CN112530876B - Integrated circuit SIP packaging structure - Google Patents
Integrated circuit SIP packaging structure Download PDFInfo
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- CN112530876B CN112530876B CN202011529158.XA CN202011529158A CN112530876B CN 112530876 B CN112530876 B CN 112530876B CN 202011529158 A CN202011529158 A CN 202011529158A CN 112530876 B CN112530876 B CN 112530876B
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- cover plate
- heat conducting
- conducting fin
- rotating shaft
- integrated circuit
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
Abstract
The invention relates to an integrated circuit SIP packaging structure, which comprises a bottom plate and an upper cover plate, wherein an upper heat conducting fin is inlaid in the upper cover plate, two side walls of the heat conducting fin, the upper wall and the rear end of the upper cover plate form a containing cavity, an integrated circuit chip can be contained, meanwhile, the heat conducting fin at the upper end at the left side protrudes outwards to form a boss, the heat conducting fin at the upper end at the right side is concaved inwards to form a groove, the splicing of the left cover plate and the right cover plate can be realized through the structure, the heat conducting fin in the left cover plate and the heat conducting fin in the right cover plate can be connected, the heat conducting fin in the whole containing cavity is integrated, in addition, the two side walls of the heat conducting fin are directly exposed in the containing cavity, the heat in the containing cavity can be conveniently absorbed, the heat dissipation efficiency is greatly improved through the integral structural design, and meanwhile, the stability of the upper cover plate is also improved.
Description
Technical Field
The invention relates to an integrated circuit SIP packaging structure, and belongs to the technical field of integrated circuit packaging.
Background
The main function of the integrated circuit package is to protect the chip from the environment and prevent the chip from contacting with the outside air. Therefore, the existing integrated circuit package basically adopts a sealed structure, and uses insulating plastic or ceramic materials to seal the integrated circuit chip, so that the structure generally has the problem of poor heat dissipation effect, and meanwhile, the package shell is sealed by adopting sealant, so that the subsequent disassembly and assembly are difficult.
Disclosure of Invention
The invention relates to an integrated circuit SIP packaging structure, which comprises a bottom plate and an upper cover plate; the upper cover plate is divided into a left cover plate and a right cover plate; the left cover plate and the right cover plate are respectively embedded with heat conducting fins; the heat conducting fin is in a precious cover shape, the heat conducting fin is embedded in the upper cover plate, and the left side and the right side of the heat conducting fin, the upper end face of the inner side of the upper cover plate and the rear end face of the inner side of the upper cover plate form a containing cavity, and the containing cavity is used for containing the integrated circuit chip; the upper part of the heat conducting fin, which is positioned at the left cover plate, is a left upper end heat conducting fin, the left upper end heat conducting fin extends along the left cover plate in the left-right direction, the left end of the left upper end heat conducting fin is level with the left end of the left cover plate, and the right end of the left upper end heat conducting fin extends out of the left cover plate to form a convex block; the upper part of the heat conducting fin, which is positioned on the right cover plate, is a right upper end heat conducting fin, the right upper end heat conducting fin extends along the right cover plate in the left-right direction, the right end of the right upper end heat conducting fin is level with the right end of the right cover plate, and the left end of the right upper end heat conducting fin is positioned in the upper wall of the right cover plate to form a groove; the left cover plate and the right cover plate are mutually matched through the convex blocks and the grooves, the left cover plate and the right cover plate are spliced to form a complete upper cover plate, the upper cover plate covers the bottom plate, the integrated circuit chip is packaged, the heat conducting fins in the left cover plate and the heat conducting fins in the right cover plate can be completely spliced, the left side wall and the right side wall of the accommodating cavity can be directly used for accommodating the heat in the accommodating cavity through the left side and the right side of the heat conducting fins, the heat is led to the outside through the left side upper end heat conducting fins and the right side upper end heat conducting fins, and the temperature reduction in the packaging structure is realized.
