CN112542539A - Packaging and reinforcing method for high-reliability application of high-power LED - Google Patents
Packaging and reinforcing method for high-reliability application of high-power LED Download PDFInfo
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- CN112542539A CN112542539A CN201910897276.7A CN201910897276A CN112542539A CN 112542539 A CN112542539 A CN 112542539A CN 201910897276 A CN201910897276 A CN 201910897276A CN 112542539 A CN112542539 A CN 112542539A
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- Prior art keywords
- reinforcing
- led
- circumferential gap
- package
- power led
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- 230000003014 reinforcing effect Effects 0.000 title claims abstract description 65
- 238000000034 method Methods 0.000 title claims abstract description 22
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 9
- 239000003292 glue Substances 0.000 claims abstract description 48
- 239000000084 colloidal system Substances 0.000 claims abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 8
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims description 5
- 229920000647 polyepoxide Polymers 0.000 claims description 5
- 238000003756 stirring Methods 0.000 claims description 3
- 238000002360 preparation method Methods 0.000 claims 1
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 230000007613 environmental effect Effects 0.000 abstract description 2
- 239000000243 solution Substances 0.000 description 7
- 238000004026 adhesive bonding Methods 0.000 description 3
- 238000005336 cracking Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000008602 contraction Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000005491 wire drawing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a package reinforcing method for high-reliability application of a high-power LED, which comprises the following steps of S1, providing an LED package body, wherein the LED package body is provided with a substrate part, a reflector part and an LED lens part, and a circumferential gap is formed between the bottom surface of the LED lens part and the top surface of the reflector part; step S2, providing a reinforcing colloid, wherein the thermal expansion coefficient of the reinforcing colloid is the same as or similar to that of the LED packaging body; and step S3, arranging reinforcing glue points by using the reinforcing glue, wherein the reinforcing glue points are formed on the periphery of the circumferential gap, the reinforcing glue points are used for bonding the reflector part and the LED lens part together, and the length of the circumferential gap closed by the reinforcing glue points is not more than half of the total length of the circumferential gap. The invention has the beneficial effects that: the service time and the environmental tolerance of the high-power LED are improved.
Description
Technical Field
The invention relates to a packaging and reinforcing method for high-reliability application of a high-power LED.
Background
The high-power LED is a high-performance and high-quality light source device appearing in recent years, and is widely used for military and civil aviation airborne illumination systems. The reliability of the onboard lighting system has a crucial influence on the man-machine interaction, the optical signal transmission and the flight safety of the aircraft, and is highly valued by onboard equipment manufacturers. At present, most of high-power LEDs in the market cannot effectively give consideration to high-performance, high-power and high-reliability application of devices. In order to meet the product performance requirements, the selected high-power LED (without package reinforcement measures) has the problems of lens falling, light guide glue cracking and the like frequently after being subjected to a high-reliability environment tolerance test or used for a long time, and the overall reliability of the aviation airborne illumination system is seriously influenced.
At present, the equipment manufacturer generally adopts the following two packaging and reinforcing processes for reinforcing the LED:
1) and an additional cover plate part is designed, is tightly buckled and attached to the periphery of the bottom of the LED lens and is fastened on the shell through screws, so that the relative displacement of the LED lens to the X, Y, Z axis triaxial direction of the shell is limited. However, this process adds additional mechanical structure and product weight, adds additional assembly precision requirements, and the accumulated part errors and LED soldering position shifts can significantly reduce the manufacturability of the product, and can exacerbate LED failure if the screw loosens the cover plate and repeatedly collides with the LED lens when mechanical shock is generated.
2) The LED lens is simply glued and reinforced, and the lens is bonded on the device body. However, in the use process of the high-power LED, a large amount of heat energy can be released to cause volume change of each material in the LED under respective thermal expansion coefficient, the internal stress of the light guide glue in the LED can be increased by the reinforcing glue with unmatched thermal expansion coefficient, the adhesive force of the reinforcing glue can be obviously reduced, and the phenomenon that the reinforcing glue automatically falls off even after repeated use for many times can occur.
Disclosure of Invention
The invention solves the technical problem that the existing selected high-power LED frequently has lens falling and light guide glue cracking after being subjected to a high-reliability environment tolerance test or used for a long time, and provides a novel high-reliability application package reinforcing method for the high-power LED.
