CN112562887A - Nano silver wire transparent conductive film with excellent bending resistance - Google Patents
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Abstract
The invention relates to the field of conductive films, in particular to a nano silver wire transparent conductive film with excellent bending resistance. The transparent conductive film comprises a hardening layer, a flexible substrate, a conductive layer and a transparent protective layer which are sequentially stacked from bottom to top, wherein: the coating component of the hardened layer contains microgel oligomer, the conductive ink component of the conductive layer contains hydrogel, and the coating component of the transparent protective layer contains microgel. According to the invention, the crosslinking structure of the microgel and the hydrogel is fully utilized, the tensile property of each film layer is effectively improved, and the integral bending resistance of the transparent conductive film is further improved.
Description
Technical Field
The invention relates to the field of conductive films, in particular to a nano silver wire transparent conductive film with excellent bending resistance.
Background
With the rapid development of flexible electronics, flexible conductive materials are receiving more and more attention. The difficulty with flexible electronic displays is the flexible materials and flexible electronics. In the research on conductive materials, nano silver is always a research hotspot due to the high conductivity of the nano silver. The nano silver wire has incomparable high light transmittance, high conductivity and high flexibility compared with Indium Tin Oxide (ITO), and particularly has outstanding advantages in the field of flexible touch control. At present, due to the increasing demand of the market for flexible transparent conductive films, especially the bending resistance of the flexible transparent conductive films, the flexible transparent conductive films are easy to produce creases and even break in the folding and bending processes, which is a problem to be solved urgently.
Disclosure of Invention
In view of the above technical problems, the present invention provides a transparent conductive film of silver nanowires having excellent bending resistance.
The invention adopts the following technical scheme:
the utility model provides a resistant excellent nanometer silver line transparent conducting film of bending property, includes sclerosis layer, flexible substrate, conducting layer, the transparent protective layer that stacks gradually the setting from bottom to top, wherein:
the coating component of the hardened layer contains microgel oligomer, the conductive ink component of the conductive layer contains hydrogel, and the coating component of the transparent protective layer contains microgel.
Further, the conductive ink of the conductive layer comprises the following components in parts by weight: 5-50 wt% of nano silver wire dispersion liquid, 1-20 wt% of hydrogel, 0.1-5 wt% of adhesive, 0.0001-1 wt% of dispersant, and the balance of water and solvent.
Furthermore, the hydrogel is polyvinyl alcohol hydrogel, polyacrylamide hydrogel, poly (N-isopropylacrylamide) hydrogel or hybrid double-network hydrogel and multi-network hydrogel which take polyvinyl alcohol, polyacrylamide and poly (N-isopropylacrylamide) as basic structures.
Furthermore, the content of the nano silver wires in the nano silver wire dispersion liquid is 0.001-2 wt%, the diameter of the nano silver wires is 5-50nm, and the length of the nano silver wires is 1-50 μm.
Further, the adhesive is one or more of acrylate, polyurethane, polyester, epoxy resin and cellulose; the dispersant is a surfactant; the conductive layer solvent is alcohol solvent such as ethanol, isopropanol, n-propanol, ethylene glycol, propylene glycol, diethylene glycol, etc., or ester solvent such as propylene glycol methyl ether acetate, dicarboxylic acid ester, etc.
The conductive layer improves the adhesive force of the coating by adding hydrogel into the nano silver wire conductive ink, the hydrogel is a hydrophilic three-dimensional network cross-linked structure and is a special soft substance capable of absorbing water and keeping cross-linking density, and the conductive material prepared by doping the hydrogel can effectively improve the bending resistance of the material, so that the stretchability of the coating after thermosetting film forming is improved.
Further, the coating of the hardened layer comprises the following components in parts by weight: 10-30 parts of light-cured oligomer, 5-20 parts of light-cured monomer, 0.1-5 parts of microgel oligomer, 0.5-3 parts of auxiliary agent, 0.5-5 parts of photoinitiator and 30-80 parts of solvent.
