CN112551476B - Multifunctional semiconductor packaging structure and manufacturing method thereof - Google Patents

Multifunctional semiconductor packaging structure and manufacturing method thereof Download PDF

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Publication number
CN112551476B
CN112551476B CN202110190861.0A CN202110190861A CN112551476B CN 112551476 B CN112551476 B CN 112551476B CN 202110190861 A CN202110190861 A CN 202110190861A CN 112551476 B CN112551476 B CN 112551476B
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substrate
chip
metal cover
mems chip
hole
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CN112551476A (en
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孙成富
钟磊
何正鸿
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Forehope Electronic Ningbo Co Ltd
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Forehope Electronic Ningbo Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0058—Packages or encapsulation for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0064—Packages or encapsulation for protecting against electromagnetic or electrostatic interferences
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/007—Interconnections between the MEMS and external electrical signals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
    • B81C1/0023—Packaging together an electronic processing unit die and a micromechanical structure die
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00269—Bonding of solid lids or wafers to the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00301—Connecting electric signal lines from the MEMS device with external electrical signal lines, e.g. through vias
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0242—Gyroscopes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0278—Temperature sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Micromachines (AREA)

Abstract

The embodiment of the application provides a multifunctional semiconductor packaging structure and a manufacturing method of the multifunctional semiconductor packaging structure, wherein the multifunctional semiconductor packaging structure comprises a substrate, an MEMS chip, a metal cover, a radio frequency chip, a plastic package body and an antenna; the MEMS chip is positioned on one side of the substrate; the metal cover and the MEMS chip are positioned on the same side of the substrate, and the metal cover is used for protecting the MEMS chip and forming a cavity for accommodating the MEMS chip; the radio frequency chip is positioned on one side of the metal cover, which is far away from the MEMS chip; the plastic package body and the metal cover are positioned on the same side of the substrate, and the plastic package body is used for protecting the radio frequency chip, the metal cover and the substrate; the antenna is positioned on the surface of the plastic package body. Through the arrangement, the semiconductor packaging structure can be multifunctional.

Description

Multifunctional semiconductor packaging structure and manufacturing method thereof
Technical Field
The application relates to the technical field of semiconductor manufacturing, in particular to a multifunctional semiconductor packaging structure and a manufacturing method of the multifunctional semiconductor packaging structure.
Background
With the rapid development of semiconductors, various types of semiconductor package structures are applied in various scenes. Meanwhile, along with the improvement of living standard of people and the popularization of intelligent equipment, more and more equipment are required to interact. Conventional semiconductor packages often serve only a single function, which requires many additional components for additional configuration to meet the increasing demands of users.
In view of the above, it is necessary for those skilled in the art to provide a solution for obtaining a multifunctional semiconductor package structure.
Disclosure of Invention
The application provides a multifunctional semiconductor packaging structure and a manufacturing method thereof.
The embodiment of the application can be realized as follows:
in a first aspect, the present application provides a multifunctional semiconductor package structure, including a substrate, an MEMS chip, a metal cap, a radio frequency chip, a plastic package body, and an antenna;
the MEMS chip is positioned on one side of the substrate;
the metal cover and the MEMS chip are positioned on the same side of the substrate, and the metal cover is used for protecting the MEMS chip and forming a cavity for accommodating the MEMS chip;
the radio frequency chip is positioned on one side of the metal cover, which is far away from the MEMS chip;
the plastic package body and the metal cover are positioned on the same side of the substrate, and the plastic package body is used for protecting the radio frequency chip, the metal cover and the substrate;
the antenna is positioned on the surface of the plastic package body;
the plastic package body is provided with a conductive hole;
one side of the conductive hole is in contact with the substrate, the other side of the conductive hole is in contact with the antenna, the conductive hole is filled with a conductive material, and the conductive material is used for achieving electrical connection between the antenna and the substrate.
In an optional embodiment, the MEMS chip is an acoustic sensor chip, the multifunctional semiconductor package structure further includes an ASIC chip, and the substrate further includes a sound inlet hole;
the ASIC chip and the acoustic sensor chip are positioned on the same side of the substrate, the ASIC chip is electrically connected with the acoustic sensor chip, and the metal cover is also used for protecting the ASIC chip;
one side of the sound inlet hole is in contact with the outside, and the other side of the sound inlet hole is in contact with the cavity, so that the cavity is communicated with the outside.
