film 170 protects the lower surface of the substrate 100 and may have its own rigidity. If the lower protective film 170 is present in the bending area BA and the lower protective film 170 is low in flexibility, the lower protective film 170 and the substrate 100 may be bent as the substrate 100 is bent, The peeling may occur. If the lower protective film 170 is also present in the bending area BA, defects such as wrinkles may be formed in the bending area BA of the lower protective film 170 as the substrate 100 is bent have. However, since the lower protective film 170 is not present in the bending area BA in the method of manufacturing the display device according to the present embodiment, such a defect occurs in the process of bending the display panel after attaching the lower protective film 170 Can be prevented.

On the other hand, the buffer layer 110 including the inorganic material, the gate insulating film 120, and the interlayer insulating film 130 may be collectively referred to as a first inorganic insulating layer. This first inorganic insulating layer has a first opening corresponding to the bending area BA, as shown in Figs. 5-7. That is, each of the buffer layer 110, the gate insulating layer 120, and the interlayer insulating layer 130 may have openings 110a, 120a, and 130a corresponding to the bending areas BA. This first opening corresponds to the bending area BA, it can be understood that the first opening overlaps with the bending area BA. At this time, the area of the first opening may be wider than the area of the bending area BA. 5 to 7 show that the width OW of the first opening is wider than the width of the bending area BA. Here, the area of the first opening may be defined as the area of the opening of the narrowest area among the openings 110a, 120a, and 130a of the buffer layer 110, the gate insulating film 120, and the interlayer insulating film 130, In FIG. 7, the area of the first opening is defined by the area of the opening 110a of the buffer layer 110.

5 to 7, the inner surface of the opening 110a of the buffer layer 110 and the inner surface of the opening 120a of the gate insulating layer 120 are shown as being aligned with each other, but the present invention is not limited thereto . The area of the opening 120a of the gate insulating film 120 may be larger than the area of the opening 110a of the buffer layer 110, for example. The area of the first opening may be defined as the area of the opening of the narrowest area among the openings 110a, 120a, and 130a of the buffer layer 110, the gate insulating film 120, and the interlayer insulating film 130.

When forming the plurality of display portions DU as described above, the organic layer 160 filling at least a part of the first opening of the first inorganic insulating layer is formed. 5 to 7 show that the organic material layer 160 fills all the first openings. The display portion DU includes a first conductive layer 215c that extends from the first region 1A to the second region 2A via the bending region BA And the organic layer 160, as shown in FIG. Of course, where the organic material layer 160 is not present, the first conductive layer 215c may be located on the inorganic insulating layer such as the interlayer insulating layer 130 or the like. The first conductive layer 215c may be formed of the same material as the source electrode 215a or the drain electrode 215b.

7, the lower protective film 170 is attached to the lower surface of the substrate 100, and then the display panel is bent in the bending area BA as shown in FIG. In this case, tensile stress may be applied to the first conductive layer 215c during bending of the substrate 100 in the bending area BA. However, in the method of manufacturing a display device according to the present embodiment, It is possible to prevent or minimize the occurrence of defects in the conductive layer 215c.

If the first inorganic insulating layer such as the buffer layer 110, the gate insulating film 120 and / or the interlayer insulating film 130 does not have an opening in the bending region BA and the second region 2A in the first region 1A, And if the first conductive layer 215c is located on such a first inorganic insulating layer, a large tensile stress is applied to the first conductive layer 215c during the process of bending the substrate 100 or the like . Particularly, since the hardness of the first inorganic insulating layer is higher than that of the organic material layer, the probability of occurrence of a crack or the like in the first inorganic insulating layer in the bending area BA is very high. When a crack occurs in the first inorganic insulating layer, A crack or the like is also generated in the first conductive layer 215c on the first conductive layer 215c and the probability of occurrence of disconnection or the like of the first conductive layer 215c is extremely high.

