CN112518141B - Laser induced cutting method and device - Google Patents
Laser induced cutting method and device Download PDFInfo
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- CN112518141B CN112518141B CN202011331586.1A CN202011331586A CN112518141B CN 112518141 B CN112518141 B CN 112518141B CN 202011331586 A CN202011331586 A CN 202011331586A CN 112518141 B CN112518141 B CN 112518141B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Abstract
The application discloses a laser-induced cutting method and device. The laser induced cutting method comprises the following steps: acquiring thickness information of a material to be cut; determining the number of cutting layers of the material to be cut by utilizing the thickness information so as to divide the material to be cut into a plurality of layers to be cut, wherein the plurality of layers to be cut at least comprise a first layer to be cut close to the upper surface of the material to be cut and a second layer to be cut which is positioned below the first layer to be cut and is adjacent to the first layer to be cut; and controlling the laser beams to respectively carry out induction cutting on the layers to be cut, wherein the cutting sequence of the first layer to be cut is prior to the cutting sequence of the second layer to be cut. By the mode, the range of the snake-shaped cutting edge growing to the surface of the material to be cut can be reduced, and the process effect of cutting the material to be cut can be improved.
Description
Technical Field
The present application relates to the field of laser processing technologies, and in particular, to a laser-induced cutting method and apparatus.
Background
At present, the laser processing technology for brittle materials mainly focuses laser with a transmission wavelength for the brittle materials in the materials, changes the properties of the materials in the materials through the nonlinear absorption effect mainly based on multiphoton absorption to form a connection force weakening area, generates microcracks in the materials by taking the area as a starting point, and finally connects the microcracks together along with the movement direction of the laser to cause the separation of the brittle materials.
The inventor of the present application found in long-term research and development work that, when a relatively thick brittle material is cut, a connection force weakened area generated by one laser scanning and a length of a micro crack are not enough to separate the brittle material, so that a plurality of scanning at different thickness positions in the brittle material are necessary to cut the brittle material. However, the weakened area of the connecting force and the microcracks formed at different thicknesses can affect each other, which causes the problem that the surface cutting straightness of the brittle material is reduced after the brittle material is cut, and the defect of the snake-shaped cutting edge is caused.
Disclosure of Invention
The technical problem that this application mainly solved is how to narrow the scope of growing the snakelike cutting edge to the material surface that waits to cut to improve the technological effect of waiting to cut the material cutting.
In order to solve the technical problem, the application adopts a technical scheme that: a laser-induced cutting method is provided. The laser-induced cutting method comprises the following steps: acquiring thickness information of a material to be cut; determining the number of cutting layers of the material to be cut by utilizing the thickness information so as to divide the material to be cut into a plurality of layers to be cut, wherein the plurality of layers to be cut at least comprise a first layer to be cut close to the upper surface of the material to be cut and a second layer to be cut which is positioned below the first layer to be cut and is adjacent to the first layer to be cut; and controlling the laser beams to respectively carry out induction cutting on the layers to be cut, wherein the cutting sequence of the first layer to be cut is prior to the cutting sequence of the second layer to be cut.
In order to solve the technical problem, the other technical scheme adopted by the application is as follows: a laser-induced cutting apparatus is provided. This laser-induced cutting device includes: the controller is used for acquiring the thickness information of the material to be cut, determining the number of cutting layers of the material to be cut by utilizing the thickness information so as to divide the material to be cut into a plurality of layers to be cut, wherein the plurality of layers to be cut at least comprise a first layer to be cut close to the upper surface of the material to be cut and a second layer to be cut which is positioned below the first layer to be cut and is adjacent to the first layer to be cut; the laser device is connected with the controller and used for emitting laser beams under the control of the controller so as to respectively carry out induction cutting on the layers to be cut through the laser beams, wherein the cutting sequence of the first layer to be cut is prior to the cutting sequence of the second layer to be cut; the light beam regulating and controlling system is connected with the controller and is used for regulating and controlling the light beam characteristics of the laser light beams under the control of the controller; the focusing system is connected with the controller and used for focusing the laser beam regulated and controlled by the beam regulating and controlling system and projecting the focused laser beam to the material to be cut; the focusing system moves along the direction vertical to the surface of the material to be cut under the control of the controller so as to adjust the focal depth of the focused laser beam in the material to be cut and form focal spots in a plurality of layers to be cut respectively; and the laser processing platform is connected with the controller and used for moving along the direction of the preset cutting channel of the material to be cut under the control of the controller so as to form a connecting force weakening area along the direction of the preset cutting channel in the layer to be cut.
The beneficial effects of the embodiment of the application are that: the laser-induced cutting method comprises the following steps: acquiring thickness information of a material to be cut; determining the number of cutting layers of the material to be cut by utilizing the thickness information so as to divide the material to be cut into a plurality of layers to be cut, wherein the plurality of layers to be cut at least comprise a first layer to be cut close to the upper surface of the material to be cut and a second layer to be cut which is positioned below the first layer to be cut and is adjacent to the first layer to be cut; and controlling the laser beams to respectively carry out induction cutting on the layers to be cut, wherein the cutting sequence of the first layer to be cut is prior to the cutting sequence of the second layer to be cut. By the mode, the layers to be cut are determined according to the thickness of the material to be cut, the laser beams are controlled to respectively conduct induction cutting on the layers to be cut, the cutting depth of each layer to be cut can be effectively controlled, and therefore the cutting straightness of the layers to be cut can be improved, and the cutting efficiency can be improved; simultaneously, this application is cut earlier and is close to the first layer of waiting to cut material upper surface, then cuts the second layer of waiting to cut that is located the upper surface below and is adjacent with the first layer of waiting to cut, for traditional first cutting second layer of waiting to cut, the mode of cutting the first layer of waiting to cut again, can avoid cutting the second layer of waiting to cut and other cutting layers below the connection force weakening area crazing line and the accumulation of internal stress to the first layer of waiting to cut, finally cause the incision straightness accuracy after waiting to cut the material fracture not enough, produce great snakelike cutting edge defect, make the problem that waits to cut the decline of material edge strength. Therefore, the range of the snake-shaped cutting edge growing to the surface of the material to be cut can be reduced, and the process effect of cutting the material to be cut can be improved.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
FIG. 1 is a schematic flow diagram of an embodiment of a laser-induced cutting apparatus of the present application;
FIG. 2 is a schematic flow chart diagram illustrating an embodiment of a laser-induced cutting method of the present application;
FIG. 3 is a flowchart illustrating the detailed process of step S203 in the laser induced cutting method of the embodiment in FIG. 2;
FIG. 4 is a schematic flowchart illustrating a step S301 of the laser induced cutting method in the embodiment of FIG. 3;
FIG. 5 is a schematic flow chart diagram illustrating an embodiment of a laser-induced cutting method of the present application;
FIG. 6 is a cross-sectional view of a material with a thickness of 150-180 μm as laser-induced inner-cut in accordance with the present invention;
FIG. 7 is a flowchart illustrating the detailed process of step S503 in the laser induced cutting method according to the embodiment of FIG. 5;
FIG. 8 is a flowchart illustrating the detailed process of step S503 in the laser induced cutting method according to the embodiment of FIG. 5;
FIG. 9 is a schematic flow chart diagram of one embodiment of a laser-induced cutting method of the present application;
FIG. 10 is a cross-sectional view of a material with a thickness of 380-420 μm for laser-induced inner cutting according to the present application;
FIG. 11 is a schematic flow chart diagram of one embodiment of a laser-induced cutting method of the present application;
FIG. 12 is a cross-sectional view of a 580-620 μm thick material for laser-induced inner cutting according to the present invention.
