CN112525064A - Self-contained medium-temperature strain gauge for semi-cured adhesive layer and use method thereof - Google Patents
Self-contained medium-temperature strain gauge for semi-cured adhesive layer and use method thereof Download PDFInfo
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- CN112525064A CN112525064A CN202011283398.6A CN202011283398A CN112525064A CN 112525064 A CN112525064 A CN 112525064A CN 202011283398 A CN202011283398 A CN 202011283398A CN 112525064 A CN112525064 A CN 112525064A
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- 238000000034 method Methods 0.000 title claims abstract description 28
- 239000012790 adhesive layer Substances 0.000 title claims description 64
- 239000003292 glue Substances 0.000 claims abstract description 80
- 229920001971 elastomer Polymers 0.000 claims abstract description 23
- 239000000806 elastomer Substances 0.000 claims abstract description 23
- 238000010438 heat treatment Methods 0.000 claims abstract description 17
- 239000010410 layer Substances 0.000 claims description 80
- 239000000853 adhesive Substances 0.000 claims description 41
- 230000001070 adhesive effect Effects 0.000 claims description 41
- 239000000758 substrate Substances 0.000 claims description 29
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 24
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 claims description 20
- 239000007787 solid Substances 0.000 claims description 19
- 238000004026 adhesive bonding Methods 0.000 claims description 16
- 239000002904 solvent Substances 0.000 claims description 16
- 238000001035 drying Methods 0.000 claims description 11
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 239000002390 adhesive tape Substances 0.000 claims description 6
- 238000004140 cleaning Methods 0.000 claims description 4
- 238000007711 solidification Methods 0.000 claims description 2
- 230000008023 solidification Effects 0.000 claims description 2
- 238000003892 spreading Methods 0.000 claims 2
- 238000001723 curing Methods 0.000 description 30
- 239000003822 epoxy resin Substances 0.000 description 22
- 229920000647 polyepoxide Polymers 0.000 description 22
- 229920001187 thermosetting polymer Polymers 0.000 description 12
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 10
- 239000003795 chemical substances by application Substances 0.000 description 8
- 229920001721 polyimide Polymers 0.000 description 8
- 239000012528 membrane Substances 0.000 description 7
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 4
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 4
- 238000000354 decomposition reaction Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000005488 sandblasting Methods 0.000 description 3
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 2
- 229910015900 BF3 Inorganic materials 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 238000007605 air drying Methods 0.000 description 2
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- AVGTYNJIWPQPIH-UHFFFAOYSA-N hexan-1-amine;trifluoroborane Chemical compound FB(F)F.CCCCCCN AVGTYNJIWPQPIH-UHFFFAOYSA-N 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- BMVXCPBXGZKUPN-UHFFFAOYSA-N 1-hexanamine Chemical compound CCCCCCN BMVXCPBXGZKUPN-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/16—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/50—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like
- B29C65/5057—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like positioned between the surfaces to be joined
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Abstract
The invention provides a self-contained medium-temperature semi-cured glue layer strain gauge and a use method thereof, wherein the self-contained medium-temperature semi-cured glue layer strain gauge comprises a strain gauge body and a semi-cured glue layer unit, wherein the semi-cured glue layer unit is coated on one side, which is attached to an elastomer, of the strain gauge body to form the self-contained medium-temperature semi-cured glue layer strain gauge; simple structure, convenient operation reduces the paster flow, has improved the paster quality, reduces pressurization, heating curing mode curing time.
Description
Technical Field
The invention relates to the technical field of strain gauges, in particular to a strain gauge with a medium-temperature semi-cured adhesive layer and a using method thereof.
Background
At present, the mounting modes of the resistance strain gauge are a sticking type and a non-sticking type, and an adhesive used by the sticking type strain gauge needs to have the characteristics of high viscosity, large insulation resistance, small creep, small hysteresis and convenience in sticking. The currently used adhesive curing modes are mainly finger pressing and pressurization and heating curing. Wherein the creep and the hysteresis performance of the pressure-indicating and normal-temperature curing are poor; the conditions of pressurization and heating curing are too high, and the pressurization process is long.
