CN112563297A

CN112563297A - Image sensor chip and manufacturing method thereof

Info

Publication number: CN112563297A
Application number: CN202011336973.4A
Authority: CN
Inventors: 冉濛; 陆斌; 沈健
Original assignee: Shenzhen Goodix Technology Co Ltd
Current assignee: Shenzhen Goodix Technology Co Ltd
Priority date: 2020-11-25
Filing date: 2020-11-25
Publication date: 2021-03-26

Abstract

The embodiment of the invention relates to a method for manufacturing a curved surface image sensor chip. The manufacturing method comprises the following steps: providing a concave mold having a concave surface; moving a concave mold over the image sensor chip with a first surface of the image sensor chip facing the concave surface; aligning the concave surface with the image sensor chip; and pushing the image sensor chip to be adhered to the concave mold upwards so that the sum of the radius of curvature of the image sensor chip, the thickness of the adhesive and the thickness of the image sensor chip is substantially the same as the radius of curvature of the concave mold.

Description

Image sensor chip and manufacturing method thereof

Technical Field

The embodiment of the invention relates to an image sensor chip and a manufacturing method thereof, in particular to a curved surface image sensor chip and a manufacturing method thereof.

Background

The camera module with the solid image sensor chip is widely used in the fields of modern digital products, mobile terminals, security monitoring and the like. At present, image sensor chips in camera modules are all planar image sensor chips. In the structure of the camera module, the optical lens is positioned on one side of the light sensing surface of the image sensor chip. Due to Lens aberrations (Lens aberrations), the optical system of the camera Lens focuses the object plane onto a curved surface instead of a flat surface, thereby generating a Focus Position Deviation (Focus Position Deviation) in the central part and the peripheral part of the focal plane perpendicular to the main optical axis for a flat image sensor chip, which is called field curvature.

The Field Curvature (Field Curvature) leads to a reduction in the imaging quality of the planar image sensor chip. To solve this problem, curvature of field is usually corrected using a plurality of lens combinations with opposite curvature of field. However, the extra lens not only results in higher manufacturing cost of the lens, increasing the mass and volume of the lens, but also the curvature of field cannot be completely flattened.

Unlike a planar image sensor chip, a curved image sensor chip can directly compensate for the curvature of the image field by using its own curvature. Therefore, the lens design can be simplified, and the volume and the weight of the lens can be reduced. In addition, the conventional research proves that the curved-surface image sensor chip can also effectively improve the uniformity of image analysis force and improve the image quality deterioration of image corners.

Disclosure of Invention

The embodiment of the invention relates to a method for manufacturing a curved surface image sensor chip, which is characterized by comprising the following steps of: providing a concave mold having a concave surface; moving a concave mold over the image sensor chip with a first surface of the image sensor chip facing the concave surface; aligning the concave surface with the image sensor chip; and pushing the image sensor chip to be adhered to the concave mold upwards so that the sum of the radius of curvature of the image sensor chip, the thickness of the adhesive and the thickness of the image sensor chip is substantially the same as the radius of curvature of the concave mold.

Another embodiment of the present invention relates to a chip module, including: a concave mold having a concave surface; and an image sensor chip having a first surface facing the concave surface, and a second surface opposite the first surface, the second surface having an array of photosensitive pixels.

Another embodiment of the present invention relates to an optical sensing module, which includes: a chip module; and the lens is adjacent to the chip module, and the effective focal plane of the lens approximately coincides with the second surface.

Drawings

Aspects of the present disclosure are better understood from the following detailed description when read in conjunction with the accompanying drawings. It should be noted that the various structures are not drawn to scale in accordance with standard practice in the industry. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.

FIG. 1 illustrates a schematic diagram of a packaging system for manufacturing a curved image sensor chip according to some embodiments of the present invention, wherein the ejection device has an array of ejector pins.

Fig. 2 illustrates a schematic structural diagram of a packaging system for manufacturing a curved image sensor chip according to some embodiments of the invention, wherein the ejection device has an air-filled module.