The upper cover plate is connected with the bottom plate through a rotating mechanism; the rotating mechanism comprises a lower rotating shaft, an upper rotating shaft, a lower connecting rod, an upper connecting rod and an intermediate rotating shaft; the lower rotating shaft is provided with four groups which are respectively fixed at the left end and the right end of the bottom plate; the upper rotating shaft is provided with four groups which are respectively fixed at the corresponding positions of the upper cover plate and the lower rotating shaft; the lower rotating shaft is rotationally connected with a lower connecting rod; the upper rotating shaft is rotationally connected with an upper connecting rod; one end of the lower connecting rod, which is far away from the lower rotating shaft, is connected with one end of the upper connecting rod, which is far away from the upper rotating shaft, through an intermediate rotating shaft; through whole slewing mechanism, realize that left apron, right apron and the rotation of bottom plate are connected.
Two ends of the bottom plate are provided with convex parts; the upper cover plate is provided with a concave part corresponding to the convex part; through the concatenation of convex part and concave part, realize the accurate location of upper cover plate and bottom plate.
The front end and the rear end of the bottom plate are provided with buckling devices; the buckling device comprises an upper lock hook and a lower lock catch; the upper lock hook is respectively fixed at the front end and the rear end of the left cover plate and the right cover plate; the lower lock catches are respectively fixed at the positions of the bottom plate corresponding to the upper lock hooks; through the lock of upper latch hook and lower hasp, realize the fixed connection of bottom plate and upper cover plate.
Pins are arranged on the front side wall and the rear side wall of the bottom plate; the pins are in communication with the integrated circuit chip.
An integrated circuit SIP packaging method includes the steps of:
s1: opening the buckling device, lifting the upper cover plate and separating the bottom plate, then separating the convex blocks from the grooves, and completely opening the packaging structure;
s2: the integrated circuit chip is arranged and connected on the bottom plate, the convex blocks are buckled with the grooves, the complete splicing of the upper cover plate is realized, the upper cover plate is arranged on the bottom plate, and the buckling device is closed, so that the packaging of the integrated circuit chip is completed.
The invention has the beneficial effects that:
1. the heat conducting fin is inlayed in the upper cover plate, two lateral walls of heat conducting fin and the upper wall and the rear end formation of upper cover plate hold the chamber, can hold integrated circuit chip, simultaneously left side upper end heat conducting fin outwards outstanding formation boss, the inwards concave recess of right side upper end heat conducting fin forms the recess, can realize the concatenation of left side apron and right side apron through this structure, and can realize the connection of heat conducting fin in left side apron and the right side apron, let whole heat conducting fin formation an organic whole in holding the chamber, in addition the both sides wall direct exposure of heat conducting fin holds the intracavity, can conveniently absorb the heat that holds the intracavity, through holistic structural design, very big improvement radiating efficiency, the stability of upper cover plate has still been improved simultaneously.
2. The upper cover plate is divided into a left cover plate and a right cover plate, and is respectively connected with the bottom plate in a rotating way through a rotating mechanism, so that the left cover plate and the right cover plate are conveniently separated and spliced, and meanwhile, enough assembly space is provided for the installation of the integrated circuit chip.
3. The upper cover plate is provided with the concave part, the bottom plate is provided with the convex part, the accurate positioning of the upper cover plate and the bottom plate can be realized, and the arrangement of the buckling device can enable the upper cover plate and the bottom plate to be more stable after being buckled, so that the reliability of encapsulation is ensured.
Drawings
FIG. 1 is a diagram of a package structure of the present invention;
FIG. 2 is a side view of a package structure of the present invention;
FIG. 3 is an opened view of the package structure of the present invention;
FIG. 4 is an open view of a package structure according to the present invention;
FIG. 5 is a right side view of the left cover plate of the present invention;
FIG. 6 is a left side view of the right cover plate of the present invention;
FIG. 7 is a cross-sectional view of the left cover plate of the present invention;
FIG. 8 is a cross-sectional view of the right cover plate of the present invention;
FIG. 9 is a left side cross-sectional view of the left cover plate of the present invention.
In the figure: 1. a bottom plate; 11. a buckling device; 111. an upper latch hook; 112. a lower lock catch; 12. a convex portion; 2. an upper cover plate; 21. a left cover plate; 22. a right cover plate; 23. a heat conductive sheet; 231. a left upper end heat conducting fin; 232. a right upper end heat conducting fin; 24. a concave portion; 25. a receiving chamber; 3. a rotating mechanism; 31. a lower rotating shaft; 32. an upper rotating shaft; 33. a lower connecting rod; 34. an upper connecting rod; 35. a middle rotating shaft; 4. a stitch; 5. an integrated circuit chip.