The conventional resistance strain gauge is generally pasted with a bi-component epoxy resin adhesive, the two components are mixed when the bi-component adhesive is used, the mixing uniformity cannot be ensured, and the service life of the mixed adhesive is greatly reduced. The current mounting mode of the resistance strain gauge is as follows: the method comprises the steps of patching and curing, wherein the patching needs to firstly carry out sand blasting and cleaning treatment on the position of the elastomer patching, the humidity is guaranteed to be less than or equal to 50% in a purification room, an operator uses a hairbrush to dip in a trace amount of thermosetting epoxy resin adhesive and coats the thermosetting epoxy resin adhesive on the position of the patching, the hairbrush is used to coat the adhesive layer as uniformly as possible, the strain gauge is placed above the adhesive layer, the excess adhesive is pressed and extruded, and then the curing treatment is carried out. The current resistance strain gauge mounting process is complex in operation and more in manual operation, manual brush gluing is utilized in the mounting process, the process is manually controlled, the thickness of a glue layer cannot be guaranteed, the uniformity of the glue layer cannot be controlled, and after solidification, a glue overflow phenomenon occurs, as shown in fig. 4, the process is a use flow chart of a conventional strain gauge mounting.
Disclosure of Invention
The invention provides a self-contained medium-temperature semi-cured adhesive layer strain gauge and a using method thereof, aiming at the problems that in the prior art, the adhesive layer thickness cannot be ensured, the adhesive layer uniformity cannot be controlled and the adhesive overflow occurs after curing because the adhesive needs to be manually brushed in the adhesive bonding process of a resistance strain gauge, the structure is simple, the operation is convenient, the adhesive bonding process is reduced, the adhesive bonding quality is improved, and the curing time of a pressurizing and heating curing mode is shortened.
The invention is realized by the following technical scheme:
the utility model provides a from area medium temperature semi-solid glue layer strainometer, includes strainometer body and semi-solid glue layer unit, and the setting is paintd at one side of the elastomer that the strainometer body was laminated to semi-solid glue layer unit, forms from area medium temperature semi-solid glue layer strainometer.
Preferably, the strain gauge body comprises a substrate, a sensitive grid and a cover layer; the cover layer is arranged on the substrate; the sensitive grid is laid between the substrate and the cover layer.
Furthermore, the smearing range of the semi-solidified glue layer unit is arranged corresponding to one side of the elastomer attached to the substrate.
Preferably, still include from the type membrane, set up on semi-solid glue layer unit is attached to from the type membrane, and correspond the setting with the shape of the one side of the elastomer of laminating of strainometer body from the shape of type membrane.
The application method of the strain gauge with the medium-temperature semi-cured adhesive layer is based on the strain gauge with the medium-temperature semi-cured adhesive layer, the position of an elastomer patch is subjected to texturing treatment and cleaning, the strain gauge with the semi-cured adhesive layer is placed in the patch area of an elastomer, the patch area is fixed by using a high-temperature adhesive tape, and the strain gauge is pressurized and heated to finish curing.
Preferably, a centrifugal rotary gluing mode is adopted for coating a semi-solid glue layer unit on one side of the strain gauge body, an adhesive is coated on one side of the elastic piece attached to the resistance strain gauge body, the thickness of the glue layer is controlled by controlling the viscosity of the adhesive and the glue homogenizing rotating speed, the strain gauge body coated with the semi-solid glue layer unit is placed in an oven for pre-drying, a glue layer solvent is volatilized, a semi-solid glue layer is formed, and the pre-drying temperature is 70-120 ℃.
Preferably, the applied pressure range is 0.3-0.5 Mpa; the heating temperature range is 120-180 ℃.