Detailed Description
The present application will be described in further detail with reference to the following drawings and examples. It is to be noted that the following examples are only illustrative of the present application, and do not limit the scope of the present application. Likewise, the following examples are only some examples of the present application, not all examples, and all other examples obtained by a person of ordinary skill in the art without making any creative effort fall within the protection scope of the present application.
In the integrated circuit manufacturing technology, wafer dicing and cutting are used as the front-end process in the semiconductor technology field, and the cutting effect and yield directly affect the quality and cost of the final product. The use of large-size, thin-wafer, and other substrate materials and the development of advanced packaging technologies pose new challenges to wafer dicing processes, such as reducing chip breakage, reducing chip breakage rate, improving chip strength, and the like. The traditional diamond grinding wheel cutting process applied to chips such as memories, logic devices, micro electro mechanical systems, radio frequency identification devices and power devices is not suitable any more, and the laser internal induced cutting technology becomes an optimal scheme for solving the wafer scribing process by virtue of the advantages of small heat affected zone, no splash, small edge breakage, high efficiency and the like.
However, when a laser internal induced cutting technology is used for cutting a thick brittle material, a connection force weakening area and a microcrack formed at different thicknesses affect each other, so that the problem that the surface cutting straightness of the brittle material is reduced after the brittle material is cut is caused, and the defect of a snake-shaped cutting edge is caused.
According to the technical scheme, laser is focused into the brittle material, a layer of modified region is generated through relative displacement of the laser focus and the brittle material, so that the brittle material near the laser focus absorbs laser energy, and a connecting force weakened region is formed in the brittle material through melting, recrystallization and other processes, for example, a monocrystalline silicon material is melted and recrystallized to become polycrystalline silicon and the like.
To solve the above technical problem, the present application first provides a laser-induced cutting device, as shown in fig. 1, where fig. 1 is a schematic structural diagram of an embodiment of the laser-induced cutting device of the present application. The laser induced cutting apparatus 10 of the present embodiment includes: a controller 110, a laser 120, a beam conditioning system 130, a focusing system 140, and a laser processing platform 150; the controller 110 is configured to obtain thickness information of the material 160 to be cut, and determine the number of layers to be cut of the material 160 to be cut by using the thickness information, so as to divide the material 160 to be cut into a plurality of layers to be cut, where the plurality of layers to be cut at least include a first layer to be cut close to the upper surface of the material 160 to be cut and a second layer to be cut located below the first layer to be cut and adjacent to the first layer to be cut; the laser 120 is connected to the controller 110, and is configured to emit a laser beam under the control of the controller 110, so as to perform induced cutting on the multiple layers to be cut respectively through the laser beam, where a cutting sequence of a first layer to be cut is prior to a cutting sequence of a second layer to be cut; the beam regulating system 130 is connected to the controller 110, and is configured to regulate and control beam characteristics of the laser beam under the control of the controller 110; the focusing system 140 is configured to focus the laser beam controlled by the beam control system 130, and project the focused laser beam to the material 160 to be cut; the focusing system 140 moves in a direction perpendicular to the surface of the material to be cut 160 under the control of the controller 110 to adjust the focal depth of the focused laser beam in the material to be cut 160 and form focal spots in a plurality of layers to be cut, respectively; the laser machining platform 150 is connected to the controller 110 for moving in a preset cutting lane direction of the material to be cut 160 under the control of the controller 110 to form a connection force weakened area in the preset cutting lane direction in the layer to be cut.
Optionally, the laser induced cutting apparatus 10 of the present embodiment further includes a reflecting mirror 170 for projecting the laser beam emitted from the beam regulating system 130 to the focusing system 140.
The beam characteristics of the laser beam comprise a polarization direction, a spot size, a divergence angle, phase distribution and the like; the light beam regulation and control system 130 regulates and controls the light beam characteristics of the laser beam, such as the polarization direction, the spot size, the divergence angle, the phase distribution and the like, and can finely regulate the focal position of the laser beam; the beam modulation system 130 of the present embodiment includes a beam expander 131, an electrically controlled liquid crystal lens 132, or a spatial light modulator 133.
Specifically, the divergence angle of the laser beam can be adjusted by adjusting the distance between the beam expanders 131 to achieve fine adjustment of the focal position; or the divergence angle of the laser beam can be adjusted by adjusting the focal power of the electrically controlled liquid crystal lens 132 to achieve fine adjustment of the focal position; or the focal position may be adjusted by adjusting the wavefront phase distribution of the laser beam by the spatial light modulator 133.
The controller 110 of this embodiment may be an industrial personal computer. Of course, in other embodiments, the controller may also be a mobile terminal or the like, or the controller may also be a control chip integrated on other components, such as the laser processing platform.
The focusing system 140 of the present embodiment may be a focusing lens or a lens array.