However, in the case of the display device manufacturing method according to the present embodiment, the first inorganic insulating layer has the first opening in the bending area BA and the portion of the bending area BA in the first conductive layer 215c And is located on the organic layer 160 filling at least a portion of the first opening of the first inorganic insulating layer. Since the first inorganic insulating layer has a first opening in the bending area BA, the probability of occurrence of cracks or the like in the first inorganic insulating layer is extremely low, and in the case of the organic material layer 160, the probability of cracking Is low. Therefore, it is possible to prevent a crack or the like from occurring in the bending area BA of the first conductive layer 215c located on the organic layer 160, or to minimize the occurrence probability. Of course, since the hardness of the organic material layer 160 is lower than that of the inorganic material layer, tensile stress generated by the bending of the substrate 100 or the like is absorbed by the organic material layer 160 and tensile stress is concentrated on the first conductive layer 215c Can be effectively minimized.

On the other hand, the second conductive layers 213a and 213b may be formed in addition to the first conductive layer 215c when forming the display part DU. The second conductive layers 213a and 213b are formed in the first region 1A or the second region 2A so as to be located in a layer different from the layer in which the first conductive layer 215c is located, As shown in FIG. 5 to 7, the second conductive layers 213a and 213b are formed on the same layer, that is, on the gate insulating layer 120, using the same material as the gate electrode 213 of the thin film transistor 210. [ And the first conductive layer 215c contacts the second conductive layers 213a and 213b through contact holes formed in the interlayer insulating layer 130. [ The second conductive layer 213a is located in the first region 1A and the second conductive layer 213b is located in the second region 2A.

The second conductive layer 213a located in the first region 1A may be electrically connected to a thin film transistor or the like in the display region DA so that the first conductive layer 215c is electrically connected to the second conductive layer 213a, To be electrically connected to a thin film transistor or the like in the display area DA. Of course, the second conductive layer 213b located in the second region 2A may be electrically connected to the thin film transistor in the display area DA by the first conductive layer 215c. The second conductive layers 213a and 213b may be electrically connected to the components located outside the display area DA while being positioned outside the display area DA and may be electrically connected to the display area DA DA) so that at least a part thereof may be located in the display area DA.

7, the lower protective film 170 is attached to the lower surface of the substrate 100, and then the display panel is bent in the bending area BA as shown in FIG. At this time, tensile stress may be applied to the components located in the bending area BA in the course of bending the substrate 100 in the bending area BA.

Thus, the first conductive layer 215c across the bending area BA is formed to include a material having a high elongation, so that cracks are generated in the first conductive layer 215c or the first conductive layer 215c is broken And the like can be prevented from occurring. In addition, in the first region 1A or the second region 2A, the second conductive layer 215c may be formed of a material having an elongation lower than that of the first conductive layer 215c but having an electrical / physical property different from that of the first conductive layer 215c 213a, and 213b, the efficiency of electrical signal transmission in the display device can be increased, or the rate of failure occurrence in the manufacturing process can be reduced. For example, the second conductive layers 213a and 213b may include molybdenum, and the first conductive layer 215c may include aluminum. Of course, the first conductive layer 215c and the second conductive layers 213a and 213b may have a multi-layer structure if necessary.

Of course, in the case of the second conductive layer 213b located in the second region 2A, at least a part of the upper portion of the second conductive layer 213b is not covered with the planarization layer 140, , And can be electrically connected to various electronic elements and printed circuit boards.

5 to 7, the organic material layer 160 may have an uneven surface 160a on at least a part of the upper surface (in the + z direction). As the organic layer 160 has the uneven surface 160a, the upper surface and / or the lower surface of the first conductive layer 215c located on the organic layer 160 are formed on the uneven surface 160a of the organic layer 160 May have a corresponding shape.

The tensile stress can be applied to the first conductive layer 215c by bending the substrate 100 in the bending area BA during the manufacturing process and the upper surface of the first conductive layer 215c and / Or the lower surface has a shape corresponding to the uneven surface 160a of the organic material layer 160, the amount of tensile stress applied to the first conductive layer 215c can be minimized. In other words, the tensile stress that may occur in the bending process can be reduced by deforming the shape of the organic material layer 160 having a low strength. At this time, at least the shape of the first conductive layer 215c, It is possible to effectively prevent defects such as disconnection in the first conductive layer 215c from occurring.