Based on the strain gauge with the medium-temperature semi-solidified glue layer, a certain amount of butanone or diacetone alcohol is sprayed on a roughened area of an elastomer, the strain gauge with the medium-temperature semi-solidified glue layer is placed on a butanone or diacetone alcohol solvent, so that the semi-solidified glue layer is slightly soluble, a patch is aligned, and then pressurization and heating are carried out to complete curing.
Preferably, a centrifugal rotary gluing mode is adopted for coating a semi-solid glue layer unit on one side of the strain gauge body, an adhesive is coated on one side of the elastic piece attached to the resistance strain gauge body, the thickness of the glue layer is controlled by controlling the viscosity of the adhesive and the glue homogenizing rotating speed, the strain gauge body coated with the semi-solid glue layer unit is placed in an oven for pre-drying, a glue layer solvent is volatilized, a semi-solid glue layer is formed, and the pre-drying temperature is 70-120 ℃.
Preferably, the applied pressure range is 0.3-0.5 Mpa; the heating temperature range is 120-180 ℃.
Compared with the prior art, the invention has the following beneficial technical effects:
the invention provides a self-contained medium-temperature semi-cured glue layer strain gauge, which is characterized in that a semi-cured glue layer unit is coated on one side, which is attached to an elastic body, of a strain gauge body, so that the strain gauge body is provided with a patch, the patch attaching process is reduced, and the curing time of a pressurizing and heating curing mode is shortened.
Furthermore, the cover layer cover in the strain gauge body is arranged on the substrate, and the sensitive grid is arranged between the substrate and the cover layer, so that the measurement efficiency is effectively improved.
Furthermore, the smearing range of the semi-solidified glue layer unit is set to correspond to one side of the elastic body, which is attached to the substrate, and the semi-solidified glue layer unit is smeared on the whole surface of one side, which is attached to the substrate, of the elastic body, so that the adhesion of the strain gauge on the elastic body is effectively enhanced.
Further, still including from the type membrane, set up on the semi-solid glue layer unit from the type membrane is attached, and correspond the setting with the shape of the one side of the elastomer that the strainometer body laminated from the shape of type membrane for from the type membrane with semi-solid glue layer unit whole cover, for avoiding semi-solid glue layer unit to air-dry, play the guard action to semi-solid glue layer unit.
A method for using a self-contained medium-temperature strain gauge with a semi-solidified glue layer is characterized in that the self-contained medium-temperature strain gauge with the semi-solidified glue layer is fixed on a patch area of an elastic body through a high-temperature adhesive tape, the self-contained medium-temperature strain gauge with the semi-solidified glue layer is fixed, the semi-solidified glue layer has viscosity through high temperature, thickness uniformity is guaranteed, and creep and return-to-zero characteristics of a sensor can be improved; and the strain gauge with the medium-temperature semi-cured adhesive layer saves the steps of gluing and removing excessive glue during pasting, improves the efficiency and is convenient for automation.
Furthermore, a centrifugal rotary gluing mode is adopted for coating a semi-solidified glue layer unit on one side of the strain gauge body, and the thickness of the glue layer is controlled by controlling the viscosity of the adhesive and the glue homogenizing rotating speed.
Furthermore, the applied pressure range is 0.3-0.5 Mpa, which is beneficial to the diffusion of the adhesive and the close contact with the adhered object; the heating temperature range is 120-180 ℃, so that the epoxy resin is fully cured.
A method for using a self-contained medium-temperature semi-solidified glue layer strain gauge comprises the steps of spraying butanone or diacetone alcohol on a roughened area of an elastic body, and placing the self-contained medium-temperature semi-solidified glue layer strain gauge on butanone or diacetone alcohol solvent, so that the semi-solidified glue layer has viscosity, the thickness uniformity is ensured, and the creep and return-to-zero characteristics of a sensor can be improved; and the strain gauge with the medium-temperature semi-cured adhesive layer saves the steps of gluing and removing excessive glue during pasting, improves the efficiency and is convenient for automation.
