CN112563223A - Heat dissipation assembly, device needing heat dissipation and preparation method thereof - Google Patents
Heat dissipation assembly, device needing heat dissipation and preparation method thereof Download PDFInfo
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- CN112563223A CN112563223A CN201910912018.1A CN201910912018A CN112563223A CN 112563223 A CN112563223 A CN 112563223A CN 201910912018 A CN201910912018 A CN 201910912018A CN 112563223 A CN112563223 A CN 112563223A
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides a heat dissipation assembly, a device needing heat dissipation and a method for preparing the heat dissipation assembly. The heat sink assembly includes an evaporation element, a cooling element, and a wicking element positioned between the evaporation element and the cooling element. Wherein the liquid absorbing element has a micron-scale structure and is covered with a corrosion-resistant plating layer on the surface, the evaporation element and the cooling element form a sealed space for containing the liquid working medium and are positioned in the sealed space, and the evaporation element is a hydrophilic and hydrophobic mixed wetting surface on the surface facing the sealed space. The heat dissipation assembly can have good temperature uniformity and cooling effect under the ultrathin condition.
Description
Technical Field
The present invention relates to the field of electrical heating, and more particularly, to a heat dissipation assembly suitable for a device requiring heat dissipation, a method of manufacturing the same, and a related device. In particular, the present invention relates to ultra-thin heat dissipation assemblies (e.g., ultra-thin thermal platens) having excellent temperature uniformity and their use in devices requiring heat dissipation, where ultra-thin means that the thickness of the heat dissipation assembly can be 240 microns or less.
Background
With the rapid development of electronic technology, the integration level and performance of electronic devices (such as electronic chips, mobile phones, and tablet computers) are continuously improved, and the power consumption thereof is also continuously increased, which puts higher and higher requirements on the heat dissipation of the electronic devices or chips. If the heat dissipation capability can not meet the requirement, the heat is collected, so that the working temperature of the electronic device or the electronic chip is too high, the working efficiency of the chip is deteriorated, the stability of the chip is influenced, and even devices are damaged and safety accidents are caused. The miniaturization of electronic products makes the space left for heat dissipation elements limited, and the cell-phone and the tablet computer that people commonly used in life have become thinner and thinner nowadays, and the thickness of smart mobile phone is generally about 5mm, and the thickness of tablet computer generally can not exceed 10mm, and this requires that heat abstractor still need frivolous compactness as far as possible under the prerequisite that has sufficient heat-sinking capability. In addition, for flexible electronic products, the heat dissipation device is required to have certain flexibility.
One common heat dissipation scheme for electronic devices (e.g., mobile phones or tablet computers) utilizes a thermally conductive graphite sheet to dissipate heat from electronic components. The scheme is that the heat-conducting graphite sheet is attached to the electronic element through the heat-conducting interface material, and heat generated by the electronic element is transferred to the graphite sheet in a heat conduction mode. Heat is transferred from a portion where the temperature in the graphite sheet is high, that is, a portion bonded to the electronic component, to a portion where the temperature in the graphite sheet is low by means of thermal conduction. Finally, heat is dissipated from the graphite sheet to the surrounding air by natural convection. The graphite sheet has an effective thermal conductivity 2-4 times that of copper, and has a temperature uniformity better than copper, which dissipates heat more quickly. Although the thickness of the heat-conducting graphite sheet is thin, the heat-conducting graphite sheet conforms to the development trend that mobile phones and flat computers become light and thin continuously, the plane thermal conductivity of the heat-conducting graphite sheet is about 4 times of that of copper at most due to the structure of the heat-conducting graphite sheet, the strength of the graphite sheet is low, the structure is easy to damage, and the effect is reduced rapidly after the structure is damaged.
Accordingly, there remains a need for improved heat dissipation devices, particularly ultra-thin heat dissipation devices, that accommodate the current need for miniaturization and miniaturization of electronic devices and products.
Disclosure of Invention
The present invention provides an ultra-thin heat dissipating module (e.g., an ultra-thin soaking plate) suitable for a device requiring heat dissipation, which can have good temperature uniformity and cooling effect in an ultra-thin condition. The ultra-thin heat dissipation assembly can also be flexible and can operate in a bending mode to a certain degree.
Specifically, the present invention provides:
1. a heat dissipation assembly, comprising:
an evaporation element is arranged on the upper surface of the shell,
a cooling element, and
a liquid absorbing element located between the evaporation element and the cooling element, having a micro-scale structure and a surface covered with a corrosion-resistant coating,
wherein the evaporation element and the cooling element form a sealed space for containing a liquid working medium and a liquid absorbing element is located in the sealed space.