Further, the light-cured oligomer is any one or more of unsaturated polyester, epoxy acrylate, polyurethane acrylate, polyester acrylate, polyether acrylate, pure acrylate, organic silicon oligomer and epoxy resin; the light-cured monomer is any one or more of alkyl acrylate, hydroxy (meth) acrylate, glycidyl methacrylate, isobornyl methacrylate, tetrahydrofuryl acrylate, diol diacrylate, trimethylolpropane triacrylate, pentaerythritol triacrylate and dipentaerythritol pentaacrylate.
Further, the microgel oligomer is styrene-divinylbenzene microgel.
Further, the auxiliary agent is a flatting agent, a light stabilizer, an anti-ultraviolet aging agent, an antioxidant and the like; the photoinitiator is 2-hydroxy-2-methyl-phenyl acetone-1, 1-hydroxy-cyclohexyl benzophenone or 2,4, 6-trimethyl benzoyl-ethoxy-phenyl phosphine oxide; the hardening layer solvent is alcohol or ester solvent.
According to the hardened layer, the microgel oligomer is added into the coating to improve the bending resistance of the material, so that the flexible transparent conductive film has certain toughness. The microgel is a polymer microsphere with internal crosslinking, is a novel functional polymer, can be well dispersed in a medium, and can be added into a coating to effectively improve the stretchability of a hardened layer.
Further, the paint of the transparent protective layer comprises the following components in parts by weight: 2-20 parts of acrylate, 0.01-1 part of microgel, 0.02-2 parts of nano silicon dioxide and 80-99 parts of solvent.
Further, the microgel is styrene-divinylbenzene microgel; the transparent protective layer solvent is alcohol or ester solvent and/or water.
The transparent protective layer is mainly used for improving the wiping resistance and chemical resistance of the protective coating by adding the nano silicon dioxide into the coating, and simultaneously improving the bending resistance of the material by adding the microgel oligomer, so that the flexible transparent conductive film is ensured to have certain toughness.
Further, the flexible substrate is a polyimide, polyester or polyolefin substrate; preferably, the flexible substrate is polyimide or polyethylene terephthalate.
The transparent conductive film of the nano silver wire with excellent bending resistance is prepared by three different processes by applying a roll-to-roll coating mode on the basis of a flexible base material. Specifically, the preparation method comprises the following steps:
(1) preparing raw materials: respectively preparing a hardening coating, a nano silver wire conductive ink and a transparent protective coating according to the raw material component ratio, and fully stirring and uniformly mixing for later use;
(2) coating a hardening layer: coating the hardened coating on the back surface of the flexible substrate, and performing photocuring to form a film;
(3) coating a conductive layer: coating the front surface of the flexible substrate with the nano silver wire conductive ink, and thermally curing to form a film through a series of temperature gradients;
(4) coating a transparent protective layer: and coating the transparent protective coating on the conductive layer, and performing thermal curing to form a film through a series of temperature gradients to obtain the nano silver wire transparent conductive film.
Further, the hardened layer is coated in a micro-concave coating mode, pre-dried at the temperature of a gradient oven at 80/100/120/120/100/80 ℃, the machine speed is 1-20m/min, and then cured into a film by an ultraviolet curing device in the nitrogen atmosphere; coating the conductive layer by adopting a slit coating mode, drying and curing at a gradient temperature of 80/100/120/120/100/80 ℃ at a machine speed of 1-10m/min to form a film; the transparent protective layer is dried and solidified into a film by adopting a slit coating mode at the machine speed of 1-5m/min and the gradient temperature of 80/100/120/120/100/80 ℃, and the nano silver wire conductive film is prepared.