Furthermore, a centrifugal rotary gluing mode is adopted for coating a semi-solidified glue layer unit on one side of the strain gauge body, and the thickness of the glue layer is controlled by controlling the viscosity of the adhesive and the glue homogenizing rotating speed.
Furthermore, the applied pressure range is 0.3-0.5 Mpa, which is beneficial to the diffusion of the adhesive and the close contact with the adhered object; the heating temperature range is 120-180 ℃, so that the epoxy resin is fully cured.
Drawings
FIG. 1 is a front view of a strain gauge with a medium-temperature semi-cured adhesive layer according to the present invention;
FIG. 2 is a side view of a strain gauge with a medium temperature prepreg layer according to the present invention;
FIG. 3 is a schematic structural view of the strain gauge with a medium temperature semi-cured adhesive layer of the present invention after the cover layer is peeled off;
FIG. 4 is a flow chart illustrating the use of a conventional strain gage patch in the prior art;
FIG. 5 is a flow chart of the strain gauge with a medium-temperature semi-cured adhesive layer in the invention;
FIG. 6 is a curve diagram of a strain gauge with a medium-temperature semi-cured adhesive layer according to an embodiment of the present invention, wherein the curve diagram is obtained by applying pressure and heat curing at 135-145 ℃ for 2 hours;
FIG. 7 is a curve diagram of a strain gauge with a medium-temperature semi-cured adhesive layer under 175-190 ℃ for 3 hours according to an embodiment of the present invention;
FIG. 8 is a TGA test graph of a self-contained medium temperature prepreg strain gauge with a decomposition temperature of 386.91 ℃ in an example of the invention;
fig. 9 is a TGA test graph of a self-contained medium temperature prepreg strain gauge with a decomposition temperature of 414.45 ℃ in an example of the invention.
In the figure: 1-a release film; 2-semi-solidified glue layer unit; 3-a substrate; 4-a sensitive grid; 5-a cover layer.
Detailed Description
The present invention will now be described in further detail with reference to specific examples, which are intended to be illustrative, but not limiting, of the invention.
The invention provides a self-contained medium-temperature semi-cured adhesive layer strain gauge, as shown in fig. 1, fig. 2 and fig. 3, a strain gauge body and a semi-cured adhesive layer unit 2, wherein the semi-cured adhesive layer unit 2 is coated on one side, which is attached to an elastic body, of the strain gauge body to form the self-contained medium-temperature semi-cured adhesive layer strain gauge; the strain gauge body comprises a substrate 3, a sensitive grid 4 and a cover layer 5; a cover layer 5 is arranged on the substrate 3; the sensitive grid 4 is arranged between the substrate 3 and the cover layer 5, so that the measurement efficiency is effectively improved. The smearing range of the semi-solidified glue layer unit 2 is set to correspond to one side of the elastomer attached to the substrate 3, and the semi-solidified glue layer unit 2 is smeared on the whole surface of one side of the substrate 3 attached to the elastomer, so that the adhesion of the strain gauge on the elastomer is effectively enhanced.
The self-contained medium-temperature semi-cured adhesive layer strain gauge further comprises a release film 1, the release film 1 is attached to the semi-cured adhesive layer unit 2, and the shape of the release film 1 corresponds to that of one side, attached with an elastomer, of the strain gauge body, so that the release film 1 covers the semi-cured adhesive layer unit 2 integrally, and the semi-cured adhesive layer unit 2 is protected from air drying in order to avoid air drying of the semi-cured adhesive layer unit 2.
The substrate 3 is made of a film material or a gum base, wherein the film material is a polyimide film, a polyether-ether-ketone film or a polyphenylene sulfide film; the gum base adopts phenolic resin or epoxy resin. The semi-cured glue layer unit 2 adopts an annular resin adhesive; the release film 1 is made of high molecular engineering plastic films such as polytetrafluoroethylene films, polyimide films and the like.