2. A device requiring heat dissipation, comprising the heat dissipation assembly described above.
3. A method of making a heat dissipation assembly comprising the steps of:
(11) providing an evaporation element and a cooling element;
(12) providing a wicking component;
(13) electroplating a corrosion-resistant coating on the surface of the liquid absorbing component with the micron structure;
(14) disposing a wicking element between an evaporating element and a cooling element and forming a sealed space with the evaporating element, the wicking element, and the cooling element and
(15) and injecting a liquid working medium into the sealed space.
Wherein the liquid absorption element has a composite structure formed by a micron-scale structure and a flower-like nanometer-scale structure.
Wherein the evaporation element is a mixed hydrophilic and hydrophobic wetting surface at a surface facing the sealed space.
Wherein the hydrophilic and hydrophobic mixed wetting surface comprises an array formed by a plurality of hydrophobic islands and a plurality of hydrophilic regions.
Wherein the corrosion-resistant coating is formed from a material compatible with the liquid working medium.
Wherein the size of the hydrophobic islands is 10-200 μm,
optionally, the pitch between adjacent hydrophobic islands is 50-400 μm in both the lateral and longitudinal directions of the mixed wetting surface,
optionally, the hydrophobic islands comprise 10-50% of the total area of the hydrophilic and hydrophobic mixed wetting surface; and
optionally, the hydrophobic islands are formed by a photolithography method from at least one material selected from silane compounds, fluorine-containing silane compounds, teflon, polyolefins, polycarbonates, polyamides, polyacrylonitrile, polyesters, and acrylates.
Wherein the evaporation element is formed of a metal (copper, aluminum, etc.) having a thermal conductivity of more than 200W/(m.K), preferably copper;
optionally, the cooling element is formed of a metal (copper and its alloys, aluminum, etc.) having a thermal conductivity of more than 200W/(m · K), preferably copper;
optionally, the wicking element is formed from a metal (copper and its alloys, stainless steel, etc.) having a thermal conductivity greater than 10W/(m.K), preferably a stainless steel mesh, and
optionally, the corrosion-resistant metal is selected from metals that do not react with hydrogen ions, such as copper, silver, platinum, gold, and the like, preferably copper.
Wherein, the thickness of the heat dissipation component is not more than 240 microns, preferably 190 microns and 210 microns.
Wherein the heat dissipation assembly further comprises a sealing member for closing the sealed space,
optionally, the sealing element is formed of Sn, Cu, Ag, Pb, or any combination thereof.
Wherein the cooling element comprises a support element, preferably a plurality of support elements, for forming an evaporation space for the liquid working substance
Optionally, the support element is integral with the cooling element,
optionally, the support element is cylindrical and has a diameter of 0.3mm to 2 mm;
optionally, the height of the support element is from 100 μm to 150 μm;
optionally, the distance between the plurality of support elements in the transverse direction of the cooling element surface is 1mm to 4mm, preferably 1.5 mm.
Wherein, the method further comprises the step of combining a liquid absorbing element with a micron-scale structure on the surface and a liquid absorbing element containing K after the step (13)2S2O8、KOH、NaClO3、Na3PO4·12H2O, NaOH and NH3·H2O、H2O2And NaOH under heating, thereby forming a composite structure of micro-scale structures and flower-like nano-scale structures on the surface.
Wherein the method further comprises the step (16) of forming an array of hydrophobic islands on at least a portion of a surface of the evaporation element facing the sealed space by a photolithographic process.
Wherein the step (16) comprises forming a photoresist pattern on at least a portion of a surface of the evaporation element facing the sealed space; immersing an evaporation element having a photoresist pattern formed therein into a solution containing a hydrophobizing compound; and removing the photoresist, such that regions protected by the photoresist form hydrophilic regions and regions not protected by the photoresist form hydrophobic islands.
Wherein the surface of the wicking element has a contact angle with water of less than 10 degrees as measured by a contact angle measuring instrument.
Wherein, the heat dissipation component is 5-30W/cm calculated according to the following formula2The in-plane effective thermal conductivity under thermal load of 1000-:
in-plane measured thermal resistance of copper/in-plane measured thermal resistance of a heat dissipation assembly
The in-plane measurement thermal resistance (the center temperature of the cooling end-the average value of the temperatures of the measurement points around the cooling end)/the input power.
Wherein, the device requiring heat dissipation is an electronic device, preferably selected from at least one of a handheld phone, a tablet computer, an electronic tablet, a handheld computer, a wearable device, or any combination thereof.