The surface area of the upper surface of the organic material layer 160 and the surface area of the first conductive layer 215c in the first opening can be reduced by forming the uneven surface 160a on at least a part of the upper surface of the organic material layer 160 The surface area of the upper and lower surfaces can be widened. The reason why the surface area is large on the top surface of the organic material layer 160 and on the top surface and the bottom surface of the first conductive layer 215c is that the shape of the substrate 100 can be deformed in order to reduce tensile stress due to bending of the substrate 100, .

The lower surface of the first conductive layer 215c has a shape corresponding to the uneven surface 160a of the organic material layer 160 because the first conductive layer 215c is located on the organic material layer 160. [ However, the upper surface of the first conductive layer 215c may have an uneven surface, and may have an uneven surface having a unique shape that does not correspond to the uneven surface 160a of the organic material layer 160. [

The uneven surface 160a of the upper surface of the organic material layer 160 (in the + z direction) can be formed by various methods. For example, when a photoresist material is used to form the organic layer 160 and various portions of the organic layer 160 whose top surface is in a substantially flat state during the manufacturing process are exposed to different amounts of exposure using a slit mask or a halftone mask , So that a particular portion can be etched (removed) relatively more than the other portion. Here, the more etched portions can be understood as the concave portions on the upper surface of the organic material layer 160. Of course, the method used in manufacturing the display device according to the present embodiment is not limited to such a method. For example, the organic layer 160 having a substantially flat top surface may be formed, and only a specific portion may be removed by a dry etching method or the like.

The organic material layer 160 has a plurality of grooves extending in the first direction (+ y direction) on the upper surface in the + z direction so that the organic material layer 160 has the uneven surface 160a on the (+ z) . At this time, the shape of the upper surface of the first conductive layer 215c on the organic material layer 160 corresponds to the shape of the upper surface of the organic material layer 160.

The organic layer 160 may have an uneven surface 160a only in the first opening of the first inorganic insulating layer. 5 to 7, the width UEW of the portion where the uneven surface 160a of the organic layer 160 is formed is smaller than the width OW of the first opening of the first inorganic insulating layer. If the organic material layer 160 has an uneven surface 160a on the inside and outside of the first opening of the first inorganic insulating layer, the inside surface of the opening 110a of the buffer layer 110 and the inside surface of the opening 120a The organic layer 160 also has the uneven surface 160a in the vicinity of the inner surface of the opening 130a of the interlayer insulating film 130 and the inner surface of the opening 130a. The organic material layer 160 in the concave portion of the uneven surface 160a is relatively thinner than the organic material layer 160 in the protruding portion so that the concave portion is formed on the inner surface of the opening 110a of the buffer layer 110, The organic material layer 160 can be disconnected without being continuously connected if the inner surface of the opening 120a of the gate insulating film 120 or the inner surface of the opening 130a of the interlayer insulating film 130 is positioned. The internal surface of the opening 110a of the buffer layer 110 and the surface of the opening 120a of the gate insulating film 120 can be formed by providing the organic material layer 160 only in the first opening of the first inorganic insulating layer. It is possible to prevent the organic layer 160 from being broken at the inner side of the opening 130a of the interlayer insulating film 130 or near the inner side of the opening 130a.

As described above, it is preferable that the organic material layer 160 has the uneven surface 160a in the bending area BA in order to prevent the first conductive layer 215c from breaking in the bending area BA . As a result, the area of the portion of the organic material layer 160 having the uneven surface 160a is larger than the area of the bending region BA but narrower than the area of the first opening. 5 to 7, the width UEW of the portion having the uneven surface 160a of the organic layer 160 is larger than the width of the bending area BA and narrower than the width OW of the first opening.