Fig. 3 illustrates a top-down schematic view of preparing image sensor chips on a wafer according to some embodiments of the invention.

Fig. 4 illustrates a schematic cross-sectional view of preparing image sensor chips on a wafer according to some embodiments of the invention.

FIG. 5 illustrates a schematic cross-sectional view of preparing an image sensor chip that is thinned and placed on the surface of an elastic film according to some embodiments of the invention.

FIG. 6 illustrates a cross-sectional schematic view of preparing an image sensor chip, wherein the image sensor chip is coated with an adhesive, according to some embodiments of the invention.

Fig. 7 illustrates a schematic cross-sectional view of preparing an image sensor chip according to some embodiments of the present invention, wherein the image sensor chip is moved under a female mold, and an ejector device has an array of ejector pins.

FIG. 8 illustrates a schematic cross-sectional view of preparing an image sensor chip that is ejected to contact the edge of a female mold according to some embodiments of the invention.

Fig. 9 illustrates a schematic cross-sectional view of preparing an image sensor chip according to some embodiments of the present invention, wherein the image sensor chip is ejected into a female mold.

FIG. 10 illustrates a cross-sectional view of an image sensor chip with a die attach film attached thereto according to some embodiments of the invention.

FIG. 11 illustrates a cross-sectional view of preparing an image sensor chip that bends with the stacking of the thimble array according to some embodiments of the invention.

Fig. 12 illustrates a schematic cross-sectional view of preparing an image sensor chip according to some embodiments of the present invention, wherein the image sensor chip is ejected into the interior of a female mold.

FIG. 13 illustrates a schematic cross-sectional view of preparing an image sensor chip that is fully pressed inside a female mold according to some embodiments of the invention.

Fig. 14 illustrates a schematic cross-sectional view of preparing an image sensor chip according to some embodiments of the invention, wherein the image sensor chip is ejected into a female mold, and the ejection device has a pneumatic module.

FIG. 15 illustrates a schematic cross-sectional view of preparing an image sensor chip with a thimble array retracted to an initial position according to some embodiments of the present invention.

FIG. 16 illustrates a schematic cross-sectional view of a chip module prepared according to some embodiments of the invention.

FIG. 17 illustrates a schematic cross-sectional view of an optical sensing module prepared according to some embodiments of the present invention.

Detailed Description

The following disclosure provides many different embodiments, or examples, for implementing different components of the provided subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, such are merely examples and are not intended to be limiting. For example, in the following description, the formation of a first means over or on a second means may include embodiments in which the first and second means are formed in direct contact, and may also include embodiments in which additional means may be formed between the first and second means such that the first and second means may not be in direct contact. In addition, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.

Moreover, spatially relative terms, such as "below … …," "below … …," "below," "above … …," "on," "… …," and the like, may be used herein to describe one component or member's relationship to another component or member as illustrated in the figures for ease of description. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

As used herein, terms such as "first," "second," and "third" describe various components, elements, regions, layers, and/or sections, but such components, elements, regions, layers, and/or sections should not be limited by such terms. Such terms may only be used to distinguish one component, region, layer or section from another. Terms such as "first," "second," and "third," when used herein, do not imply a sequence or order unless clearly indicated by the context.

The invention relates to a method for manufacturing a curved image sensor chip, which can press and bend a flat image sensor chip by a mould, namely, the flat image sensor chip is shaped into a curved image sensor chip with a specific bending curvature. Meanwhile, considering that the flat image sensor chip may slide during the bending process to generate an incorrect curvature, the present invention applies an adhesive on the back surface of the image sensor chip to be bent so that it can be adhered to the mold without sliding.

Fig. 1 shows a schematic structural diagram of a packaging system for manufacturing a curved image sensor chip according to an embodiment of the invention. As shown in fig. 1, in some embodiments, the encapsulation system 1 includes an ejector 10, an elastic membrane 20, a female mold 30, and a suction head 40. Wherein, the elastic membrane 20 is arranged on the ejection device 10, the concave mould 30 is arranged on the elastic membrane 20, and the suction head 40 is arranged on the concave mould 30.