The invention has at least one of the following advantages:
the thickness of the heat dissipation component (such as a soaking plate) can be as low as 240 μm, preferably 200 μm or less, which is far less than that of the commercial heat dissipation component (such as a soaking plate), and is more consistent with the miniaturization trend of electronic components;
all parts or elements of the heat dissipation assembly (such as the vapor chamber) can be made of metal materials, so that the heat dissipation assembly has better strength than a heat conduction graphite sheet and strong durability;
the shape of the heat dissipation component (such as a soaking plate) can be made into any size or shape according to the heat dissipation requirement;
the heat dissipation assembly (such as a vapor chamber) of the invention can be flexible and can be used for certain electronic components needing bending, such as curved screens;
in a preferred embodiment, the heat dissipation assembly of the present invention can have good temperature uniformity and cooling effect in case of ultra-thin, for example, the in-plane effective thermal conductivity can be 1000-.
Brief description of the drawings
Fig. 1 schematically shows a cross-sectional view of a heat dissipation assembly according to an embodiment of the present invention.
Fig. 2 shows: (a) the heat dissipation principle of the heat dissipation assembly according to one embodiment of the present invention; (b) a cross-sectional view of the heat dissipating assembly of example 1; (c) a cross-sectional view of the heat dissipating module of example 2 and (d) a cross-sectional view of the heat dissipating module of example 3.
Fig. 3 shows: (a) schematic process flow for forming a support member on a cooling member and (b) an electron micrograph of a surface state of the cooling member having the support member in the heat dissipating apparatus of examples 1 to 3.
Fig. 4 schematically shows a top view of a cooling element surface of a heat dissipation assembly according to an embodiment of the invention.
Fig. 5 shows a schematic view of an evaporation element wetted surface when the array of hydrophobic islands is square, according to an embodiment of the present invention.
Fig. 6 shows: (a) a photograph of a wetted surface of an evaporation element having an array of hydrophobic islands in the heat dissipation assembly of example 3; (b) in the heat dissipation assembly of example 3, a photograph of the state of wetting of the working fluid on the surface of the evaporation element having the array of hydrophobic islands.
Fig. 7 shows: (a) a photograph of the surface state of the stainless steel net as the liquid absorbing member according to the embodiment of the present invention; (b) a photograph of the surface state of the copper-plated stainless steel net according to the embodiment of the present invention; (c) photographs of the surface state of the stainless steel net having flower-like nanostructures according to examples 2 and 3 of the present invention; and (d) an enlarged photograph of the flower-like nanostructure in panel (c).
Detailed Description
Embodiments of the present invention are described in detail below. The embodiments described below are exemplary only, are intended to illustrate the invention, and should not be construed as limiting the invention. The embodiments are not specified to specific techniques or conditions, according to the techniques or conditions described in the literature in the field or according to the product description. The reagents or instruments used are not indicated by the manufacturer, and are all conventional products commercially available.
Definitions and general terms
Reference will now be made in detail to certain embodiments of the invention, examples of which are illustrated by the accompanying structural and chemical formulas. The invention is intended to cover alternatives, modifications and equivalents, which may be included within the scope of the invention as defined by the appended claims. Those skilled in the art will recognize that many methods and materials similar or equivalent to those described herein can be used in the practice of the present invention. The present invention is in no way limited to the methods and materials described herein. In the event that one or more of the incorporated documents, patents, and similar materials differ or contradict this application (including but not limited to defined terminology, application of terminology, described techniques, and the like), this application controls.
It will be further appreciated that certain features of the invention, which are, for clarity, described in the context of separate embodiments, may also be provided in combination in a single embodiment. Conversely, various features of the invention which are, for brevity, described in the context of a single embodiment, may also be provided separately or in any suitable subcombination.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. All patents and publications referred to herein are incorporated by reference in their entirety.
The articles "a," "an," and "the" as used herein are intended to include "at least one" or "one or more" unless otherwise indicated or clearly contradicted by context. Thus, as used herein, the articles refer to articles of one or more than one (i.e., at least one) object. For example, "a component" refers to one or more components, i.e., there may be more than one component contemplated for use or use in embodiments of the described embodiments.
The terms "comprising" or "including" are open-ended expressions that include what is specified in the present invention, but do not exclude other aspects.
The term "micro-scale structures" refers to structures having characteristic dimensions of 1 micron or greater, preferably 50 μm microns or greater, in at least one dimension, preferably three dimensions. Preferably, the micro-scale structures have a size in at least one dimension, preferably three dimensions, in the range of 1 micron to 500 microns. In the present invention, the micro-scale structure may include a mesh having a size of 1 micron or more.
The term "nanoscale structure" means a structure having a dimension in at least one dimension, preferably three dimensions, of 1000nm or less, preferably 100nm or less. Preferably, the nano-scale structures have a size in the range of 1-100nm in at least one dimension, preferably three dimensions. In the present invention, the characteristic dimension of the nano-scale structure may include a flower-like nano-structure formed by treating the metal plating layer with a specific etching solution (described below).