The material 160 to be cut in this embodiment may be a brittle material such as a silicon wafer, a ceramic material, or a glass material.
Optionally, the transmittance of the laser beam in the material 160 to be cut in the embodiment is greater than 90%, so as to improve the energy of the laser beam in the material 160 to be cut, and improve the cutting efficiency and the cutting effect. The laser beams of different wavelengths may be selected according to the material of the material 160 to be cut such that the transmittance of the laser beams in the material 160 to be cut is greater than 90%. In this way, the loss of the laser beam inside the material to be cut 160 can be reduced, so that the laser light source cost can be reduced.
In an application scenario, the laser processing platform 150 is arranged on an X-Y plane, the material 160 to be cut is placed on the laser processing platform 150, and the upper surface of the material 160 to be cut is away from the laser processing platform 150; the focusing system 140 is positioned above the upper surface of the material to be cut 160 such that the laser beam emitted from the focusing system 140 is projected to the lower surface of the material to be cut 160.
In the laser induced cutting process, the controller 110 controls the focusing system 140 to move along the z-axis direction, focuses a laser beam into a layer to be cut of the material to be cut 160 close to the lower surface to form a focal spot in the layer to be cut, and controls the laser processing platform 150 to move in the X-Y plane, so that the focal spot moves along the preset cutting channel direction of the material to be cut 160, so that a connection force weakened area along the preset cutting channel direction is formed in the layer to be cut; with similar control, cutting of other layers to be cut of the material to be cut 160 can be achieved; wherein the cutting order of the first layer to be cut close to the upper surface of the material to be cut 160 is prior to the cutting order of the second layer to be cut which is located below and adjacent to the first layer to be cut.
Different from the prior art, the method determines a plurality of layers to be cut according to the thickness of the material to be cut, controls the laser to respectively perform induction cutting on the layers to be cut, can effectively control the cutting depth of each layer to be cut, and further can improve the cutting straightness of the materials to be cut and improve the cutting efficiency; simultaneously, this application is cut earlier and is close to the first layer of waiting to cut material upper surface, then the cutting is located the upper surface below and waits to cut the layer with the adjacent second of first layer of waiting to cut, for the traditional first layer of waiting to cut of cutting the second, the mode of cutting the first layer of waiting to cut again can avoid cutting the second and waiting to cut the layer and other layers of waiting to cut of below connection power weakening area crazing line microcracks and the accumulation of internal stress to the first layer of waiting to cut, finally cause the incision straightness accuracy after waiting to cut the material fracture not enough, produce great snakelike cutting edge defect, make and wait to cut the reduction of material edge strength. Therefore, the range of the snake-shaped cutting edge growing to the upper surface of the material to be cut can be reduced, and the process effect of cutting the material to be cut can be improved.
In this embodiment, except for the first layer to be cut and the second layer to be cut which are close to the material 160 to be cut, the other layers to be cut are cut in the sequence from bottom to top, that is, the cutting sequence of the layer to be cut which is close to the lower surface of the material 160 to be cut is prior to that of the other layers to be cut, so that microcracks in the weakened area of the connecting force of the other layers to be cut and the accumulation of internal stress on the layer to be cut on the lower surface of the material to be cut can be avoided, the range of the snake-shaped cutting edge which grows on the lower surface of the material to be cut can be reduced, and the process effect of cutting the material to be cut can be improved.
To solve the above technical problem, the present application further provides a laser induced cutting method, as shown in fig. 2, and fig. 2 is a schematic flow chart of an embodiment of the laser induced cutting method of the present application. The laser induced cutting method of the present embodiment may be applied to the laser induced cutting apparatus, and specifically includes the following steps:
step S201: and acquiring the thickness information of the material to be cut.
The material to be cut in this embodiment may be a brittle material such as a silicon wafer, a ceramic material, or a glass material, which is only slightly deformed by an external force (such as stretching, impact, etc.).
The thickness information of the material to be cut can be manually measured and input into the controller; or measuring the thickness information of the material to be cut through an automatic instrument and feeding the thickness information back to the controller.
The thickness information of the material to be cut in the embodiment refers to the thickness size of the material to be cut.
The cutting direction of the material to be cut is parallel to the thickness direction of the material to be cut, namely the laser beam cuts the material to be cut along the thickness direction of the material to be cut.
Step S202: the number of cutting layers of the material to be cut is determined by utilizing the thickness information so as to divide the material to be cut into a plurality of layers to be cut, wherein the plurality of layers to be cut at least comprise a first layer to be cut close to the upper surface of the material to be cut and a second layer to be cut which is positioned below the first layer to be cut and is adjacent to the first layer to be cut.
The number of cutting layers of the material to be cut is determined according to the thickness information of the material to be cut, the focal depth of the laser beam in the material to be cut during each laser cutting is determined, the material to be cut is divided into a plurality of layers to be cut, and the number of the layers to be cut is equal to the number of the cutting layers.
Alternatively, the present embodiment may implement step S202 through step S2001.
Step S2001: and determining the number of cutting layers of the material to be cut to be 1 or 2 in response to the thickness of the material to be cut being smaller than the thickness threshold value.
The controller obtains the thickness threshold value from the storage medium, compares the thickness of the material to be cut with the thickness threshold value, and determines that the number of cutting layers of the material to be cut is 1 or 2 if the thickness of the material to be cut is judged to be smaller than the thickness threshold value.
Optionally, the thickness threshold of the embodiment may be 100 μm, and when the thickness of the material to be cut is less than 100 μm, the controller determines that the number of cutting layers of the material to be cut is 1 or 2.
According to the analysis, when the laser beam is controlled to cut the material to be cut, the cutting channel to be cut is preset in the layer to be cut to form a connection force weakened area, and the preset cutting channel to be cut of the material to be cut is separated through the connection force weakened area so as to achieve induced cutting. Therefore, the number of cutting layers of the material to be cut can be finally determined according to the thickness of the material to be cut and the thickness of the connection force weakened area.
In the laser-induced cutting process, after laser cutting is completed, the material to be cut is not completely cracked, and subsequent splitting, film expanding or etching and other processes are required to be added to finally complete cutting, so that the cumulative sum of the thicker multilayer 'connecting force weakening areas' is smaller than the thickness of the material to be cut.