The ejection device 10 is used to push the image sensor chip up to contact the concave mold 30, i.e., to apply a force to the image sensor chip against the concave mold 30 to achieve bending of the image sensor chip. In some embodiments, the ejection device 10 has at least one needle array 11, and each needle array 11 has a plurality of needles 110 uniformly arranged. The ejector pin 110 can be driven by a power unit (not shown) such as a motor to be raised or lowered in a vertical direction, so as to push an object located above the ejector pin 110 to be raised or lowered. In some embodiments, each of the pins 110 may have the same vertical displacement, for example, the top surface (front end) of the pin array 11 is maintained as a plane during the raising process of the pin 110; in other embodiments, each of the pins 110 may have different vertical displacements, for example, the pins 110 near the central portion of the pin array 11 may have more vertical displacements during the process of lifting the pins 110, so that the top surface of the pin array 11 has a central convex profile. In some embodiments, the time for each needle 110 to be lifted or lowered is different, for example, the needle 110 near the central portion of the needle array 11 may be lifted first, and then the needle 110 near the edge portion of the needle array 11 may start to be lifted, so as to achieve the effect that the top surface of the needle array 11 has a central convex profile. In some embodiments, the manner in which the needle 110 is raised or lowered is a result of the combined effect of the time and displacement driven by a power unit such as a motor.

As shown in fig. 2, in some embodiments, the ejection device 10 may include an inflation module 12, such inflation module 12 having an air inlet 120, an inflation space 121, and an opening 122. The opening 122 of the inflation module 12 is close to or faces the position where the ejection device 10 is adjacent to the elastic membrane 20, and is shielded by the elastic membrane 20, so that the elastic membrane 20 can be supported when the inflation module 12 is inflated, the position of the elastic membrane 20 adjacent to the edge of the opening 122 has a smaller vertical supporting height, and the position of the elastic membrane 20 adjacent to the central part of the opening 122 has a larger vertical supporting height, so that the elastic membrane 20 approximately presents a circular arch-shaped bulge; in other words, when the interior of the inflation module 12 is formed with a positive pressure by the inflation gas, the object located above the elastic membrane 20 can be supported by the action of the gas pressure. In some embodiments, the inflation module 12 has an elastic sealing film (not shown) at the opening 122 itself, so that the inflation module 12 can use its inflation procedure and the elastic sealing film to lift the object above the inflation module 12.

The elastic membrane 20 may be constructed of synthetic polymers, natural rubber, or other elastic substances. In some embodiments, the elastic film 20 may be a blue film used in the semiconductor industry. In some embodiments, the elastic membrane 20 may be an industrial conveyor belt. The elastic membrane 20 is characterized by being deformed by being pushed by the ejector 10, such as being pushed by the thimble array 11 or being expanded by the inflator of the inflation module 12. Generally, the elastic membrane 20 is horizontally disposed on the ejection device 10 in an undeformed state, and includes a first elastic surface 201 and a second elastic surface 202 opposite to the first elastic surface 201, wherein the first elastic surface 201 is adjacent to the ejection device 10, and the second elastic surface 202 is used for carrying an image sensor chip.

There is a space between the concave mold 30 and the elastic film 20 to place the image sensor chip to be bent. The concave mold 30 has a concave surface 301 facing the elastic membrane 20 with a specific and precisely controlled curvature for the image sensor chip to be bent to be formed with the same curvature. In some embodiments, the concave mold 30 may be made of metal, ceramic or polymer material, and has a certain strength to prevent the bending accuracy of the image sensor chip from being affected by the deformation of the concave mold itself when the image sensor chip is bent. In some embodiments, the concave mold 30 has a flat surface 302 opposite to the concave surface 301 as the suction surface, and this flat surface 302 is a plane surface to make it easier to suck the concave mold 30 using a suction head.

The suction head 40 is for sucking the female mold 30, and may have a vacuum passage 401. One end of this vacuum channel 401 can be closed by contact with the flat surface 302 of the female mould 30, so that the female mould 30 is sucked under the suction head 40 by evacuating the vacuum channel 401.