The term "flower-like nano-scale structure" is a nano-scale structure formed on a surface in a shape similar to a blooming flower, which may form a composite structure with a micro-scale structure.
One preferred heat dissipation scheme in the art is to use heat pipes or vapor chambers to dissipate heat from electronic components. The heat generated by the electronic element is transferred to the heat pipe or the vapor chamber through the heat-conducting interface material, and the liquid working medium in the heat pipe or the vapor chamber absorbs enough heat to be changed into steam. The steam releases heat to the vapor chamber and other places of the heat pipe in a convection mode, so that the temperature of the whole surface is uniform, the vapor chamber is cooled to become liquid, and the liquid working medium returns to the evaporation section through the liquid suction core. The heat is finally dissipated from the condensation end by natural convection or forced convection. This solution has the advantage that it uses the latent heat of phase change of the liquid, making it possible to absorb a large amount of heat. Commercial heat pipes or vapor chambers today, while capable of achieving better heat dissipation than thermally conductive graphite sheets, are typically thicker and do not have the flexibility characteristic.
To this end, the present invention provides a heat dissipating assembly that utilizes the above principles, but can be made as an ultra-thin component and can have flexible characteristics. As shown in fig. 1, the heat sink assembly includes an evaporation element 1, a liquid absorption element 2, a cooling element 4, and a sealing element 5. The wicking element 2 is located between the evaporation element and the cooling element and is coated with a corrosion resistant coating on its surface. For example, the corrosion-resistant plating layer may be formed of a metal having a thermal conductivity of 401W/(m.K) or higher. The wicking element 2 has a micro-scale structure, such as micro-scale pores. The evaporation element 1 and the cooling element 4 may form a sealed space for accommodating a liquid working substance. The wicking element 2 may be located in a sealed space formed by the evaporation element 1 and the cooling element 4 by welding (e.g., soldering) via the sealing element 5, or formed by the evaporation element 1 and the cooling element 4 by hot pressing.
As shown in fig. 1, the cooling element 4 may also have a support element 3 on the surface, preferably an array of a plurality of support elements 3. The cooling element 4 and the supporting element 3 may be of an integral structure, or the supporting element may be formed and fixed on the surface of the cooling element 4.
As shown in fig. 4, the support member may be a dense micropillar array. As shown in fig. 3(a), the support member may be fabricated on the cooling member through a photolithography process and an electroplating process. The cooling element 4 is first provided (S1). The cooling member 4, such as a copper sheet, is processed by a photolithography process to form a pattern composed of a photoresist (S2). The cooling element (e.g., copper sheet) is then placed in a plating bath for plating, and the micro-support posts grow out of the areas not protected by the photoresist ((S3). then, the photoresist is removed (S4). because plating is performed slowly, the heights of the micro-support posts are all very similar.
When the support element is cylindrical, the diameter is 0.3mm to 2 mm.
The height of the support element may be 100 μm to 150 μm.
The distance between the support elements in the transverse direction of the surface of the cooling element is 1mm-4mm, preferably 1.5 mm.
As shown in fig. 2(a), when the heat dissipation assembly is heated, the liquid working medium inside the heat dissipation assembly absorbs heat in the heated area and evaporates to form steam. The vapor rapidly diffuses throughout the sealed cavity 8 and then releases heat at the surface of the cooling plate and condenses into a liquid. The heat released at the cooling element is carried away by external cooling, such as natural or forced convection. The cooled working fluid is returned along the support structure and the wicking element (e.g., wick) to the heated region of the surface of the evaporation element, thereby forming a thermal cycle.
Preferably, the evaporation element 1 is a mixed hydrophilic and hydrophobic wetted surface at the surface facing the sealed space. The hydrophilic and hydrophobic hybrid wetting surface includes an array formed of a plurality of hydrophobic islands and a plurality of hydrophilic regions.
The hydrophobic islands may be 10-200 μm in size. Those skilled in the art will appreciate that the dimensions may be side lengths, diameters, maximum lengths, etc., depending on the shape of the hydrophobic islands. For example, where the hydrophobic islands are circular, the dimension is a diameter. In the case where the hydrophobic islands are square, the dimension may be a side length.
The pitch between adjacent hydrophobic islands is 50-400 μm in both the lateral and longitudinal directions of the mixed wetting surface.
Optionally, the hydrophobic islands comprise 10-50%, preferably 30-40% of the total area of the hydrophilic and hydrophobic mixed wetting surface.
Optionally, the hydrophobic islands are formed by a photolithographic process from a material selected from silane compounds, fluorine-containing silane materials, teflon, polyolefins, polycarbonates, polyamides, polyacrylonitrile, polyesters, acrylates, or any mixture thereof, and the like.