According to the illustration in fig. 5, the strain gauge with the medium-temperature semi-cured adhesive layer can be mounted in several ways, wherein one of the using methods of the strain gauge with the medium-temperature semi-cured adhesive layer is to perform texturing processing and cleaning on the position where the elastomer is mounted, place the strain gauge with the medium-temperature semi-cured adhesive layer in the mounting area of the elastomer, fix the strain gauge with a high-temperature adhesive tape, and perform pressurization and heating to complete curing;
the other usage method of the strain gauge with the medium-temperature semi-solidified glue layer comprises the steps of spraying a certain amount of butanone or diacetone alcohol on a roughened area of the elastomer, placing the strain gauge with the medium-temperature semi-solidified glue layer on butanone or diacetone alcohol solvent to slightly dissolve the semi-solidified glue layer, aligning a patch, pressurizing and heating to finish curing.
The method comprises the following steps of coating a semi-cured adhesive layer unit 2 on one side of a strain gauge body in a centrifugal rotary gluing mode, coating an adhesive on one side of an elastic part attached to the resistance strain gauge body, controlling the thickness of the adhesive layer by controlling the viscosity and the glue-homogenizing rotating speed of the adhesive, and placing the strain gauge body coated with the semi-cured adhesive layer unit 2 in a drying oven for pre-drying to volatilize a solvent of the adhesive layer to form a semi-cured adhesive layer, wherein the pre-drying temperature is 70-120 ℃; the pressure range is 0.3-0.5 Mpa; the heating temperature range is 120-150 ℃;
the preparation method of the semi-cured adhesive layer unit 2 comprises the steps of sequentially adding a curing agent and an accelerant into epoxy resin; wherein the epoxy resin is bisphenol A epoxy resin; the curing agent adopts a latent curing agent, and the latent curing agent adopts 4, 4' -diaminodiphenyl sulfone or dicyandiamide; the accelerator adopts boron trifluoride monohexyl amine and modified imidazole; the usage amount of the curing agent is 20 to 40 percent; the usage amount of the accelerant is 5-15%.
The semi-cured adhesive layer unit 2 is a thermosetting epoxy resin adhesive to form an epoxy resin-aromatic amine curing system, boron trifluoride single hexylamine accelerator can be added into the system to reduce the curing temperature and curing time of the curing system, and the medium-temperature semi-cured adhesive layer resistance strain gauge is provided with the resistance strain gauge substrate 3 which is a special polyimide film; the medium-temperature semi-cured glue layer unit 2 is tightly attached to the strain gauge of the substrate 3 in a gluing mode and is protected by a release film 1, wherein the release film 1 can be taken down.
The preparation method of the semi-cured adhesive layer comprises the steps of preparing a medium-temperature cured epoxy resin adhesive by using bisphenol A epoxy resin as a bonding material, 4, 4' -diaminodiphenyl sulfone or dicyandiamide and other latent curing agents and using a certain amount of boron trifluoride monohexylamine as an accelerator, wherein the curing temperature is 135-190 ℃; the adhesive is coated on the substrate 3 in a rotary gluing mode, and a medium-temperature curing epoxy resin adhesive solvent is volatilized by using an oven to form a medium-temperature semi-curing adhesive layer, wherein the thickness of the adhesive layer is 3-5 microns.