In an application scene, the thickness of the connecting force weakening area is 40 micrometers, and when the controller judges that the thickness of the material to be cut is smaller than 100 micrometers, the controller determines that the number of cutting layers of the material to be cut is 2.
In another application scenario, the thickness of the connection force weakening area may be larger than 40 μm, for example, 60 μm, and when the controller determines that the thickness of the material to be cut is smaller than 100 μm, the controller determines that the number of cutting layers of the material to be cut is 1.
Alternatively, the present embodiment may implement step S202 through step S2002.
Step S2002: and determining that the cutting layer number of the material to be cut is greater than or equal to (N +1) in response to the fact that the thickness of the material to be cut is greater than or equal to N times of the thickness threshold value and less than or equal to (N +1) times of the thickness threshold value, wherein N is a natural number greater than 1.
The controller determines that the number of cutting layers of the material to be cut is greater than or equal to (N +1) when the controller determines that the thickness of the material to be cut is within the range of (N × 100 μm, (N +1) × 100 μm).
The embodiment can increase or decrease the thickness of the connection force weakening area formed in the layer to be cut by the laser beam by adjusting the energy density and other properties of the laser beam in the material to be cut.
It should be noted that, when the number of cutting layers of the material to be cut is 1, the laser induced cutting device of the present application may also be used for cutting.
Step S203: and controlling the laser beams to respectively perform induction cutting on the layers to be cut, wherein the cutting sequence of the first layer to be cut is prior to the cutting sequence of the second layer to be cut.
Optionally, the transmittance of the laser beam in the material to be cut in the embodiment is greater than 90%, so as to improve the energy of the laser beam in the material to be cut, and improve the cutting efficiency and the cutting effect. The laser beams with different wavelengths can be selected according to different materials of the materials to be cut, so that the transmissivity of the laser beams in the materials to be cut is larger than 90%. By the mode, the loss of the laser beam in the material to be cut can be reduced, so that the cost of the laser light source can be reduced.
Different from the prior art, the embodiment determines a plurality of layers to be cut according to the thickness of the material to be cut, controls the laser to respectively perform induction cutting on the layers to be cut, can effectively control the cutting depth of each layer to be cut, and further can improve the incision straightness of the layers to be cut and improve the cutting efficiency; meanwhile, the first layer to be cut close to the upper surface of the material to be cut is firstly cut, then the second layer to be cut which is positioned below the upper surface and is adjacent to the first layer to be cut is cut, microcracks in a connection force weakening area and the accumulation of internal stress of the second layer to be cut and other layers to be cut below the second layer to be cut can be avoided, and finally the problem that the straightness of a cut of the material to be cut after the material to be cut is broken is not enough, a large snake-shaped cutting edge defect is generated, and the edge strength of the material to be cut is reduced is solved. Therefore, the range of the snake-shaped cutting edge growing to the upper surface of the material to be cut can be reduced, and the process effect of cutting the material to be cut can be improved.
Specifically, the present embodiment may implement step S203 by the method as shown in fig. 3. The method of the present embodiment includes steps S301 to S303.
Step S301: and controlling the laser beam to sequentially perform induction cutting on other layers to be cut in the plurality of layers to be cut from the lower surface to the upper surface of the material to be cut until the layer to be cut which is positioned below the second layer to be cut and adjacent to the second layer to be cut is cut, so as to form connecting force weakened areas in the other layers to be cut respectively.
As can be seen from the above analysis, the first layer to be cut is close to the upper surface of the material to be cut, and the second layer to be cut is located below the first layer to be cut and adjacent to the first layer to be cut, so that the step S301 can complete the cutting of the layers to be cut except for the first layer to be cut and the second layer to be cut in the material to be cut.
Specifically, the present embodiment may implement step S301 by the method as shown in fig. 4. The method of the present embodiment includes step S401 and step S402.
Step S401: and controlling a laser to emit a laser beam, adjusting the focal depth of the laser beam, and focusing the laser beam into the layer to be cut so as to form a focal spot in the layer to be cut.
The controller controls the laser to emit a laser beam and controls the focusing system to move along the z-axis direction so as to adjust the focal depth of the laser beam in the material to be cut.
Furthermore, the divergence angle of the laser beam can be adjusted by adjusting the distance between the beam expanders so as to realize fine adjustment of the focus position; or the divergence angle of the laser beam can be adjusted by adjusting the focal power of the electrically controlled liquid crystal lens so as to realize fine adjustment of the focal position; or the focal position can be adjusted by adjusting the laser beam wavefront phase distribution through the spatial light modulator.
Specifically, the controller firstly controls the focusing system to move along the z-axis direction, focuses the laser beam on the layer to be cut of the material to be cut close to the lower surface, and forms a focal spot in the layer to be cut.
Step S402: and controlling the laser beam to move to enable the focal spot to perform induced cutting on the layer to be cut along the preset cutting channel so as to form a connecting force weakened area along the preset cutting channel.
And the controller controls the laser processing platform to move in the X-Y plane so as to enable the focal spot to move along the direction of the preset cutting channel of the material to be cut, and a connecting force weakening area along the direction of the preset cutting channel is formed in the layer to be cut.
Steps S401 and S402 are executed in a cyclic manner to realize cutting of the layers to be cut other than the first layer to be cut and the second layer to be cut in the material to be cut 160 with similar control.
Step S302: and controlling the laser beam to perform induced cutting on the first layer to be cut so as to form a first connecting force weakening area.
Specifically, the controller controls the focusing system to move along the z-axis direction, so that the laser beam is focused into the first layer to be cut to form a focal spot in the first layer to be cut; the controller controls the laser processing platform to move in the X-Y plane so that the focal spot moves along the direction of a preset cutting channel of the material to be cut, and a first connecting force weakening area along the direction of the preset cutting channel is formed in the first layer to be cut.
Step S303: and controlling the laser beam to perform induced cutting on the second layer to be cut so as to form a second connecting force weakening area.
Specifically, the controller controls the focusing system to move along the z-axis direction, and focuses the laser beam into the second layer to be cut so as to form a focal spot in the second layer to be cut; the controller controls the laser processing platform to move in the X-Y plane so that the focal spot moves along the direction of the preset cutting channel of the material to be cut, and a second connecting force weakening area along the direction of the preset cutting channel is formed in the second layer to be cut.