Detailed Description
The invention provides an integrated circuit SIP packaging structure, which comprises a bottom plate 1 and an upper cover plate 2; the upper cover plate 2 is divided into a left cover plate 21 and a right cover plate 22; the left cover plate 21 and the right cover plate 22 are respectively embedded with a heat conducting fin 23; the heat conducting fin 23 is in a precious cover shape, the heat conducting fin 23 is embedded in the upper cover plate 2, and the left side and the right side of the heat conducting fin 23, the inner upper end surface of the upper cover plate 2 and the inner rear end surface of the upper cover plate 2 form a containing cavity 25, and the containing cavity 25 is used for containing the integrated circuit chip 5; the heat conducting fin 23 is located at the upper part of the left cover plate 21 and is a left upper end heat conducting fin 231, the left upper end heat conducting fin 231 extends along the left cover plate 21 in the left-right direction, the left end of the left upper end heat conducting fin 231 is level with the left end of the left cover plate 21, and the right end of the left upper end heat conducting fin 231 extends out of the left cover plate 21 to form a protruding block; the upper part of the heat conducting fin 23, which is positioned on the right cover plate 22, is a right upper end heat conducting fin 232, the right upper end heat conducting fin 232 extends along the right cover plate 22 in the left-right direction, the right end of the right upper end heat conducting fin 232 is flush with the right end of the right cover plate 22, and the left end of the right upper end heat conducting fin 232 is positioned in the upper wall of the right cover plate 22 to form a groove; the splicing of the left cover plate 21 and the right cover plate 22 is realized through the mutual matching of the convex blocks and the grooves to form the complete upper cover plate 2, the upper cover plate 2 is covered on the bottom plate 1 to realize the packaging of the integrated circuit chip 5, the heat conducting fins 23 in the left cover plate 21 and the heat conducting fins 23 in the right cover plate 22 can be completely spliced, the left side wall and the right side wall of the containing cavity 25 are directly arranged on the left side and the right side of the heat conducting fins 23, the heat in the containing cavity 25 can be fully absorbed, and the heat is led to the outside through the left upper end heat conducting fins 231 and the right upper end heat conducting fins 232, so that the temperature reduction in the packaging structure is realized. The thermally conductive sheet may be composed of a ceramic material.
The upper cover plate 2 is connected with the bottom plate 1 through a rotating mechanism 3; the rotating mechanism 3 comprises a lower rotating shaft 31, an upper rotating shaft 32, a lower connecting rod 33, an upper connecting rod 34 and an intermediate rotating shaft 35; the lower rotating shaft 31 is provided with four groups which are respectively fixed at the left end and the right end of the bottom plate 1; the upper rotating shaft 32 is provided with four groups which are respectively fixed at the corresponding positions of the upper cover plate 2 and the lower rotating shaft 31; the lower rotating shaft 31 is rotatably connected with a lower connecting rod 33; the upper rotating shaft 32 is rotatably connected with an upper connecting rod 34; one end of the lower connecting rod 33, which is far away from the lower rotating shaft 31, is connected with one end of the upper connecting rod 34, which is far away from the upper rotating shaft 32, through an intermediate rotating shaft 35; the left cover plate 21 and the right cover plate 22 are rotatably connected with the bottom plate 1 through the whole rotating mechanism 3.
Two ends of the bottom plate 1 are provided with convex parts 12; the upper cover plate 2 is provided with a concave part 24 corresponding to the convex part 12; by splicing the convex part 12 and the concave part 24, the accurate positioning of the upper cover plate 2 and the bottom plate 1 is realized.
The front end and the rear end of the bottom plate 1 are provided with buckling devices 11; the buckling device 11 comprises an upper lock hook 111 and a lower lock catch 112; the upper latch hook 111 is fixed to the front and rear ends of the left and right cover plates 21 and 22, respectively; the lower lock catches 112 are respectively fixed at positions of the bottom plate 1 corresponding to the upper lock hooks 111; the bottom plate 1 and the upper cover plate 2 are fixedly connected through the buckling of the upper lock hook 111 and the lower lock catch 112.