In an alternative embodiment, one side of the sound inlet hole, which is in contact with the cavity, is vertically arranged on a horizontal plane determined by any side of the substrate, and one side of the sound inlet hole, which is in contact with the outside, is horizontally arranged on a horizontal plane determined by any side of the substrate.
In an alternative embodiment, the sound inlet hole is perpendicular to any side of the substrate and is opened through the substrate.
In an alternative embodiment, the MEMS chip is a gyroscope chip;
the metal cover and the substrate are sealed.
In an optional embodiment, the MEMS chip is a temperature sensitive sensor chip, and the multifunctional semiconductor package structure further includes a heat conductive cylinder;
the heat conduction column penetrates through the substrate, and one end, close to the metal cover, of the heat conduction column is located near the temperature-sensitive sensor chip.
In a second aspect, the present application provides a method for fabricating a multifunctional semiconductor package structure, including:
attaching the MEMS chip to one side of the substrate;
placing a metal cover on one side of the substrate where the MEMS chip is located, wherein the metal cover is used for protecting the MEMS chip and forming a cavity for accommodating the MEMS chip;
attaching the radio frequency chip to one side of the metal cover, which is far away from the MEMS chip;
carrying out plastic package on the radio frequency chip and the metal cover to obtain a plastic package body;
and manufacturing an antenna on one side of the plastic package body, which is far away from the radio frequency chip, so as to obtain the multifunctional semiconductor packaging structure.
In an alternative embodiment, the substrate comprises a sound inlet hole, the substrate being prepared by:
pressing a second substrate on one side of the first substrate;
performing laser grooving on the second base material to form a groove;
pressing a third base material on one side of the second base material far away from the first base material;
performing laser drilling on the third base material to obtain a first drilling hole and a second drilling hole, wherein the first drilling hole is communicated with the second drilling hole through the groove;
and performing a cutting process by using the cutting path determined by the central point of the first base material, the central point of the second base material and the central point of the third base material to obtain the substrate, wherein the sound inlet hole comprises a first drilling hole and a groove, or the sound inlet hole comprises a second drilling hole and a groove.
In an alternative embodiment, placing the metal cover on the side of the substrate where the MEMS chip is located includes:
and placing the metal cover on the side of the substrate where the MEMS chip is positioned, wherein the first drilling hole or the second drilling hole is within the range determined by the metal cover.
The beneficial effects of the embodiment of the application include, for example: by adopting the multifunctional semiconductor packaging structure and the manufacturing method thereof, the multifunctional semiconductor packaging structure comprises a substrate, an MEMS chip, a metal cover, a radio frequency chip, a plastic package body and an antenna; the MEMS chip is positioned on one side of the substrate; the metal cover and the MEMS chip are positioned on the same side of the substrate, and the metal cover is used for protecting the MEMS chip and forming a cavity for accommodating the MEMS chip; the radio frequency chip is positioned on one side of the metal cover, which is far away from the MEMS chip; the plastic package body and the metal cover are positioned on the same side of the substrate, and the plastic package body is used for protecting the radio frequency chip, the metal cover and the substrate; the antenna is positioned on the surface of the plastic package body. Through the arrangement, the layout of the MEMS chip, the metal cover, the radio frequency chip and the plastic package body is ingeniously utilized, and the multifunctional semiconductor packaging structure is realized.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained from the drawings without inventive effort.
Fig. 1 is a schematic structural diagram of a multifunctional semiconductor package structure according to an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of a multifunctional semiconductor package structure according to an embodiment of the present disclosure;
FIG. 3 is a schematic structural diagram of a multifunctional semiconductor package structure according to an embodiment of the present disclosure;
FIG. 4 is a flowchart illustrating a method for fabricating a multi-functional semiconductor package structure according to an embodiment of the present disclosure;
fig. 5 is a schematic view of a cutting process flow provided in an embodiment of the present application;
fig. 6 is a partial schematic view of a cutting process flow provided in an embodiment of the present application.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present application, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. are used for indicating the orientation or positional relationship based on the orientation or positional relationship shown in the drawings or the orientation or positional relationship which the present invention product is usually put into use, it is only for convenience of describing the present application and simplifying the description, but it is not intended to indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation and be operated, and thus, should not be construed as limiting the present application.
Furthermore, the appearances of the terms "first," "second," and the like, if any, are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
It should be noted that the features of the embodiments of the present application may be combined with each other without conflict.