Furthermore, in the embodiment, the layers to be cut, except for the first layer to be cut and the second layer to be cut, in the material to be cut are sequentially subjected to induced cutting from bottom to top, microcracks in the connection force weakened area and internal stress can be sequentially accumulated to the second layer to be cut from top to bottom, so that the cutting layers can be easily broken along the cutting path; meanwhile, the cutting sequence of the layer to be cut close to the lower surface of the material 160 to be cut is prior to that of other layers to be cut, so that microcracks in the weakened area of the connecting force of other layers to be cut and the accumulation of internal stress on the layer to be cut close to the lower surface of the material to be cut can be caused, the range of the snake-shaped cutting edge growing on the lower surface of the material to be cut can be reduced, and the process effect of cutting the material to be cut can be improved.
Optionally, a difference between a focal depth of the laser beam in the first layer to be cut and a focal depth of the laser beam in the second layer to be cut is a first preset value, so that the first connecting force weakening area and the second connecting force weakening area are spaced.
In order to further prevent the crack defects generated from bottom to top from accumulating on the upper surface of the material to be cut, thereby affecting the quality of the upper surface and forming a 'snake-shaped' cutting effect, the first connecting force weakened area and the second connecting force weakened area are not connected.
In an application scenario, the thickness of the connection force weakened area is 40 μm, and the first preset value may be 20-50 μm. In other application scenarios, the first preset value may be adjusted according to the thickness of the connection force weakening area.
Optionally, the difference of the focal depths of the laser beams in the adjacent two of the other layers to be cut is a second preset difference, so that the connection force weakened areas in the adjacent two of the other layers to be cut are connected, wherein the second preset difference is smaller than the first preset difference.
The connection of the connection force weakening areas in other layers to be cut can increase the accumulation of microcracks and internal stress in the connection force weakening areas.
The present application further proposes another embodiment of a laser induced cutting method, as shown in fig. 5. The method of the embodiment can realize the induced cutting of the material to be cut as shown in FIG. 6, and the thickness of the material to be cut is 150-180 μm. The method of the embodiment comprises the following steps:
step S501: and acquiring the thickness information of the material to be cut.
Step S501 is similar to step S201 described above, and is not described here.
Step S502: and responding to the thickness of the material to be cut being 150-180 mu m, and determining the number of cutting layers of the material to be cut to be 3, wherein the plurality of layers to be cut comprise a first layer to be cut, a second layer to be cut and a third layer to be cut close to the lower surface.
The controller responds to the fact that the thickness of the material to be cut is 150-180 mu m, the number of the cutting layers of the material to be cut is determined to be 3, and the material to be cut is divided into a first layer to be cut 1, a second layer to be cut 2 and a third layer to be cut 3.
The multiple layers to be cut are not connected with each other, so that the cutting depth of the materials to be cut is not too deep, and the straightness of the cutting line can be improved.
Step S503: and controlling the laser beam to sequentially perform induced cutting on the third layer to be cut 3, the first layer to be cut 1 and the second layer to be cut 2.
The controller controls the laser beam to sequentially carry out induction cutting on the third layer to be cut 3, the first layer to be cut 1 and the second layer to be cut 2. The induced cutting method for each layer to be cut is similar to the above embodiments, and is not repeated here.
According to the method, for the material to be cut with the thickness of 150-180 micrometers, three layers of connection force weakened areas are processed in the material to be cut by utilizing laser, the connection force weakened areas are formed at the bottom of the material to be cut by first processing, microcracks in the material to be cut expand to the lower surface of the material to be cut, and the lower surface is good in straightness; the second processing is carried out on the top of the material to be cut, so that the microcracks are expanded to the surface of the material to be cut, and the good straightness of the upper surface is realized; processing the middle part of the material to be cut for the third time, wherein the distance between the focal position and the focal position of the second time is 20-50 mu m, so that microcracks in the material to be cut are connected; and finally, completely separating the materials to be cut by modes of film expanding and the like.
The induction cutting method can realize the induction cutting of the material to be cut with the thickness of 150-180 mu m, the first layer to be cut 1 close to the upper surface of the material to be cut is firstly cut, then the second layer to be cut 2 which is positioned below the upper surface and is adjacent to the first layer to be cut 1 is cut, the accumulation of microcracks in a connecting force weakening area and internal stress generated when the second layer to be cut 2 is cut to the first layer to be cut 1 can be avoided, and the range of the snake-shaped cutting edge growing to the upper surface of the material to be cut can be reduced; and the third layer 3 to be cut is cut firstly, and then the second layer 2 to be cut is cut, so that microcracks in a connection force weakened area and the accumulation of internal stress generated when the second layer 2 to be cut is cut to the third layer 3 to be cut can be avoided, and the range of the snake-shaped cutting edge growing to the lower surface of the material to be cut can be reduced. Therefore, the process effect of cutting the material to be cut can be improved.
Alternatively, the present embodiment may implement step S503 by the method shown in fig. 7. The method of the present embodiment includes step S701 and step S702.
Step S701: and controlling a laser to emit laser beams, adjusting the focal depth of the laser beams, and focusing the laser beams into the first layer to be cut.
For a specific adjustment method, reference may be made to the above embodiments, which are not described herein.
Step S702: modulating the laser beam, and elongating the focal point of the laser beam to form a first elliptical focal spot in the first layer to be cut, wherein the long axis of the first elliptical focal spot is along the preset cutting track direction.
In the embodiment, in the processing process of the first layer to be cut 1, the light beam regulation and control system elongates the focal length to 20-50 μm for processing, so that the connection force weakened area of the first layer to be cut 1 forms long and straight focal distribution, thereby improving the straightness of internal microcracks and reducing the snake-shaped defects on the upper surface of the material to be cut.
The control method of the focus in this embodiment may include: 1) forming a Bessel beam by adding an axicon to the beam steering system to finally elongate the focal length; 2) the focal length is changed by adding an electrically controlled liquid crystal lens in a light beam regulation and control system and modulating focal power at different positions in the lens; 3) the focal length can be changed by adding a spatial light modulator in the light beam regulation system and changing the wave front phase distribution of the laser.
Alternatively, this embodiment may also implement step S503 by the method shown in fig. 8. The method of the present embodiment includes steps S801 to S806.