If at least one of the buffer layer 110, the gate insulating layer 120, and the interlayer insulating layer 130 includes an organic insulating material, the organic insulating layer 160 may be formed at the same time Further, the layer including the organic insulating material and the organic material layer 160 may be integrally formed with each other. Examples of such organic insulators include polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyimide, polyethylene sulfonate, polyoxymethylene, polyarylate, or hexamethyldisiloxane.

After acquiring a plurality of display panels as shown in Fig. 5, before the temporary protective film 20 is removed from the plurality of display panels as shown in Fig. 6, stress neutralization is performed outside the display area DA A stress neutralization layer (SNL) 600 may be formed. That is, the stress-neutralizing layer 600 may be positioned on the first conductive layer 215c corresponding to at least the bending area BA.

When a laminate is bent, a stress neutral plane exists in the laminate. If the stress neutralization layer 600 is not present, excessive tensile stress or the like may be applied to the first conductive layer 215c in the bending area BA according to bending of the substrate 100 or the like as described above have. This is because the position of the first conductive layer 215c may not correspond to the stress neutral plane. However, by controlling the thickness, modulus, and the like of the stress-neutralizing layer 600, it is possible to reduce stress neutrality in the laminate including both the substrate 100, the first conductive layer 215c, and the stress neutralization layer 600 The position of the plane can be adjusted. Thus, by placing the stress neutral plane in the vicinity of the first conductive layer 215c through the stress neutralization layer 600, the tensile stress applied to the first conductive layer 215c can be minimized.

The stress relieving layer 600 may be formed to extend to the edge of the substrate 100 of the display device, as shown in FIGS. The first conductive layer 215c, the second conductive layer 213b, and / or other conductive layers electrically connected to the first conductive layer 215c and / or the second conductive layer 213b in the second region 2A may be formed at least partially in the interlayer insulating layer 130 or the planarization layer 140, and the like, and can be electrically connected to various electronic elements, a printed circuit board, and the like. Accordingly, the first conductive layer 215c, the second conductive layer 213b, and / or other conductive layers electrically connected to the first conductive layer 215c and the second conductive layer 213b are electrically connected to each other with various electronic elements or printed circuit boards. At this time, it is necessary to protect the electrically connected portion from impurities such as external moisture, and by allowing the stress neutralizing layer 600 to cover such an electrically connected portion, You can even play roles. For this purpose, the stress-neutralizing layer 600 may be extended to the edge of the substrate 100 of the display device, for example.

5 to 7 illustrate that the upper surface of the stress neutrality layer 600 in the display area DA direction (-x direction) coincides with the upper surface of the polarizer 520 in the + z direction. However, But is not limited thereto. The end of the stress neutrality layer 600 in the direction of the display area DA (-x direction) may cover a part of the upper surface of the edge of the polarizing plate 520. Or the end of the stress neutrality layer 600 in the display area DA direction (-x direction) may not be in contact with the polarizing plate 520 and / or the light transmitting adhesive 510.

When attaching the lower protective film 170 corresponding to the first region 1A as shown in Fig. 7, various methods can be used. For example, as shown in FIG. 9, which is a plan view schematically illustrating a process of a method of manufacturing a display device according to another embodiment of the present invention, a lower protective film 170 is formed on the (-z direction) The lower protective film 170 is attached to the lower surface of each of the plurality of display panels so that a part of the lower protective film 170 having an area wider than the area of the first area 1A is exposed to the outside of the display panel . 10, a portion of the lower protective film 170 exposed to the outside of the display panel, that is, a portion exposed to the outside of the substrate 100, may be removed. At this time, a portion of the lower protective film 170 near the edge of the substrate 100 is irradiated with a laser beam to irradiate a portion exposed to the outside of the display panel of the lower protective film 170, that is, a portion exposed to the outside of the substrate 100 Can be removed.