Fig. 5 shows a schematic view of the wetted surface when the array of hydrophobic islands is square. The method of making such a hybrid wetted surface is as follows: firstly, after an evaporation element (such as a copper sheet) is processed by a photoetching process, a pattern consisting of photoresist is formed on the surface of the evaporation element, so that a specific area is protected from chemical reaction; then, immersing the evaporation element (such as a copper sheet) into a solution which can form a hydrophobic layer on the surface, wherein the hydrophobic layer is formed on the area which is not protected by the photoresist; next, the evaporation element (e.g., copper sheet) is cleaned and put into a photoresist removing solution to perform a stripping process to remove the photoresist, the protected areas are hydrophilic areas 12, and the unprotected areas are hydrophobic islands 13. By processing the evaporation element (such as a copper sheet), the evaporation element has a mixed wetting surface, the number of possible nucleation points on the surface of the evaporation element can be greatly increased, and the evaporation strength and the heat exchange effect of the liquid working medium are enhanced.
In another aspect, the present invention is also a method of making a heat dissipation assembly, comprising the steps of:
(11) providing an evaporation element and a cooling element;
(12) providing a wicking component;
(13) plating a corrosion-resistant metal having a thermal conductivity of 401W/(m.K) or higher on the surface of the liquid-absorbing member having a microstructure;
(14) causing said evaporation element and said cooling element to form a sealed space to accommodate a wicking element between the evaporation element and the cooling element and causing said evaporation element to be a mixed hydrophilic and hydrophobic wetted surface at a surface facing the sealed space, and
(15) and injecting a liquid working medium into the sealed space.
The method may further comprise, after step (13), bringing a liquid-absorbing member having a surface with a micro-scale structure into contact with the substrate, the liquid-absorbing member including K2S2O8、KOH、NaClO3、Na3PO4·12H2O、NaOH、NH3·H2O、H2O2A solution of at least one of NaOH or other strongly oxidizing compound is contacted under heated conditions to form a composite structure of micro-scale structures and flower-like nano-scale structures on the surface.
The surface of the liquid absorbing element can have a composite structure formed by a micron-scale structure and a flower-like nanometer-scale structure. Such structures, also known as micro-nano composite structures, are made by adding nanostructures to the surface of a micro-mesh structure. To make such a micro-nano composite structure wicking element, the wicking element (e.g., a mesh member such as a stainless steel mesh) is first subjected to an activation treatment, and then its surface is plated with a heat-resistant metal (e.g., copper) film. The activation treatment is to improve the plating strength of the metal (e.g., copper) film and the wicking element. Then the liquid absorbing element plated with the metal film is immersed in a mixed solution of potassium hydroxide and potassium persulfate at the temperature of 70-75 ℃ for a period of time (30-35 minutes), and the liquid absorbing element is taken out, cleaned, put into a high-temperature furnace and baked for a period of time (60-70 minutes) to form a flower-shaped nano structure on the surface, so that the reflux capacity of the working medium can be improved, and the evaporation intensity can be enhanced.
According to the invention, the evaporation element is formed of a metal (copper and its alloys, aluminium, etc.) having a thermal conductivity greater than 200W/(m.K), preferably copper.
Optionally, the cooling element is formed of a metal (copper and its alloys, aluminum, etc.) having a thermal conductivity of more than 200W/(m · K), preferably copper.
Optionally, the wicking element is formed of a metal (copper, stainless steel, etc.) having a thermal conductivity greater than 10W/(m.K), preferably stainless steel, and
optionally, the corrosion-resistant metal is selected from metals that do not react with hydrogen ions, such as copper, silver, platinum, gold, and the like, preferably copper.
According to the invention, the thickness (preferably the overall thickness) of the heat dissipation assembly is no more than 240 microns, preferably 190 and 210 microns.
In a particular embodiment, the heat dissipating assembly further comprises a sealing member for closing said sealed space, optionally formed of Sn, Cu, Ag, Pb.
According to the invention, the surface of the wicking element has a contact angle with water of less than 10 degrees as measured using a contact angle measuring instrument.
According to the invention, the heat dissipation component is 5-30W/cm2The in-plane effective thermal conductivity under a thermal load of (1) is 1000-2000W/(m.K). The in-plane effective thermal conductivity is calculated as follows:
in-plane measured thermal resistance (average value of central temperature of cooling end-temperature of measuring points around cooling end)/input power
In-plane measured thermal resistance of copper/in-plane measured thermal resistance of heat dissipation assembly
In order to provide the heat dissipating module with ultra-thin and flexible characteristics, the evaporation element and the cooling element may use a copper plate of 30 to 60 μm, an aluminum plate, or stainless steel, preferably a copper plate. The liquid absorbing element can adopt a stainless steel net with 300-500 meshes, and the height of the supporting element is 100-150 mu m. The hydrophobic island array structure on the surface of the evaporation element can be made into a round shape, a square shape, a hexagon shape or other shapes, the size of each hydrophobic island is in the order of tens of micrometers, and the total area of the hydrophobic islands accounts for 10-50%, preferably 30-40% of the whole evaporation surface. The evaporation element, the liquid absorption element and the cooling element can be made into square or round uniform heating plates, and are sealed by soldering or hot pressing after being stacked together. After sealing, the soaking plate is vacuumized and then injected with liquid working medium for final sealing.