According to the nano silver wire transparent conductive film with excellent bending resistance, the flexible substrate is used as the base material, the microgel oligomer is added into the hardened layer, the hydrogel is added into the conductive layer, and the microgel is added into the transparent protective layer, so that the crosslinking structure of the microgel and the hydrogel is fully utilized, the tensile property of each film layer is effectively improved, and the integral bending resistance of the transparent conductive film is further improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a transparent conductive film of silver nanowires of the invention;
in the figure: 1-a hardened layer, 2-a flexible substrate, 3-a conductive layer and 4-a transparent protective layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
A transparent conductive film of silver nanowires with excellent bending resistance, as shown in figure 1, comprises a hardened layer 1, a flexible substrate 2, a conductive layer 3 and a transparent protective layer 4 which are sequentially stacked from bottom to top. The preparation method comprises the following steps:
(1) preparing raw materials: the hardening coating, the nano silver wire conductive ink and the transparent protective coating are respectively prepared according to the raw material component ratio, and specifically:
preparing a hardening coating: uniformly dispersing 15 parts of light-cured oligomer urethane acrylate CN8000NS (sartomer), 5 parts of light-cured monomer pentaerythritol triacrylate SR444 (sartomer), 10 parts of light-cured monomer di-trimethylolpropane tetraacrylate SR355 (sartomer), 2 parts of photoinitiator 2-hydroxy-2-methyl-phenyl acetone-1, 5 parts of styrene-divinylbenzene microgel, 1 part of light stabilizer Tinuvin329, 1 part of flatting agent BYK-333 and 61 parts of solvent butyl acetate in a shading solvent for 3 hours to prepare a hardened coating for later use;
preparing nano silver wire conductive ink: uniformly dispersing 30 parts of nano silver wire dispersion liquid containing 0.25 wt% of nano silver wires, 3 parts of polyvinyl alcohol hydrogel, 0.8 part of adhesive hydroxymethyl cellulose, 0.2 part of dispersing agent BYK-349, 10 parts of n-propyl alcohol and 56 parts of deionized water in a container for 48 hours to prepare nano silver wire conductive ink for later use;
preparing a transparent protective coating: uniformly dispersing 10 parts of polyurethane modified acrylate emulsion, 2 parts of nano silicon dioxide, 1 part of styrene-divinylbenzene microgel, 5 parts of propylene glycol methyl ether acetate, 80 parts of deionized water and 1 part of BYK-346 in a container for 4 hours to prepare a transparent protective coating for later use;
(2) coating a hardening layer: coating the hardened coating on the back of the polyimide substrate in a micro-concave coating mode, pre-drying at the temperature of a gradient oven of 80/100/120/120/100/80 ℃ at the machine speed of 1-20m/min, and performing photocuring film forming through an ultraviolet curing device in nitrogen atmosphere to prepare a transparent polyimide film with a hardened layer;
(3) coating a conductive layer: coating the nano silver wire conductive ink on the front surface of the flexible substrate in a slit coating mode, drying and curing at a gradient temperature of 80/100/120/120/100/80 ℃ to form a film, wherein the machine speed is 1-10 m/min;
(4) coating a transparent protective layer: and coating the transparent protective coating on the conductive layer by adopting a slit coating mode, drying and curing at a machine speed of 1-5m/min and a gradient temperature of 80/100/120/120/100/80 ℃ to form a film, and obtaining the nano silver wire transparent conductive film.
Example 2
A nano silver wire transparent conductive film with excellent bending resistance comprises a hardening layer, a flexible substrate, a conductive layer and a transparent protective layer which are sequentially stacked from bottom to top. The preparation method comprises the following steps:
(1) preparing raw materials: the hardening coating, the nano silver wire conductive ink and the transparent protective coating are respectively prepared according to the raw material component ratio, and specifically:
preparing a hardening coating: uniformly dispersing 10 parts of light-cured oligomer polyester acrylate CN710 (sartomer), 10 parts of light-cured monomer alkyl acrylate, 10 parts of light-cured monomer isobornyl methacrylate, 0.5 part of photoinitiator 2-hydroxy-2-methyl-phenyl acetone-1, 3 parts of styrene-divinylbenzene microgel, 0.5 part of flatting agent and 66 parts of solvent isopropanol in a shading solvent for 3 hours to prepare a hardened coating for later use;
preparing nano silver wire conductive ink: uniformly dispersing 47 parts of nano silver wire dispersion liquid containing 0.001 wt% of nano silver wires, 1.2 parts of polyacrylamide hydrogel, 0.1007 parts of adhesive polyurethane, 0.0003 part of dispersant BYK-349, 21.699 parts of n-propanol and 30 parts of deionized water in a container for 48 hours to prepare nano silver wire conductive ink for later use;
preparing a transparent protective coating: uniformly dispersing 2 parts of polyurethane modified acrylate emulsion, 0.02 part of nano silicon dioxide, 0.8 part of styrene-divinylbenzene microgel, 7.18 parts of propylene glycol methyl ether and 90 parts of deionized water in a container for 4 hours to prepare a transparent protective coating for later use;
(2) coating a hardening layer: coating the hardened coating on the back of the polyimide substrate in a micro-concave coating mode, pre-drying at the temperature of a gradient oven of 80/100/120/120/100/80 ℃ at the machine speed of 1-20m/min, and performing photocuring film forming through an ultraviolet curing device in nitrogen atmosphere to prepare a transparent polyimide film with a hardened layer;
(3) coating a conductive layer: coating the nano silver wire conductive ink on the front surface of the flexible substrate in a slit coating mode, drying and curing at a gradient temperature of 80/100/120/120/100/80 ℃ to form a film, wherein the machine speed is 1-10 m/min;
(4) coating a transparent protective layer: and coating the transparent protective coating on the conductive layer by adopting a slit coating mode, drying and curing at a machine speed of 1-5m/min and a gradient temperature of 80/100/120/120/100/80 ℃ to form a film, and obtaining the nano silver wire transparent conductive film.