One of the objectives of the present invention is to bend a flat image sensor chip formed by a semiconductor process by pressing the image sensor chip with a mold. As shown in fig. 3, for example, in some embodiments, a large number of image sensor chips 500, such as CMOS image sensor chips, are fabricated on wafer 50. Image sensor chip 500 has a first surface that is a non-photosensitive backside of image sensor chip 500 and a second surface opposite to the first surface that is a photosensitive side 502 of image sensor chip 500. As shown in fig. 4, which discloses a cross section along line AA' of fig. 3, the photosensitive surface 502 of the visible image sensor chip 500 is arranged with a photosensitive pixel array 503, which can convert the received optical signal into an electrical signal for output. Then, in some embodiments, the image sensor chip 500 may be thinned and diced on the backside 501 opposite to the photosensitive surface 502 by using the conventional CMOS process to obtain a plurality of thinner and independently separated image sensor chips 500 from a single wafer 50 through thinning and separation steps. In some embodiments, the thinned thickness of the image sensor chip 500 is about 100 μm or less. As shown in fig. 5, in some embodiments, the separated and thinned image sensor chip 500 is placed on the surface of a blue film, which can be used as the elastic film 20. In some embodiments, the image sensor chip thinning and Dicing process is not limited to the process flow of first back-side thinning and then Dicing, and may also be a process of first performing a half-cut form Grinding (DBG) and then performing back-side thinning, so as to obtain a plurality of independently separated image sensor chips 500.

As shown in fig. 6, after providing the wafer 50 including the plurality of image sensor chips 500 and separating and thinning the image sensor chips 500, the adhesive 60 may be applied on a first surface of the image sensor chips 500, i.e., the aforementioned back surface 501. In some embodiments, the adhesive 60 may be a thermosetting epoxy, a photo-curable adhesive, or a similar adhesive material, which can be uniformly attached to the back surface 501 of the image sensor chip 500 by means of dispensing. In some embodiments, the adhesive 60 is uniformly distributed on the back surface 501 of the image sensor core 500 in a plurality of dots to avoid the overflow of the adhesive when the image sensor core 500 is adhered to the concave surface 301 of the concave mold 30; meanwhile, the coating amount of the adhesive 60 cannot be too small, so that voids are prevented from being formed after the adhesive 60 is cured.

The present invention is not limited to the above dispensing method, and other methods capable of fixing the bent image sensor chip 500 in the concave mold are also included in the scope of the present invention. For example, in some embodiments, the adhesive 60 may be a Die Attach Film (DAF).

As shown in fig. 7, in some embodiments, the image sensor chip 500 coated with the adhesive 60 is then moved under the concave mold 30. In some embodiments, the suction head 40 can be actuated to move the concave mold 30 over the image sensor chip 500 coated with the adhesive 60 such that the back surface 501 of the image sensor chip 500 faces the concave surface 301 of the concave mold 30. In some embodiments, the number and positions of the concave molds 30 may correspond to those of the image sensor chips 500, thereby realizing mass production of curved image sensor chips. In this step or subsequent steps, the image sensor core 500 is aligned with the concave surface 301 of the concave mold 30 via an alignment step, such as optically vertically aligning the center 500C of the image sensor core 500 with the center 30C of the concave mold 30. In general, in order for the flat image sensor core 500 to be integrally molded with a precise curvature, the area of the image sensor core 500 should be not larger than the projected size of the concave mold 30.

In some embodiments, the present invention may integrate the Die pick up & Place (Die pick up) technology of the conventional semiconductor device packaging process with respect to the semiconductor chip, for example, by accurately positioning the image sensor core 500 using the conventional packaging process even when the semiconductor chip is picked up, i.e., under the technology using the optical system alignment procedure, so that the image sensor core 500 can be accurately ejected and adhered to the concave mold 30. In some embodiments, since the wafer 50 is placed on the blue film for dicing, the blue film is actually disposed between the ejector 10 and the concave mold 30 in conjunction with the image sensor core 500, and thus the blue film can directly serve as the elastic film 20.