In order to achieve the purpose, the technical scheme of the invention is as follows: a package reinforcing method for high reliability application of high power LED comprises the following steps,
step S1, providing an LED package body, wherein the LED package body is provided with a substrate part, a reflector part and an LED lens part, the reflector part is positioned above the substrate part, the LED lens part is positioned above the reflector part, and a circumferential gap is formed between the bottom surface of the LED lens part and the top surface of the reflector part;
step S2, providing a reinforcing colloid, wherein the thermal expansion coefficient of the reinforcing colloid is the same as or similar to that of the LED packaging body; and the number of the first and second groups,
step S3, arranging reinforcing glue points by using the reinforcing glue, wherein the reinforcing glue points are formed on the periphery of the circumferential gap, the reinforcing glue points are used for bonding the reflector part and the LED lens part together, and the length of the circumferential gap closed by the reinforcing glue points is not more than half of the total length of the circumferential gap.
As a preferable scheme of the package reinforcing method for high reliability application of the high power LED, in step S2, the method for preparing the reinforcing colloid includes the following substeps,
step S21, according to the volume ratio of 4:1, measuring E-51 epoxy resin and 593 curing agent;
step S22, mixing and stirring the E-51 epoxy resin and the 593 curing agent; and the number of the first and second groups,
and step S23, standing for 30min to obtain the reinforced colloid.
As a preferable scheme of the package reinforcing method for high reliability application of the high power LED, in step S3, the number of the reinforcing glue dots is plural, and the reinforcing glue dots are uniformly arranged along the periphery of the circumferential gap. Further, the number of the reinforcing glue points is four.
As a preferable scheme of the package reinforcing method for high-reliability application of the high-power LED, in step S3, the reinforcing colloid is limited to be used within 30 min.
Compared with the prior art, the invention has the beneficial effects that: the service time and the environmental tolerance of the high-power LED are improved. The reliability in the environment with large temperature difference and large vibration quantity is obviously improved, and the original optical performance of the LED is not influenced. The process is easy to implement, the defect rate is extremely low, an additional part structure is not needed, the manufacturability of a product is not influenced, the coated reinforcing glue is extremely few, the reinforcing glue is tightly attached to a device, and the space and the weight of the product are not occupied.
Drawings
Fig. 1 is a schematic flow chart according to an embodiment of the invention.
Fig. 2 is a schematic structural diagram of an LED package body according to an embodiment of the invention.
Fig. 3 is a schematic view of the arrangement of the reinforcing gel in an embodiment of the invention.
Detailed Description
The invention will be described in further detail below with reference to specific embodiments and drawings. Here, the description of the embodiments is provided to help understanding of the present invention, but the present invention is not limited thereto. In addition, the technical features involved in the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
Referring to fig. 1, a package reinforcement method for high reliability applications of high power LEDs is shown. Comprises the following steps and is executed in sequence,
step S1, providing the LED package body 1. Referring to fig. 2, the LED package body 1 includes a substrate portion 11, a reflector portion 12 and an LED lens portion 13. The substrate portion 11 has a high-power LED thereon. The mirror portion 12 is located above the substrate portion 11. The LED lens portion 13 is located above the reflector portion 12. A circumferential gap 100 in the vertical direction is left between the bottom surface of the LED lens portion 13 and the top surface of the reflector portion 12.
In step S2, a reinforcing gel 4 is provided. The thermal expansion coefficient of the reinforcing colloid 4 is the same as or similar to that of the LED packaging body 1, so that the reinforcing colloid 4 and the LED packaging body 1 synchronously expand with heat and contract with cold, the risk caused by the expansion with heat and contraction with cold effect of the reinforcing colloid 4 in the using process is reduced, and the high-reliability application of the high-power LED is achieved. In the embodiment, the reinforced colloid 4 is prepared by respectively measuring E-51 epoxy resin and 593 curing agent by using a beaker with scales, uniformly mixing and stirring the materials according to the volume ratio of 4:1, and standing the mixed solution for 30 min. The reason is that the glue solution is viscous but has no wire drawing, the viscosity of the glue solution can ensure the glue forming after gluing, and the glue solution is prevented from flowing along the bottom circumference of the LED lens part 13 to form a sealing ring after gluing.
In step S3, please refer to fig. 3, the reinforcing glue dots 40 are arranged by using the reinforcing glue 4. The reinforcing glue dots 40 are formed on the outer circumference of the circumferential slits 100. The reinforcing adhesive dots 40 bond the reflector portion 12 and the LED lens portion 13 together. The length of the circumferential slit 100 closed by the reinforcing glue points 40 is not more than half of its total length, correspondingly, the length of the circumferential slit 100 not closed by the reinforcing glue points 40 is more than half of its total length. In this embodiment, the reinforcing glue dots 40 (generally 4 dots) are uniformly distributed around the edge of the LED lens portion 13. The glue solution can be used within 30 minutes (after time out, the viscosity of the glue solution further rises and the glue solution can not be used, and the mixed glue solution needs to be discarded and reconfigured). After the glue is coated, the glue is kept stand and cured for 24 hours at room temperature, and the defects of glue adhesion, glue pollution and the like can not be caused.