The lower protective film 170 is not accurately exposed to the outside of the substrate 100 as shown in Figure 10 when the lower protective film 170 is attached to the lower surface of the substrate 100 from the beginning. A lower protective film 170 having a width corresponding to the width (in the + y direction) of the substrate 100 may be prepared and attached to the lower surface of the substrate 100. However, in this case, there is a problem that the lower protective film 170 and the substrate 100 must be accurately aligned. The lower protective film 170 and the substrate 100 are aligned only to the extent that the lower protective film 170 does not overlap the bending area BA so that the lower protective film 170 The lower protective film 170 is attached to the lower surface of the substrate 100 and then only the portion of the lower protective film 170 exposed to the outside of the substrate 100 is removed. In this case, since it is not necessary to precisely align the lower protective film 170 with respect to the substrate 100, the incidence of defects in the manufacturing process can be remarkably reduced, and the time required for manufacturing can be effectively reduced.

On the other hand, a printed circuit board (FPCB) may be attached to the display panel as shown in FIG. 4, the mother substrate 100 and the temporary protective film 20 are cut to obtain a plurality of display panels, and then the temporary protective film 20 is removed. It can be done before. Specifically, after attaching the polarizing plate 520 on the sealing layer 400 using the translucent adhesive 510 as described above, the printed circuit board FPCB is placed on the display panel 400 before the stress neutralizing layer 600 is applied. Can be attached. The printed circuit board (FPCB) may be attached to the second area 2A of the display panel, and in this case, electrically connected to the second conductive layer 213b.

9 and 10, the straight line IL connecting the center C1 of the first area 1A of the display panel and the center C2 of the second area 2A intersects with the straight line IL of the second area 2A, The length of the second region 2A in the direction of the imaginary straight line IL of the printed circuit board FPCB may be the same as the length of the second region 2A in the direction of + .

The lower protective film 170 is not present in the second region 2A where the printed circuit board FPCB is attached, do. Therefore, if the printed circuit board FPCB is attached to the second area 2A after removing the temporary protective film 20, the printed circuit board FPCB is not attached to the correct position of the display panel due to the characteristics of the flexible display panel . Therefore, by attaching the printed circuit board (FPCB) to the second area 2A of the display panel before removing the temporary protective film 20, the display panel can be supported even by the temporary protective film 20, The substrate FPCB can be attached to the second area 2A of the display panel.

At this time, the length of the second area 2A in the direction (+ y direction) intersecting with the imaginary line IL of the display panel and the length of the second area 2A in the direction crossing the imaginary straight line IL of the printed circuit board FPCB + y direction) are equal to each other, it is possible to effectively prevent the display panel from being deformed after removal of the temporary protective film 20. If the length in the direction (+ y direction) intersecting with the imaginary straight line IL of the printed circuit board FPCB is the second area in the direction (+ y direction) intersecting with the imaginary straight line IL of the display panel Only a part of the edge of the second area 2A extending in the direction (+ y direction) intersecting with the virtual straight line IL comes into contact with the printed circuit board FPCB. In this case, it can be understood that the second area 2A is not uniformly supported by the printed circuit board FPCB because the entire edge of the second area 2A is not in contact with the printed circuit board FPCB, As a result, deformation of the substrate 100 or the like may occur in the second area 2A. The length of the second region 2A in the direction (+ y direction) intersecting with the imaginary straight line IL of the display panel and the length of the second region 2A in the direction crossing the imaginary straight line IL of the printed circuit board FPCB + the entire edge of the second area 2A is brought into contact with the printed circuit board FPCB so that the second area 2A is evenly supported by the printed circuit board FPCB As a result, the possibility of deformation of the substrate 100 and the like in the second region 2A can be drastically reduced.

The electronic chip EC contacts the substrate 100 or the like and the printed circuit board FPCB does not contact the electronic chip EC as shown in FIG. 11, instead of directly contacting the printed circuit board FPCB directly to the substrate 100, The length of the second region 2A in the direction (+ y direction) intersecting with the imaginary straight line IL of the display panel and the length of the second region 2A in the direction intersecting with the imaginary straight line IL of the electronic chip EC (+ Y direction) in the direction perpendicular to the X-direction.