At present, semiconductor packaging structures are applied to various fields, and in the center of the prior art, a single semiconductor package can often realize only one type of function, and if multiple functions are to be realized, the semiconductor package can be realized only by being linked with other semiconductor packaging structures or other additional components. With the improvement of living standard of people, interactive multifunctional equipment has become a trend, which cannot be solved by the traditional semiconductor packaging structure.
Referring to fig. 1, fig. 1 illustrates a multifunctional semiconductor package structure 1 according to an embodiment of the present disclosure, which includes a substrate 10, a MEMS chip, a metal cap 30, a radio frequency chip 40, a plastic package 50, and an antenna 60.
The MEMS chip is located on one side of the substrate 10.
The metal cap 30 and the MEMS chip are located on the same side of the substrate 10, and the metal cap 30 is used to protect the MEMS chip and form a cavity for accommodating the MEMS chip.
The rf chip 40 is located on a side of the metal cap 30 away from the MEMS chip.
The plastic package body 50 and the metal cover 30 are located on the same side of the substrate 10, and the plastic package body 50 is used for protecting the rf chip 40, the metal cover 30 and the substrate 10.
The antenna 60 is located on the surface of the plastic package body 50.
Through the above-mentioned packaging structure, it can cooperate with the rf chip 40 while the MEMS (Micro Electro Mechanical System) chip realizes corresponding functions, and the rf chip 40 can realize interaction with other external devices after being configured with the antenna 60. It should be noted that, while the metal cover 30 provides protection for the MEMS chip, due to the firmness of the metal cover 30 and the function of metal shielding, the metal cover 30 can be used as a mounting position of the rf chip 40, and the plastic package body 50 provides protection for the rf chip 40 and also provides protection for the metal cover 30 and the substrate 10, because a multifunctional semiconductor package structure 1 is not produced separately in an actual production process, which inevitably involves a cutting process, whereas in the prior art, since the plastic package body 50 is not arranged between the metal cover 30 and the substrate 10, structural damage may be caused between the metal cover 30 and the substrate 10 when the substrate 10 is warped due to the cutting process. After the plastic package body 50 is disposed, the rf chip 40 can be protected, the connection structure between the metal cover 30 and the substrate 10 can be protected, and the plastic package body can also be used as a support for disposing the antenna 60.
On the basis, referring to fig. 2, the plastic package body 50 is provided with a conductive hole 501.
One side of the conductive hole 501 contacts the substrate 10, and the other side contacts the antenna 60, and the conductive hole 501 is filled with a conductive material for electrically connecting the antenna 60 and the substrate 10.
In order to realize the interaction function of the rf chip 40, when the rf chip 40 is electrically connected to the substrate 10 by wire bonding, the antenna 60 may also be electrically connected to the substrate 10 by the conductive material filled in the conductive hole 501, so as to realize the linkage between the rf chip 40 and the antenna 60.
As an alternative embodiment, the MEMS chip 20 is an acoustic sensor chip, the multifunctional semiconductor package 1 further includes an ASIC chip 70, and the substrate 10 further includes a sound inlet 101.
The ASIC chip 70 and the acoustic sensor chip are located on the same side of the substrate 10, the ASIC chip 70 is electrically connected to the acoustic sensor chip, and the metal cover 30 is further used for protecting the ASIC chip 70.
One side of the sound inlet hole 101 is in contact with the outside and the other side is in contact with the cavity, so that the cavity communicates with the outside.
An ASIC (Application Specific Integrated Circuit, abbreviated as Integrated Circuit) chip is used to cooperate with the MEMS chip to realize the related functions thereof.
In order to more clearly describe the scheme provided by the present application, one side of the sound inlet hole 101 contacting the cavity is vertically opened at a horizontal plane determined by any side of the substrate 10, and one side of the sound inlet hole 101 contacting the outside is horizontally opened at a horizontal plane determined by any side of the substrate 10.
In order to more clearly describe the solution provided by the present application, the sound inlet hole 101 is perpendicular to either side of the substrate 10 and is opened through the substrate 10.
It should be understood that in the prior art, the acoustic sensor chips are all in direct contact with external sound sources, which makes the fragile acoustic sensor chips easily damaged, and then causes damage to the related equipment, and the damage of the acoustic sensor chips is generally difficult to maintain, which makes it impractical to maintain the chips separately. Through the above arrangement, the sound inlet hole 101 is opened in the substrate 10, and simultaneously, an external sound source passes through a corner instead of being in direct contact when entering the metal cover 30, thereby protecting the chip of the acoustic sensor.