Step S801: and controlling a laser to emit laser beams, adjusting the focal depth of the laser beams, and focusing the laser beams into the layer to be cut close to the lower surface of the material to be cut.
Step S802: modulating the laser beam, and lengthening the focal point of the laser beam to form a second elliptical focal spot on the to-be-cut layer on the lower surface of the to-be-cut material, wherein the long axis of the second elliptical focal spot is along the preset cutting channel direction.
Wherein the length of the major axis of the second elliptical focal spot is 20-50 μm.
Step S803: and adjusting the focal depth of the laser beam, and focusing the laser beam into the first layer to be cut.
Step S803 is similar to step S701 and is not described in detail here.
Step S804: the laser beam is modulated, and the focal point of the laser beam is elongated to form a first elliptical focal spot in the first layer to be cut, wherein the long axis of the first elliptical focal spot is along the preset cutting track direction.
Step S804 is similar to step S702 and is not described herein.
Wherein the length of the long axis of the first elliptical focal spot is 20-50 μm.
Step S805: and adjusting the focal depth of the laser beam and focusing the laser beam to be positioned in the second layer to be cut.
The distance between the central point of the focal spot in the second layer to be cut and the central point of the first elliptical focal spot is 10-30 microns, and the distance between the central point of the focal spot in the second layer to be cut and the central point of the second elliptical focal spot is 10-30 microns.
Step S806: and carrying out aberration correction processing on the focal point of the laser beam so as to improve the energy density of the focal spot in the second layer to be cut.
In the embodiment, in the processing process of forming the connecting force weakened area from bottom to top, the focus distribution of each layer to be cut is regulated, wherein the sub-focuses of the central layer are subjected to aberration correction processing and are in a high-energy density state, the sub-focuses close to the two surfaces are subjected to elongation processing, the length of the sub-focuses is 20-50 micrometers, and the distance between the centers of the sub-focuses close to the two surfaces and the center of the sub-focus of the central layer is 10-30 micrometers.
In this way, the energy density of the central layer is made higher, and longer microcracks can be formed; the sub-focuses on the two surfaces are distributed longer, so that a straighter micro-crack can be formed, and therefore, the formed sub-focuses form a light field form, and the distributed focal spots can obtain a long and straight micro-crack, so that the snake-shaped defect is reduced; the control mode of the focal position and the length can be realized by adding a spatial light modulator in a light beam regulation and control system and changing the wave front phase distribution of the laser.
The present application further proposes another embodiment of a laser induced cutting method, as shown in fig. 9. The method of the embodiment can realize the induced cutting of the material to be cut as shown in FIG. 10, and the thickness of the material to be cut is 380-420 μm. The method of the embodiment comprises the following steps:
step S901: and acquiring the thickness information of the material to be cut.
Step S901 is similar to step S501 described above, and is not described here.
Step S902: and responding to the fact that the thickness of the material to be cut is 380-420 microns, and determining that the number of cutting layers of the material to be cut is 5, wherein the plurality of layers to be cut comprise a first layer to be cut 1, a second layer to be cut 2, a third layer to be cut 3, a fourth layer to be cut 4 and a fifth layer to be cut 5, the third layer to be cut 3, the fourth layer to be cut 4 and the fifth layer to be cut 5 are sequentially located below the second layer to be cut 2, and the fifth layer to be cut 5 is close to the lower surface of the material to be cut.
The controller responds to the fact that the thickness of the material to be cut is 380-420 mu m, the number of the cutting layers of the material to be cut is determined to be 5, and the material to be cut is divided into a first layer to be cut 1, a second layer to be cut 2, a third layer to be cut 3, a fourth layer to be cut 4 and a fifth layer to be cut 5.
The multiple layers to be cut are not connected with each other, so that the cutting depth of the materials to be cut is not too deep, and the straightness of the cutting line can be improved.
Step S903: and controlling the laser beam to sequentially perform induction cutting on the fifth layer to be cut 5, the fourth layer to be cut 4, the third layer to be cut 3, the first layer to be cut 1 and the second layer to be cut 2.
The controller controls the laser beam to sequentially perform induction cutting on the fifth layer to be cut 5, the fourth layer to be cut 4, the third layer to be cut 3, the first layer to be cut 1 and the second layer to be cut 2. The induced cutting method for each layer to be cut is similar to the above embodiments, and is not repeated here.
In the embodiment, five layers of connection force weakened areas are processed in a material to be cut with the thickness of 380-420 mu m by laser; the first processing enables the bottom of the material to be cut to form a connecting force weakening area, and microcracks in the material to be cut expand to the lower surface of the material to be cut, so that the straightness of the material to be cut is good; the second and third processing enable the connection force weakening area and the microcracks in the material to be connected from bottom to top, but the connection force weakening area and the microcracks do not reach the upper surface of the material to be cut; processing the top of the material to be cut for the fourth time to enable the microcracks to expand to the upper surface of the material to be cut and realize better straightness of the upper surface; performing fifth processing on the middle part of the material to be cut to enable the third processing and the microcracks formed by the fourth processing to be connected, wherein the distance between the focus position and the focus position of the fourth processing is 20-50 micrometers; and finally, completely separating the materials to be cut by modes of film expanding and the like.
According to the embodiment, the induction cutting of the material to be cut with the thickness of 380-420 microns can be realized, the first layer to be cut 1 close to the upper surface of the material to be cut is cut firstly, then the second layer to be cut 2 which is positioned below the upper surface and is adjacent to the first layer to be cut 1 is cut, microcracks in a connection force weakening area and the accumulation of internal stress to the first layer to be cut 1, which are generated when the second layer to be cut 2 is cut, can be avoided, and the range of a snake-shaped cutting edge growing to the upper surface of the material to be cut can be reduced; and the fifth layer to be cut 5 is cut first, and then the fourth layer to be cut 4 and the third layer to be cut 3 are cut, so that the accumulation of microcracks in a connecting force weakening area and internal stress generated when the fourth layer to be cut 4 and the third layer to be cut 3 are prevented from reaching the fifth layer to be cut 5, and the range of the snake-shaped cutting edge growing to the lower surface of the material to be cut can be reduced. Therefore, the process effect of cutting the material to be cut can be improved.