Although a plurality of display units DU are formed on the mother substrate 100 and the mother substrate 100 and the temporary protective film 20 are simultaneously cut to form a plurality of display panels, But is not limited thereto. For example, as shown in Fig. 12, which is a cross-sectional view schematically showing a process of a method of manufacturing a display device according to another embodiment of the present invention, a method of manufacturing a display device comprising a carrier substrate 10, The substrate 100 may be formed and one display portion DU may be formed on the first region 1A of the substrate 100. [ 13, the substrate 100 is separated from the carrier substrate 10 and the temporary protective film 20 is attached to the lower surface of the carrier substrate 10 of the substrate 100 (in the -z direction) can do.

In this case, the substrate 100 has a first region 1A, a second region 2A, and a bending region BA located between the first region 1A and the second region 2A from the beginning, It can be understood that the protective film 20 is attached to the lower surface of the substrate 100 across the first area 1A, the bending area BA and the second area 2A. And Fig. 5 can be understood to show such a state that the temporary protective film 20 is attached.

Hereinafter, the contents described above with reference to FIGS. 5 to 8 can be directly applied. 5, the polarizer 520 is attached and the printed circuit board (FPCB) or the electronic chip EC is electrically connected to the second conductive layer 213b, and the stress neutralization layer 600 . 6, the temporary protective film 20 may be removed, and the lower protective film 170 may be attached to the lower surface of the substrate 100 so as to correspond to the first region 1A as shown in FIG. 7 have. Then, the display device can be manufactured by bending the substrate 100 so as to bend about the bending axis BAX in the bending area BA as shown in Fig.

9 and 10, the lower protective film 170 has an area wider than the area of the first area 1A, so that a part of the lower protective film 170 is exposed to the outside of the substrate 100, A portion of the lower protective film 170 exposed to the outside of the substrate 100 may be removed by irradiating the lower protective film 170 with a laser beam. As shown in Figs. 10 and 11, in a direction intersecting the imaginary line IL connecting the center C1 of the first area 1A of the display panel and the center C2 of the second area 2A (+ y direction) and the length in the direction (+ y direction) intersecting the virtual straight line IL of the printed circuit board FPCB or the electronic chip EC are the same .

Although the display device manufacturing method has been described so far, the present invention is not limited thereto, and the display device manufactured according to the method is also within the scope of the present invention.

14, the display device according to the present embodiment may include a substrate 100, a display portion DU, a lower protective film 170, and a supporting layer 700, as shown in FIG.

The substrate 100 may have a bending area BA located between the first area 1A and the second area 2A as described above and may have a shape bent around the bending axis. As a result, at least a part of the lower surface of the first region 1A of the substrate 100 and the lower surface of the second region 2A are opposed to each other.

The display portion DU is disposed on the upper surface of the substrate 100 so as to be located in the first region 1A. The display portion DU may include the thin film transistor 210 and the display device 300 as described above with reference to FIGS. 5 to 7 and may further include the sealing layer 400, the light-transmitting adhesive 510, and / Or a polarizing plate 520 as shown in FIG.

The lower protective film 170 is located on the lower surface of the substrate 100 so as to correspond to at least a part of the first region 1A. The supporting layer 700 is interposed between the lower protective film 170 and the lower surface of the second region 2A of the substrate 100. This support layer 700 may comprise a metal such as stainless steel and / or a resilient synthetic resin. Thus, the lower protective film 170 may not be present in the bending area BA and the second area 2A. The support layer 700 may be adhered to the lower protective film 170 and to the lower surface of the substrate 100 in the second region 2A. Of course, additional layers may be interposed between the lower protective film 170 and the support layer 700 as needed.

On the other hand, the substrate 100 may be smoothly bent in the bending area BA as shown in Fig. 14, but for this purpose, the substrate 100 needs to have sufficient strength. However, if the substrate 100 has sufficient strength, the substrate 100 may be damaged during the bending process. Therefore, the substrate 100 needs to have excellent flexibility or bending property at least in the bending area BA. In this case, the shape of the substrate 100 in the bending area BA may be modified, as shown in Fig. 15, which is a sectional view schematically showing a part of another display device according to another embodiment of the present invention.