Yet another aspect of the present invention provides a device requiring heat dissipation, which may include any of the heat dissipation assemblies described above.
The device requiring heat dissipation is preferably an electronic device, and examples thereof may be selected from at least one of a handheld phone, a tablet computer, an electronic tablet, a laptop computer, and a wearable device.
The following examples are provided for illustrative purposes to aid those skilled in the art in understanding the present invention. However, the following examples of the present invention should not be construed to unduly limit the present invention. Variations and modifications to the discussed examples may occur to those of ordinary skill in the art without departing from the scope of the discovery.
Example 1
As shown in fig. 2(b), the heat dissipating assembly of example 1 comprises an evaporation element, a liquid absorbing element 2, a cooling element and a sealing element. The liquid-absorbing member 2 was a 500 mesh stainless steel net (area: 60 × 0.05 mm)3The diameter of the steel wire is as follows: 25 μm, mesh size: 25 microns). The stainless steel mesh was first activated for 2 minutes under a current of 2A, then the stainless steel mesh was washed with deionized water and washed with 0.8M CuSO4And 1.5M H2SO4The plating solution of (1A) was applied for 5 minutes. Thus, a micron-sized stainless steel mesh with a copper layer plated on the surface thereof was obtained as a liquid absorbing member. Fig. 7a shows a scanning electron micrograph of a stainless steel mesh with a copper-plated surface.
The cooling element and the evaporation element were copper plates 40 μm and 30 μm thick, respectively. An array of micro copper pillars was designed on a copper plate as a cooling element to support the vapor space. First, a copper plate having a thickness of 40 μm was washed with acetone, isopropyl alcohol and deionized water in this order, and then immersed in 20% sulfuric acid to remove an oxide layer on the surface thereof. Then, the surface thereof was subjected to a photolithography process using a photoresist AZ9260 and baked at 120 ℃. The photoresist-patterned copper plate was placed in an electroplating bath at a current of 0.07A for 15 hours to perform electroplating. The copper pillar is 110 microns high, and 0.8 mm in diameter. The center distance between two adjacent pillars was 1.5 mm. A stainless steel mesh was sandwiched between the evaporation element and the wicking element and sealed with a solder Sn/Pd (60/40) material. And injecting a liquid working medium into the sealed space, thereby obtaining the heat dissipation assembly of the embodiment 1. The size of the heat dissipation assembly is 70 x 70mm2And the working area is 60 x 60mm2. The thickness of the heat dissipation assembly of example 1 was 230 microns.
Example 2
As shown in fig. 2(c), a heat dissipation assembly of example 2 was prepared in substantially the same manner as in example 1, except that flower-like nanostructures were formed on a stainless steel mesh having a surface plated with copper. Specifically, a copper-plated stainless steel net was dipped into a stainless steel net containing 0.065M K2S2O8And 2.5M KOH in 70 ℃ water for 30 minutes. The sample was rinsed with water and dried at 180 ℃ for 1 hour. As a result, at least a portion of the surface of the stainless steel mesh is covered with flower-like nanostructures, as shown in fig. 7b and c. The contact angle of the surface with flower-like nanostructures to water is less than 10 degrees. Thus, the nanostructured network surface is superhydrophilic, which can greatly improve capillary forces. The thickness of the heat dissipation assembly of example 2 was 230 microns.
Example 3
As shown in fig. 2(d), a heat dissipating module of example 2 was prepared in substantially the same manner as in example 2, except that a wetted surface having a hydrophilic network of a hydrophobic island array was also formed on the inner surface of the copper plate of the evaporation element. Specifically, at 70 × 0.03mm3The hydrophobic islands are fabricated on the copper substrate surface by first forming a HPR504 photoresist pattern on a clean copper substrate by photolithography to protect the hydrophilic regions. The sample is then immersed in a solution containing FAS (fluorinated alkyl silane) to form hydrophobic islands. Finally the photoresist was removed, resulting in a square array of hydrophobic islands of 45 μm size with a 65 μm pitch on the hydrophobic surface. Fig. 6(a) shows a photograph of an array of square hydrophobic islands prepared, and fig. 6(b) shows condensation of steam on the hydrophobic areas, demonstrating the success of the wetting agent. In fig. 6(a), 13 denotes a hydrophobic island, and 12 denotes a hydrophilic region. The thickness of the heat dissipation assembly of example 3 was 230 microns.