Example 3
A nano silver wire transparent conductive film with excellent bending resistance comprises a hardening layer, a flexible substrate, a conductive layer and a transparent protective layer which are sequentially stacked from bottom to top. The preparation method comprises the following steps:
(1) preparing raw materials: the hardening coating, the nano silver wire conductive ink and the transparent protective coating are respectively prepared according to the raw material component ratio, and specifically:
preparing a hardening coating: uniformly dispersing 20 parts of light-cured oligomer urethane acrylate CN965NS (sartomera), 10 parts of light-cured monomer pentaerythritol triacrylate SR454 (sartomera), 4.9 parts of photoinitiator 2-hydroxy-2-methyl-phenyl acetone-1, 0.1 part of styrene-divinylbenzene microgel, 3 parts of flatting agent BYK-333 and 62 parts of solvent diformate in a shading solvent for 3 hours to prepare a hardened coating for later use;
preparing nano silver wire conductive ink: uniformly dispersing 6 parts of nano silver wire dispersion liquid containing 2 wt% of nano silver wires, 20 parts of poly (N-isopropylacrylamide) hydrogel, 0.1 part of adhesive epoxy resin, 0.1 part of dispersant BYK-349, 7.8 parts of N-propanol and 66 parts of deionized water in a container for 48 hours to prepare nano silver wire conductive ink for later use;
preparing a transparent protective coating: uniformly dispersing 18 parts of polyurethane modified acrylate emulsion, 1.5 parts of nano silicon dioxide, 0.02 part of styrene-divinylbenzene microgel, 10.48 parts of propylene glycol and 70 parts of deionized water in a container for 4 hours to prepare a transparent protective coating for later use;
(2) coating a hardening layer: coating the hardened coating on the back of the polyimide substrate in a micro-concave coating mode, pre-drying at the temperature of a gradient oven of 80/100/120/120/100/80 ℃ at the machine speed of 1-20m/min, and performing photocuring film forming through an ultraviolet curing device in nitrogen atmosphere to prepare a transparent polyimide film with a hardened layer;
(3) coating a conductive layer: coating the nano silver wire conductive ink on the front surface of the flexible substrate in a slit coating mode, drying and curing at a gradient temperature of 80/100/120/120/100/80 ℃ to form a film, wherein the machine speed is 1-10 m/min;
(4) coating a transparent protective layer: and coating the transparent protective coating on the conductive layer by adopting a slit coating mode, drying and curing at a machine speed of 1-5m/min and a gradient temperature of 80/100/120/120/100/80 ℃ to form a film, and obtaining the nano silver wire transparent conductive film.