Examples of the invention in methods of use:
example 1
60-65 parts of adhesive epoxy resin by mass, 10-15 parts of diaminodiphenyl sulfone serving as a curing agent by mass, 5-10 parts of boron trifluoride monohexylamine serving as an accelerator by mass, and 10-15 parts of filler by mass, wherein acetone, butanone, diacetone alcohol, xylene, ethylene glycol ethyl ether, butyl acetate, ethylene glycol butyl ether and the like can be used as solvents to prepare a thermosetting epoxy resin adhesive with the viscosity of 2.0-5.0 mps; from TGA test graph 8, the decomposition temperature is 386.91 ℃, well above its use temperature. Then, the bottom of the special polyimide film of the substrate 3 is subjected to sand blasting or laser texturing treatment, a thermosetting epoxy resin adhesive with certain viscosity is coated on the textured surface of the special polyimide film 3 in a rotary gluing mode, and is pre-dried, wherein the pre-drying parameter is 70 ℃/30 minutes, the solvent of the thermosetting epoxy resin adhesive is volatilized to form a thermosetting epoxy resin adhesive semi-cured adhesive layer unit 2, the thickness of the adhesive layer is 3 mu m-5 mu m, and the semi-cured adhesive layer is in a dry state and can be protected by a release film 1 or directly exposed. When the strain gauge is used, the resistance strain gauge forming the semi-solidified glue layer is placed on a clean elastic body and fixed by using a polyimide adhesive tape, or the strain gauge can be placed on the elastic body and pressed and positioned after being coated with butanone or acetone or alcohol or other related solvents, or the strain gauge can be heated to 70 ℃ to soften and press the semi-solidified glue on the elastic body, the strain gauge is pressed and heated and solidified according to a curve of a graph shown in figure 6, the strain gauge can be pasted at the temperature of 135-145 ℃ under the pressure of 0.3-0.5 Mpa for 2 hours, wherein the table 1 is the thickness of a semi-solidified glue layer unit 2 smeared on a substrate 3 in the self-contained medium-temperature semi-solidified glue layer strain gauge;
TABLE 1 bondline thickness of substrates
Example 2
60-65 parts of adhesive epoxy resin, 20-25 parts of diaminodiphenyl sulfone serving as a curing agent, 10-15 parts of filler and acetone, butanone, diacetone alcohol, xylene, ethylene glycol ethyl ether, butyl acetate, ethylene glycol butyl ether and the like serving as solvents are added to prepare the thermosetting epoxy resin adhesive, the viscosity is 2.0-5.0 mps, and the decomposition temperature is 414.45 ℃ and is far higher than the use temperature of the thermosetting epoxy resin adhesive according to a TGA test curve diagram 9. Then, the bottom of the special polyimide film of the substrate 3 is subjected to sand blasting or laser texturing treatment, a thermosetting epoxy resin adhesive with certain viscosity is coated on the substrate 3 in a rotary gluing mode, and is pre-dried, wherein the pre-drying parameter is 110 ℃/1 hour, the solvent of the thermosetting epoxy resin adhesive is volatilized, a thermosetting epoxy resin adhesive layer unit 2 is formed, the thickness of the adhesive layer is 3-5 mu m, the prepreg adhesive layer is in a dry state, and can be protected by a release film 1 or directly exposed. When the semi-cured elastic body is used, the resistance strain gauge forming the semi-cured adhesive layer is placed on a clean elastic body and is fixed by using a polyimide adhesive tape, or the strain gauge can be placed on the elastic body and pressed and positioned after being coated with butanone or acetone or alcohol or other related solvents, or the strain gauge can be heated to 110-120 ℃ to soften and press the semi-cured adhesive on the elastic body, and the semi-cured adhesive is pressurized, heated and cured according to a curve shown in figure 7, and can be firmly adhered at the pressure of 0.3-0.5 Mpa and the temperature of 175-190 ℃ for 3 hours; the thickness of a semi-solidified glue layer unit 2 smeared on a substrate 3 in a self-contained medium-temperature semi-solidified glue layer strain gauge is shown in table 2;
TABLE 2 bondline thickness of substrates
In order to verify the performance of the strain gauge used for the weighing sensor, the strain gauges of the two embodiments are applied to a 20kg parallel double-hole beam sensor patch, and the test results are shown in table 3, so that the strain gauge can completely meet the performance indexes of high-precision sensors of C3 grade and above.
TABLE 3 test results of parallel two-hole Beam sensor Patches
The strain gauge manufactured by the method can fully meet the requirements of various standard precision sensors, standard sensors, force sensors, stress analysis and the like.