The front and rear side walls of the bottom plate 1 are provided with pins 4; the pins 4 communicate with the integrated circuit chip 5.
An integrated circuit SIP packaging method includes the steps of:
s1: opening the buckling device 11, lifting the upper cover plate 2 to be separated from the bottom plate 1, and then separating the convex blocks from the grooves to completely open the packaging structure;
s2: the integrated circuit chip 5 is arranged and connected on the bottom plate 1, the convex blocks are buckled with the grooves to realize the complete splicing of the upper cover plate 2, and the upper cover plate 2 is arranged on the bottom plate 1 to close the buckling device 11, thus completing the encapsulation of the integrated circuit chip
According to the invention, the heat conducting fins 23 are embedded in the upper cover plate 2, the two side walls of the heat conducting fins 23, the upper wall and the rear end of the upper cover plate 2 form the accommodating cavity 25, the integrated circuit chip 5 can be accommodated, meanwhile, the left upper end heat conducting fin 231 protrudes outwards to form a boss, the right upper end heat conducting fin 232 is concaved inwards to form a groove, the splicing of the left cover plate 21 and the right cover plate 22 can be realized through the structure, the connection of the heat conducting fins in the left cover plate 21 and the right cover plate 22 can be realized, the heat conducting fins in the whole accommodating cavity 25 are integrated, and in addition, the two side walls of the heat conducting fins 23 are directly exposed in the accommodating cavity 25, so that the heat in the accommodating cavity 25 can be conveniently absorbed.
The upper cover plate 2 is divided into a left cover plate 21 and a right cover plate 22, and is respectively connected with the bottom plate 1 in a rotating way through the rotating mechanism 3, so that the left cover plate 21 and the right cover plate 22 are conveniently separated and spliced, and meanwhile, enough assembly space is provided for the installation of the integrated circuit chip 5.
The upper cover plate 2 is provided with the concave part 24, the bottom plate 1 is provided with the convex part 12, the accurate positioning of the upper cover plate 2 and the bottom plate 1 can be realized through the splicing of the concave part 24 and the convex part 12, and the arrangement of the buckling device 11 can enable the upper cover plate 2 and the bottom plate 1 to be more stable after buckling, so that the reliability of encapsulation is ensured.
Claims (5)
1. An integrated circuit SIP package structure, characterized in that:
comprises a bottom plate (1) and an upper cover plate (2);
the upper cover plate (2) is divided into a left cover plate (21) and a right cover plate (22);
the left cover plate (21) and the right cover plate (22) are respectively embedded with a heat conducting sheet (23);
the heat conducting fin (23) is in a precious cover shape, the heat conducting fin (23) is embedded in the upper cover plate (2), the left side and the right side of the heat conducting fin (23) and the inner upper end face of the upper cover plate (2) and the inner rear end face of the upper cover plate (2) form a containing cavity (25), and the containing cavity (25) is used for containing the integrated circuit chip (5);
the heat conducting fin (23) is positioned at the upper part of the left cover plate (21) and is a left upper end heat conducting fin (231), the left upper end heat conducting fin (231) extends along the left cover plate (21) in the left-right direction, the left end of the left upper end heat conducting fin (231) is level with the left end of the left cover plate (21), and a lug is formed at the position, extending out of the left cover plate (21), of the right end of the left upper end heat conducting fin (231);
the upper part of the heat conducting fin (23) positioned on the right cover plate (22) is a right upper end heat conducting fin (232), the right upper end heat conducting fin (232) extends along the right cover plate (22) in the left-right direction, the right end of the right upper end heat conducting fin (232) is flush with the right end of the right cover plate (22), and the left end of the right upper end heat conducting fin (232) is positioned in the upper wall of the right cover plate (22) to form a groove;
the integrated circuit chip (5) is packaged by the upper cover plate (2) covered on the bottom plate (1), the heat conducting fins (23) in the left cover plate (21) and the heat conducting fins (23) in the right cover plate (22) can be completely spliced, the left side and the right side of the heat conducting fins (23) are directly the left side wall and the right side wall of the containing cavity (25), heat in the containing cavity (25) can be fully absorbed, and the heat is led to the outside through the left upper end heat conducting fins (231) and the right upper end heat conducting fins (232), so that the temperature in the packaging structure is reduced.