As an alternative embodiment, MEMS chip 20 is a gyroscope chip.
The metal cover 30 is sealed with the substrate 10.
In addition to the foregoing embodiments, the MEMS chip may also be a gyroscope chip, which may be used in positioning, navigation, and other scenarios, and in order to implement this function, the metal cover 30 and the substrate 10 are sealed.
As an alternative embodiment, referring to fig. 3, the MEMS chip 20 is a temperature-sensitive sensor chip, and the multifunctional semiconductor package 1 further includes a thermal pillar 80.
The heat-conducting pillar 80 penetrates through the substrate 10, and one end of the heat-conducting pillar 80 close to the metal cover 30 is located near the temperature-sensitive sensor chip.
In another implementation manner of the embodiment of the present application, the MEMS chip is a temperature-sensitive sensor chip, and in order that the temperature-sensitive sensor chip can accurately detect the external temperature, the heat-conducting pillar 80 may be disposed near the temperature-sensitive sensor chip through the substrate 10, so that the temperature-sensitive sensor can more accurately sense the temperature.
An embodiment of the present invention provides a method for manufacturing a multifunctional semiconductor package structure 1, please refer to fig. 4, which includes:
step S201, attaching the MEMS chip to one side of the substrate 10.
In step S202, the metal cover 30 is placed on the side of the substrate 10 where the MEMS chip is located.
The metal cap 30 serves to protect the MEMS chip and form a cavity for accommodating the MEMS chip.
Step S203, attach the rf chip 40 to the side of the metal cover 30 away from the MEMS chip.
Step S204, plastic-sealing the radio frequency chip 40 and the metal cover 30 to obtain the plastic-sealed body 50.
In step S205, the antenna 60 is fabricated on the side of the plastic package body 50 away from the rf chip 40, so as to obtain the multifunctional semiconductor package structure 1.
The multifunctional semiconductor packaging structure 1 prepared by the steps can complete the interaction function with other equipment based on the radio frequency chip 40 and the antenna 60 while realizing the functions of the MEMS chip, so that the multifunctional semiconductor packaging structure 1 can be applied in a multifunctional scene without adding external equipment.
In order to more clearly describe the solution provided by the present application, the substrate 10 includes the sound inlet 101, and referring to fig. 5 and 6, the substrate 10 is prepared in the following manner.
Step S301, a second substrate is pressed on one side of the first substrate.
In step S302, laser grooving is performed on the second substrate to form a groove 1011.
Step S303, pressing a third base material on one side of the second base material, which is far away from the first base material;
in step S304, a laser drilling process is performed on the third substrate to obtain a first drilling 1012 and a second drilling 1013, and the first drilling 1012 and the second drilling 1013 are connected through the groove 1011.
Step S305, performing a cutting process on the scribe line defined by the center point of the first base material, the center point of the second base material, and the center point of the third base material to obtain the substrate 10.
Wherein the sound inlet 101 comprises a first bore 1012 and a recess 1011 or the sound inlet 101 comprises a second bore 1013 and a recess 1011.
It should be understood that, in the actual production process, one multifunctional semiconductor package 1 is not produced separately, but produced in batch, so that the sound inlet holes 101 in the embodiment of the present application can be produced in batch by the above-mentioned process, and after the cutting process, at least two sound inlet holes 101 can be formed skillfully without repeated operations, which also makes it easier to realize batch production in the production process of the multifunctional semiconductor package 1.
In order to more clearly describe the scheme provided by the present application, the foregoing step S202 may be implemented in the following manner.
In substep S202-1, the metal cap 30 is placed on the substrate 10 on the side where the MEMS chip is located.
Wherein the first bore 1012 or the second bore 1013 is within the confines of the metal cover 30.