Example 4
A nano silver wire transparent conductive film with excellent bending resistance comprises a hardening layer, a flexible substrate, a conductive layer and a transparent protective layer which are sequentially stacked from bottom to top. The preparation method comprises the following steps:
(1) preparing raw materials: the hardening coating, the nano silver wire conductive ink and the transparent protective coating are respectively prepared according to the raw material component ratio, and specifically:
preparing a hardening coating: uniformly dispersing 15 parts of light-cured oligomer urethane acrylate CN8000NS (sartomer), 15 parts of light-cured oligomer epoxy acrylate CN-104A80 NS (sartomer), 5 parts of light-cured monomer di-trimethylolpropane tetraacrylate SR355 (sartomer), 3 parts of photoinitiator 1-hydroxy-cyclohexyl benzophenone, 2 parts of styrene-divinylbenzene microgel, 1 part of light stabilizer Tinuvin329 and 59 parts of solvent ethylene glycol in a shading solvent for 3 hours to prepare a hardened coating for later use;
preparing nano silver wire conductive ink: uniformly dispersing 20 parts of nano silver wire dispersion liquid containing 0.25 wt% of nano silver wires, 8 parts of polyvinyl alcohol hydrogel, 4.8 parts of adhesive hydroxymethyl cellulose, 0.9 part of dispersant BYK-349, 6.3 parts of n-propyl alcohol and 60 parts of deionized water in a container for 48 hours to prepare nano silver wire conductive ink for later use;
preparing a transparent protective coating: uniformly dispersing 6 parts of polyurethane modified acrylate emulsion, 0.9 part of nano silicon dioxide, 0.16 part of styrene-divinylbenzene microgel, 12.94 parts of propylene glycol and 80 parts of deionized water in a container for 4 hours to prepare a transparent protective coating for later use;
(2) coating a hardening layer: coating the hardened coating on the back of the polyimide substrate in a micro-concave coating mode, pre-drying at the temperature of a gradient oven of 80/100/120/120/100/80 ℃ at the machine speed of 1-20m/min, and performing photocuring film forming through an ultraviolet curing device in nitrogen atmosphere to prepare a transparent polyimide film with a hardened layer;
(3) coating a conductive layer: coating the nano silver wire conductive ink on the front surface of the flexible substrate in a slit coating mode, drying and curing at a gradient temperature of 80/100/120/120/100/80 ℃ to form a film, wherein the machine speed is 1-10 m/min;
(4) coating a transparent protective layer: and coating the transparent protective coating on the conductive layer by adopting a slit coating mode, drying and curing at a machine speed of 1-5m/min and a gradient temperature of 80/100/120/120/100/80 ℃ to form a film, and obtaining the nano silver wire transparent conductive film.
Comparative example 1
This comparative example is substantially identical to example 1 except that no microgel oligomer is contained in the hardened layer coating.
Comparative example 2
This comparative example is essentially identical to example 1, except that the conductive ink of the conductive layer does not contain a hydrogel.
Comparative example 3
This comparative example is substantially identical to example 1 except that no microgel oligomer is contained in the hardened layer coating.
The transparent conductive films prepared in examples 1 to 4 and comparative examples 1 to 3 were subjected to bending property tests, and the specific test procedures were as follows: conducting film prepared in each example and comparative example was tested by using an XHS-ZW-03A model repeated bender manufactured by Shenzhen Xinhensen instruments Limited under the following test conditions: one end of a conductive film to be tested is clamped by a clamping plate, one end of the clamping plate is respectively a semi-circular angle with the radius of 1mm, 3mm and 5mm, the other end of the clamping plate is clamped on a crank shaft, the conductive film is repeatedly bent under the driving of a motor, and the bending frequency is once per second. The appearance of the different conductive films after 50 ten thousand folds was recorded, and the results are shown in table 1. The method for detecting the appearance of the bending resistance test comprises the following steps: the strong light/searchlight is held by hand, the front side/the back side is irradiated and light-transmitting observed, the angle of a light source and the film surface form an angle of 45 degrees, and the observation is carried out at a distance of 30-35cm from the film surface. The resistance change of each conductive film after different bending tests was tested at the same time, and the results are shown in table 2.
TABLE 1 test results of the film surface state of the transparent conductive film
Table 2 resistance value variation test results of transparent conductive film
As can be seen from the results of the bending resistance tests of the conductive films in tables 1-2, examples 1-4, and comparative examples 1-3, the microgel oligomer, the hydrogel and the transparent protective layer are respectively added into the hardened layer, the conductive layer and the transparent conductive film of the present invention by using the flexible substrate as the substrate, and the crosslinking structures of the microgel and the hydrogel are fully utilized, so that the stretchability of each film layer is effectively improved, and the overall bending resistance of the transparent conductive film is further improved. After 50 ten thousand times of bending, the film surface appearance is good, and no crack appears; meanwhile, the resistance change rate of the conductive film is within 1%, and the excellent performance is still maintained. As can be seen from the analysis of the film surface state and the resistance value change in comparison with those of the comparative examples, the bending resistance of the conductive film of the present invention is obtained by the combined action between the layers, and is not indispensable.