After the image sensor core 500 is moved and aligned with the ejector 10 and the concave mold 30, the image sensor chip 500 can be pushed upward to be adhered to the concave mold 30, so that the image sensor chip 500 and the concave surface 301 of the concave mold 30 have the same curvature. In this step, it can be further subdivided into a front-stage step, as shown in fig. 8, including ejecting the image sensor chip 500 up to contact the edge 30S of the concave mold 30; and a back-end step, as shown in fig. 9, including pushing the image sensor chip 500 up into the female mold 30.

In the former step, the pins 110 of the pin array 11 have the same initial displacement amount D1, which is aimed at lifting the image sensor chip 500 on the first elastic surface 201 of the elastic film 20 by the pin array 11 to contact with the edge 30S of the concave mold 30 having a fixed curvature thereon. In this previous step, the image sensor chip 500 is still in a state where the holding surface is flat.

In the latter step, the needles 110 of the needle array 11 are displaced by different amounts, for example, the needles 110 near the central portion of the needle array 11 are controlled to have a larger displacement amount, and the displacement amount is smaller as the needles 110 are closer to the edge of the needle array 11, so that the needle array 11 entirely assumes a profile having a peak value at the central portion, and thus, the profile assumed by the needle array 11 finally forms a profile equivalent to the same curvature as the concave surface 301 of the concave mold 30, and thus the image sensor chip 500 is pushed into the concave mold 30 having a fixed curvature. Meanwhile, the adhesive 60 on the back surface 501 of the image sensor chip 500 contacts the concave surface 301 of the concave mold 30, and the adhesive 60 fills the gap between the back surface 501 of the image sensor chip 500 and the concave surface 301 of the concave mold 30 due to the pushing pressure from the ejector pin array 11.

In other embodiments of the present invention, the image sensor chip 500 is not limited to be ejected out of the center of the ejector pin array 11, and other ways of ejecting the image sensor chip 500 may be used, such as adjusting the displacement of the center portion and the edge of the ejector pin array 11 to form a curved surface with a curvature smaller than or equal to the curvature of the concave surface 301 of the concave mold 30. For example, as shown in fig. 10, the image sensor chip 500 with the die attach film 601 adhered to the back surface 501 and the elastic film 20 may be fixed above the ejection device 10, and the concave mold 30 with the intrinsic curvature sucked by the suction head 40 may be placed above the image sensor chip 500, so that the image sensor chip 500 and the concave mold 30 are aligned.

Next, as shown in fig. 11, the displacement of the central portion and the edge position of the thimble array 11 can be adjusted to make the displacement of the central portion larger than the edge position, the front end of the thimble array 11 forms a curved surface with a curvature smaller than or equal to that of the concave mold 30, and the image sensor chip 500 is ejected, at this time, the image sensor chip 500 is bent along with the thimble array 11 to form a curved surface with a curvature smaller than or equal to that of the concave mold 30.

Then, as shown in fig. 12, the thimble array 11 having a curved front end pushes the image sensor chip 500 into the inside of the female mold 30, and the curvature of the curved front end of the thimble array 11 is smaller than that of the female mold 30, so that the top of the image sensor chip 500 bent with the thimble array 11 preferentially contacts the female mold 30. As shown in fig. 13, the displacement of the edge of the thimble array 11 is then adjusted to completely press the entire image sensor chip 500 into the concave mold 30, so that the curvature of the curved image sensor chip 500 is consistent with the curvature of the concave mold 30.

In some embodiments, after pushing the image sensor chip 500 to be bonded to the concave mold 30, the concave mold 30 may be heated to cure the adhesive 60 contacting the concave mold 30, so that the image sensor chip 500 formed to have the same curvature as the concave surface 301 of the concave mold 30 is fixed to the concave mold 30 while maintaining the same curvature. In some embodiments, the concave mold 30 may be heated to maintain a temperature for curing the adhesive 60, so as to quickly complete the adhesive fixation when the image sensor chip 500 is pushed into the concave mold 30. In embodiments using the die attach film 601, the die attach film 601 can also be cured by the same heating method.