Test example
The in-plane effective thermal conductivity of the heat dissipating modules prepared in examples 1 to 3 was measured by the following manner:
the center of the bottom of the evaporation element of the heat sink assembly was heated by 8mm heating fins and the center temperature point 1 and the peripheral temperature points 2,3,4 and 5 of the outer surface of the cooling element were measured. When the temperature is stable, the in-plane measurement thermal resistance is calculated by measuring the temperature and the heating power of the heating plate, and the formula is as follows:
in-plane measurement thermal resistance (the central temperature of the cooling element-the average value of the temperatures of the measurement points around the cooling element)/input power
Pure copper sheets of the same dimensions as the heat sink assembly were also tested. The in-plane effective thermal conductivity can be calculated by the following formula:
in-plane measured thermal resistance of copper/in-plane measured thermal resistance of heat dissipation assembly
The in-plane effective thermal conductivities of the heat dissipation assemblies of examples 1-3 at the optimum water loading of water are summarized in table 1. It can be seen that the in-plane effective thermal conductivity of the heat dissipation assemblies of examples 1-3 is at least 2.5 times that of copper. The heat dissipation assembly of example 2 showed some improvement compared to example 1. Example 3 further improves the temperature uniformity of example 2 at 23.91W/cm2Approximately 30 times the in-plane thermal conductivity of copper under the same heat. Here, the combination of the nanostructure core and the wettability patterned surface can greatly improve the in-plane effective thermal conductivity of the ultra-thin heat dissipation assembly, showing better temperature uniformity.
TABLE 1
In summary, the invention provides an ultrathin heat dissipation assembly (vapor chamber), wherein a flower-shaped nano structure is added on the surface of a liquid absorption core of the ultrathin heat dissipation assembly (vapor chamber), so that the reflux capacity of a liquid working medium of the ultrathin heat dissipation assembly is improved, and meanwhile, a hydrophilic-hydrophobic mixed wetting surface is manufactured on an evaporation element of the ultrathin heat dissipation assembly, so that the phase change heat exchange strength of the ultrathin heat dissipation assembly is improved, and the ultrathin heat dissipation assembly has good temperature uniformity and cooling effect. The heat sink assembly may be flexible and capable of bending operation to some extent. .
It is to be understood that the above embodiments are merely exemplary embodiments that have been employed to illustrate the principles of the present disclosure, which, however, is not to be taken as limiting the disclosure. It will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the disclosure, and these are to be considered as the scope of the disclosure.
Claims (17)
1. A heat sink assembly, comprising:
an evaporation element is arranged on the upper surface of the shell,
a cooling element, and
a liquid absorbing element located between the evaporation element and the cooling element, the surface of which is covered with a corrosion-resistant coating and has a micro-scale structure,
wherein the evaporation element and the cooling element form a sealed space for containing a liquid working medium and a liquid absorbing element is located within the sealed space, and the evaporation element is a hydrophilic and hydrophobic mixed wetting surface at a surface facing the sealed space.
2. A device requiring heat dissipation, comprising:
the heat removal assembly of claim 1.
3. A method of making a heat-dissipating component, comprising the steps of:
(11) providing an evaporation element and a cooling element;
(12) providing a wicking element;
(13) electroplating a corrosion-resistant coating on the surface of the liquid absorbing element with the micron structure;
(14) disposing a liquid absorbing member between an evaporation member and a cooling member such that the evaporation member, the liquid absorbing member and the cooling member form a sealed space and the evaporation member is a hydrophilic and hydrophobic mixed wetting surface at a surface facing the sealed space, and
(15) and injecting a liquid working medium into the sealed space.
4. The heat dissipation assembly of claim 1 or the device in need of heat dissipation of claim 2 or the method of claim 3, wherein the wicking element has a composite structure of micro-scale structures and flower-like nano-scale structures.
5. The heat dissipation assembly of claim 1 or 4 or the device requiring heat dissipation of claim 2 or 4 or the method of claim 3, wherein the corrosion-resistant coating is formed from a material compatible with the liquid working medium.
6. The heat dissipation assembly of claim 1 or the device in need of heat dissipation of claim 2 or the method of claim 3, wherein the hydrophilic and hydrophobic hybrid wetting surface comprises an array formed of a plurality of hydrophobic islands and a plurality of hydrophilic regions.