The present application further proposes another embodiment of a laser induced cutting method, as shown in fig. 11. The method of the embodiment can realize the induced cutting of the material to be cut as shown in FIG. 12, and the thickness of the material to be cut is 580-620 μm. The method of the embodiment comprises the following steps:
step S1101: thickness information of a material to be cut is acquired.
Step S1101 is similar to step S501 described above, and is not described here.
Step S1102: and responding to the thickness of the material to be cut being 580-620 mu m, and determining the number of cutting layers of the material to be cut to be 8, wherein the plurality of layers to be cut comprise a first layer to be cut 1, a second layer to be cut 2, a third layer to be cut 3, a fourth layer to be cut 4, a fifth layer to be cut 5, a sixth layer to be cut 6, a seventh layer to be cut 7 and an eighth layer to be cut 8 which are sequentially positioned below the second layer to be cut 2, and the eighth layer to be cut 8 is close to the lower surface of the material to be cut.
The plurality of layers to be cut are not connected with each other, so that the cutting depth of the materials to be cut cannot be too deep, and the straightness of the cutting lines can be improved.
Step S1103: and controlling the laser beam to sequentially perform induction cutting on the eighth layer to be cut 8, the seventh layer to be cut 7, the sixth layer to be cut 6, the fifth layer to be cut 5, the fourth layer to be cut 4, the third layer to be cut 3, the first layer to be cut 1 and the second layer to be cut 2.
In the embodiment, aiming at a material to be cut with the thickness of 580-620 mu m, an eight-layer connection force weakening area is processed in the material by utilizing laser; the first processing enables the bottom of the material to be cut to form a connecting force weakening area, and microcracks in the material to be cut expand to the lower surface of the material to be cut, so that the straightness of the material to be cut is good; the second to sixth processing leads the connecting force weakening area and the microcrack in the material to be cut to be connected from bottom to top, but not to reach the upper surface of the material to be cut; the seventh processing is carried out on the top of the material to be cut, so that the microcracks are expanded to the upper surface of the material to be cut, and the good straightness of the upper surface is realized; and the eighth processing is performed in the middle of the material to be cut, so that the microcracks formed by the sixth processing and the seventh processing are connected. And finally, completely separating the materials to be cut by modes of film expanding and the like.
According to the embodiment, induced cutting of the material to be cut with the thickness of 580-620 microns can be realized, the first layer to be cut 1 close to the upper surface of the material to be cut is cut firstly, then the second layer to be cut 2 which is located below the upper surface and is adjacent to the first layer to be cut 1 is cut, microcracks in a connecting force weakening area and the accumulation of internal stress to the first layer to be cut 1, which are generated when the second layer to be cut 2 is cut, can be avoided, and the range of a snake-shaped cutting edge growing to the upper surface of the material to be cut can be reduced; and the eighth layer to be cut 8 is cut first, and then the seventh layer to be cut 7 to the third layer to be cut 3 is cut, so that microcracks in a connection force weakened area and the accumulation of internal stress generated when the seventh layer to be cut 7 to the third layer to be cut 3 are prevented from being accumulated in the eighth layer to be cut 8, and the range of the snake-shaped cutting edge growing to the lower surface of the material to be cut can be reduced. Therefore, the process effect of cutting the material to be cut can be improved.
The laser induced cutting method can realize cutting with the thickness of 100-700 mu m. Of course, in other embodiments of the present application, the material to be cut with a thickness less than 100 μm or with a thickness greater than 700 μm may also be cut, and the cutting method is similar to that of the foregoing embodiments, and is not described herein again.
Different from the prior art, the laser induced cutting method comprises the following steps: acquiring thickness information of a material to be cut; determining the number of cutting layers of the material to be cut by utilizing the thickness information so as to divide the material to be cut into a plurality of layers to be cut, wherein the plurality of layers to be cut at least comprise a first layer to be cut close to the upper surface of the material to be cut and a second layer to be cut which is positioned below the first layer to be cut and is adjacent to the first layer to be cut; and controlling the laser beams to respectively perform induction cutting on the layers to be cut, wherein the cutting sequence of the first layer to be cut is prior to the cutting sequence of the second layer to be cut. By the mode, the layers to be cut are determined according to the thickness of the material to be cut, the laser beams are controlled to respectively conduct induction cutting on the layers to be cut, the cutting depth of each layer to be cut can be effectively controlled, and therefore the cutting straightness of the layers to be cut can be improved, and the cutting efficiency can be improved; simultaneously, this application is cut earlier and is close to the first layer of waiting to cut material upper surface, then the cutting is located the upper surface below and waits to cut the layer with the adjacent second of first layer of waiting to cut, for the traditional first layer of waiting to cut of cutting the second, the mode of cutting the first layer of waiting to cut again can avoid cutting the second and wait to cut the layer and other layers of waiting to cut of below connection force weakening area crazing line and the accumulation of internal stress to the first layer of waiting to cut, finally cause the incision straightness accuracy after waiting to cut the material fracture not enough, produce great snakelike cutting edge defect, make the problem of waiting to cut material edge strength decline. Therefore, the range of the snake-shaped cutting edge growing to the surface of the material to be cut can be reduced, and the process effect of cutting the material to be cut can be improved.
The above description is only an embodiment of the present application, and not intended to limit the scope of the present application, and all equivalent mechanisms or equivalent processes performed by the present application and the contents of the appended drawings, or directly or indirectly applied to other related technical fields, are all included in the scope of the present application.
Claims (11)
1. A laser-induced cutting method, comprising:
acquiring thickness information of a material to be cut;
determining the number of cutting layers of the material to be cut by utilizing the thickness information so as to divide the material to be cut into a plurality of layers to be cut, wherein the plurality of layers to be cut at least comprise a first layer to be cut close to the upper surface of the material to be cut and a second layer to be cut which is positioned below the first layer to be cut and is adjacent to the first layer to be cut;
controlling laser beams to respectively perform induction cutting on the layers to be cut, wherein the cutting sequence of the first layer to be cut is prior to that of the second layer to be cut;
wherein, the step of controlling the laser beam to respectively carry out induced cutting on the layers to be cut comprises the following steps:
controlling laser beams to sequentially perform induction cutting on other layers to be cut in the multiple layers to be cut from the lower surface to the upper surface of the material to be cut until the layer to be cut which is positioned below the second layer to be cut and is adjacent to the second layer to be cut is cut, so as to form connecting force weakened areas in the other layers to be cut respectively;
controlling the laser beam to perform induced cutting on the first layer to be cut so as to form a first connecting force weakening area;
and controlling the laser beam to perform induced cutting on the second layer to be cut so as to form a second connecting force weakening area.