Specifically, a portion of the substrate 100 on which the support layer 700 is disposed is referred to as a first lower surface 101a and a lower surface of the substrate 100 in the second region 2A The distance d1 between the first lower surface 101a and the second lower surface 102a is smaller than the distance d1 between the first lower surface 101a and the second lower surface 102a in the lower surface of the substrate 100. [ And the second lower surface 102a of the first lower surface 102a.

The lower protective film 170 is bonded to the supporting layer 700 in the first region 1A of the substrate 100 and the second lower surface 102a in the second region 1A of the substrate 100 is also bonded to the supporting layer 700. [ The distance d1 must be fixed. On the other hand, in the case of the bending area BA of the substrate 100, since there is no other component for fixing the position of the bending area BA, the shape of the bending area BA can be deformed by the restoring force to restore the substrate 100 before bending, The maximum distance d2 between mutually facing portions between the first and second lower surfaces 101a and 102a of the lower surface of the base 100 is less than the distance between the first and second lower surfaces 101a and 102a (d1).

In this case, a virtual first plane including the upper surface of the substrate 100 in the second region 2A at the portion corresponding to the support layer 700 can be considered. It can be understood that this imaginary first plane is parallel to the xy plane. 15, a first upper surface of a portion of the upper surface of the substrate 100 in which the supporting layer 700 is located and a second upper surface of the upper surface of the substrate 100 in the second region 2A A part of the upper surface of the substrate 100 between the second upper surface at the portion where the supporting layer 700 is located protrudes in the direction opposite to the display portion DU direction (-z direction) . That is, the substrate 100 in the portion of the bending region BA adjacent to the second region 2A may have a convex shape downward (-z direction).

The portion of the bending area BA adjacent to the first area 1A is directly or indirectly supported by the first wide area 1A while the part of the bending area BA adjacent to the second area 2A is relatively And is directly or indirectly supported by the narrow second region 2A. The substrate 100 can have a convex shape in the downward direction (-z direction) at the portion of the bending area BA adjacent to the second area 2A.

16, which is a cross-sectional view schematically showing a part of another display device according to another embodiment of the present invention, the upper surface of the substrate 100 between the first upper surface and the second upper surface, A portion may protrude in the direction of the display portion DU (+ z direction) from the imaginary second plane including the upper surface of the substrate 100 at the portion where the display portion DU is disposed.

17 is a cross-sectional view schematically showing a part of another display device according to another embodiment of the present invention. The area of the surface 701 of the supporting layer 700 in the direction of the lower protective film 107 and the surface of the supporting layer 700 in the direction of the second region 2A of the substrate 100 (702) are different from each other. The area of the surface 701 of the supporting layer 700 in the direction of the lower protective film 170 is larger than the area of the surface 702 of the supporting layer 700 in the direction of the second area 2A of the substrate 100 .

In this case, the first upper surface of the upper surface of the first region 1A of the substrate 100 where the supporting layer 700 is located and the upper surface of the supporting layer 700 of the upper surface of the second region 2A of the substrate 100, A portion of the upper surface of the substrate 100 between the second upper surface in the portion where the first display portion DU is projected in the opposite direction (-z direction) to the display portion DU direction. That is, the substrate 100 in the portion of the bending region BA adjacent to the second region 2A may have a convex shape downward (-z direction). However, it can be prevented from protruding in the direction of the display portion DU (+ z direction) from the portion of the bending region BA adjacent to the first region 1A. This is because the area of the surface 701 of the support layer 700 in the direction of the lower protective film 170 is wider than the area of the surface 702 of the support layer 700 in the direction of the second area 2A of the substrate 100, It is possible to prevent deformation of the portion of the first region BA adjacent to the first region 1A.