The present invention has been further described with reference to specific embodiments, but it should be understood that the detailed description should not be construed as limiting the spirit and scope of the present invention, and various modifications made to the above-described embodiments by those of ordinary skill in the art after reading this specification are within the scope of the present invention.
Claims (10)
1. The utility model provides a resistant excellent nanometer silver line transparent conducting film of bending property which characterized in that includes sclerosis layer, flexible substrate, conducting layer, the transparent protective layer that stacks gradually the setting by lower supreme, wherein:
the coating component of the hardened layer contains microgel oligomer, the conductive ink component of the conductive layer contains hydrogel, and the coating component of the transparent protective layer contains microgel.
2. The transparent conductive film of silver nanowires with excellent bending resistance according to claim 1, wherein the conductive ink of the conductive layer comprises the following components in percentage by mass: 5-50 wt% of nano silver wire dispersion liquid, 1-20 wt% of hydrogel, 0.1-5 wt% of adhesive, 0.0001-1 wt% of dispersant, and the balance of water and solvent.
3. The transparent conductive film of silver nanowires with excellent bending resistance as claimed in claim 1 or 2, wherein the hydrogel is a polyvinyl alcohol hydrogel, a polyacrylamide hydrogel, a poly (N-isopropylacrylamide) hydrogel, or a hybrid dual-network hydrogel or a multi-network hydrogel having a polyvinyl alcohol, polyacrylamide, or poly (N-isopropylacrylamide) as a basic structure.
4. The transparent conductive film of silver nanowires with excellent bending resistance as claimed in claim 2, wherein the silver nanowires are contained in the silver nanowire dispersion in an amount of 0.001 to 2 wt%, and the silver nanowires have a diameter of 5 to 50nm and a length of 1 to 50 μm.
5. The transparent conductive film of silver nanowires with excellent bending resistance as claimed in claim 1, wherein the coating of the hardened layer comprises the following components in parts by weight: 10-30 parts of light-cured oligomer, 5-20 parts of light-cured monomer, 0.1-5 parts of microgel oligomer, 0.5-3 parts of auxiliary agent, 0.5-5 parts of photoinitiator and 30-80 parts of solvent.
6. The silver nanowire transparent conductive film with excellent bending resistance of claim 5, wherein the light-cured oligomer is one or more of unsaturated polyester, epoxy acrylate, polyurethane acrylate, polyester acrylate, polyether acrylate, pure acrylate, organic silicon oligomer and epoxy resin;
the light-cured monomer is any one or more of alkyl acrylate, hydroxy (methyl) acrylate, glycidyl methacrylate, isobornyl methacrylate, tetrahydrofuran methyl acrylate, diol diacrylate, trimethylolpropane triacrylate, pentaerythritol triacrylate and dipentaerythritol pentaacrylate.
7. The transparent conductive film of silver nanowires with excellent bending resistance as claimed in claim 1 or 5, wherein the microgel oligomer is styrene-divinylbenzene microgel.
8. The transparent conductive film of silver nanowires with excellent bending resistance as claimed in claim 1, wherein the coating of the transparent protective layer comprises the following components in parts by weight: 2-20 parts of acrylate, 0.01-1 part of microgel, 0.02-2 parts of nano silicon dioxide and 80-99 parts of solvent.
9. The transparent conductive film of silver nanowires with excellent bending resistance as claimed in claim 1 or 8, wherein the microgel is styrene-divinylbenzene microgel.
10. The transparent conductive film of silver nanowires with excellent bending resistance as claimed in claim 1, wherein the flexible substrate is a polyimide, polyester or polyolefin substrate.
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| CN113185944A (en) * | 2021-04-24 | 2021-07-30 | 深圳市撒比斯科技有限公司 | UV adhesive and electric control PDLC functional film containing UV adhesive |
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