Claims (10)
1. The utility model provides a from area medium temperature semi-solid glue layer strainometer, its characterized in that, includes strainometer body and semi-solid glue layer unit (2), semi-solid glue layer unit (2) are paintd the setting and are in the one side of the elastomer that the strainometer body was laminated, form from taking medium temperature semi-solid glue layer strainometer.
2. The strain gauge with medium temperature semi-solidified glue layer in the tape as claimed in claim 1, characterized in that the strain gauge body comprises a substrate (3), a sensitive grid (4) and a cover layer (5); the cover layer (5) is arranged on the substrate (3) in a covering manner; the sensitive grid (4) is laid between the substrate (3) and the cover layer (5).
3. The strain gauge with medium temperature prepreg according to claim 2, wherein the coating range of the prepreg layer unit (2) is arranged corresponding to one side of the substrate (3) attached with the elastomer.
4. The strain gauge with the medium-temperature semi-cured adhesive layer as claimed in claim 1, further comprising a release film (1), wherein the release film (1) is attached to the semi-cured adhesive layer unit (2), and the shape of the release film (1) corresponds to the shape of one side of the elastic body attached to the strain gauge body.
5. A use method of a strain gauge with a self-contained medium-temperature semi-solidified glue layer is based on the strain gauge with the self-contained medium-temperature semi-solidified glue layer in any one of claims 1 to 3, and is characterized in that the position of an elastomer patch is subjected to texturing treatment and cleaning, the strain gauge with the self-contained semi-solidified glue layer is placed in the patch area of an elastomer, the patch area is fixed by using a high-temperature adhesive tape, and the strain gauge is subjected to pressurization and heating to complete curing.
6. The use method of the strain gauge with the medium-temperature semi-cured adhesive layer as claimed in claim 5, wherein the semi-cured adhesive layer unit (2) is coated on one side of the strain gauge body in a centrifugal rotary gluing manner, an adhesive is coated on one side of the resistance strain gauge body, which is attached to the elastomer, the thickness of the adhesive layer is controlled by controlling the viscosity of the adhesive and the glue spreading rotation speed, the strain gauge body coated with the semi-cured adhesive layer unit (2) is placed in an oven for pre-drying, so that the solvent of the adhesive layer is volatilized, and the semi-cured adhesive layer is formed, wherein the pre-drying temperature is 70-120 ℃.
7. The use method of the strain gauge with the self-contained medium-temperature semi-cured adhesive layer according to claim 5, wherein the applied pressure is in a range of 0.3-0.5 MPa; the heating temperature range is 120-180 ℃.
8. A use method of a self-contained medium-temperature semi-solidified glue layer strain gauge is based on the self-contained medium-temperature semi-solidified glue layer strain gauge in any one of claims 1 to 3, and is characterized in that a certain amount of butanone or diacetone alcohol is sprayed on a roughened area of an elastomer, the self-contained medium-temperature semi-solidified glue layer strain gauge is placed on butanone or diacetone alcohol solvent, so that the semi-solidified glue layer is slightly soluble, the strain gauge is placed on a paster in an aligned mode, and then pressurization and heating are carried out, and solidification is completed.
9. The use method of the strain gauge with the medium-temperature semi-cured adhesive layer as claimed in claim 8, wherein the semi-cured adhesive layer unit (2) is coated on one side of the strain gauge body by centrifugal rotation glue coating, the adhesive is coated on one side of the resistance strain gauge body, which is attached to the elastomer, the adhesive layer thickness is controlled by controlling the adhesive viscosity and the glue-spreading rotation speed, and the strain gauge body coated with the semi-cured adhesive layer unit (2) is placed in an oven for pre-baking to volatilize the solvent of the adhesive layer and form the semi-cured adhesive layer, wherein the pre-baking temperature is 70-120 ℃.
10. The use method of the strain gauge with the self-contained medium-temperature semi-cured adhesive layer according to claim 8, wherein the applied pressure is in a range of 0.3-0.5 MPa; the heating temperature range is 120-180 ℃.
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Application publication date: 20210319 |