2. An integrated circuit SIP package structure according to claim 1, wherein:
the upper cover plate (2) is connected with the bottom plate (1) through a rotating mechanism (3);
the rotating mechanism (3) comprises a lower rotating shaft (31), an upper rotating shaft (32), a lower connecting rod (33), an upper connecting rod (34) and an intermediate rotating shaft (35);
the lower rotating shaft (31) is provided with four groups which are respectively fixed at the left end and the right end of the bottom plate (1);
the upper rotating shaft (32) is provided with four groups which are respectively fixed at the corresponding positions of the upper cover plate (2) and the lower rotating shaft (31);
the lower rotating shaft (31) is rotatably connected with a lower connecting rod (33);
the upper rotating shaft (32) is rotatably connected with an upper connecting rod (34);
one end of the lower connecting rod (33) far away from the lower rotating shaft (31) is connected with one end of the upper connecting rod (34) far away from the upper rotating shaft (32) through an intermediate rotating shaft (35);
through the whole rotating mechanism (3), the rotating connection of the left cover plate (21), the right cover plate (22) and the bottom plate (1) is realized.
3. An integrated circuit SIP package structure according to claim 1, wherein:
two ends of the bottom plate (1) are provided with convex parts (12);
a concave part (24) is arranged at the position of the upper cover plate (2) corresponding to the convex part (12);
by splicing the convex part (12) and the concave part (24), the accurate positioning of the upper cover plate (2) and the bottom plate (1) is realized.
4. An integrated circuit SIP package structure according to claim 1, wherein:
the front end and the rear end of the bottom plate (1) are provided with buckling devices (11);
the buckling device (11) comprises an upper lock hook (111) and a lower lock catch (112);
the upper lock hook (111) is respectively fixed at the front end and the rear end of the left cover plate (21) and the right cover plate (22);
the lower lock catches (112) are respectively fixed at positions corresponding to the bottom plate (1) and the upper lock hooks (111);
the bottom plate (1) and the upper cover plate (2) are fixedly connected through the buckling of the upper lock hook (111) and the lower lock catch (112).
5. An integrated circuit SIP package structure according to claim 1, wherein:
pins (4) are arranged on the front side wall and the rear side wall of the bottom plate (1);
the pins (4) are in communication with the integrated circuit chip (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011529158.XA CN112530876B (en) | 2020-12-22 | 2020-12-22 | Integrated circuit SIP packaging structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011529158.XA CN112530876B (en) | 2020-12-22 | 2020-12-22 | Integrated circuit SIP packaging structure |
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| CN112530876A CN112530876A (en) | 2021-03-19 |
| CN112530876B true CN112530876B (en) | 2023-05-09 |
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| CN113394169B (en) * | 2021-06-18 | 2022-07-22 | 汕头市骅芯电子科技有限公司 | Cover plate for integrated circuit packaging |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106298702A (en) * | 2016-08-22 | 2017-01-04 | 王文庆 | A kind of heat dissipation type integrated antenna package of optimization |
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| JP3416450B2 (en) * | 1997-03-21 | 2003-06-16 | 三菱電機株式会社 | Power transistor module mounting structure |
| US20020134543A1 (en) * | 2001-03-20 | 2002-09-26 | Motorola, Inc | Connecting device with local heating element and method for using same |
| JP6445100B1 (en) * | 2017-07-06 | 2018-12-26 | 株式会社フジクラ | Optical module and manufacturing method thereof |
| US11029475B2 (en) * | 2019-04-08 | 2021-06-08 | Cisco Technology, Inc. | Frame lid for in-package optics |
| CN210628294U (en) * | 2019-12-10 | 2020-05-26 | 深圳市旭锦科技有限公司 | High-performance chip |
| CN212161788U (en) * | 2020-07-27 | 2020-12-15 | 上海北芯集成电路技术有限公司 | Small-size packaging structure for chip |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106298702A (en) * | 2016-08-22 | 2017-01-04 | 王文庆 | A kind of heat dissipation type integrated antenna package of optimization |
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