In some embodiments of the present invention, as shown in fig. 14, the image sensor chip 500 is ejected into the concave mold 30 by using the ejection device 10 having the inflation module 12. Compared with the method using the thimble array 11, the method can prevent the stress concentration of the mechanical force applied by the thimble at the position contacting the image sensor chip 500, thereby preventing the thinned image sensor chip 500 from being cracked. In this embodiment, the process flow of ejecting the image sensor chip 500 into the concave mold 30 is substantially the same as that of the other embodiments, except that the sealed space between the elastic membrane 20 and the inflation module 12 is inflated and has a positive pressure, pushing the image sensor chip 500 up into the concave mold 30.

After the image sensor chip 500 is fixed to the female mold 30, as shown in FIG. 15, in some embodiments, the pins 110 of the pin array 11 are sequentially retracted to the initial position, for example, from the pins 110 near the edge of the pin array 11, and retracted to the position where the elastic membrane 20 is returned to the horizontal and undeformed position. The elastic membrane 20 also separates from the photosensitive surface 502 of the image sensor chip 500 during the process of restoring to a horizontal, undeformed state. In some cases, when the inflatable module 12 is used, other image sensor chips 500' located at the periphery of the image sensor chip 500 to be bent may be slightly pushed up by the expanded elastic membrane 20 due to the inflation of the inflatable module 12, but return to the original height as the elastic membrane 20 returns to the original shape after the inflatable module 12 stops inflating and returns to the normal pressure.

Finally, in some embodiments, the suction head 40 may be moved to place the female mold 30 with the image sensor chip 500 embedded therein to a pre-designed position to enable assembly of the image sensor chip 500. In some implementations, the suction head 40 can be separated from the flat surface 302 of the female mold 30 by releasing the vacuum suction, and the chip module 5 can be obtained after the suction head 40 is separated. As shown in fig. 16, in some embodiments, the chip module 5 may include the concave mold 30, the adhesive 60, and the image sensor chip 500 through the aforementioned manufacturing process, wherein the concave surface 301 of the concave mold 30 and the photosensitive surface 502 of the image sensor chip 500 have the same curvature. Thus, in some embodiments, the sum of the radius of curvature (a) of the image sensor chip 500, the thickness (c1) of the adhesive 60, and the thickness (c2) of the image sensor chip 500 is substantially the same as the radius of curvature (b) of the concave mold 30, i.e., (b) ═ a) + (c1) + (c 2). In some embodiments, the relationship of the curvature radii may have an error margin due to the practical process level, such as the uniformity of the adhesive 60 and the thickness tolerance of the image sensor chip 500, but still not departing from the scope of the present invention. In some embodiments, the adhesive 60 is a die attach film.

In some embodiments, the female mold 30 is retained in the chip module 5 equipped with the image sensor chip 500. In some implementations, thinning the concave mold 30 adhered to the back surface 501 of the image sensor chip 500 to reduce the thickness of the chip module 5 may be further included.

As shown in fig. 17, the optical sensing module 7 with the image sensor chip 500 of the present disclosure may have a lens 70 and the image sensor chip 500, wherein the lens 70 is adjacent to the chip module for transmitting light to the photosensitive pixel array 503 of the photosensitive surface 502 of the chip module, and the effective focal plane of the lens 70 is substantially coincident with the photosensitive surface 502. In some embodiments, the image sensor chip 500 manufactured by the present invention is applied to a situation where curvature of field may occur, for example, whether the incident light L1 parallel to the main optical axis (focused on the center of the focal plane, i.e. the center of the photosensitive pixel array 503 of the photosensitive surface 502 of the image sensor chip 500) or the incident light L2 having an angle difference with the main optical axis (focused on the edge of the focal plane, i.e. the edge of the photosensitive pixel array 503 of the photosensitive surface 502 of the image sensor chip 500) passes through the lens 70, both of which can be focused on the photosensitive surface 502 of the image sensor chip 500 to avoid curvature of field due to deviation of the focusing position. In other words, the image sensor chip 500 manufactured by the present invention may have a precise specific curvature, and it is not necessary to dispose other lenses between the light emitting surface 701 of the lens 70 and the photosensitive surface 502 of the image sensor chip 500 to correct curvature of field, for example, it is not necessary to use a plurality of lenses for combining lenses with opposite curvature of field to correct curvature of field, and light rays may go straight between the lens 70 and the photosensitive pixel array of the photosensitive surface 502 of the image sensor chip 500.