If the high-power LED is wetted before gluing and reinforcing, the processing technology is also applicable. Since the sealing length after the adhesive is cured is no more than 50% of the total length, the temperature change caused by self-heating or severe environment change during the product use is actually utilized as the repeated baking process for dehumidifying the LED, even if the temperature is gradually raised to the higher use temperature of the LED, since the reinforcing adhesive dots 40 do not completely seal the LED lens part 13 and the reflector part 12, a certain outflow gap exists, and the internal moisture can be discharged through the outflow gap. Therefore, the light guide glue in the high-power LED is only subjected to smaller thermal stress, and the cracking of the light guide glue cannot be generated.
The foregoing merely represents embodiments of the invention, which are described in some detail and detail, and therefore should not be construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (5)
1. A package reinforcing method for high reliability application of high power LED is characterized by comprising the following steps,
step S1, providing an LED package body, wherein the LED package body is provided with a substrate part, a reflector part and an LED lens part, the reflector part is positioned above the substrate part, the LED lens part is positioned above the reflector part, and a circumferential gap is reserved between the bottom surface of the LED lens part and the top surface of the reflector part;
step S2, providing a reinforcing colloid, wherein the thermal expansion coefficient of the reinforcing colloid is the same as or similar to that of the LED packaging body; and the number of the first and second groups,
step S3, arranging reinforcing glue points by using the reinforcing glue, wherein the reinforcing glue points are formed on the periphery of the circumferential gap, the reinforcing glue points are used for bonding the reflector part and the LED lens part together, and the length of the circumferential gap closed by the reinforcing glue points is not more than half of the total length of the circumferential gap.
2. The package reinforcing method for high reliability application of high power LED as claimed in claim 1, wherein in step S2, the preparation method of the reinforcing adhesive comprises the following sub-steps,
step S21, according to the volume ratio of 4:1, measuring E-51 epoxy resin and 593 curing agent;
step S22, mixing and stirring the E-51 epoxy resin and the 593 curing agent; and the number of the first and second groups,
and step S23, standing for 30min to obtain the reinforced colloid.
3. The package reinforcing method for high reliability application of high power LED according to claim 1 or 2, wherein in step S3, the number of the reinforcing glue dots is plural and is uniformly arranged along the periphery of the circumferential gap.
4. The package reinforcing method for high reliability application of high power LED according to claim 3, wherein the number of the reinforcing glue dots is four.
5. The package reinforcing method for high reliability application of high power LED according to claim 1 or 2, wherein in step S3, the reinforcing colloid is limited to be used within 30 min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910897276.7A CN112542539A (en) | 2019-09-23 | 2019-09-23 | Packaging and reinforcing method for high-reliability application of high-power LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910897276.7A CN112542539A (en) | 2019-09-23 | 2019-09-23 | Packaging and reinforcing method for high-reliability application of high-power LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112542539A true CN112542539A (en) | 2021-03-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910897276.7A Pending CN112542539A (en) | 2019-09-23 | 2019-09-23 | Packaging and reinforcing method for high-reliability application of high-power LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112542539A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101950787A (en) * | 2009-07-10 | 2011-01-19 | 夏普株式会社 | Light emitting element module and manufacturing method thereof, and backlight apparatus |
| US20120025214A1 (en) * | 2010-07-30 | 2012-02-02 | Apt Electronics Ltd. | Led packaging structure and packaging method |
| CN104102045A (en) * | 2013-04-15 | 2014-10-15 | Lg电子株式会社 | Display apparatus |
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2019
- 2019-09-23 CN CN201910897276.7A patent/CN112542539A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101950787A (en) * | 2009-07-10 | 2011-01-19 | 夏普株式会社 | Light emitting element module and manufacturing method thereof, and backlight apparatus |
| US20120025214A1 (en) * | 2010-07-30 | 2012-02-02 | Apt Electronics Ltd. | Led packaging structure and packaging method |
| CN104102045A (en) * | 2013-04-15 | 2014-10-15 | Lg电子株式会社 | Display apparatus |
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Application publication date: 20210323 |
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