2. The laser induced cutting method according to claim 1, wherein the step of controlling the laser beam to perform the induced cutting on the plurality of layers to be cut respectively comprises performing the following sub-steps in a cyclic manner:
controlling a laser to emit a laser beam, adjusting the focal depth of the laser beam, and focusing the laser beam into the layer to be cut so as to form a focal spot in the layer to be cut;
and controlling the laser beam to move to enable the focal spot to perform induced cutting on the layer to be cut along a preset cutting channel so as to form the connecting force weakened area, the first connecting force weakened area or the second connecting force weakened area along the preset cutting channel.
3. The laser-induced cutting method according to claim 2, wherein a difference between a focal depth of the laser beam in the first layer to be cut and a focal depth of the laser beam in the second layer to be cut is a first preset value, so that the first connecting force weakening area and the second connecting force weakening area are spaced apart.
4. The laser-induced cutting method according to claim 3, wherein the first preset value is 20 to 50 μm.
5. The laser induced cutting method of claim 4, wherein the step of adjusting the focal depth of the laser beam and focusing the laser beam into the layer to be cut to form a focal spot in the layer to be cut comprises:
adjusting the focal depth of the laser beam, and focusing the laser beam into the first layer to be cut;
modulating the laser beam, and elongating a focal point of the laser beam to form a first elliptical focal spot in the first layer to be cut, wherein a long axis of the first elliptical focal spot is along the preset cutting channel direction.
6. The laser-induced cutting method according to claim 5, further comprising, before the step of adjusting the focal depth of the laser beam and focusing the laser beam into the first layer to be cut:
adjusting the focal depth of the laser beam and focusing the laser beam into the layer to be cut close to the lower surface of the material to be cut;
modulating the laser beam and lengthening a focus of the laser beam to form a second elliptical focal spot on the to-be-cut layer on the lower surface of the to-be-cut material, wherein the long axis of the second elliptical focal spot is along the preset cutting channel direction;
after the step of modulating the laser beam and elongating the focal point of the laser beam to form a first elliptical focal spot in the first layer to be cut, the method further comprises:
adjusting the focal depth of the laser beam and focusing the laser beam to be positioned in the second layer to be cut;
and carrying out aberration correction processing on the focal point of the laser beam so as to improve the energy density of the focal spot in the second layer to be cut.
7. The laser-induced cutting method according to claim 6, wherein the length of the long axis of the first elliptical focal spot is 20-50 μm, the length of the long axis of the second elliptical focal spot is 20-50 μm, the distance between the center point of the focal spot in the second layer to be cut and the center point of the first elliptical focal spot is 10-30 μm, and the distance between the center point of the focal spot in the second layer to be cut and the center point of the second elliptical focal spot is 10-30 μm.
8. The laser induced cutting method according to any of the claims 1 to 7, characterized in that the step of determining the number of cutting layers of the material to be cut using the thickness information comprises:
responding to the fact that the thickness of the material to be cut is smaller than a thickness threshold value, and determining that the number of cutting layers of the material to be cut is 1 or 2;
and determining that the cutting layer number of the material to be cut is greater than or equal to (N +1) in response to that the thickness of the material to be cut is greater than or equal to N times of the thickness threshold value and less than or equal to (N +1) times of the thickness threshold value, wherein N is a natural number greater than 1.
9. The laser induced cutting method according to claim 8, wherein the thickness threshold is 100 μm and the thickness of the joining force weakened area is 40 μm.
10. Laser induced cutting method according to any of claims 1 to 7, characterized in that the transmission of the laser beam in the material to be cut is greater than 90%.
11. A laser-induced cutting apparatus, comprising:
the controller is used for acquiring thickness information of a material to be cut, determining the number of cutting layers of the material to be cut by utilizing the thickness information, and dividing the material to be cut into a plurality of layers to be cut, wherein the plurality of layers to be cut at least comprise a first layer to be cut close to the upper surface of the material to be cut and a second layer to be cut which is positioned below the first layer to be cut and is adjacent to the first layer to be cut;
the laser is connected with the controller and used for emitting laser beams under the control of the controller so as to respectively perform induced cutting on the layers to be cut through the laser beams, wherein the cutting sequence of the first layer to be cut is prior to that of the second layer to be cut;
the light beam regulation and control system is connected with the controller and is used for regulating and controlling the light beam characteristics of the laser light beam under the control of the controller;
the focusing system is connected with the controller and used for focusing the laser beam regulated and controlled by the beam regulating and controlling system and projecting the focused laser beam to the material to be cut; the focusing system moves along the direction vertical to the surface of the material to be cut under the control of the controller so as to adjust the focal depth of the focused laser beam in the material to be cut and form focal spots in the layers to be cut respectively;
the laser processing platform is connected with the controller and used for moving along the direction of a preset cutting channel of the material to be cut under the control of the controller so as to form a connecting force weakening area along the direction of the preset cutting channel in the layer to be cut;
the controller controls the laser beam to sequentially perform induced cutting on other layers to be cut in the multiple layers to be cut from the lower surface to the upper surface of the material to be cut until the layer to be cut which is positioned below the second layer to be cut and adjacent to the second layer to be cut is cut, so that connection force weakened areas are formed in the other layers to be cut respectively; the controller then controls the laser beam to perform induced cutting on the first layer to be cut so as to form a first connection force weakened area, and the controller then controls the laser beam to perform induced cutting on the second layer to be cut so as to form a second connection force weakened area.
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| CN113942014B (en) * | 2021-11-08 | 2023-08-01 | 北京华航唯实机器人科技股份有限公司 | Track generation method, track generation device, robot device, and storage medium |
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| JP4907984B2 (en) * | 2005-12-27 | 2012-04-04 | 浜松ホトニクス株式会社 | Laser processing method and semiconductor chip |
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