In summary, the embodiment of the present application provides a multifunctional semiconductor package structure and a method for manufacturing the multifunctional semiconductor package structure, where the multifunctional semiconductor package structure includes a substrate, an MEMS chip, a metal cover, a radio frequency chip, a plastic package body, and an antenna; the MEMS chip is positioned on one side of the substrate; the metal cover and the MEMS chip are positioned on the same side of the substrate, and the metal cover is used for protecting the MEMS chip and forming a cavity for accommodating the MEMS chip; the radio frequency chip is positioned on one side of the metal cover, which is far away from the MEMS chip; the plastic package body and the metal cover are positioned on the same side of the substrate, and the plastic package body is used for protecting the radio frequency chip, the metal cover and the substrate; the antenna is positioned on the surface of the plastic package body. Through the arrangement, the layout of the MEMS chip, the metal cover, the radio frequency chip and the plastic package body is ingeniously utilized, and the multifunctional semiconductor packaging structure is realized.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present application should be covered within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (9)

1. A multifunctional semiconductor packaging structure is characterized by comprising a substrate, an MEMS chip, a metal cover, a radio frequency chip, a plastic package body and an antenna;
the MEMS chip is positioned on one side of the substrate;
the metal cover and the MEMS chip are positioned on the same side of the substrate, and the metal cover is used for protecting the MEMS chip and forming a cavity for accommodating the MEMS chip;
the radio frequency chip is positioned on one side of the metal cover, which is far away from the MEMS chip;
the plastic package body and the metal cover are positioned on the same side of the substrate, and the plastic package body is used for protecting the radio frequency chip, the metal cover and the substrate;
the antenna is positioned on the surface of the plastic package body;
the plastic package body is provided with a conductive hole;
one side of the conductive hole is in contact with the substrate, the other side of the conductive hole is in contact with the antenna, the conductive hole is filled with a conductive material, and the conductive material is used for achieving electrical connection between the antenna and the substrate.
2. The multi-functional semiconductor package according to claim 1, wherein the MEMS chip is an acoustic sensor chip, the multi-functional semiconductor package further comprises an ASIC chip, the substrate further comprises a sound inlet hole;
the ASIC chip and the acoustic sensor chip are positioned on the same side of the substrate, the ASIC chip is electrically connected with the acoustic sensor chip, and the metal cover is also used for protecting the ASIC chip;
one side of the sound inlet hole is in contact with the outside, and the other side of the sound inlet hole is in contact with the cavity, so that the cavity is communicated with the outside.
3. The multi-functional semiconductor package structure of claim 2, wherein one side of the sound inlet hole contacting the cavity is vertically opened at a level determined by either side of the substrate, and one side of the sound inlet hole contacting the outside is horizontally opened at a level determined by either side of the substrate.
4. The multi-functional semiconductor package according to claim 2, wherein the sound inlet hole is formed through the substrate.
5. The multi-functional semiconductor package structure of claim 1, wherein the MEMS chip is a gyroscope chip;
the metal cover and the substrate are sealed.
6. The multi-functional semiconductor package according to claim 1, wherein the MEMS chip is a temperature sensitive sensor chip, the multi-functional semiconductor package further comprising a thermally conductive cylinder;
the heat conduction column penetrates through the substrate, and one end, close to the metal cover, of the heat conduction column is located near the temperature-sensitive sensor chip.
7. A manufacturing method of a multifunctional semiconductor packaging structure is characterized by comprising the following steps:
attaching the MEMS chip to one side of the substrate;
placing a metal cover on one side of the substrate where the MEMS chip is located, wherein the metal cover is used for protecting the MEMS chip and forming a cavity for accommodating the MEMS chip;
attaching a radio frequency chip to one side of the metal cover, which is far away from the MEMS chip;
carrying out plastic package on the radio frequency chip and the metal cover to obtain a plastic package body;
and manufacturing an antenna on one side of the plastic package body, which is far away from the radio frequency chip, so as to obtain the multifunctional semiconductor packaging structure.
8. The method of claim 7, wherein the substrate comprises a sound inlet hole, the substrate being prepared by:
pressing a second substrate on one side of the first substrate;
performing laser grooving on the second base material to form a groove;
pressing a third base material on one side of the second base material far away from the first base material;
performing laser drilling on the third base material to obtain a first drilling hole and a second drilling hole, wherein the first drilling hole is communicated with the second drilling hole through the groove;
and performing a cutting process by using the cutting path determined by the central point of the first base material, the central point of the second base material and the central point of the third base material to obtain the substrate, wherein the sound inlet hole comprises the first drilling hole and the groove, or the sound inlet hole comprises the second drilling hole and the groove.
9. The method of claim 8, wherein placing a metal cap on the substrate on a side of the MEMS chip comprises:
and placing the metal cover on the side, where the MEMS chip is located, of the substrate, wherein the first drilling hole or the second drilling hole is within the range determined by the metal cover.
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