18 is a cross-sectional view schematically showing a part of another display device according to still another embodiment of the present invention. 18, in the display device according to the present embodiment, the electronic device located on the second upper surface in the portion where the supporting layer 700 is located in the upper surface of the second region 2A of the substrate 100 800). The electronic device 800 includes a direct circuit or the like for controlling an electrical signal to be applied to the display unit DU or a direct circuit that receives an external electrical signal and converts the electrical signal into an electrical signal to be applied to the display unit DU. Circuits, and the like.

The display device according to the present embodiment also includes a reinforcing film 810 located on the second upper surface so as to be positioned adjacent to the electronic element 800. [ The reinforcing film 810 may prevent deformation that may occur in the second area 2A of the substrate 100. [ The second region 2A of the substrate 100 corresponds to the vicinity of the edge of the substrate 100 as shown in Fig. 18 and the like, and the shape thereof may be deformed. However, by placing the reinforcing film 810, it is possible to effectively prevent such deformation from occurring. In addition, in order to maximize the deformation preventing effect, the reinforcing film 810 may cover all portions of the second upper surface exposed to the outside of the electronic device 800. [ The stress relieving layer 600 shown in FIG. 7 and the like may extend to the edge of the substrate 100 so as to cover at least a part of the reinforcing film 810, and the like.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is evident that many alternatives, modifications and variations will be apparent to those skilled in the art . Therefore, the true scope of the present invention should be determined by the technical idea of the appended claims.

1A: first region 2A: second region
BA: Bending area BAX: Bending axis
DU: Display section 20: Temporary protective film
100: mother board, substrate 110: buffer layer
120: Gate insulating film 130: Interlayer insulating film
110a, 120a, 130a: opening 140: planarization layer
150: pixel defining layer 160: organic layer
170: lower protective film 210: thin film transistor
211: semiconductor layer 213: gate electrode
213a, 213b: second conductive layer 215a: source electrode
215b: drain electrode 215c: first conductive layer
300: display element 310: pixel electrode
320: intermediate layer 330: opposing electrode

Claims (9)

Wherein the second region has a bending region located between the first region and the second region and is bent about a bending axis such that at least a portion of the first region and the at least a portion of the second region are facing each other, Direction, and at least a part of a lower surface of the second region in the direction of the first region faces the substrate;
A display unit disposed on an upper surface of the substrate;
A lower protective film located on a lower surface of the substrate to correspond to at least a portion of the first region;
A supporting layer interposed between a lower surface of the lower protective film and the lower surface of the substrate; And
An electronic device located on a second top surface of the substrate, the top surface of which is the portion of the substrate on which the supporting layer is located;
And a display device. The method according to claim 1,
Wherein the supporting layer is adhered to a lower surface of the lower protective film and the second region of the substrate. The method according to claim 1,
Wherein a distance between a first lower surface of a portion of the substrate on which the support layer is located and a second surface of the substrate on which the support layer is located, Of the lower surface of the first lower surface and the second lower surface. The method of claim 3,
The upper surface of the substrate in the first area of the substrate and the upper surface of the substrate in the second area of the substrate, Is projected in a direction opposite to the direction of the display portion, with respect to a virtual first plane including an upper surface of the substrate in the second region at a portion corresponding to the support layer. 5. The method of claim 4,
And the other portion of the upper surface of the substrate between the first upper surface and the second upper surface is protruded toward the display portion from a virtual second plane including the upper surface of the substrate at the portion where the display portion is disposed, Display device. The method according to claim 1,
An area of a surface of the support layer in the direction of the lower protective film is different from an area of a surface of the substrate in the direction of the second area of the support layer. The method according to claim 1,
Wherein an area of a surface of the support layer in the direction of the lower protective film is wider than an area of a surface of the substrate in the direction of the second region. The method according to claim 1,
And a reinforcing film disposed on the second upper surface so as to be positioned adjacent to the electronic device. 9. The method of claim 8,
Wherein the reinforcing film covers all portions of the second upper surface exposed to the outside of the electronic device.

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