7. The heat dissipation assembly of claim 6, or the device in need of heat dissipation of claim 6, or the method of claim 3, wherein the hydrophobic islands have a size of 10-200 μm,
optionally, the pitch between adjacent hydrophobic islands is 50-400 μm in both the lateral and longitudinal directions of the mixed wetting surface,
optionally, the hydrophobic islands comprise 10-50% of the total area of the hydrophilic and hydrophobic mixed wetting surface; and
optionally, the hydrophobic islands are formed by a photolithography method from at least one material selected from silane compounds, fluorine-containing silane compounds, teflon, polyolefins, polycarbonates, polyamides, polyacrylonitrile, polyesters, and acrylates.
8. The heat dissipating assembly of any one of claims 1 and 4 to 7 or the device requiring heat dissipation of any one of claims 2, 4 to 7 or the method of claim 3, wherein the evaporation element is formed of a metal (copper, aluminum, etc.) having a thermal conductivity greater than 200W/(m-K), preferably copper;
optionally, the cooling element is formed of a metal (copper and its alloys, aluminum, etc.) having a thermal conductivity of more than 200W/(m · K), preferably copper;
optionally, the wicking element is formed from a corrosion-resistant metal (copper and its alloys, stainless steel, etc.) having a thermal conductivity greater than 10W/(m.K), preferably a stainless steel mesh, and
optionally, the corrosion-resistant metal is selected from metals that do not react with hydrogen ions, such as copper, silver, platinum, gold, and the like, preferably copper.
9. The heat dissipation assembly of any one of claims 1 and 4-7 or the device requiring heat dissipation of any one of claims 2, 4-7 or the method of claim 3, wherein the thickness of the heat dissipation assembly is no more than 240 microns, preferably 190-210 microns.
10. The heat dissipating assembly of any one of claims 1, 4-7 or the device requiring heat dissipation of any one of claims 2, 4-7 or the method of claim 3, wherein the heat dissipating assembly further comprises a sealing member for closing the sealed space,
optionally, the sealing element is formed of Sn, Cu, Ag, Pb, or any combination thereof.
11. The heat dissipating assembly of any one of claims 1 and 4 to 10 or the device requiring heat dissipation of any one of claims 2, 4 to 10 or the method of claim 3, characterized in that the cooling element comprises a support element, preferably a plurality of support elements, for forming an evaporation space for the liquid working substance;
optionally, the support element is integral with the cooling element,
optionally, the support element is cylindrical and has a diameter of 0.3mm to 2 mm;
optionally, the height of the support element is from 100 μm to 150 μm;
optionally, the distance between the plurality of support elements in the transverse direction of the cooling element surface is 1mm to 4mm, preferably 1.5 mm.
12. A method according to claim 3, wherein the method further comprises, after step (13), contacting the liquid-absorbing member having a surface with a micro-scale structure with a composition comprising K2S2O8、KOH、NaClO3、Na3PO4·12H2O, NaOH and NH3·H2O、H2O2And NaOH under heating, thereby forming a composite structure of micro-scale structures and flower-like nano-scale structures on the surface.
13. The method according to claim 3 or 12, characterized in that the method further comprises the step (16) of forming an array of hydrophobic islands on at least a part of the surface of the evaporation element facing the sealed space by means of a lithographic process.
14. The method according to claim 13, characterized in that the step (16) comprises forming a photoresist pattern on at least a portion of a surface of the evaporation element facing the sealed space; immersing an evaporation element having a photoresist pattern formed therein into a solution containing a hydrophobizing compound; and removing the photoresist, such that regions protected by the photoresist form hydrophilic regions and regions not protected by the photoresist form hydrophobic islands.
15. The heat dissipation assembly of any one of claims 1, 4-10 or the device in need of heat dissipation of any one of claims 2, 4-10 or the method of claim 3, wherein the surface of the wicking element has a contact angle with water of less than 10 degrees as measured by a contact angle meter.
16. The heat dissipating assembly of any one of claims 1 or 4 to 10 or the device requiring heat dissipation of any one of claims 2 or 4 to 10 or the method of claim 3, wherein the heat dissipating assembly is calculated according to the following equation5-30W/cm2The in-plane effective thermal conductivity under thermal load of 1000-:
in-plane measured thermal resistance of copper/in-plane measured thermal resistance of a heat dissipation assembly
The in-plane measurement thermal resistance (the center temperature of the cooling end-the average value of the temperatures of the measurement points around the cooling end)/the input power.
17. The device requiring heat dissipation according to claim 2, characterized by being an electronic device, preferably selected from at least one of a handheld phone, a tablet, an electronic tablet, a handheld computer, a wearable device, or any combination thereof.
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| CN113594101B (en) * | 2021-07-19 | 2023-09-01 | 合肥圣达电子科技实业有限公司 | Metal packaging shell and manufacturing method thereof |
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