In summary, the present invention provides a new method for manufacturing a curved image sensor chip, which forms a curved surface matching the curvature of a concave mold by introducing the concave mold with an inherent curvature and precisely controlling the ejection displacement of the center and the edge of a thimble array in the ejection process based on the existing CMOS image sensor chip manufacturing process, and ejects a planar image sensor chip into the mold with the inherent curvature above the planar image sensor chip, thereby realizing the manufacturing of the curved image sensor chip.

The foregoing outlines structures of several embodiments so that those skilled in the art may better understand the aspects of the present disclosure. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other manufacturing processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions, and alterations herein without departing from the spirit and scope of the present disclosure.

Claims

1. A method for manufacturing a curved surface image sensor chip is characterized by comprising the following steps:

providing a concave mold having a concave surface;

moving a concave mold over the image sensor chip with a first surface of the image sensor chip facing the concave surface;

aligning the concave surface with the image sensor chip; and

and pushing the image sensor chip to be adhered to the concave mould upwards so that the sum of the curvature radius of the image sensor chip, the thickness of the adhesive and the thickness of the image sensor chip is substantially the same as the curvature radius of the concave mould.

2. The method of manufacturing according to claim 1, wherein a second surface of the image sensor chip opposite to the first surface is carried by an elastic film.

3. The method of claim 2, wherein pushing the image sensor die up to adhere to the female mold comprises having an array of pins under the elastic film.

4. The method of manufacturing as claimed in claim 3, wherein aligning the concave surface with the image sensor chip comprises optically aligning a center of the concave mold with a center of the image sensor chip.

5. The method of claim 3, wherein the plurality of pins have the same initial displacement when the image sensor chip is pushed upward to be adhered to the concave mold.

6. The method according to claim 3, wherein when the image sensor chip is adhered to the concave mold, a displacement of the pins near a center of the pin array is greater than a displacement of the pins near an edge of the pin array.

7. The method of claim 2, wherein the elastic membrane has an inflation module beneath it.

8. The method of claim 1, further comprising disposing a plurality of dots of the adhesive on the first surface of the image sensor chip.

9. The method of claim 1, further comprising disposing the adhesive on the first surface of the image sensor chip, wherein the adhesive is a die attach film.

10. The method of claim 8 or 9, wherein after pushing the image sensor chip upward to adhere to the concave mold, further comprising heating the concave mold to cure the adhesive.

11. The method of manufacturing according to claim 2, further comprising:

providing a wafer comprising a plurality of the image sensor chips;

thinning a plurality of the image sensor chips; and

separating a plurality of the image sensor chips.

12. The method of making as defined in claim 1, further comprising thinning the concave mold from a flat surface relative to the concave surface.

13. The method of manufacturing as defined in claim 1, further comprising adsorbing a flat surface of the female mold relative to the female surface with a suction head.

14. A chip module manufactured by the manufacturing method according to claim 1, comprising:

the concave mold having the concave surface; and

the image sensor chip having the first surface facing the concave surface, and a second surface opposite the first surface, the second surface having an array of photosensitive pixels.

15. The chip module according to claim 14, wherein the concave surface and the second surface have the same curvature.

16. The chip module according to claim 14, further comprising the adhesive between the first surface and the concave surface.

17. An optical sensing module comprising the chip module of claim 14, comprising:

the chip module; and

a lens adjacent to the chip module, an effective focal plane of the lens substantially coincident with the second surface.